INFINEON IPD65R225C7

MOSFET
MetalOxideSemiconductorFieldEffectTransistor
CoolMOS™C7
650VCoolMOS™C7PowerTransistor
IPD65R225C7
DataSheet
Rev.2.0
Final
PowerManagement&Multimarket
650VCoolMOS™C7PowerTransistor
IPD65R225C7
1Description
DPAK
CoolMOS™isarevolutionarytechnologyforhighvoltagepower
MOSFETs,designedaccordingtothesuperjunction(SJ)principleand
pioneeredbyInfineonTechnologies.
CoolMOS™C7seriescombinestheexperienceoftheleadingSJ
MOSFETsupplierwithhighclassinnovation.Theproductportfolio
providesallbenefitsoffastswitchingsuperjunctionMOSFETsoffering
betterefficiency,reducedgatecharge,easyimplementationand
outstandingreliability.
tab
1
2
3
Features
•IncreasedMOSFETdv/dtruggedness
•BetterefficiencyduetobestinclassFOMRDS(on)*EossandRDS(on)*Qg
•BestinclassRDS(on)/package
•Easytouse/drive
•Pb-freeplating,halogenfreemoldcompound
•QualifiedforindustrialgradeapplicationsaccordingtoJEDEC(J-STD20
andJESD22)
Drain
Pin 2, tab
Gate
Pin 1
Source
Pin 3
Benefits
•Enablinghighersystemefficiency
•Enablinghigherfrequency/increasedpowerdensitysolutions
•Systemcost/sizesavingsduetoreducedcoolingrequirements
•Highersystemreliabilityduetoloweroperatingtemperatures
Applications
PFCstagesandhardswitchingPWMstagesfore.g.Computing,Server,
Telecom,UPSandSolar.
Pleasenote:ForMOSFETparallelingtheuseofferritebeadsonthegate
orseparatetotempolesisgenerallyrecommended.
Table1KeyPerformanceParameters
Parameter
Value
Unit
VDS @ Tj,max
700
V
RDS(on),max
225
mΩ
Qg.typ
20
nC
ID,pulse
41
A
Eoss@400V
2.3
µJ
Body diode di/dt
55
A/µs
Type/OrderingCode
Package
Marking
IPD65R225C7
PG-TO 252
65C7225
Final Data Sheet
2
RelatedLinks
see Appendix A
Rev.2.0,2013-04-18
650VCoolMOS™C7PowerTransistor
IPD65R225C7
TableofContents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Final Data Sheet
3
Rev.2.0,2013-04-18
650VCoolMOS™C7PowerTransistor
IPD65R225C7
2Maximumratings
atTj=25°C,unlessotherwisespecified
Table2Maximumratings
Parameter
Symbol
Continuous drain current 1)
Values
Unit
Note/TestCondition
11
7
A
TC=25°C
TC=100°C
-
41
A
TC=25°C
-
-
48
mJ
ID=4.8A; VDD=50V
EAR
-
-
0.24
mJ
ID=4.8A; VDD=50V
Avalanche current, single pulse
IAS
-
-
4.8
A
-
MOSFET dv/dt ruggedness
dv/dt
-
-
100
V/ns
VDS=0...400V
Gate source voltage (static)
VGS
-20
-
20
V
static;
Gate source voltage (dynamic)
VGS
-30
-
30
V
AC (f>1 Hz)
Power dissipation
Ptot
-
-
63
W
TC=25°C
Storage temperature
Tstg
-55
-
150
°C
-
Operating junction temperature
Tj
-55
-
150
°C
-
Mounting torque
-
-
-
-
Ncm -
Continuous diode forward current
IS
-
-
11
A
TC=25°C
Diode pulse current2)
IS,pulse
-
-
41
A
TC=25°C
dv/dt
-
-
1
V/ns
VDS=0...400V,ISD<=IS,Tj=25°C
Maximum diode commutation speed
dif/dt
-
-
55
A/µs VDS=0...400V,ISD<=IS,Tj=25°C
Insulation withstand voltage
VISO
-
-
n.a.
V
Min.
Typ.
Max.
