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Gate Driver Providing Galvanic isolation Series
Isolation voltage 2500Vrms
1ch Gate Driver Providing Galvanic Isolation
BM60014FV-C
General Description
Key Specifications




The BM60014FV-C is a gate driver with an isolation
voltage of 2500Vrms, I/O delay time of 120ns, and
minimum input pulse width of 70ns. It incorporates the
fault signal output functions, Under-voltage Lockout
(UVLO) function and Miller clamp function.
Isolation voltage:
Maximum gate drive voltage:
I/O delay time:
Minimum input pulse width:
2500Vrms
24V
120ns(Max)
70ns(Max)
Features
 AEC-Q100 Qualified(Note1)
 Providing Galvanic Isolation
 Active Miller Clamping
 Fault signal output function
 Under-voltage Lockout function
 UL1577 Recognized:File No. E356010
(Note1: Grade1)
Package
W(Typ) x D(Typ) x H(Max)
6.50mm x 8.10mm x 2.01mm
SSOP-B20W
Applications
 IGBT Gate Driver
 MOSFET Gate Driver
Typical Application Circuits
GND1
Gen
NC
NC
Gen
GND2
NC
NC
UVLO1
P VCC1
INA
UVLO2
S
Q
R
Pulse
Generator
U
INB
P VCC2
Predriver
OUT
U
MC
U
U
XFLT
NC
UVLO1
1
U
NC
U
+
U
-
NC
U
GND1
U
NC
U
GND2
NC
U 1pin
Figure 1. Application Circuits (IGBT Gate Driver)
GND1
Gen
NC
NC
Gen
GND2
NC
NC
UVLO1
P VCC1
INA
UVLO2
S
Q
R
Pulse
Generator
U
INB
P VCC2
Predriver
OUT
U
MC
U
U
XFLT
NC
UVLO1
1
U
NC
U
+
U
-
NC
U
GND1
U
NC
U
GND2
NC
U 1pin
Figure 2. Application Circuits (MOSFET Gate Driver)
〇Product structure : Silicon integrated circuit
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Recommended Range of External Constants
Pin Name
Symbol
VCC1
VCC2
Recommended Value
Unit
Min.
Typ.
Max.
CVCC1
0.1
1.0
-
µF
CVCC2
0.33
-
-
µF
Pin Configurations
(TOP VIEW)
NC
1
GND2
2
NC
3
NC
4
MC
5
OUT
6
VCC2
7
NC
8
GND2
9
20
8
19
8
18
8
17
8
16
8
15
8
14
8
13
8
12
8
11
8
NC 10
GND1
NC
NC
XFLT
INB
INA
VCC1
NC
NC
GND1
Pin Descriptions
Pin No.
Pin Name
Function
1
NC
2
GND2
3
NC
No Connection
4
NC
No Connection
5
MC
Output pin for Miller Clamp
6
OUT
Output pin
7
VCC2
Output-side power supply pin
8
NC
9
GND2
10
NC
No Connection
Output-side ground pin
No Connection
Output-side ground pin
No Connection
11
GND1
12
NC
No Connection
13
NC
No Connection
14
VCC1
15
INA
Control input pin A
16
INB
Control input pin B
17
XFLT
18
NC
No Connection
19
NC
No Connection
20
GND1
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Input-side ground pin
Input-side power supply pin
Fault signal output pin
Input-side ground pin
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Description of pins and cautions on layout of board
1) VCC1 (Input-side power supply pin)
The VCC1 pin is a power supply pin on the input side. To suppress voltage fluctuations due to the current to drive internal
transformers, connect a bypass capacitor between the VCC1 and the GND1 pins.
2) GND1 (Input-side ground pin)
The GND1 pin is a ground pin on the input side.
3) VCC2 (Output-side positive power supply pin)
The VCC2 pin is a power supply pin on the output side. To reduce voltage fluctuations due to OUT pin output current,
connect a bypass capacitor between the VCC2 and the GND2 pins.
