NTMFS4C01N D

NTMFS4C01N
Power MOSFET
30 V, 0.9 mW, 303 A, Single N−Channel,
SO−8FL
Features
•
•
•
•
Small Footprint (5x6 mm) for Compact Design
Low RDS(on) to Minimize Conduction Losses
Low QG and Capacitance to Minimize Driver Losses
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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V(BR)DSS
RDS(ON) MAX
0.9 mW @ 10 V
30 V
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
30
V
Gate−to−Source Voltage
VGS
"20
V
TC = 25°C
ID
303
A
TC = 25°C
PD
134
W
TA = 25°C
ID
47
A
Continuous Drain Current RqJC (Notes 1, 3)
Power Dissipation
RqJC (Notes 1, 3)
Continuous Drain Current RqJA (Notes 1, 2,
3)
Power Dissipation
RqJA (Notes 1, 2, 3)
Steady
State
Steady
State
D (5)
G (4)
S (1,2,3)
N−CHANNEL MOSFET
TA = 25°C
PD
3.2
W
TA = 25°C, tp = 10 ms
IDM
900
A
TJ, Tstg
−55 to
150
°C
IS
110
A
Single Pulse Drain−to−Source Avalanche
Energy (IL(pk) = 35 A)
EAS
862
mJ
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
Pulsed Drain Current
303 A
1.2 mW @ 4.5 V
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
ID MAX
Operating Junction and Storage Temperature
Source Current (Body Diode)
260
MARKING
DIAGRAM
D
1
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
SO−8 FLAT LEAD
CASE 488AA
STYLE 1
A
Y
W
ZZ
S
S
S
G
D
4C01N
AYWZZ
D
D
= Assembly Location
= Year
= Work Week
= Lot Traceability
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
Symbol
Value
Unit
Junction−to−Case − Steady State
RqJC
0.93
°C/W
Junction−to−Ambient − Steady State (Note 2)
RqJA
39
Parameter
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Surface−mounted on FR4 board using a 650 mm2, 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. 0
1
ORDERING INFORMATION
Device
Package
Shipping†
NTMFS4C01NT1G
SO−8FL
(Pb−Free)
1500 /
Tape & Reel
NTMFS4C01NT3G
SO−8FL
(Pb−Free)
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NTMFS4C01N/D
NTMFS4C01N
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)
Parameter
Symbol
Test Condition
Min
Drain−to−Source Breakdown Voltage
V(BR)DSS
VGS = 0 V, ID = 250 mA
30
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V(BR)DSS/
TJ
Typ
Max
Unit
OFF CHARACTERISTICS
Zero Gate Voltage Drain Current
Gate−to−Source Leakage Current
IDSS
V
16.3
VGS = 0 V,
VDS = 24 V
mV/°C
TJ = 25 °C
1
TJ = 125°C
100
IGSS
VDS = 0 V, VGS = 20 V
VGS(TH)
VGS = VDS, ID = 250 mA
100
mA
nA
ON CHARACTERISTICS (Note 4)
Gate Threshold Voltage
Negative Threshold Temperature Coefficient
Drain−to−Source On Resistance
VGS(TH)/TJ
RDS(on)
Forward Transconductance
gFS
Gate Resistance
RG
1.3
2.2
5.8
V
mV/°C
VGS = 10 V
ID = 30 A
0.71
0.9
VGS = 4.5 V
ID = 30 A
0.94
1.2
VDS = 3 V
ID = 30 A
183
S
1.0
W
TA = 25 °C
mW
CHARGES AND CAPACITANCES
Input Capacitance
CISS
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
148
Total Gate Charge
QG(TOT)
63
Threshold Gate Charge
QG(TH)
Gate−to−Source Charge
QGS
Gate−to−Drain Charge
QGD
Total Gate Charge
10144
VGS = 0 V, f = 1 MHz, VDS = 15 V
VGS = 4.5 V, VDS = 15 V; ID = 30 A
5073
pF
18
nC
29
13
QG(TOT)
VGS = 10 V, VDS = 15 V,
ID = 30 A
139
nC
SWITCHING CHARACTERISTICS (Note 5)
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
td(ON)
29
tr
td(OFF)
VGS = 4.5 V, VDS = 15 V, ID = 15 A,
RG = 3.0 W
tf
68
ns
53
36
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
Reverse Recovery Time
VSD
TJ = 25°C
0.73
TJ = 125°C
0.55
tRR
Charge Time
ta
Discharge Time
tb
Reverse Recovery Charge
VGS = 0 V,
IS = 10 A
1.1
V
87
VGS = 0 V, dIS/dt = 100 A/ms,
IS = 30 A
QRR
43
ns
44
147
nC
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.