ID
-
-
Pulsed drain current 2)
ID,pulse
-
Avalanche energy, single pulse
EAS
Avalanche energy, repetitive
Reverse diode dv/dt
3)
Vrms,TC=25°C,t=1min
1)
Limited by Tj max.
Pulse width tp limited by Tj,max
3)
IdenticallowsideandhighsideswitchwithidenticalRG
2)
Final Data Sheet
4
Rev.2.0,2013-04-18
650VCoolMOS™C7PowerTransistor
IPD65R225C7
3Thermalcharacteristics
Table3Thermalcharacteristics
Parameter
Symbol
Thermal resistance, junction - case
Thermal resistance, junction - ambient
Values
Unit
Note/TestCondition
Min.
Typ.
Max.
RthJC
-
-
1.99
°C/W -
RthJA
-
-
62
°C/W device on PCB, minimal footprint
Thermal resistance, junction - ambient
for SMD version
RthJA
-
35
45
Device on 40mm*40mm*1.5mm
epoxy PCB FR4 with 6cm² (one
layer, 70µm thickness) copper
°C/W
area for drain connection and
cooling. PCB is vertical without air
stream cooling.
Soldering temperature, wave- & reflow
soldering allowed
Tsold
-
-
260
°C
Final Data Sheet
5
reflow MSL1
Rev.2.0,2013-04-18
650VCoolMOS™C7PowerTransistor
IPD65R225C7
4Electricalcharacteristics
atTj=25°C,unlessotherwisespecified
Table4Staticcharacteristics
Parameter
Symbol
Drain-source breakdown voltage
Values
Unit
Note/TestCondition
-
V
VGS=0V,ID=1mA
3.5
4
V
VDS=VGS,ID=0.24mA
-
10
1
-
µA
VDS=650,VGS=0V,Tj=25°C
VDS=650,VGS=0V,Tj=150°C
IGSS
-
-
100
nA
VGS=20V,VDS=0V
Drain-source on-state resistance
RDS(on)
-
0.199
0.478
0.225
-
Ω
VGS=10V,ID=4.8A,Tj=25°C
VGS=10V,ID=4.8A,Tj=150°C
Gate resistance
RG
-
1.2
-
Ω
f=1MHz,opendrain
Unit
Note/TestCondition
Min.
Typ.
Max.
V(BR)DSS
650
-
Gate threshold voltage
V(GS)th
3
Zero gate voltage drain current
IDSS
Gate-source leakage current
Table5Dynamiccharacteristics
Parameter
Symbol
Input capacitance
Values
Min.
Typ.
Max.
Ciss
-
996
-
pF
VGS=0V,VDS=400V,f=250kHz
Output capacitance
Coss
-
14
-
pF
VGS=0V,VDS=400V,f=250kHz
Effective output capacitance, energy
related 1)
Co(er)
-
29
-
pF
VGS=0V,VDS=0...400V
Effective output capacitance, time related
Co(tr)
-
313
-
pF
ID=constant,VGS=0V,VDS=0...400V
Turn-on delay time
td(on)
-
9
-
ns
VDD=400V,VGS=13V,ID=4.8A,
RG=10Ω
Rise time
tr
-
6
-
ns
VDD=400V,VGS=13V,ID=4.8A,
RG=10Ω
Turn-off delay time
td(off)
-
48
-
ns
VDD=400V,VGS=13V,ID=4.8A,
RG=10Ω
Fall time
tf
-
10
-
ns
VDD=400V,VGS=13V,ID=4.8A,
RG=10Ω
Unit
Note/TestCondition
2)
Table6Gatechargecharacteristics
Parameter
Symbol
Gate to source charge
Values
Min.
Typ.
Max.
