Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ) 8S2 GPC Matte Tin (Sn) RoHS Compliant e3 Green Compliant Amkor Philippines REACH Compliant STN Yes Yes Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Bisphenol‐F Epichlorhydrin Resin Polyglycidyl Ester 2,6‐Diglycidyl Phenyl Allyl Ether Oligomer Copper Oxide gamma‐Butyrolactone Poly(oxypropylene)diamine 1,4‐Bis(2,3‐epoxypropoxy)butane 7440‐22‐4 9003‐36‐5 68475‐94‐5 Proprietary 1317‐38‐0 96‐48‐0 Proprietary 2425‐79‐8 Silver (Ag) 7440‐22‐4 Gold (Au) 7440‐57‐5 Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black 60676‐86‐0 Proprietary 29690‐82‐2 Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Sub‐Total Terminal Plating Sub‐Total Total Weight (mg) 24.169 0.596 0.025 0.025 24.814 2.820 2.820 0.153 0.013 0.013 0.011 0.010 0.005 0.005 0.001 0.209 0.350 0.350 0.055 0.055 81.158 7.318 3.041 3.041 0.475 95.033 1.966 1.966 125.248 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 73.1 731000 6.0 60000 6.0 60000 5.2 52000 4.6 46000 2.3 23000 2.3 23000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 100.0 1000000 85.4 854000 7.7 77000 3.2 32000 3.2 32000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 19.30 192969 0.48 4755 0.02 198 0.02 198 19.81 198120 2.25 22514 2.25 22514 0.12 1220 0.01 100 0.01 100 0.01 87 0.01 77 0.00 38 0.00 38 0.00 8 0.17 1669 0.28 2795 0.28 2795 0.04 438 0.04 438 64.80 647984 5.84 58425 2.43 24280 2.43 24280 0.38 3794 75.88 758764 1.57 15700 1.57 15700 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 19, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ) 8S2 GPC STN Yes Matte Tin (Sn) RoHS Compliant e3 Green Compliant Yes Lingsen REACH Compliant Yes Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) Silicon (Si) Silver (Ag) Epoxy Resin t‐Butyl Phenyl Glycidyl Ether Butyl Cellosolve Acetate Phenolic Resin Dicyandiamide Silver (Ag) Gold (Au) Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Tin (Sn) Package Material Declaration Homogeneous Material CAS # Weight (mg) Percentage ppm 7440‐50‐8 24.169 97.4 974000 7439‐89‐6 0.596 2.4 24000 7723‐14‐0 0.025 0.1 1000 7440‐66‐6 0.025 0.1 1000 24.814 100.0 1000000 7440‐21‐3 2.820 100.0 1000000 2.820 100.0 1000000 7440‐22‐4 0.139 72.1 721000 9003‐36‐5 0.038 19.5 195000 3101‐60‐8 0.013 6.5 65000 0.002 0.8 8000 112‐07‐2 92‐88‐6 0.002 0.8 8000 461‐58‐5 0.001 0.3 3000 0.193 100.0 1000000 7440‐22‐4 0.350 100.0 1000000 0.350 100.0 1000000 7440‐57‐5 0.055 100.0 1000000 0.055 100.0 1000000 60676‐86‐0 81.158 85.4 854000 Proprietary 7.318 7.7 77000 29690‐82‐2 3.041 3.2 32000 Proprietary 3.041 3.2 32000 1333‐86‐4 0.475 0.5 5000 95.033 100.0 1000000 7440‐31‐5 1.966 100.0 1000000 1.966 100.0 1000000 125.231 Package Percentage ppm 19.30 192995 0.48 4756 0.02 198 0.02 198 19.81 198146 2.25 22517 2.25 22517 0.11 1108 0.03 300 0.01 100 0.00 12 0.00 12 0.00 5 0.15 1537 0.28 2795 0.28 2795 0.04 438 0.04 438 64.81 648070 5.84 58433 2.43 24284 2.43 24284 0.38 3794 75.89 758864 1.57 15702 1.57 15702 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 19, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ) 8S2 GPC STN Yes Matte Tin (Sn) RoHS Compliant e3 Green Compliant Yes UTAC Thailand REACH Compliant Yes Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) Silicon (Si) Silver (Ag) Diester Resin Functionalized Urethane Epoxy Resin Silver (Ag) Gold (Au) Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Tin (Sn) Package Material Declaration Homogeneous Material CAS # Weight (mg) Percentage ppm 7440‐50‐8 24.169 97.4 974000 7439‐89‐6 0.596 2.4 24000 7723‐14‐0 0.025 0.1 1000 7440‐66‐6 0.025 0.1 1000 24.814 100.0 1000000 7440‐21‐3 2.820 100.0 1000000 2.820 100.0 1000000 7440‐22‐4 0.140 77.0 770000 Proprietary 0.019 10.3 103000 Proprietary 0.015 8.5 85000 Proprietary 0.008 4.2 42000 0.182 100.0 1000000 7440‐22‐4 0.350 100.0 1000000 0.350 100.0 1000000 7440‐57‐5 0.055 100.0 1000000 0.055 100.0 1000000 60676‐86‐0 81.158 85.4 854000 Proprietary 7.318 7.7 77000 29690‐82‐2 3.041 3.2 32000 Proprietary 3.041 3.2 32000 1333‐86‐4 0.475 0.5 5000 95.033 100.0 1000000 7440‐31‐5 1.966 100.0 1000000 1.966 100.0 1000000 125.220 Package Percentage ppm 19.30 193012 0.48 4756 0.02 198 0.02 198 19.82 198164 2.25 22519 2.25 22519 0.11 1116 0.01 149 0.01 123 0.01 61 0.14 1450 0.28 2795 0.28 2795 0.04 438 0.04 438 64.81 648127 5.84 58438 2.43 24286 