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FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16658C
Generic Copy
Issue Date: 11-Apr-2013
TITLE: Sourcing MOSFET Die from United Microelectronics Corporation
PROPOSED FIRST SHIP DATE: 11-Jul-2013
AFFECTED CHANGE CATEGORY(S): ON Semiconductor Wafer Fab Site
FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:
Contact your local ON Semiconductor Sales Office or
Jason Jeong<[email protected]>
SAMPLES: Contact your local ON Semiconductor Sales Office or
Brian Goodburn<[email protected]>
ADDITIONAL RELIABILITY DATA: Available
Contact your local ON Semiconductor Sales Office or
Donna Scheuch<[email protected]>
NOTIFICATION TYPE:
Final Product/Process Change Notification (FPCN)
Final change notification sent to customers.
implementation of the change.
FPCNs are issued at least 90 days prior to
ON Semiconductor will consider this change approved unless specific conditions of acceptance are
provided in writing within 30 days of receipt of this notice. To do so, contact <[email protected]>.
DESCRIPTION AND PURPOSE:
ON Semiconductor is already utilizing United Microelectronics Corp (UMC) for their High Cell
Density (HD3e) and Trench (T2) MOSFET technology silicon platforms.
A fraction of the Trench (T1) MOSFET portfolio started to use UMC Wafer Fab July 2012 per FPCN
#16658, FPCN #16658A and FPCN #16658B. With additional qualification and electrical
characterization of this silicon platform, more T1 products will be built with Die sourced from the
UMC. Wafer shipments of this group of products will begin in July 2013.
Reliability Qualification and full electrical characterization over temperature have been performed,
and available upon request.
Issue Date: 11-Apr-2013
Rev. 06-Jan-2010
Page 1 of 2
FINAL PRODUCT/PROCESS CHANGE NOTIFICATION #16658C
RELIABILITY DATA SUMMARY:
Reliability Test Results:
NTTFS5116PLTAG
Test
HTRB
JESD22 A108
Conditions :
Ta=175°C, 80% max
rated Vdss 504 hrs
Ta=75°C, 100% of max
rated Vgss, 504 hrs
Lots
Samples/lot
Total Samples
3
80 pc
0/240
HTGB
JESD22 A108
3
80 pc
0/240
TC
JESD22 A104
-65°C to+150°C; for
1000 cycles
3
80 pc
0/240
AC
JESD22 A102
3
80 pc
0/240
H3TRB
JESD22 A101
3
80 pc
0/240
IOL
MIL-STD-750
(M1036&M1037)
AEC-Q101
121°C/100% RH, 15 psi
for 96 hrs
131°C/85% RH, 80% of
max rated Bvdss, 96hrs
Ta=+25°C, delta
Tj=100°C
On/off = 2 min
15000 cyc
3
80 pc
0/240
ELECTRICAL CHARACTERISTIC SUMMARY:
There is no change in electrical parametric performance. Characterization data is available upon
request.
CHANGED PART IDENTIFICATION:
There will be no physical change to the Devices assembled with Die from the United
Microelectronics Corp (UMC) wafer fabrication facility. There will be Wafer Lot traceability from the
manufacturing Lot to determine the Die origin.
List of affected General Parts:
NTTFS5116PLTAG
NTTFS5116PLTWG
NVTFS5116PLTAG
NVTFS5116PLTWG
Issue Date: 11-Apr-2013
Rev. 06-Jan-2010
Page 2 of 2
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