PHILIPS HEF4067BT

HEF4067B
16-channel analog multiplexer/demultiplexer
Rev. 6 — 16 November 2011
Product data sheet
1. General description
The HEF4067B is a 16-channel analog multiplexer/demultiplexer with four address inputs
(A0 to A3), an active LOW enable input (E), sixteen independent inputs/outputs (Y0 to
Y15) and a common input/output (Z). The device contains sixteen bidirectional analog
switches, each with one side connected to an independent input/output (Y0 to Y15) and
the other side connected to the common input/output (Z). With E LOW, one of the sixteen
switches is selected (low-impedance ON-state) by A0 to A3. All unselected switches are
in the high-impedance OFF-state. With E HIGH all switches are in the high-impedance
OFF-state, independent of A0 to A3. The analog inputs/outputs (Y0 to Y15 and Z) can
swing between VDD as a positive limit and VSS as a negative limit. VDD to VSS may not
exceed 15 V.
2. Features and benefits





Fully static operation
5 V, 10 V, and 15 V parametric ratings
Standardized symmetrical output characteristics
Specified from 40 C to +85 C
Complies with JEDEC standard JESD 13-B
3. Applications
 Analog multiplexing and demultiplexing
 Digital multiplexing and demultiplexing
 Signal gating
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
HEF4067BP
40 C to +85 C
DIP24
plastic dual in-line package; 24 leads (600 mil)
SOT101-1
HEF4067BT
40 C to +85 C
SO24
plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
5. Functional diagram
9 Y0
8 Y1
A0 10
7 Y2
6 Y3
A1 11
5 Y4
4 Y5
A2 14
3 Y6
2 Y7
A3 13
23 Y8
1-OF-16
DECODER
22 Y9
21 Y10
20 Y11
19 Y12
18 Y13
17 Y14
16 Y15
E 15
1 Z
001aag123
Fig 1.
Functional diagram
Yn
VDD
VDD
Z
VSS
001aag126
Fig 2.
Schematic diagram (one switch)
HEF4067B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
2 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
Y0
Y1
Y2
Y3
Y4
A0
Y5
Y6
Y7
A1
Y8
Y9
Y10
A2
Y11
Y12
Y13
A3
Y14
Y15
E
Z
001aag125
Fig 3.
Logic diagram
HEF4067B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
3 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
6. Pinning information
6.1 Pinning
Z
1
24 VDD
Y7
2
23 Y8
Y6
3
22 Y9
Y5
4
21 Y10
Y4
5
20 Y11
Y3
6
Y2
7
Y1
8
17 Y14
Y0
9
16 Y15
HEF4067B
19 Y12
18 Y13
A0 10
15 E
A1 11
14 A2
VSS 12
13 A3
001aag124
Fig 4.
Pin configuration
6.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
Z
1
common input/output
Y0 to Y15
9, 8, 7, 6, 5, 4, 3, 2, 23, 22, 21, 20, 19, 18, 17, 16
independent input/output
A0 to A3
10, 11, 14, 13
address input
VSS
12
ground (0 V)
E
15
enable input (active LOW)
VDD
24
supply voltage
HEF4067B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
4 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
7. Functional description
Table 3.
Function table[1]
Control
Address
E
A3
A2
A1
A0
L
L
L
L
L
Y0 = Z
L
L
L
L
H
Y1 = Z
L
L
L
H
L
Y2 = Z
L
L
L
H
H
Y3 = Z
L
L
H
L
L
Y4 = Z
L
L
H
L
H
Y5 = Z
L
L
H
H
L
Y6 = Z
L
L
H
H
H
Y7 = Z
L
H
L
L
L
Y8 = Z
L
H
L
L
H
Y9 = Z
L
H
L
H
L
Y10 = Z
L
H
L
H
H
Y11 = Z
L
H
H
L
L
Y12 = Z
L
H
H
L
H
Y13 = Z
L
H
H
H
L
Y14 = Z
L
H
H
H
H
Y15 = Z
H
X
X
X
X
none
[1]
Channel ON
H = HIGH voltage level; L = LOW voltage level; X = don’t care.
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS = 0 V (ground).
Symbol
Parameter
VDD
supply voltage
IIK
input clamping current
VI
input voltage
II/O
input/output current
IDD
Conditions
pins An and E;
VI < 0.5 V or VI > VDD + 0.5 V