2.43 24286 0.38 3795 75.89 758930 1.57 15703 1.57 15703 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 19, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ) 8S2 GPC Matte Tin (Sn) RoHS Compliant e3 Green Compliant Amkor Philippines REACH Compliant STN Yes Yes Yes Package Material Declaration Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) CAS # 7440‐50‐8 7439‐89‐6 7723‐14‐0 7440‐66‐6 Silicon (Si) 7440‐21‐3 Silver (Ag) Bisphenol‐F Epichlorhydrin Resin Polyglycidyl Ester 2,6‐Diglycidyl Phenyl Allyl Ether Oligomer Copper Oxide gamma‐Butyrolactone Poly(oxypropylene)diamine 1,4‐Bis(2,3‐epoxypropoxy)butane 7440‐22‐4 9003‐36‐5 68475‐94‐5 Proprietary 1317‐38‐0 96‐48‐0 Proprietary 2425‐79‐8 Silver (Ag) 7440‐22‐4 Copper (Cu) Palladium (Pd) 7440‐50‐8 7440‐05‐3 Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black 60676‐86‐0 Proprietary 29690‐82‐2 Proprietary 1333‐86‐4 Tin (Sn) 7440‐31‐5 Sub‐Total Terminal Plating Sub‐Total Total Weight (mg) 24.169 0.596 0.025 0.025 24.814 2.820 2.820 0.153 0.013 0.013 0.011 0.010 0.005 0.005 0.001 0.209 0.350 0.350 0.025 0.001 0.026 81.158 7.318 3.041 3.041 0.475 95.033 1.966 1.966 125.218 Homogeneous Material Percentage ppm 97.4 974000 2.4 24000 0.1 1000 0.1 1000 100.0 1000000 100.0 1000000 100.0 1000000 73.1 731000 6.0 60000 6.0 60000 5.2 52000 4.6 46000 2.3 23000 2.3 23000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 97.6 976000 2.4 24000 100.0 1000000 85.4 854000 7.7 77000 3.2 32000 3.2 32000 0.5 5000 100.0 1000000 100.0 1000000 100.0 1000000 Package Percentage ppm 19.30 193014 0.48 4756 0.02 198 0.02 198 19.82 198167 2.25 22519 2.25 22519 0.12 1220 0.01 100 0.01 100 0.01 87 0.01 77 0.00 38 0.00 38 0.00 8 0.17 1669 0.28 2795 0.28 2795 0.02 199 0.00 5 0.02 204 64.81 648136 5.84 58438 2.43 24286 2.43 24286 0.38 3795 75.89 758941 1.57 15704 1.57 15704 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 19, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Package Description Package Code Lead Finish J‐STD‐609 Category Assembly Location Material Leadframe Sub‐Total Integrated Circuit Sub‐Total Die Attach Sub‐Total Die Pad Plating Sub‐Total Bond Wire Sub‐Total Encapsulation Sub‐Total Terminal Plating Sub‐Total Total Atmel Corporation ‐ Package Material Declaration Datasheet 8‐Lead, 0.208" Body, Plastic Small Outline Package (EIAJ) 8S2 GPC STN Matte Tin (Sn) RoHS Compliant Yes e3 Green Compliant Yes Lingsen REACH Compliant Yes Substance Copper (Cu) Iron (Fe) Phosphorous (P) Zinc (Zn) Silicon (Si) Silver (Ag) Epoxy Resin t‐Butyl Phenyl Glycidyl Ether Butyl Cellosolve Acetate Phenolic Resin Dicyandiamide Silver (Ag) Copper (Cu) Palladium (Pd) Silica (Amorphous) Epoxy Resin A Epoxy Resin B Phenol Resin Carbon Black Tin (Sn) Package Material Declaration Homogeneous Material CAS # Weight (mg) Percentage ppm 7440‐50‐8 24.169 97.4 974000 7439‐89‐6 0.596 2.4 24000 7723‐14‐0 0.025 0.1 1000 7440‐66‐6 0.025 0.1 1000 24.814 100.0 1000000 7440‐21‐3 2.820 100.0 1000000 2.820 100.0 1000000 7440‐22‐4 0.139 72.1 721000 9003‐36‐5 0.038 19.5 195000 3101‐60‐8 0.013 6.5 65000 112‐07‐2 0.002 0.8 8000 92‐88‐6 0.002 0.8 8000 461‐58‐5 0.001 0.3 3000 0.193 100.0 1000000 7440‐22‐4 0.350 100.0 1000000 0.350 100.0 1000000 7440‐50‐8 0.025 97.6 976000 7440‐05‐3 0.001 2.4 24000 0.026 100.0 1000000 60676‐86‐0 81.158 85.4 854000 Proprietary 7.318 7.7 77000 29690‐82‐2 3.041 3.2 32000 Proprietary 3.041 3.2 32000 1333‐86‐4 0.475 0.5 5000 95.033 100.0 1000000 7440‐31‐5 1.966 100.0 1000000 1.966 100.0 1000000 125.202 Package Percentage ppm 19.30 193040 0.48 4757 0.02 198 0.02 198 19.82 198193 2.25 22522 2.25 22522 0.11 1109 0.03 300 0.01 100 0.00 12 0.00 12 0.00 5 0.15 1538 0.28 2796 0.28 2796 0.02 199 0.00 5 0.02 204 64.82 648221 5.84 58446 2.43 24289 2.43 24289 0.38 3795 75.90 759041 1.57 15706 1.57 15706 100.00 1000000 Package Material Declaration Certificate Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS). Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration. Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other agreement signed by both parties. Name / Title: William B. Dupey III / Quality Engineer & Chemist Date: January 19, 2016 RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate (BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous material. Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material.