517DD

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN6 3x3, 0.95P
CASE 517DD
ISSUE O
1
SCALE 2:1
DATE 28 OCT 2014
A
D
L
L
B
L1
PIN 1
REFERENCE
2X
0.15 C
2X
DETAIL A
ÎÎÎ
ÎÎÎ
ÎÎÎ
0.15 C
ALTERNATE TERMINAL
CONSTRUCTIONS
E
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND 0.30
MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
ÎÎ
ÎÎ
ÏÏ
EXPOSED Cu
TOP VIEW
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTIONS
DETAIL B
0.10 C
A
7X
0.08 C
(A3)
NOTE 4
SIDE VIEW
C
A1
SEATING
PLANE
6X
1
L
3
E2
K
6
GENERIC
MARKING DIAGRAM*
1
D2
DETAIL A
4
e
6X
b
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.20 REF
0.25
0.35
3.00 BSC
2.30
2.50
3.00 BSC
1.55
1.75
0.95 BSC
0.28 REF
0.30
0.50
−−−
0.15
XXXXX
XXXXX
ALYWG
G
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
6X
2.60
PKG
OUTLINE
1.80
0.60
3.30
1
0.95
PITCH
6X
0.45
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON92479F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
UDFN6 3X3, 0.95P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON92479F
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY I. MARIANO.
DATE
28 OCT 2014
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2014
October, 2014 − Rev. 01O
Case Outline Number:
517DD