Datasheet Download

DC Brushless Fan Motor Driver
5V Single-phase Full-wave
Fan Motor Driver
BU6909AGFT
Description
The BU6909AGFT is a 5V single-phase full-wave FAN motor driver with built in HALL element. It is part of the DC brushless
FAN motor driver series. BU6909AGFT is built in a compact package and provides Auto Gain Control function (AGC), silent
drive by soft switching, and low battery consumption via its standby function. BU6909AGFT is best used for notebook PC
cooling FANs.
Features
„ Built in HALL element
„ Auto Gain Control function (AGC)
„ Soft switching drive (PWM type)
„ Low PWM duty start up
„ Quick start function
„ Stand-by mode
„ Incorporates lock protection and automatic restart
circuit
„ Compact package (GFT:TSSOF6 flat lead package)
When TSSOF6 is mounted, package thickness is
0.3mm
„ Rotating speed pulse signal (FG) output
„ PWM speed control
Package
TSSOF6
W(Typ) x D(Typ) x H(Max)
2.90mm x 3.80mm x 0.8mm
TSSOF6
Applications
„ For compact 5V FAN such as notebook PC cooling FAN
Absolute Maximum Ratings
Parameter
Symbol
Limit
Unit
Supply Voltage
VCC
7
V
Power Dissipation
Pd
0.54(Note 1)
W
Operating Temperature
Topr
-40 to +85
°C
Storage Temperature
Tstg
-55 to +125
°C
Output Voltage
VOMAX
7
V
Output Current
IOMAX
800(Note 2)
mA
VFG
7
V
IFG
10
mA
Tjmax
125
°C
FG Signal Output Voltage
FG Signal Output Current
Junction Temperature
(Note 1) Reduce by 5.4mW/℃ over 25℃. (On 70.0mm×70.0mm×1.6mm glass epoxy board)
(Note 2) This value is not to exceed Pd.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Condition
Parameter
Operating Supply Voltage Range
Symbol
Limit
Unit
VCC
1.8 to 5.5
V
○Product structure:Silicon monolithic integrated circuit
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○This product has no protection against radioactive rays
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Datasheet
BU6909AGFT
Block Diagram
HALL ELEMENT
This is an open drain output.
Connect a pull-up resistor.
FG
Page 15.
VCC
OFFSET
CANCEL
1
6
A/D
CONVERSION
OSCILLATOR
CIRCUIT
GND
2
Consider protection against
voltage rise due to reverse
connection of power supply and
back electromotive force.
Page 14.
PWM
UVLO
5
CONTROL
LOGIC
TSD
PRE
DRIVER
Enables speed control by
applying external PWM signal.
Maximum input frequency is
50KHz.
Page 10.
OUT2
H-BRIDGE
OUT1
3
4
PWM DUTY
LOCK
PROTECTION
Conventional FAN motor driver IC with HALL element requires
adjustment of HALL bias resistor due to several factors that
affect the HALL Amplitude. This IC automatically adjusts HALL
amplitude through the use of a built in HALL element and unique
AGC function.
Page 8.
SIGNAL OUT
M
(Heatrejection
protection
circuit)
TSD : Thermal shut down(heat
circuit)
UVLO :Under voltage lock outputs (low voltage protection circuit)
Figure 1. Block diagram and Application circuit
Pin Description
Pin No.