Min
Max
Unit
0.5
+18
V
-
10
mA
0.5
VDD + 0.5
V
-
10
mA
supply current
-
50
mA
Tstg
storage temperature
65
+150
C
Tamb
ambient temperature
40
+85
C
HEF4067B
Product data sheet
[1]
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
5 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
Table 4.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS = 0 V (ground).
Symbol
Parameter
Conditions
Ptot
total power dissipation
Tamb = 40 C to +125 C
P
[1]
power dissipation
DIP24
[2]
SO24
[3]
per output
Min
Max
Unit
-
750
mW
-
500
mW
-
100
mW
To avoid drawing VDD current out of terminal Z, when switch current flows into terminals Yn, the voltage drop across the bidirectional
switch must not exceed 0.4 V. If the switch current flows into terminal Z, no VDD current will flow out of terminals Yn, in this case there is
no limit for the voltage drop across the switch, but the voltages at Y and Z may not exceed VDD or VSS.
[2]
For DIP24 packages: above Tamb = 70 C, Ptot derates linearly at 12 mW/K.
[3]
For SO24 packages: above Tamb = 70 C, Ptot derates linearly at 8 mW/K.
9. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
VDD
Conditions
Min
Typ
Max
Unit
supply voltage
3
-
15
V
VI
input voltage
0
-
VDD
V
Tamb
ambient temperature
in free air
40
-
+85
C
t/V
input transition rise and fall rate
VDD = 5 V
-
-
3.75
s/V
VDD = 10 V
-
-
0.5
s/V
VDD = 15 V
-
-
0.08
s/V
10. Static characteristics
Table 6.
Static characteristics
VSS = 0 V; VI = VSS or VDD; unless otherwise specified.
Symbol Parameter
VIL
VIH
LOW-level input
voltage
HIGH-level input
voltage
Conditions
VDD
VO = 0.5 V or 4.5 V
Max
Min
Max
Min
Max
5V
-
1
-
1
-
1
V
VO = 1.0 V or 9.0 V
10 V
-
2
-
2
-
2
V
VO = 1.5 V or 13.5 V
15 V
-
2.5
-
2.5
-
2.5
V
VO = 0.5 V or 4.5 V
5V
4
-
4
-
4
-
V
VO = 1.0 V or 9.0 V
10 V
8
-
8
-
8
-
V
VO = 1.5 V or 13.5 V
15 V
12.5
-
12.5
-
12.5
-
V
15 V
-
0.3
-
0.3
-
1.0
A
A
IO < 1 A
input leakage
current
IOZ
OFF-state output output at VDD
current
output at VSS
Product data sheet
Min
IO < 1 A
II
HEF4067B
Tamb = 40 C Tamb = +25 C Tamb = +85 C Unit
VI = 0 V or 15 V
15 V
-
1.6
-
1.6
-
12.0
15 V
-
1.6
-
1.6
-
12.0 A
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
6 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
Table 6.
Static characteristics …continued
VSS = 0 V; VI = VSS or VDD; unless otherwise specified.
Symbol Parameter
IS(OFF)
IDD
CI
OFF-state
leakage current
supply current
Conditions
Tamb = 40 C Tamb = +25 C Tamb = +85 C Unit
VDD
Min
Max
Min
Max
Min
Max
Z port; all channels OFF;
see Figure 5
15 V
-
-
-
1000
-
-
nA
Yn port; per channel;
see Figure 6
15 V
-
-
-
200
-
-
nA
all valid input combinations;
IO = 0 A
5V
-
20
-
20
-
150
A
10 V
-
40
-
40
-
300
A
15 V
-
80
-
80
-
600
A
15 V
-
-
-
7.5
-
-
pF
input capacitance digital inputs
10.1 Test circuits
VDD
A0 to A3
VDD or VSS
Z
Yn
E
IS
VSS
VDD
VI
VO
001aal616
Fig 5.
Test circuit for measuring OFF-state leakage current Z port
VDD
VDD or VSS
A0 to A3
Y0 1
Z
Yn 2
switch
IS
E
VSS
VSS
VI
VO
001aal617
Fig 6.
Test circuit for measuring OFF-state leakage current Yn port
HEF4067B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
7 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
10.2 On resistance
Table 7.
ON resistance
Tamb = 25 C; ISW = 200 A; VSS = 0 V.
Symbol
Parameter
Conditions
VDD
Typ
Max
Unit
RON(peak)
ON resistance (peak)
VI = 0 V to VDD; see Figure 7 and
Figure 8
5V
350
2500