Qgs
-
5
-
nC
VDD=400V,ID=4.8A,VGS=0to10V
Gate to drain charge
Qgd
-
6
-
nC
VDD=400V,ID=4.8A,VGS=0to10V
Gate charge total
Qg
-
20
-
nC
VDD=400V,ID=4.8A,VGS=0to10V
Gate plateau voltage
Vplateau
-
5.4
-
V
VDD=400V,ID=4.8A,VGS=0to10V
1)
Co(er)isafixedcapacitancethatgivesthesamestoredenergyasCosswhileVDSisrisingfrom0to400V
Co(tr)isafixedcapacitancethatgivesthesamechargingtimeasCosswhileVDSisrisingfrom0to400V
2)
Final Data Sheet
6
Rev.2.0,2013-04-18
650VCoolMOS™C7PowerTransistor
IPD65R225C7
Table7Reversediodecharacteristics
Parameter
Symbol
Diode forward voltage
Values
Unit
Note/TestCondition
-
V
VGS=0V,IF=4.8A,Tj=25°C
890
-
ns
VR=400V,IF=11A,diF/dt=55A/µs
-
6
-
µC
VR=400V,IF=11A,diF/dt=55A/µs
-
16
-
A
VR=400V,IF=11A,diF/dt=55A/µs
Min.
Typ.
Max.
VSD
-
0.9
Reverse recovery time
trr
-
Reverse recovery charge
Qrr
Peak reverse recovery current
Irrm
Final Data Sheet
7
Rev.2.0,2013-04-18
650VCoolMOS™C7PowerTransistor
IPD65R225C7
5Electricalcharacteristicsdiagrams
Table8
Diagram1:Powerdissipation
Diagram2:Safeoperatingarea
102
70
100 µs
1 µs
1 ms
60
10 ms
101
DC
50
100
40
ID[A]
Ptot[W]
10 µs
30
10-1
20
10-2
10
0
0
25
50
75
100
125
10-3
150
100
101
TC[°C]
102
103
VDS[V]
Ptot=f(TC)
ID=f(VDS);TC=25°C;D=0;parameter:tp
Table9
Diagram3:Safeoperatingarea
Diagram4:Max.transientthermalimpedance
2
101
10
100 µs
1 ms
10 ms
101
10 µs
1 µs
DC
100
0.2
ID[A]
ZthJC[K/W]
100
10-1
0.5
0.1
10-1
0.05
0.02
0.01
single pulse
10-2
10-3
100
101
102
103
10-2
10-5
10-4
VDS[V]
10-2
10-1
tp[s]
ID=f(VDS);TC=80°C;D=0;parameter:tp
Final Data Sheet
10-3
ZthJC=f(tP);parameter:D=tp/T
8
Rev.2.0,2013-04-18
650VCoolMOS™C7PowerTransistor
IPD65R225C7
Table10
Diagram5:Typ.outputcharacteristics
Diagram6:Typ.outputcharacteristics
50
30
45
20 V
10 V
40
20 V
25
10 V
8V
8V
7V
35
20
7V
6V
ID[A]
ID[A]
30
25
15
20
5.5 V
10
15
6V
5V
10
5
5.5 V
5
0
4.5 V
5V
4.5 V
0
5
10
15
0
20
0
5
10
VDS[V]
15
20
VDS[V]
ID=f(VDS);Tj=25°C;parameter:VGS
ID=f(VDS);Tj=125°C;parameter:VGS
Table11
Diagram7:Typ.drain-sourceon-stateresistance
0.9
5.5 V
Diagram8:Drain-sourceon-stateresistance
0.6
6V
7V
6.5 V
0.8
20 V
10 V
0.5
98%
0.7
RDS(on)[Ω]
RDS(on)[Ω]
0.4
0.6
typ
0.3
0.5
0.2
0.4
0.3
0
10
20
30
0.1
-50
-25
0
25
ID[A]
RDS(on)=f(ID);Tj=125°C;parameter:VGS
Final Data Sheet
50
75
100
125
150
Tj[°C]
RDS(on)=f(Tj);ID=4.8A;VGS=10V
9
Rev.2.0,2013-04-18
650VCoolMOS™C7PowerTransistor
IPD65R225C7
Table12
Diagram9:Typ.transfercharacteristics
Diagram10:Typ.gatecharge
45
12
11
40
120 V
25 °C
400 V
10
35
9
8
7
25
VGS[V]
ID[A]
30
150 °C
20
15
6
5
4
3
10
2
5
0
1
0
2
4
6
8
10
0
12
0
5
VGS[V]
10
15
20
25
125
150
Qgate[nC]
ID=f(VGS);VDS=20V;parameter:Tj
VGS=f(Qgate);ID=4.8Apulsed;parameter:VDD
Table13
Diagram11:Forwardcharacteristicsofreversediode
Diagram12:Avalancheenergy
2
10
50
45
40
35
101
30
EAS[mJ]
IF[A]
125 °C
25 °C
100
25
20
15
10
5
10-1
0.0
0.5
1.0
1.5
2.0
0
25
50
VSD[V]
100
Tj[°C]
IF=f(VSD);parameter:Tj
Final Data Sheet
75
EAS=f(Tj);ID=4.8A;VDD=50V
10
Rev.2.0,2013-04-18