Pin Name
1
FG
Function
FG signal output
2
GND
GND
3
OUT1
Motor output 1
4
OUT2
Motor output 2
5
PWM
PWM signal input
6
VCC
Power supply
I/O truth table
・Supply magnetic direction (positive)
・Output operation
S
VOUT1
Marking
VOUT2
BHYS
BHYS
BREV
N
B FWD
BREV
Magnetic flux density:B
BFWD
Magnetic flux density:B
Figure 2. Output operation
Supply magnetic
direction
S
N
S
N
PWM*
OUT1
OUT2
FG
H(OPEN)
H(OPEN)
L
L
H
L
L
L
L
H
L
L
L (Output Tr:ON)
H (Output Tr:OFF)
H (Output Tr:OFF)
H (Output Tr:OFF)
*When PWM terminal is L, IC state changes to stand-by mode. FG terminal is always H in stand-by mode
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Datasheet
BU6909AGFT
Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=5V)
Parameter
Symbol
MIN
TYP
MAX
Unit
Conditions
Characteristics
Circuit Current 1
ICC1
-
2
4
mA
PWM=OPEN
Figure 3
Circuit Current 2
(stand-by mode)
ICC2
-
25
50
µA
PWM=GND
Figure 4
Magnetic Switch-point for
Forward Rotation
BFWD
-
1.5
Magnetic Switch-point for
Reverse Rotation
BREV
Magnetic hysteresis
BHYS
PWM Input H Level
PWM Input L Level
mT
Figure 5
-1.5
-
mT
Figure 6
-
3.0
5.0
mT
Figure 7
VPWMH
2.5
-
VCC
V
-
VPWML
0
-
0.8
V
-
fPWM
5
-
50
kHz
-
Output Voltage
VO
-
0.16
0.24
V
Io=200mA
Upper and Lower total
Figure 8 to 13
FG Low Voltage
VFGL
-
-
0.4
V
IFG=5mA
Figure 14,15
FG Leak Current
IFGL
-
-
5
µA
VFG=7V
Figure 16
Lock Detection ON Time
tON
0.35
0.50
0.65
s
Figure 17
Lock Detection OFF Time
tOFF
3.5
5.0
6.5
s
Figure 18
PWM Input Frequency
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Datasheet
BU6909AGFT
Typical Performance Curves
100
80
3.0
Circuit current : IC C2 [µA]
Circuit current : I CC1 [mA]
4.0
85°C
25°C
-40°C
2.0
1.0
60
40
85°C
25°C
-40°C
20
Operating Voltage Range
Operating voltage range
0
0.0
1
2
3
4
5
Supply voltage : VCC [V]
1
6
2.5
2.0
1.5
85°C
25°C
-40°C
1.0
0.5
0.0
-0.5
-1.0
-1.5
-2.0
OperatingVoltage
voltage Range
range
Operating
-2.5
1
2
3
4
5
Supply voltage : VCC [V]
6
Figure 5. Magnetic Switch-point for Forward Rotation
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3
4
5
Supply Voltage : VCC [V]
6
Figure 4. Circuit Current 2 (Stand-by mode)
Magnetic switch-point for reverse rotation : BREV [mT]
Magnetic switch-point for forward rotation : BFWD [mT]
Figure 3. Circuit Current 1
2
4/18
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
-40°C
25°C
85°C
-1.0
-1.5
-2.0
Operating
voltage range
動作電圧範囲
-2.5
1
2
3
4
5
Supply voltage : VCC [V]
6
Figure 6. Magnetic Switch-point for Reverse Rotation
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Datasheet
BU6909AGFT
Typical Performance Curves
- continued
1.0
2.5
0.8
85℃
Output H voltage : VOH [V]
Magnetic hysteresis : Bhys [mT]
3.0
25℃
2.0
-40℃
1.5
1.0
0.6
0.4
85°C
25°C
-40°C
0.2
0.5
Operating voltage range
0.0
0.0
1
2
3
4
5
Supply voltage : Vcc [V]
0.0
6
1.0
1.0
0.8
0.8
0.6
1.8V
0.4
5.0V
5.5V
0.2
0.4
0.6
Output current : IO [A]
0.8
Figure 8. Output H Voltage
(Temperature Characteristics)
Output L voltage : VOL [V]
Output H voltage : VOH [V]
Figure 7. Magnetic hysteresis
0.2
0.6
85°C
0.4
25°C
-40°C
0.2
0.0
0.0
0.0
0.2
0.4
0.6
Output current : IO [A]
0.8
Figure 9. Output H Voltage
(Voltage Characteristics)
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0.0
0.2
0.4
0.6
Output current : IO [A]
0.8
Figure 10. Output L Voltage
(Temperature Characteristics)
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Datasheet
BU6909AGFT
Typical Performance Curves
- continued
1.0
1.0
1.8V
