D a t a S he et , V 3. 0 , N o v e m be r 2 00 8 B G F 11 2 A V I / F D e v i c e w i t h E S D P r o t e c t i on S m a l l S i g n a l D i s c r et e s Edition 2008-11-19 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2008. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF112 AV I/F Device with ESD Protection BGF112 Revision History: 2008-11-19, V3.0 Previous Version: 2008-10-07, V2.0 Page Subjects (major changes since last revision) All Preliminary status removed Data Sheet 3 V3.0, 2008-11-19 BGF112 AV I/F Device with ESD Protection BGF112 BGF112 Features • ESD protection circuit and filter for AV I/F interface • Integrated ESD protection at external pins of 15 kV contact discharge according to IEC61000-4-2 • Wafer level package with SnAgCu solder balls • RoHS and WEEE compliant package • 400 µm solder ball pitch WLP-5-1 Description BGF112 is an ESD protection circuit and EMI filtering device for an AV I/F interface for mobile applications. The external pins are protected against ESD pulses of 15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green leadfree package with a size of only 0.76 mm x 1.16 mm and a total height of 0.6 mm Ext . IOs Int. IOs A1 R1, 15Ω A2 C1 R2, 15Ω C2 C1, 5nF C2, 5nF GND, B2 BGF 112_schematic.vsd Figure 1 Schematic Type Package Marking Chip BGF112 WLP-5-1 112 N0736 Table 1 Maximum Ratings Parameter Symbol Voltage at all pins to GND VP TOP TSTG Pin Operating temperature range Storage temperature range Power dissipation each line Values Unit Note / Test Condition Min. Typ. Max. 0 – 4 V – -40 – +85 °C – -65 – +150 °C – – – 70 mW TS < 70 °C -15 – 15 kV – -2 – 2 kV – Electrostatic Discharge According to IEC61000-4-2 Contact discharge from A2 or C2 to GND Contact discharge between all other pins Data Sheet VESD VESD 4 V3.0, 2008-11-19 BGF112 AV I/F Device with ESD Protection BGF112 Table 2 Electrical Characteristics1) Parameter Symbol Values Min. Typ. Max. Unit Note / Test Condition Resistors R1, R2 R1,2 13.5 15 16.5 Ω – Capacitors C1, C2 C1,2 4 5 6 nF – Total ESD junction capacitance of each line to GND CT – 18 30 pF V=0V Leakage currents ESD diodes to GND 1) at TA = 25 °C IR – 0.1 0.1 100 100 nA µA V = ±3 V V = ±14 V Data Sheet 5 V3.0, 2008-11-19 BGF112 AV I/F Device with ESD Protection BGF112 BGF112 insertion loss 0 -10 dB -20 -30 -40 -50 -60 0.1 1 10 100 1000 10000 MHz Insertion loss of path A1-A2 or C1-C2 (ZS = ZL = 50 Ω) Figure 2 BGF112 cross talk 0 -10 -20 -30 dB -40 -50 -60 -70 -80 -90 -100 0.1 1 10 100 1000 10000 MHz Figure 3 Data Sheet Cross talk of path A1-C2 or C1-A2 (ZS = ZL = 50 Ω) 6 V3.0, 2008-11-19 BGF112 AV I/F Device with ESD Protection BGF112 Package Outlines Solder balls face down Solder balls face up 0.76 ±0.05 C1 A2 A1 5x C 0.25 ±0.04 1) ø0.05 M A B 0.08 C 5x COPLANARITY A 1.16 ±0.05 B2 C2 0.4 2 x 0.4 = 0.8 (0.18 ±0.05 ) (0.18 ±0.05 ) (0.18 ±0.05 ) 0.1 C (0.18 ±0.05 ) Pin 1 Corner Index Area 2) SEATING PLANE 3) 0.2 ±0.05 STANDOFF B 0.4 0.6 ±0.05 1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C 2) A1 corner identified by marking 3) Primary datum C and seating plane are defined by the domed crowns of the balls WLP-5-1-N-PO V02 Figure 4 WLP-5-1 (dimensions in mm) Tape and reel specification 0.25 Pin 1 Corner Index Area Figure 5 0.87 8 1.27 4 0.71 WLP-5-1-N-TP V01 Tape for WLP-5-1 (dimensions in mm) You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products Data Sheet 7 V3.0, 2008-11-19