650VCoolMOS™C7PowerTransistor
IPD65R225C7
Table14
Diagram13:Drain-sourcebreakdownvoltage
Diagram14:Typ.capacitances
104
760
740
Ciss
720
103
680
C[pF]
VBR(DSS)[V]
700
660
102
Coss
640
101
620
600
Crss
580
-60
-20
20
60
100
140
180
100
0
100
200
Tj[°C]
300
400
500
VDS[V]
VBR(DSS)=f(Tj);ID=1mA
C=f(VDS);VGS=0V;f=250kHz
Table15
Diagram15:Typ.Cossstoredenergy
3.5
3.0
Eoss[µJ]
2.5
2.0
1.5
1.0
0.5
0.0
0
100
200
300
400
500
VDS[V]
Eoss=f(VDS)
Final Data Sheet
11
Rev.2.0,2013-04-18
650VCoolMOS™C7PowerTransistor
IPD65R225C7
6TestCircuits
Table16Diodecharacteristics
Test circuit for diode characteristics
Diode recovery waveform
V ,I
Rg1
VDS( peak)
VDS
VDS
VDS
trr
IF
Rg 2
tF
tS
dIF / dt
QF
IF
t
dIrr / dt trr =tF +tS
Qrr = QF + QS
Irrm
Rg1 = Rg 2
IF
10 %Irrm
QS
Table17Switchingtimes
Switching times test circuit for inductive load
Switching times waveform
VDS
90%
VDS
VGS
VGS
10%
td(on)
td(off)
tr
ton
tf
toff
Table18Unclampedinductiveload
Unclamped inductive load test circuit
Unclamped inductive waveform
V(BR)DS
ID
VD
VDS
VDS
Final Data Sheet
12
ID
VDS
Rev.2.0,2013-04-18
650VCoolMOS™C7PowerTransistor
IPD65R225C7
7PackageOutlines
Figure1OutlinePG-TO252,dimensionsinmm/inches
Final Data Sheet
13
Rev.2.0,2013-04-18
650VCoolMOS™C7PowerTransistor
IPD65R225C7
8AppendixA
Table19RelatedLinks
• IFXCoolMOSTMC7Webpage:www.infineon.com
• IFXCoolMOSTMC7applicationnote:www.infineon.com
• IFXCoolMOSTMC7simulationmodel:www.infineon.com
• IFXDesigntools:www.infineon.com
Final Data Sheet
14
Rev.2.0,2013-04-18
650VCoolMOS™C7PowerTransistor
IPD65R225C7
RevisionHistory
IPD65R225C7
Revision:2013-04-18,Rev.2.0
Previous Revision
Revision
Date
Subjects (major changes since last revision)
2.0
2013-04-18
Release of final version
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Edition2011-08-01
Publishedby
InfineonTechnologiesAG
81726München,Germany
©2011InfineonTechnologiesAG
AllRightsReserved.
LegalDisclaimer
Theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics.With
respecttoanyexamplesorhintsgivenherein,anytypicalvaluesstatedhereinand/oranyinformationregardingtheapplication
ofthedevice,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithout
limitation,warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty.
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Forfurtherinformationontechnology,deliverytermsandconditionsandpricespleasecontactyournearestInfineon
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Duetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion,
pleasecontactthenearestInfineonTechnologiesOffice.
TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/or
automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifa
failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand
aerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsare
intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itis
reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered.
Final Data Sheet
15
Rev.2.0,2013-04-18