0.8
Output voltage : VO [V]
Output L voltage : VOL [V]
0.8
0.6
0.4
5.0V
5.5V
85°C
25°C
0.6
-40°C
0.4
0.2
0.2
0.0
0.0
0.0
0.2
0.4
0.6
Output current : IO [A]
0.8
0.0
Figure 11. Output L Voltage
(Voltage Characteristics)
0.2
0.4
0.6
Output current : IO [A]
0.8
Figure 12. Total Output Voltage (Output H and L)
(Temperature Characteristics)
0.5
1.0
1.8V
0.6
FG output L voltage : VFGL [V]
Output voltage : VO [V]
0.8
5.0V
5.5V
0.4
0.2
0.4
85°C
0.3
25°C
-40°C
0.2
0.1
0.0
0.0
0.0
0.2
0.4
0.6
Output current : IO [A]
0.8
Figure 13. Total Output Voltage (Output H and L)
(Voltage Characteristics)
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0
2
4
6
FG current : IFG [mA]
8
10
Figure 14. FG Output L Voltage
(Temperature Characteristics)
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BU6909AGFT
Typical Performance Curves
- continued
2.0
0.5
Operating voltage range
0.4
FG leak current : IFGL [µA]
FG output L voltage : VFGL [V]
1.8V
0.3
5.0V
5.5V
0.2
0.1
1.5
1.0
85°C
0.5
25°C
-40°C
0.0
0.0
0
2
4
6
FG current : IFG [mA]
8
1
10
2
6
Figure 16. FG Output Leak Current
Figure 15. FG Output L Voltage
(Voltage Characteristics)
1.0
10
Lock detection OFF time : tOFF [s]
Lock detection ON time : tON [s]
3
4
5
Supply voltage : VCC [V]
0.8
0.6
85°C
25°C
-40°C
0.4
0.2
8
6
85°C
25°C
-40°C
4
2
Operating voltage range
Operating voltage range
0.0
0
1
2
3
4
5
Supply voltage : VC C [V]
6
Figure 17. Lock Detection ON Time
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1
2
3
4
5
Supply voltage : VC C [V]
6
Figure 18. Lock Detection OFF Time
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BU6909AGFT
Auto gain control
Conventional FAN motor driver IC with HALL element requires adjustment of HALL bias resistor for acoustic noise
characteristic and motor rotation efficiency because the magnetic field strength and the magnetic field waveform are different
in each motor. This IC automatically controls HALL amplitude generated by built in HALL element and motor magnet
through the use of a unique AGC function. AGC function needs 15 ms to select the required HALL amp gain when turning on
the power, and recovering from stand-by mode and lock protection.(Refer to Figure 23 and 24.)
At starting
( Approach AGC area)
N
HALL signal
( image)
Indefinite
area
[+/-1.5mT]
N
At driving
(AGC control)
S
S
AGC control
Pre – AGC area
Gain up
N
Gain up
(Insufficient magnetic force area)
Pre – AGC area
(Best magnetic force area)
Motor start up
(Excess magnetic force area)
Approach AGC area by analog circuit
Precise AGC by digital circuit
VCC
PWM
PWM soft-switching time
OUT1
OUT2
FG
Hall amp gain select time : 15 ms
Figure 19. AGC Image of the Hall signal (In case of weak magnetic field)
After the startup, the Hall signal is increased by Hall amplifier gain. The increased Hall signal is set by the AGC around the
Pre-AGC area, the weak magnetic field of the motor as in Figure 19. To selecting a gain requires about 15ms before it
activates the motor.
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BU6909AGFT
Soft switching (PWM type)
Soft switching is operated using an output PWM pulse. The output PWM signal is generated by the slope of processed
AGC HALL signal. First, the processed AGC HALL signal is converted to absolute waveform. Next, the absolute waveform
and the triangular waveform internally generated by the IC are synthesized. The synthesized waveform determines the
PWM soft switching duty and the ratio of time.