4) GND2 (Output-side ground pin)
The GND2 pin is a ground pin on the output side.
5) INA, INB (Control input terminal)
The INA and INB pins are used to determine output logic.
INB
INA
OUT
H
L
L
H
H
L
L
L
L
L
H
H
6) OUT (Output pin)
The OUT pin is used to drive the gate of a power device.
7) MC (Output pin for Miller Clamp)
The MC pin is for preventing the increase in gate voltage due to the Miller current of the power device connected to the
OUT pin. If the Miller Clamp function is not used, short-circuit the MC pin to the GND2 pin.
8) XFLT (Fault signal output pin)
The XFLT pin is an open drain pin used to output a fault signal when a fault occurs (i.e., when the Under-voltage Lockout
function (UVLO1) is activated).
Conditions
XFLT
While in normal operation
L
When an Fault occurs
Hi-Z
(When UVLO1 is activated)
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Description of functions and examples of constant setting
1) Miller Clamp function
When INA=L and OUT pin voltage < VMCON (typ 2V), the internal MOSFET of the MC pin is turned ON.
INA
MC
Internal MOSFET of the MC pin
L
less than VMCON
ON
H
X
OFF
VCC2
PREDRIVER
LOGIC
OUT
GATE
PREDRIVER
MC
PREDRIVER
+
-
VMCON
GND2
Figure 3. Block diagram of Miller Clamp function.
tPOFFA
tPONA
H
INA
L
H
OUT
L
H
GATE
VMCON
L
Hi-Z
MC
L
Figure 4. Timing chart of Miller Clamp function
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2) Under-voltage Lockout (UVLO) function
The BM60014FV-C incorporates the Under-voltage Lockout (UVLO) function both on the low and the high voltage sides.
When the power supply voltage drops to the UVLO ON voltage (low voltage side typ 3.4V, high voltage side voltage typ
9.5V), the OUT pin will output the “L” signal. In addition, to prevent malfunctions due to noises, a mask time of tUVLO1MSK
(typ 2.5µs) and tUVLO2MSK (typ 2.85µs) are set on both the low and the high voltage sides.
This IC does not have a function which feeds back the high voltage side state to the low voltage side. After the high
voltage side UVLO is released, the input signal will take effect from the time after the input signal switches.
H
INA
L
VUVLO1H
VCC1
H
OUT
L
Hi-Z
XFLT
L
Figure 5. Input-side UVLO Function Operation Timing Chart
H
INA
L
VUVLO2H
VUVLO2L
VCC2
H
Hi-Z
L
OUT
Hi-Z
XFLT
L
Figure 6. Output-side UVLO Function Operation Timing Chart
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BM60014FV-C
3)I/O condition table
Input
Output
No.
Status
V
C
C
1
V
C
C
2
I
N
B
I
N
A
O
U
T
M
C
X
F
L
T
1
VCC1UVLO
UVLO
X
X
X
L
L
H
2
VCC2UVLO
X
UVLO
X
X
L
L
L
3
INB Active
○
○
H
X
L
L
L
4
Normal operation L input
○
○
L
L
L
L
L
5
Normal operation H input
○
○
L
H
H
Hi-Z
L
○: VCC1 or VCC2 > UVLO, X:Don't care
4) Power supply startup / shutoff sequence
H
INA
L
VCC1
VCC2
VUVLO1H
VUVLO2H
VUVLO1L
VUVLO1H
VUVLO2L
VUVLO2H
VUVLO1L
VUVLO2L
Hi-Z
L
H
Hi-Z
L
XFLT
OUT
MC
Hi-Z
L
: Since the VCC2 to GND2 pin voltage is low and the output MOS does not turn ON, the
output pins become Hi-Z.
