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Package Description
Package Code
Lead Finish
J‐STD‐609 Category
Assembly Location
Atmel Corporation ‐ Package Material Declaration Datasheet
32‐Lead, 7 x 7 mm Body Size, 0.8 mm Lead Pitch, 3.5 x 3.5 mm Exposed Pad, Thin Profile Plastic Quad Flat Package (TQFP)
6.543‐5157.01‐4
GPC
ADL
RoHS Compliant
Matte Tin (Sn)
Yes
e3
Green Compliant
Yes
Amkor Philippines
REACH Compliant
Yes
Package Material Declaration
Material
Leadframe
Sub‐Total
Integrated Circuit
Sub‐Total
Die Attach
Sub‐Total
Die Pad Plating
Sub‐Total
Bond Wire
Sub‐Total
Encapsulation
Substance
Copper (Cu)
Iron (Fe)
Phosphorous (P)
Zinc (Zn)
CAS #
7440‐50‐8
7439‐89‐6
7723‐14‐0
7440‐66‐6
Silicon (Si)
7440‐21‐3
Silver (Ag)
Bisphenol F Diglycidyl Ether
1,4‐Bis(2,3‐Epoxypropoxy)Butane
2,6‐Diglycidyl Phenyl Allyl Ether Oligomer
Dihydro‐3‐(Tetrapropenyl)Furan‐2,5‐Dione
Oxirane, 2‐Dodecyl‐
Methylhexahydrophthalic Anhydride
7440‐22‐4
39817‐09‐9
2425‐79‐8
Proprietary
26544‐38‐7
3234‐28‐4
19438‐60‐9
Silver (Ag)
7440‐22‐4
Gold (Au)
7440‐57‐5
Silica (Amorphous) A
Epoxy Resin
Silica (Amorphous) B
Phenol Resin
Carbon Black
60676‐86‐0
Proprietary
7631‐86‐9
Proprietary
1333‐86‐4
Tin (Sn)
7440‐31‐5
Sub‐Total
Terminal Plating
Sub‐Total
Total
Weight (mg)
49.025
1.208
0.050
0.050
50.334
4.898
4.898
0.249
0.020
0.017
0.017
0.015
0.015
0.009
0.344
0.490
0.490
0.250
0.250
67.341
7.637
7.637
3.471
0.694
86.779
4.094
4.094
147.189
Homogeneous Material
Percentage
ppm
97.4
974000
2.4
24000
0.1
1000
0.1
1000
100.0
1000000
100.0
1000000
100.0
1000000
72.4
724000
5.9
59000
5.0
50000
5.0
50000
4.5
45000
4.5
45000
2.7
27000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
100.0
1000000
77.6
776000
8.8
88000
8.8
88000
4.0
40000
0.8
8000
100.0
1000000
100.0
1000000
100.0
1000000
Package
Percentage
ppm
33.31
333077
0.82
8207
0.03
342
0.03
342
34.20
341968
3.33
33276
3.33
33276
0.17
1692
0.01
138
0.01
117
0.01
117
0.01
105
0.01
105
0.01
63
0.23
2337
0.33
3329
0.33
3329
0.17
1697
0.17
1697
45.75
457513
5.19
51883
5.19
51883
2.36
23583
0.47
4717
58.96
589579
2.78
27814
2.78
27814
100.00
1000000
Package Material Declaration Certificate
Atmel Corporation certifies that the material content information provided above is representative and accurate as of the date of this declaration. Atmel
Corporation products designated as "RoHS Compliant" or "Green" (defined below) do not exceed the threshold limits of the European Union Restriction of
Hazardous Substances (RoHS) Directive 2011/65/EU, and the China Administration on Control of Pollution by Electronic Information Products (China RoHS).
Atmel Corporation has taken commercially reasonable steps to provide representative and accurate information, but may not have conducted chemical analysis
or destructive testing on incoming materials. Atmel Corporation and its suppliers consider certain information to be proprietary and thus CAS numbers and
other limited information may not be available for release. Atmel Corporation accepts no duty to notify or update users of any changes made to this declaration.
Atmel Corporation's standard Terms and Conditions apply to the representations provided herein unless otherwise provided by a written contract or other
agreement signed by both parties.
Name / Title:
William B. Dupey III / Quality Engineer & Chemist
Date:
August 24, 2015
RoHS Compliant: Atmel Corporation defines "RoHS Compliant" to mean maximum concentration value of 0.1% (1000 ppm) for Lead (Pb), Mercury (Hg),
Hexavalent Chromium (Cr+6), Polybrominated Biphenyl (PBB), Polybrominated Diphenyl Ether (PBDE) , Bis(2‐ethylhexyl) Phthalate (DEHP), Butyl Benzyl Phthalate
(BBP), Dibutyl Phthalate (DBP), Diisobutyl Phthalate (DIBP) and maximum concentration value of 0.01% (100 ppm) for Cadmium (Cd) in any homogeneous
material.
Green: Atmel Corporation defines "Green" to mean, in addition to substances listed in "RoHS Compliant", maximum concentration value of 0.09% (900 ppm) for
Antimony (Sb), 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous
material.