PWM soft switching time depends on motor speed. In case of a slower HALL signal, PWM soft switching time is long due to
the obtuse angle of the processed AGC HALL signal (PWM soft switching time is about 2ms to 4ms.). In case of a faster
HALL signal, PWM soft switching time is short due to the sharp slope of the AGC HALL signal (PWM soft switching time is
about 200µs to 1ms.). And, the triangular wave oscillator inside the IC uses a PWM soft switching frequency of 50kHz
(typical). Hence, input PWM frequency is not equal to PWM soft switching frequency.
(a) The processed AGC HALL signal is converted to absolute waveform
(b) Motor speed is slow
(c) Motor speed is fast
Figure 20. PWM soft switching signal synthesis
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BU6909AGFT
PWM control
Rotation speed of motor can be changed by controlling ON/OFF of the upper output depending on the duty of the input
signal to PWM terminal. When PWM terminal is open, H logic is applied. Output PWM frequency is 50 kHz (Typ). This IC is
not direct PWM. Hence, input PWM frequency is not equal to output PWM frequency. Figure 21 shows the characteristic of
input PWM duty and output PWM duty.
PWM terminal has a built in digital low pass filter (LPF). Output PWM duty has 3.5ms (Max) transitional time from the point
of change in input PWM duty, this is caused by the LPF characteristic (reference is shown in Figure 22). Additionally, Input
PWM uses frequencies above 5 kHz.
Output PWM DUTY [%]
100
80
60
40
20
0
0
20
40
60
80
Input PWM DUTY [%]
100
Figure 21. Characteristic of input PWM DUTY and output PWM DUTY
Figure 22. Timing chart of PWM control
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BU6909AGFT
Low duty start up function
During motor start up from stop condition, outputs are driven by a PWM signal of about PWM 50% duty for 3 times of
changing magnetic direction. After the low PWM duty start up function, output PWM duty changes corresponding to the
input PWM duty. For cases of input PWM duty range of more than 50%, output PWM duty changes corresponding to same
input PWM duty at all driving time. This function enables the IC to start the motor regardless of input PWM signal’s duty.
When input PWM duty is 0%, the motor is held on stand-by mode. Additionally, the motor changes to idling mode for input
PWM duty range of 0% to 2.5%. Idling mode only runs on circuit current 1 (ICC1) in the Electrical Characteristics table. Idling
mode turns all output terminals to open state.
(a) Case A : Input PWM DUTY 2.5% to 50%
(b) Case B : Input PWM DUTY 50% to 100%
Figure 23. Low duty start up function
Table 1. Truth table of input PWM duty and each outputs terminals
Input PWM duty [%]
IC function (state)
DUTY 0
DUTY 0 < 2.5
OFF
ON
Case A : DUTY 2.5 to 50
ON
Case B : DUTY 50 to 100
ON
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(Stand-by mode)
(Idle mode)
(Low duty start up
driving)
(Normal driving)
11/18
OUT1, OUT2
FG
OFF, OFF (Open state)
OFF, OFF (Open state)
H (Output Tr : OFF)
H (Output Tr : OFF)
H / L, L / H
H/L
H / L, L / H
H/L
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Datasheet
BU6909AGFT
Quick start function
This series has an integrated quick start function. When the PWM signal is input, this function can start up the motor at
once regardless of the detection time of the lock protection function. (Consider HALL amp gain select time. Reference is
shown in Figure 24.)
Stand-by mode
Stand-by function turns off the circuit when the time of PWM=L has elapsed in order to reduce stand-by current. The circuit
current consumption during stand-by mode is specified at the parameter “Circuit current 2” of the electrical characteristics.
Figure 24 shows the timing diagram of stand-by mode and quick start function.
The 0% detection time before the IC changes to stand-by mode is variable depending on the input PWM duty. This is
because of the built in LPF at the PWM terminal. As an example, Figure 25 shows the characteristic curve of 0% detection
time and input PWM duty for a 25kHz input PWM frequency.