Figure 7. Power Supply Startup / Shutoff Sequence
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Absolute Maximum Ratings
Parameter
Input-side supply voltage
Output-side supply voltage
Symbol
Limits
Unit
VCC1
-0.3~+7.0(Note 1)
V
VCC2
-0.3~+30.0(Note 2)
V
+7.0(Note 3)
V
INA pin input voltage
VINA
-0.3~+VCC1+0.3 or
INB pin input voltage
VINB
-0.3~+VCC1+0.3 or +7.0(Note1)
V
IOUTPEAK
5.0(Note 3)
A
IXFLT
10
mA
Pd
1.19(Note 4)
W
Operating temperature range
Topr
-40~+125
°C
Storage temperature range
Tstg
-55~+150
°C
Tjmax
+150
°C
OUT pin output current (Peak 10µs)
XFLT pin output current
Power dissipation
Junction temperature
(Note 1) Relative to GND1.
(Note 2) Relative to GND2.
(Note 3) Should not exceed Pd and Tj=150°C
(Note 4) Derate by 9.5mW/°C when operating above Ta=25°C. Mounted on a glass epoxy of 70mm ×70mm ×1.6mm.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Ratings
Parameter
Symbol
Min.
Max.
Units
Input-side supply voltage
VCC1(Note 5)
4.5
5.5
VCC1(Note 5)
Output-side supply voltage
VCC2(Note 6)
10
24
VCC2(Note 6)
(Note 5)
(Note 6)
Relative to GND1.
Relative to GND2.
Insulation Related Characteristics
Parameter
Symbol
Characteristic
Units
RS
>109
Ω
Insulation Withstand Voltage / 1min
VISO
2500
Vrms
Insulation Test Voltage / 1sec
VISO
3000
Vrms
Insulation Resistance (VIO=500V)
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Electrical Characteristics
(Unless otherwise specified Ta=-40°C to 125°C, V CC1=4.5V to 5.5V, VCC2=10V to 24V)
Parameter
Symbol
Min.
Typ.
Max.
General
Input side circuit current 1
ICC11
0.06
0.14
0.22
Unit
Conditions
mA
Input side circuit current 2
Input side circuit current 3
ICC12
ICC13
0.10
0.15
0.20
0.30
0.30
0.45
mA
mA
INA =10kHz, Duty=50%
INA =20kHz, Duty=50%
Output side circuit current 1
Output side circuit current 2
Logic block
Logic high level input voltage
ICC21
ICC22
0.26
0.22
0.44
0.38
0.62
0.57
mA
mA
OUT=L
OUT=H
VINH
2.0
-
VCC1
V
INA, INB
Logic low level input voltage
Logic pull-down resistance
VINL
RIND
0
25
50
0.8
100
V
kΩ
INA, INB
INA, INB
Logic input minimum pulse width
Output
tINMIN
-
-
70
ns
INA, INB
OUT ON resistance (Source)
OUT ON resistance (Sink)
RONH
RONL
0.4
0.2
0.9
0.6
2.0
1.3
Ω
Ω
OUT maximum current (Source)
IOUTMAXH
3.0
4.5
-
A
OUT maximum current (Sink)
IOUTMAXL
3.0
3.9
-
A
Turn ON time
tPONA
tPONB
70
65
90
85
120
115
ns
ns
IOUT=-40mA
IOUT=40mA
VCC2=15V,
Guaranteed by design
VCC2=15V,
Guaranteed by design
INA=PWM, INB=L
INA=H, INB=PWM
Turn OFF time
tPOFFA
tPOFFB
70
75
90
95
120
125
ns
ns
INA=PWM, INB=L
INA=H, INB=PWM
Propagation distortion
tPDISTA
tPDISTB
-25
-15
0
10
25
35
ns
ns
tPOFFA – tPONA
tPOFFB – tPONB
tRISE
tFALL
0.20
50
50
0.65
1.40
ns
ns
Ω
10nF between OUT-GND2
Rise time
Fall time
MC ON resistance
MC ON threshold voltage
RONMC
VMCON
1.8
2
2.2
V
CM
100
-
-
kV/µs
VCC1 UVLO OFF voltage
VCC1 UVLO ON voltage
VUVLO1H
VUVLO1L
3.35
3.25
3.50
3.40
3.65
3.55
V
V
VCC1 UVLO mask time
VCC2 UVLO OFF voltage
tUVLO1MSK
VUVLO2H
1.0
9.0
2.5
9.5
5.0
10.0
µs
V
VCC2 UVLO ON voltage
VCC2 UVLO mask time
VUVLO2L
tUVLO2MSK
8.0
1.00
8.5
2.85
9.0
5.00
V
µs
VXFLT
-
0.10
0.25
V
Common Mode Transient Immunity
10nF between OUT-GND2
IMC=40mA
Guaranteed by design
Protection functions
XFLT output L voltage
INA
50%
IXFLT=5mA
50%
tPONA
tPOFFA
OUT
90%
50%
10%
90%
tFALL
tRISE
50%
10%
Figure 8. IN-OUT Timing Chart
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BM60014FV-C
UL1577 Ratings Table
Following values are described in UL Report.