5. Switching characteristics are independent of operating junction temperatures.
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2
NTMFS4C01N
TYPICAL CHARACTERISTICS
3.4 V
3.6 V
3.2 V
300
4.5 V
250
200
3.0 V
150
2.8 V
100
50
RDS(on), DRAIN−TO−SOURCE RESISTANCE (mW)
0
0.5
1.0
1.5
2.0
2.5
200
100
TJ = −55°C
1.5
2
2.5
3
3.5
Figure 1. On−Region Characteristics
Figure 2. Transfer Characteristics
TJ = 25°C
1.3
1.2
1.1
1.0
0.9
0.8
0.7
4
5
6
7
8
9
10
VGS, GATE VOLTAGE (V)
4
1.5
TJ = 25°C
1.4
1.3
1.2
1.1
VGS = 4.5 V
1.0
0.9
0.8
VGS = 10 V
0.7
0.6
0
50
100
150
200
250
300
350 400
ID, DRAIN CURRENT (A)
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
100000
1.8
VGS = 10 V
ID = 30 A
IDSS, LEAKAGE (nA)
RDS(on), NORMALIZED DRAIN−TO−
SOURCE RESISTANCE (W)
TJ = 150°C
VGS, GATE−TO−SOURCE VOLTAGE (V)
1.4
1.6
TJ = 25°C
150
0
3.0
ID = 30 A
3
250
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
1.5
0.6
300
50
VGS = 2.6 V
0.0
VDS = 3 V
350
RDS(on), DRAIN−TO−SOURCE RESISTANCE (mW)
ID, DRAIN CURRENT (A)
350
400
10 V
ID, DRAIN CURRENT (A)
400
1.4
1.2
1.0
10000
TJ = 125°C
TJ = 100°C
1000
TJ = 85°C
100
0.8
0.6
−50
−25
0
25
50
75
100
125
150
10
0
5
10
15
20
25
TJ, JUNCTION TEMPERATURE (°C)
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
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3
30
NTMFS4C01N
TYPICAL CHARACTERISTICS
CISS
10k
COSS
1k
VGS = 0 V
TJ = 25°C
f = 1 MHz
100
10
0.1
CRSS
10
1
12
11
VGS
8
12
7
6
9
5
4
QGD
QGS
VDS = 15 V
ID = 30 A
TJ = 25°C
3
2
1
0
0
20
40
60
80
100
6
3
0
140
120
QG, TOTAL GATE CHARGE (nC)
Figure 7. Capacitance Variation
Figure 8. Gate−to−Source and
Drain−to−Source Voltage vs. Total Charge
1000
tr
IS, SOURCE CURRENT (A)
td(off)
VGS = 4.5 V
VDD = 15 V
ID = 15 A
tf
td(on)
100
0.1
1
10
100
10
1
0.1
100
TJ = 150°C
0.3
0.4
0.5
TJ = 25°C
0.6
0.7
TJ = −55°C
0.8
0.9
1.0
RG, GATE RESISTANCE (W)
VSD, SOURCE−TO−DRAIN VOLTAGE (V)
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
Figure 10. Diode Forward Voltage vs. Current
1000
1 ms
ID, DRAIN CURRENT (A)
t, TIME (ns)
VDS
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
1000
10
15
10
9
100
18
QT
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
VGS, GATE−TO−SOURCE VOLTAGE (V)
C, CAPACITANCE (pF)
100k
10 ms
100
10
1
0.1
10 ms
100 ms
VGS ≤ 10 V
TC = 25°C
RDS(on) Limit
Thermal Limit
Package Limit
1
10
VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
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4
100
NTMFS4C01N
TYPICAL CHARACTERISTICS
100
RqJA = Steady State = 39°C/W
Duty Cycle = 0.5
0.2
0.1
0.05
1 0.02
0.01
R(t) (°C/W)
10
PCB Cu Area = 650 mm2
PCB Cu Thk = 2 oz
0.1
0.01
Single Pulse
0.000001
0.00001
0.0001
0.001
0.1
0.01
1
t, TIME (s)
Figure 12. Thermal Impedance (Junction−to−Ambient)
1000
100
IPEAK, (A)
0.001
TJ(initial) = 25°C
10
TJ(initial) = 100°C
1
1.00E−04
1.00E−03
TIME IN AVALANCHE (s)
Figure 13. Avalanche Characteristics
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5
1.00E−02
10
100
1000
NTMFS4C01N
PACKAGE DIMENSIONS
DFN5 5x6, 1.27P
(SO−8FL)
CASE 488AA
ISSUE K
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
0.20 C
D
2
A
B
D1
2X
0.20 C
4X
E1
2
3
q
E
2
1
DIM
A
A1
b
c
D
D1
D2
E
E1
E2
e
G
K
L
L1
M
q
c
A1
4
TOP VIEW
C
3X
e
0.10 C
SEATING
PLANE
DETAIL A
A
STYLE 1:
PIN 1. SOURCE
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
0.10 C
SIDE VIEW
SOLDERING FOOTPRINT*
DETAIL A
3X
8X
0.10
C A B
0.05
c
4X
e/2
1
4
0.965
K
G
0.750
1.000
L
PIN 5
(EXPOSED PAD)
4X
1.270
b
MILLIMETERS
MIN
NOM
MAX
0.90
1.00
1.10
0.00
−−−
0.05
0.33
0.41
0.51
0.23
0.28
0.33
5.00
5.15
5.30
4.70
4.90
5.10
3.80
4.00
4.20
6.00
6.15
6.30
5.70
5.90
6.10
3.45
3.65
3.85
1.27 BSC
0.51
0.61
0.71
1.20
1.35
1.50
0.51
0.61
0.71
0.125 REF
3.00
3.40
3.80
0_
−−−
12 _
1.330
2X
0.905
2X
E2
L1
M
0.495
4.530
3.200
0.475
D2
2X
1.530
BOTTOM VIEW
4.560
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
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or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
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NTMFS4C01N/D