Figure 24. Stand-by mode and quick start function
Input PWM DUTY [%]
100
80
60
40
20
0
0.0
1.0
2.0
3.0
0% detection time : t0 [ms]
4.0
Figure 25. Characteristic curve of 0% detection time and input PWM duty at 25kHz
Lock protection and automatic restart
Motor rotation is detected by HALL signal, while lock detection ON time (tON) and lock detection OFF time (tOFF) are set by
IC internal counter. External part (C or R) is not required. Timing chart is shown in Figure 26.
Figure 26. Lock protection timing chart
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BU6909AGFT
Equivalent circuit
1) Supply voltage terminal
2) PWM signal input terminal
VCC
VCC
200kΩ
PWM
10kΩ
GND
3) FG output terminal
4) Motor output terminal
FG
VCC
OUT1
OUT2
GND
GND
HALL position (Reference data)
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BU6909AGFT
Safety measure
1) Reverse connection protection diode
Reverse connection of power results in IC destruction as shown in Figure 27. When reverse connection is possible,
reverse connection protection diode must be added between power supply and VCC.
In normal energization
After reverse connection destruction
prevention
Reverse power connection
VCC
VCC
Circuit
block
VCC
Circuit
block
Each
Pin
GND
Each
Pin
Circuit
block
GND
GND
Large current flows
→ Thermal destruction
Internal circuit impedance high
→ amperage small
Each
Pin
No destruction
Figure 27. Flow of current when power is connected reversely
2) Protection against VCC voltage rise by back electromotive force
Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse
connection protection diode is connected, VCC voltage rises because the diode prevents current flow to power supply.
ON
ON
ON
Phase switching
ON
Figure 28. VCC voltage rise by back electromotive force
When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place a
(A) Capacitor or (B) Zener diode between VCC and GND. If necessary, add both (C). (D) Capacitor and resistor can
also be used to have better ESD surge protection.
(A) Capacitor
(B) Zener diode
ON
ON
ON
ON
(C) Capacitor and Zener diode
(D) Capacitor and resistor
ON
ON
ON
ON
Figure 29. Protection against VCC voltage rise
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BU6909AGFT
3) Problem of GND-line PWM switching
Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum.
VCC
Motor
Driver
M
GND
Controller
PWM input
Prohibite
Figure 30. GND Line PWM switching prohibited
4) FG output
FG output is an open drain output and requires pull-up resistor. A VCC voltage that is beyond its absolute maximum
rating when FG output terminal is directly connected to power supply, could damage the IC. The IC can be protected by
adding resistor R1 (as shown in Figure 31).
VC C
Pull-up resistor
FG
R1
Protection resistor
C onnector of board
Figure 31. Protection of FG terminal
Thermal derating curve
Thermal derating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that can
be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance
θja. Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging condition,
wind velocity, etc., even when the same package is used. Thermal derating curve indicates a reference value measured at
a specified condition. Figure 32. shows a thermal derating curve.
POWER DISSIPATION : Pd [W]
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
25
50
75 100 125 150
AMBIENT TEMPERATURE : Ta [℃]
Reduce by 5.4mW/℃ over 25℃.
(70.0mm×70.0mm×1.6mm FR4 glass epoxy board)
Figure 32. Thermal derating curve
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BU6909AGFT
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
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Datasheet
BU6909AGFT
Operational Notes – continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The
operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical
damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an
input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input terminals
when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the
input terminals have voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
Marking Diagrams
TSSOF6(TOP VIEW)
A B
LOT Number
Part Number Marking
1 PIN MARK
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TSZ02201-0H1H0B101190-1-2
28.Oct.2014 Rev.002
Datasheet
BU6909AGFT
Physical Dimension, Tape and Reel Information
Package Name
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© 2014 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TSSOF6
18/18
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28.Oct.2014 Rev.002
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-GE
© 2013 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
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