Parameter
Values
Units
Side 1 (Input Side) Circuit Current
0.14
mA
VCC1=5.0V, OUT=L
Side 2 (Output Side) Circuit Current
0.44
mA
VCC2=V, OUT=L
Side 1 (Input Side) Consumption Power
0.7
mW
VCC1=5.0V, OUT=L
Side 2 (Output Side) Consumption Power
6.6
mW
VCC2=15V, OUT=L
Isolation Voltage
2500
Vrms
Maximum Operating (Ambient) Temperature
125
℃
Maximum Junction Temperature
150
℃
Maximum Strage Temperature
150
℃
Maximum Data Transmission Rate
2.5
MHz
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Conditions
TSZ02201-0P5P0BH00010-1-2
25.Dec.2015 Rev.004
BM60014FV-C
0.22
0.22
0.20
0.20
0.18
0.18
Ta=125°C
0.16
ICC11 [mA]
ICC11 [mA]
Typical Performance Curves
0.14
0.16
0.14
0.12
0.12
0.10
0.10
VCC1=5.5V
VCC1=5.0V
VCC1=4.5V
Ta=25°C
0.08
0.08
Ta=-40°C
0.06
0.06
4.50
4.75
5.00
5.25
5.50
VCC1 [V]
Figure 9. Input Side Circuit Current vs Input Side Supply Voltage
0.30
-40
-20
0
20
40
60
80 100 120
Ta [°C]
Figure 10. Input Side Circuit Current vs Temperature
0.30
Ta=125°C
0.26
0.22
ICC12 [mA]
ICC12 [mA]
0.26
0.18
Ta=25°C
0.22
VCC1=5.5V
0.18
VCC1=5.0V
VCC1=4.5V
Ta=-40°C
0.14
0.14
0.10
0.10
4.50
4.75
5.00
5.25
5.50
VCC1 [V]
Figure 11. Input Side Circuit Current vs Input Side Supply Voltage
(at INA=10kHz, Duty=50%)
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-40
-20
0
20
40
60
80 100 120
Ta [°C]
Figure 12. Input Side Circuit Current vs Temperature
(at INA=10kHz, Duty=50%)
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25.Dec.2015 Rev.004
BM60014FV-C
Typical Performance Curves
- continued
4.9
0.45
4.5
0.40
Ta=125°C
4.1
ICC13 [mA]
ICC14 [mA]
0.35
3.7
3.3
0.30
VCC1=5.5V
0.25
2.9
Ta=25°C
VCC1=5.0V
Ta=-40°C
VCC1=4.5V
0.20
2.5
2.1
0.15
4.50
4.75
5.00
VCC1 [V]
5.25
5.50
-40
Figure 13. Input Side Circuit Current vs Input Side Supply Voltage
(INA=20kHz, Duty=50%)
0.60
-20
0
20
40
60
80 100 120
Ta [°C]
Figure 14. Input Side Circuit Current vs Temperature
(INA=20kHz, Duty=50%)
0.60
Ta=125°C
0.55
0.55
VCC2=24V
0.50
ICC21 [mA]
ICC21 [mA]
0.50
0.45
0.40
0.45
0.40
VCC2=15V
Ta=25°C
0.35
0.35
0.30
0.30
VCC2=10V
Ta=-40°C
0.25
0.25
10
12
14
16
18
VCC2 [V]
20
22
24
Figure 15. Output Side Circuit Current vs Output Side Supply Voltage
(at OUT=L)
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-40
-20
0
20
40
60
Ta [°C]
80
100 120
Figure 16. Output Side Circuit Current vs Temperature
(at OUT=L)
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BM60014FV-C
Typical Performance Curves
- continued
0.57
0.57
0.52
0.52
VCC2=24V
Ta=125°C
0.47
ICC22 [mA]
ICC22 [mA]
0.47
0.42
0.37
0.42
0.37
0.32
0.32
VCC2=15V
Ta=25°C
0.27
0.27
VCC2=10V