10 V
80
245

15 V
60
175

5V
115
340

10 V
50
160

15 V
40
115

5V
120
365

10 V
65
200

15 V
50
155

RON(rail)
ON resistance (rail)
VI = 0 V; see Figure 7 and Figure 8
VI = VDD; see Figure 7 and Figure 8
RON
ON resistance mismatch
between channels
VI = 0 V to VDD; see Figure 7
5V
25
-

10 V
10
-

15 V
5
-

10.2.1 On resistance waveform and test circuit
001aae648
400
RON
(Ω)
VDD = 5 V
300
VSW
V
200
VDD
VDD or VSS
A0 to A3
Z
Yn
10 V
100
15 V
E
VSS
VSS
ISW
VI
0
0
5
Test circuit for measuring RON
HEF4067B
Product data sheet
15
Iis = 200 A; VSS = 0 V.
RON = VSW / ISW.
Fig 7.
10
VI (V)
001aag127
Fig 8.
Typical RON as a function of input voltage
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
8 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Tamb = 25 C; VSS = 0 V; for test circuit see Figure 12.
Symbol
Parameter
Conditions
VDD
Min
Typ
Max
Unit
tPHL
HIGH to LOW propagation delay
Yn, Z to Z, Yn; see Figure 9
5V
-
30
60
ns
10 V
-
15
25
ns
15 V
-
10
20
ns
5V
-
190
380
ns
10 V
-
70
145
ns
An to Yn, Z; see Figure 10
tPLH
LOW to HIGH propagation delay
Yn, Z to Z, Yn; see Figure 9
An to Yn, Z; see Figure 10
tPHZ
tPLZ
tPZH
HIGH to OFF-state propagation delay
LOW to OFF-state propagation delay
OFF-state to HIGH propagation delay
E to Yn, Z; see Figure 11
E to Yn, Z; see Figure 11
E to Yn, Z; see Figure 11
E to Yn, Z; see Figure 11
tPZL
OFF-state to LOW propagation delay
HEF4067B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
15 V
-
50
100
ns
5V
-
25
50
ns
10 V
-
10
20
ns
15 V
-
10
20
ns
5V
-
175
345
ns
10 V
-
70
140
ns
15 V
-
50
100
ns
5V
-
195
385
ns
10 V
-
140
280
ns
15 V
-
130
260
ns
5V
-
215
435
ns
10 V
-
180
355
ns
15 V
-
170
340
ns
5V
-
155
315
ns
10 V
-
70
135
ns
15 V
-
50
100
ns
5V
-
170
340
ns
10 V
-
70
140
ns
15 V
-
50
100
ns
© NXP B.V. 2011. All rights reserved.
9 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
11.1 Waveforms and test circuit
VDD
VI
Yn or Z
input
VM
VM
An input
VM
VM
VSS
0V
tPLH
tPLH
tPHL
tPHL
VO
VOH
Yn or Z
output
VY
Yn or Z
output
VM
VM
VX
VSS
switch OFF
VOL
switch ON
switch OFF
001aag199
001aal618
Measurement points are given in Table 9.
Measurement points are given in Table 9.
VOL and VOH are typical output voltage levels that occur
with the output load.
Fig 9.
Yn, Z to Z, Yn propagation delays
Fig 10. Sn to Yn, Z propagation delays
VI
VM
E input
VM
0V
tPLZ
tPZL
VDD
Yn or Z output
VM
VX
VOL
tPHZ
VOH
tPZH
VY
Yn or Z output
VM
0V
switch ON
switch OFF
switch ON
001aag198
Measurement points are shown in Table 9.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 11. Enable and disable times
Table 9.
Measurement points
Supply voltage
Input
VCC
VM
VI
VM
VX
VY
5 V to 15 V
0.5VDD
GND to VDD
0.5VDD
10%
90%
HEF4067B
Product data sheet
Output
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
10 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
VDD
VDD
VI
PULSE
GENERATOR
VO
S1
RL
open
