VISHAY SI3473DV

Si3473DV
New Product
Vishay Siliconix
P-Channel 12-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
-12
rDS(on) (W)
ID (A)
0.023 @ VGS = -4.5 V
-7.9
0.029 @ VGS = -2.5 V
- 7.0
0.041 @ VGS = -1.8 V
- 5.9
D TrenchFETr Power MOSFET: 1.8-V Rated
D Ultra Low On-Resistance
APPLICATIONS
D Load Switch
D PA Switch
(4) S
TSOP-6
Top View
1
6
(3) G
3 mm
2
5
3
4
(1, 2, 5, 6) D
2.85 mm
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
5 secs
Steady State
Drain-Source Voltage
VDS
-12
Gate-Source Voltage
VGS
"8
Continuous Drain Current (TJ = 150_C)
_ a
TA = 25_C
V
- 7.9
-5.9
- 5.7
-4.3
ID
TA = 85_C
Pulsed Drain Current
IDM
Continuous Diode Current (Diode Conduction)a
IS
TA = 25_C
Maximum Power Dissipationa
Unit
TA = 85_C
Operating Junction and Storage Temperature Range
PD
A
-20
-1.7
-0.9
2.0
1.1
1.0
0.6
TJ, Tstg
W
_C
-55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 5 sec
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot (Drain)
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
45
62.5
90
110
25
30
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 71937
S-22122—Rev. B, 25-Nov-02
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Si3473DV
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = -250 mA
-0.40
Typ
Max
Unit
-1
V
"100
nA
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Voltagea
VDS = -9.6 V, VGS = 0 V
-1
VDS = -9.6 V, VGS = 0 V, TJ = 85_C
-5
VDS = -5 V, VGS = -4.5 V
-20
m
mA
A
VGS = -4.5 V, ID = -7.9 A
0.019
0.023
VGS = -2.5 V, ID = -7.0 A
0.024
0.029
VGS = -1.8 V, ID = -3 A
0.033
0.041
gfs
VDS = -5 V, ID = -7.9 A
28
VSD
IS = -1.7 A, VGS = 0 V
-0.7
-1.2
22
33
rDS(on)
Forward Transconductancea
Diode Forward
VDS = 0 V, VGS = "8 V
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
5.8
Turn-On Delay Time
td(on)
25
tr
50
75
130
200
110
165
65
90
Rise Time
Turn-Off Delay Time
VDS = -6 V, VGS = -4.5 V, ID = -7.9 A
VDD = -6 V, RL = 6 W
ID ^ -1 A, VGEN = -4.5 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
3.2
IF = -1.7 A, di/dt = 100 A/ms
nC
40
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
20
20
VGS = 5 thru 2 V
16
I D - Drain Current (A)
I D - Drain Current (A)
16
1.5 V
12
8
4
12
8
TC = 125_C
4
25_C
1V
0
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
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2
5
0
0.0
0.5
-55 _C
1.0
1.5
2.0
VGS - Gate-to-Source Voltage (V)
Document Number: 71937
S-22122—Rev. B, 25-Nov-02
Si3473DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
3000
2500
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
0.08
0.06
0.04
VGS = 1.8 V
VGS = 2.5 V
Ciss
2000
1500
1000
Coss
0.02
Crss
500
VGS = 4.5 V
0.00
0
0
4
8
12
16
20
0
3
ID - Drain Current (A)
Gate Charge
12
On-Resistance vs. Junction Temperature
1.4
VDS = 6 V
ID = 7.9 A
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
9
VDS - Drain-to-Source Voltage (V)
5
4
3
2
VGS = 4.5 V
ID = 7.9 A
1.2
1.0
0.8
1
0
0
4
8
12
16
20
0.6
-50
24
-25
0
Qg - Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.08
r DS(on) - On-Resistance ( W )
10
TJ = 150_C
TJ = 25_C
1
0.0
25
TJ - Junction Temperature (_C)
20
I S - Source Current (A)
6
0.06
ID = 7.9 A
0.04
ID = 3 A
0.02
0.00
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
Document Number: 71937
S-22122—Rev. B, 25-Nov-02
1.2
0
1
2
3
4
5
VGS - Gate-to-Source Voltage (V)
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Si3473DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.4
40
32
ID = 250 mA
0.2
Power (W)
V GS(th) Variance (V)
0.3
0.1
24
TA = 25_C
16
0.0
8
-0.1
-0.2
-50
-25
0
25
50
75
100
125
0
10- 2
150
10- 1
TJ - Temperature (_C)
1
10
100
600
Time (sec)
Safe Operating Area
1000
rDS(on) Limited
IDM Limited
I D - Drain Current (A)
100
P(t) = 0.001
P(t) = 0.01
10
ID(on)
Limited
P(t) = 0.1
1
P(t) = 1
P(t) = 10
TC = 25_C
Single Pulse
BVDSS Limited
0.1
0.1
dc
1
10
100
VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 90_C/W
3. TJM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10- 4
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4
10- 3
10- 2
10- 1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 71937
S-22122—Rev. B, 25-Nov-02
Si3473DV
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10- 4
Document Number: 71937
S-22122—Rev. B, 25-Nov-02
10- 3
10- 2
10- 1
Square Wave Pulse Duration (sec)
1
10
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