Ta=-40°C
0.22
-40 -20
0
20
40
60
80 100 120
16
18
20
22
24
Ta [°C]
VCC2 [V]
Figure 17. Output Side Circuit Current vs Output Side Supply Voltage
Figure 18. Output Side Circuit Current vs Temperature
(at OUT=H)
(at OUT=H)
0.22
12
14
3.0
24
2.5
20
Ta=-40°C
Ta=25°C
Ta=125°C
2.0
H level
1.5
Vcc1=5V
16
OUT [V]
VINH / VINL [V]
10
12
L level
Ta=-40°C
Ta=25°C
Ta=125°C
1.0
8
0.5
4
0.0
0
4.50
4.75
5.00
VCC1 [V]
5.25
5.50
Figure 19. Logic (INA/INB) High/Low Level Voltage
vs Input Side Supply Voltage
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0
1
2
3
4
INA [V]
Figure 20. OUT vs Logic (INA) Input Voltage
(VCC1=5V, VCC2=15V, Ta=25°C)
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5
BM60014FV-C
Typical Performance Curves
- continued
100
100
80
Vcc1=4.5V
Vcc1=5.0V
Vcc1=5.5V
tINMin [ns]
RIND [kΩ]
75
50
60
40
Vcc1=4.5V
Vcc1=5.0V
Vcc1=5.5V
25
20
0
0
-40
-20
0
20
40
60
Ta [°C]
80
100
120
-40
Figure 21. Logic Pull-down Resistance vs Temperature
40
60
80 100 120
Ta [°C]
Figure 22. Logic (INA) Input Minimum Pulse Width vs Temperature
2.0
-20
0
1.2
Vcc2=10V
Vcc2=15V
Vcc2=24V
1.0
1.6
Vcc2=10V
Vcc2=15V
Vcc2=24V
RONL [Ω]
RONH [Ω]
20
1.2
0.8
0.6
0.8
0.4
0.4
0.2
-40
-20
0
20
40
60
Ta [°C]
80
100
120
Figure 23. OUT ON Resistance (Source) vs Temperature
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-40
-20
0
20
40
60
80 100 120
Ta [°C]
Figure 24. OUT ON Resistance (Sink) vs Temperature
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BM60014FV-C
- continued
120
120
110
110
Vcc2=10V
Vcc2=15V
Vcc2=24V
100
tPOFFA [ns]
tPONA [ns]
Typical Performance Curves
90
Vcc2=10V
Vcc2=15V
Vcc2=24V
100
90
80
80
70
70
-40
-20
0
20
40
60
Ta [°C]
80
100
-40
120
0
20
40
60
Ta [°C]
80
100
120
Figure 26. Turn OFF Time vs Temperature
(INA=PWM, INB=L)
Figure 25. Turn ON Time vs Temperature
(INA=PWM, INB=L)
120
120
110
110
Vcc2=10V
Vcc2=15V
Vcc2=24V
tPOFFB [ns]
tPONB [ns]
-20
100
90
100
Vcc2=10V
Vcc2=15V
Vcc2=24V
90
80
80
70
70
-40
-20
0
-40
20
40
60
80 100 120
Ta [°C]
Figure 27. Turn ON Time vs Temperature
(INA=H, INB=PWM)
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TSZ22111 • 15 • 001
14/26
-20
0
20
40
60
80 100 120
Ta [°C]
Figure 28. Turn OFF Time vs Temperature
(INA=H, INB=PWM)
TSZ02201-0P5P0BH00010-1-2
25.Dec.2015 Rev.004
BM60014FV-C
Typical Performance Curves
- continued
100
100
75
75
Ta=125°C
tFALL [ns]
tRISE [ns]
Ta=125°C
50
50
Ta=25°C
Ta=25°C
Ta=-40°C
Ta=-40°C
25
25
10
10
18
22
VCC2 [V]
Figure 30. Fall Time vs Output Side Supply Voltage
(10nF between OUT-GND2)
14
18
22
VCC2 [V]
Figure 29. Rise Time vs Output Side Supply Voltage