DUT
CL
RT
001aag183
Test data is given in Table 10.
Definitions test circuit:
RT = termination resistance should be equal to output impedance Zo of the pulse generator
CL = load capacitance including jig and probe capacitance
RL = load resistor
S1 = test selection switch
Fig 12. Test circuit for measuring switching times
Table 10.
Test data
Input
Yn, Z
Load
An and E
tr, tf
VDD or VSS VDD or VSS  20 ns
[1]
S1 position
VM
CL
RL
tPHL[1]
0.5VDD
50 pF
10 k
VDD or VSS VSS
tPLH
tPZH, tPHZ tPZL, tPLZ other
VSS
VDD
VSS
For Yn to Z or Z to Yn propagation delays use VSS. For An or to Yn or Z propagation delays use VDD.
HEF4067B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
11 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
11.2 Additional dynamic parameters
Table 11. Additional dynamic characteristics
VSS = 0 V; Tamb = 25 C.
Symbol
THD
f(3dB)
Parameter
Conditions
total harmonic distortion
3 dB frequency response
VDD
Typ
Max
Unit
see Figure 13; RL = 10 k; CL = 15 pF; 5 V
channel ON; VI = 0.5VDD (p-p);
10 V
fi = 1 kHz
15 V
[1]
0.25
-
%
[1]
0.04
-
%
[1]
0.04
-
%
see Figure 14; RL = 1 k; CL = 5 pF;
channel ON; VI = 0.5VDD (p-p)
5V
[1]
13
-
MHz
10 V
[1]
40
-
MHz
70
-
50
15 V
[1]
iso
isolation (OFF-state)
see Figure 15; fi = 1 MHz; RL = 1 k;
CL = 5 pF; channel OFF;
VI = 0.5VDD (p-p)
10 V
[1]
Vct
crosstalk voltage
digital inputs to switch; see Figure 16;
RL = 10 k; CL = 15 pF;
E or An = VDD (square-wave)
10 V
Xtalk
crosstalk
between switches; see Figure 17;
fi = 1 MHz; RL = 1 k;
VI = 0.5VDD (p-p)
10 V
[1]
50
[1]
MHz
-
-
50
dB
mV
-
dB
fi is biased at 0.5 VDD; VI = 0.5VDD (p-p).
Table 12. Dynamic power dissipation PD
PD can be calculated from the formulas shown; VSS = 0 V; tr = tf  20 ns; Tamb = 25 C.
Symbol
PD
Parameter
dynamic power
dissipation
VDD
Typical formula for PD (W)
5V
where:
PD = 1000  fi + (fo  CL)  VDD
2
fi = input frequency in MHz;
10 V
PD = 5500  fi + (fo  CL)  VDD
2
fo = output frequency in MHz;
15 V
PD = 15000  fi + (fo  CL)  VDD2
CL = output load capacitance in pF;
VDD = supply voltage in V;
(CL  fo) = sum of the outputs.
11.2.1 Test circuits
VDD
VDD
VDD or VSS
A0 to A3
Z
VDD or VSS
A0 to A3
Z
Yn
VSS
VSS
CL
RL
D
fi
CL dB
fi
001aag235
001aag129
Fig 13. Test circuit for measuring total harmonic
distortion
Product data sheet
VSS
VSS
RL
HEF4067B
Yn
E
E
Fig 14. Test circuit for measuring frequency response
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
12 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
VDD
VDD or VSS
A0 to A3
Y0 1
Z
Yn 2
switch
E
VSS
VSS
RL
CL
dB
fi
001aal619
Fig 15. Test circuit for measuring isolation (OFF-state)
0.5VDD
VDD
RL
A0 to A3
Y0 1
Z
Yn 2
switch
E
VSS
VDD or VSS
RL
CL
V
VO
G
001aag128
a. Test circuit
logic
input (An, E)
off
on
off
VO
Vct
001aal620
b. Input and output pulse definitions
Fig 16. Test circuit for measuring crosstalk voltage between digital inputs and switch
VDD