(10nF between OUT-GND2)
2.0
2.2
1.6
2.1
Vcc2=10V
Vcc2=15V
Vcc2=24V
1.2
VMCON [V]
RONH [Ω]
14
0.8
2.0
Vcc2=10V
Vcc2=15V
Vcc2=24V
1.9
0.4
1.8
-40
-20
0
20
40
60
80 100 120
Ta [°C]
Figure 31. MC ON Resistance vs Temperature
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
-40
15/26
-20
0
20
40
60
80 100 120
Ta [°C]
Figure 32. MC ON Threshold Voltage vs Temperature
TSZ02201-0P5P0BH00010-1-2
25.Dec.2015 Rev.004
BM60014FV-C
Typical Performance Curves
- continued
3.65
5
3.60
4
tUVLO1MSK [µs]
VUVLO1H/L [V]
3.55
3.50
3.45
VUVLO1H
3.40
3
2
3.35
1
VUVLO1L
3.30
0
3.25
40
60
80 100 120
Ta [°C]
Figure 33. Input Side UVLO ON/OFF Voltage vs Temperature
-40
10.0
5
-40
-20
0
20
-20
0
20
40
60
80
100
120
Ta [°C]
Figure 34. Input Side UVLO Mask Time vs Temperature
4
tUVLO2MSK [µs]
VUVLO2H/L [V]
9.5
VUVLO2H
9.0
3
2
8.5
1
VUVLO2L
8.0
0
-40
-20
0
20
40
60
Ta [°C]
80
100
120
-20
0
20
40
60
80
100
120
Ta [°C]
Figure 35. Output Side UVLO ON/OFF voltage vs Temperature
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-40
16/26
Figure 36. Output Side UVLO Mask Time vs Temperature
TSZ02201-0P5P0BH00010-1-2
25.Dec.2015 Rev.004
BM60014FV-C
Typical Performance Curves
- continued
0.4
Ta=125°C
0.3
Ta=25°C
VXFLT [V]
Ta=-40°C
0.2
0.1
0.0
4.50
4.75
5.00
VCC1 [V]
5.25
5.50
Figure 37. Output Low Voltage vs Input Side Supply Voltage
(IXFLT=5mA)
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Selection of Components Externally Connected
GND1
Gen
NC
NC
Gen
GND2
NC
P VCC1
NC
UVLO1
INA
Pulse
Generator
U
INB
UVLO2
S
Q
R
P VCC2
Predriver
OUT
U
MC
U
U
XFLT
U
NC
NC
UVLO1
1
U
NC
U
GND2
+
U
-
NC
U
GND1
U
Figure 38. For Driving IGBT
Recommended
ROHM
MCR03EZP
GND1
Gen
NC
INA
U
INB
Recommended
ROHM
2SCR542P
NC
Gen
GND2
NC
P VCC1
Recommended
ROHM
MCR100EZP
NC
U 1pin
Recommended
ROHM
MCR100EZP
NC
UVLO2
UVLO1
Pulse
Generator
S
Q
R
P VCC2
Predriver
OUT
U
MC
U
U
XFLT
U
NC
U
+
U
-
NC
U
GND1
U
NC
U
GND2
NC
U 1pin
GND1
Gen
NC
U
INB
Recommended
ROHM
MCR100EZP
NC
Gen
GND2
NC
INA
Recommended
ROHM
2SAR542P
Figure 39. For Driving IGBT with Buffer Circuits
Recommended
ROHM
MCR03EZP
P VCC1
Recommended
ROHM
MCR100EZP
NC
UVLO1
1
NC
UVLO1
Pulse
Generator
UVLO2
S
Q
R
P VCC2
Predriver
Recommended
ROHM
MCR03EZP
OUT
U
MC
U
U
XFLT
U
NC
NC
UVLO1
1
U
+
U
-
NC
U
GND1
U
Recommended
ROHM
MCR03EZP
NC
U
GND2
NC
U 1pin
Figure 40. For Driving IGBT with Negative Power Supply
Recommended
ROHM
2SCR542P
GND1
Gen
NC
NC
Gen
GND2
NC
P VCC1
INA
U
INB
Recommended
ROHM
TDZTR5.1
Recommended
ROHM
MCR100EZP
NC
UVLO1
Pulse
Generator
UVLO2
S
Q
R
P VCC2
Predriver
Recommended
ROHM
MCR100EZP
OUT
U
MC