VDD or VSS
VDD
A0 to A3
Y0
Z
Yn
VDD or VSS
A0 to A3
Y0
Z
Yn
E
E
VSS
VSS
VSS
VSS
RL
VO
RL
VI
VI
RL
001aag130
a. Switch closed condition
RL
VO
001aag131
b. Switch open condition
Fig 17. Test circuit for measuring crosstalk between switches
HEF4067B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
13 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
12. Package outline
seating plane
DIP24: plastic dual in-line package; 24 leads (600 mil)
SOT101-1
ME
D
A2
L
A
A1
c
e
Z
b1
w M
(e 1)
b
MH
13
24
pin 1 index
E
1
12
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
5.1
0.51
4
1.7
1.3
0.53
0.38
0.32
0.23
32.0
31.4
14.1
13.7
2.54
15.24
3.9
3.4
15.80
15.24
17.15
15.90
0.25
2.2
inches
0.2
0.02
0.16
0.066
0.051
0.021
0.015
0.013
0.009
1.26
1.24
0.56
0.54
0.1
0.6
0.15
0.13
0.62
0.60
0.68
0.63
0.01
0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT101-1
051G02
MO-015
SC-509-24
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Fig 18. Package outline SOT101-1 (DIP24)
HEF4067B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
14 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT137-1
075E05
MS-013
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 19. Package outline SOT137-1 (SO24)
HEF4067B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
15 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
13. Abbreviations
Table 13.
Abbreviations
Acronym
Description
DUT
Device Under Test
14. Revision history
Table 14.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
HEF4067B v.6
20111116
Product data sheet
-
HEF4067B v.5
Modifications:
HEF4067B v.5
•
•
Legal pages updated.
Changes in “General description”, “Features and benefits” and “Applications”.
20100325
Product data sheet
-
HEF4067B v.4
HEF4067B v.4
20100308
Product data sheet
-
HEF4067B_CNV v.3
HEF4067B_CNV v.3
19950101
Product specification
-
HEF4067B_CNV v.2
HEF4067B_CNV v.2
19950101
Product specification
-
-
HEF4067B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
16 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
HEF4067B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
17 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
HEF4067B
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 16 November 2011
© NXP B.V. 2011. All rights reserved.
18 of 19
HEF4067B
NXP Semiconductors
16-channel analog multiplexer/demultiplexer
17. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
10.1
10.2
10.2.1
11
11.1
11.2
11.2.1
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
On resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 8
On resistance waveform and test circuit. . . . . . 8
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Waveforms and test circuit . . . . . . . . . . . . . . . 10
Additional dynamic parameters . . . . . . . . . . . 12
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 16 November 2011
Document identifier: HEF4067B