U
U
XFLT
U
NC
NC
UVLO1
1
U
U
+
-
NC
U
GND1
U
Recommended
ROHM
MCR03EZP
Recommended
ROHM
2SAR542P
NC
U
GND2
NC
U 1pin
Figure 41. For Driving IGBT with Buffer Circuits & Negative Power Supply
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Recommended
ROHM
TDZTR5.1
18/26
Recommended
ROHM
MCR03EZP
TSZ02201-0P5P0BH00010-1-2
25.Dec.2015 Rev.004
BM60014FV-C
GND1
Gen
NC
NC
Gen
GND2
NC
P VCC1
NC
UVLO1
INA
Pulse
Generator
U
INB
UVLO2
S
Q
R
P VCC2
Predriver
OUT
U
MC
U
U
XFLT
U
NC
NC
UVLO1
1
U
NC
U
GND2
+
U
-
NC
U
GND1
U
Figure 42. For Driving MOSFET
Recommended
ROHM
MCR03EZP
Recommended
ROHM
2SCR542P
GND1
Gen
NC
NC
Gen
GND2
NC
P VCC1
INA
U
INB
Recommended
ROHM
MCR100EZP
NC
U 1pin
Recommended
ROHM
MCR100EZP
NC
UVLO2
UVLO1
Pulse
Generator
S
Q
R
P VCC2
Predriver
OUT
U
MC
U
U
XFLT
U
NC
U
+
U
-
NC
U
GND1
U
NC
U
GND2
NC
U 1pin
GND1
Gen
NC
U
INB
Recommended
ROHM
MCR100EZP
NC
Gen
GND2
NC
INA
Recommended
ROHM
2SAR542P
Figure 43. For Driving MOSFET with Buffer Circuits
Recommended
ROHM
MCR03EZP
P VCC1
Recommended
ROHM
MCR100EZP
NC
UVLO1
1
NC
UVLO1
Pulse
Generator
UVLO2
S
Q
R
P VCC2
Predriver
Recommended
ROHM
MCR03EZP
OUT
U
MC
U
U
XFLT
U
NC
NC
UVLO1
1
U
+
U
-
NC
U
GND1
U
Recommended
ROHM
MCR03EZP
NC
U
GND2
NC
U 1pin
Figure 44. For Driving MOSFET with Negative Power Supply
Recommended
ROHM
2SCR542P
GND1
Gen
NC
NC
Gen
GND2
NC
P VCC1
INA
U
INB
Recommended
ROHM
TDZTR5.1
Recommended
ROHM
MCR100EZP
NC
UVLO1
Pulse
Generator
UVLO2
S
Q
R
P VCC2
Predriver
Recommended
ROHM
MCR100EZP
OUT
U
MC
U
U
XFLT
U
NC
NC
UVLO1
1
U
U
+
-
NC
U
GND1
U
Recommended
ROHM
MCR03EZP
Recommended
ROHM
2SAR542P
NC
U
GND2
NC
U 1pin
Figure 45. For Driving MOSFET with Buffer Circuits & Negative Power Supply
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
Recommended
ROHM
TDZTR5.1
19/26
Recommended
ROHM
MCR03EZP
TSZ02201-0P5P0BH00010-1-2
25.Dec.2015 Rev.004
BM60014FV-C
Power Dissipation
Measurement machine:TH156(Kuwano Electric)
Measurement condition:ROHM board
Board size:70×70×1.6mm3
1-layer board:θja=105.3°C/W
Power Dissipation:Pd [W]
1.5
1.19 W
1.0
0.5
0
0
25
50
75
100
125
150
Ambient Temperature: Ta[°C]
Figure 46. SSOP-B20W Derating Curve
Thermal Design
Please make sure that the IC’s chip temperature Tj is not over 150°C, while considering the IC’s power consumption (W),
package power (Pd) and ambient temperature (Ta). When Tj=150°C is exceeded, the function as a semiconductor will not
operate and some problems (ex. Abnormal operation of various parasitic elements and increasing of leak current) occur.
Constant use under these circumstances leads to deterioration and eventually IC may destruct. Tjmax=150°C must be strictly
followed under all circumstances.
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20/26
TSZ02201-0P5P0BH00010-1-2
25.Dec.2015 Rev.004
BM60014FV-C
I/O Equivalent Circuits
Name
Pin No
I/O equivalence circuits
Function
VCC2
OUT
1
OUT
Output pin
GND2
VCC2
MC
2
MC
Output pin for Miller clamp
GND2
VCC1
INA
Control input pin A
INA
INB
3
INB
Control input pin B
GND1
XFLT
XFLT
4
Fault signal output pin
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TSZ22111 • 15 • 001
GND1
21/26
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25.Dec.2015 Rev.004
BM60014FV-C
Operational Notes
1.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
6.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
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TSZ22111 • 15 • 001
22/26
TSZ02201-0P5P0BH00010-1-2
25.Dec.2015 Rev.004
BM60014FV-C
Operational Notes – continued
11.
Unused Input Terminals
Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
12. Regarding Input Pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
C
E
Pin A
N
P+
P
N
N
P+
N
Pin B
B
Parasitic
Elements
N
P+
N P
N
P+
B
N
C
E
Parasitic
Elements
P Substrate
P Substrate
GND
GND
Parasitic
Elements
GND
Parasitic
Elements
GND
N Region
close-by
Figure 47. Example of monolithic IC structure
13.
Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
23/26
TSZ02201-0P5P0BH00010-1-2
25.Dec.2015 Rev.004
BM60014FV-C
Ordering Information
B
M
6
0
0
1
Part Number
4
F
V
Package
FV:SSOP-B20W
-
CE 2
Product class
C: for Automotive applications
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
SSOP-B20W(TOP VIEW)
Part Number Marking
BM60014
LOT Number
1PIN MARK
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25.Dec.2015 Rev.004
BM60014FV-C
Physical Dimension, Tape and Reel Information
Package Name
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
SSOP-B20W
25/26
TSZ02201-0P5P0BH00010-1-2
25.Dec.2015 Rev.004
BM60014FV-C
Revision History
Date
Revision
25.Nov.2013
001
26.Jan.2015
002
20.May.2015
25.Dec.2015
003
004
Changes
New Release
Page 1 Add AEC-Q100 Grade
Page 15 Change Typical Performance Curve Figure.36
Page 1 Features Adding item (UL1577 Recognized)
Page 9 Adding UL1577 Rating Table
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TSZ22111 • 15 • 001
26/26
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25.Dec.2015 Rev.004
Notice
Precaution on using ROHM Products
1.
(Note 1)
If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001
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