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Datasheet
Single-chip Type with Built-in FET Switching Regulator Series
Step-down Switching regulators
with Built-in Power MOSFET
BU9000xGWZ series
●General Description
●Applications
The BU9000xGWZ are a high efficiency 6MHz
synchronous step-down switching regulator with ultra
low current PFM mode.
It provides up to 1.0A load current and an input voltage
range from 3.0V to 5.5V, optimized for battery powered
portable applications.
BU9000xGWZ has a mode control pin that allows the
user to select Forced PWM (Pulse Width Modulation)
mode or PFM (Pulse Frequency Modulation) and PWM
auto change mode utilized power save operation at light
load current.
Smart phones, Cell phones, Portable applications,
Micro DC/DC modules, and USB accessories
●Package(s)
W(Typ.) x D(Typ.) x H(Max.)
1.30mm x 0.90mm x 0.40mm
UCSP35L1
●Typical Application Circuit(s)
●Features







Fast transient response
Automatic PFM/PWM operation
Forced PWM operation
Internal Soft Start
Under voltage lockout
Over current protection
Thermal shutdown
●Lineup
Figure 1. Typical Application Circuit(s)
Part No.
Output
voltage
Input voltage
Switching frequency
BU90002GWZ
3.30V
4.0V to 5.5V
5.4MHz to 6.6MHz
BU90003GWZ
1.20V
2.3V to 5.5V
3.6MHz to 4.4MHz
BU90004GWZ
1.80V
2.3V to 5.5V
4.8MHz to 6.0MHz
BU90005GWZ
2.50V
2.3V to 5.5V
5.4MHz to 6.6MHz
BU90006GWZ
3.00V
2.3V to 5.5V
5.4MHz to 6.6MHz
BU90007GWZ
1.25V
2.3V to 5.5V
3.6MHz to 4.4MHz
BU90008GWZ
1.00V
2.3V to 5.5V
3.2MHz to 4.0MHz
BU90009GWZ
1.30V
2.3V to 5.5V
3.8MHz to 4.8MHz
●Pin Configuration(s)
Operating mode
MODE=L
MODE=H
Automatic
PFM/PWM
Forced PFM
Forced PWM
Automatic
PFM/PWM
●Pin Description(s)
(BOTTOM VIEW)
Pin No.
Symbol
A1
VIN
Function
Power supply input pin
A2
EN
A3
GND
Enable pin
B1
MODE
Forced PWM mode pin
B2
LX
Inductor connection pin
B3
FB
Feedback voltage input pin
GND pin
Figure 2. Pin Configuration(s)
○Product structure：Silicon monolithic integrated circuit
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TSZ22111・14・001
○This product is not designed protection against radioactive rays
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Datasheet
BU9000xGWZ series
●Block Diagram(s)
L ：　PWM/PFM MODE
H ：　PWM MODE
MODE
B1
TSD
UVLO
FB
VOUT
PWM/PFM
control
VIN
A1
2.3～5.5V
B3
EN
ERROR COMP
Switching
Control Logic
and
Gate Driver
B2
1.5～0.47uH
LX
VOUT
4.7～10uF
VREF
EN
H ：　ON
L ：　OFF
A2
SHUTDOWN
Frequency
control
A3
GND
Figure 3. Block Diagram(s)
●Description of Block(s)
The BU9000xGWZ are a synchronous step-down DC/DC converter that achieves fast transient response from light load to
heavy load by hysteretic PWM control system and current constant PFM control system.
○PWM control
BU9000xGWZ operates by hysteretic PWM control. This scheme ensures fast switching, high efficiency, and fast transient
response.
When the output voltage is below the VREF voltage, the error comparator output is low to high and turning on P-channel
MOSFET until above the VREF voltage and minimum on time.
○PFM control
At light load the regulator and MODE=low, the regulator operates with reduced switching frequency and improves the
efficiency.During PFM operation, the output voltage slightly higher than typical output voltage.
Figure 4. Operation of PFM mode and PWM mode
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Datasheet
BU9000xGWZ series
●Description of operations
1) Shutdown
If the EN input pin set to low (<0.4V), all circuit are shut down and the regulator is standby mode.
Do not leave the EN pin floating.
2) Soft start function
The regulator has a soft start circuit that reduces in-rush current at start-up. Typical start up times with a 4.7uF output
capacitor is 120usec.
3) Current limit
The BU9000xGWZ has a current limit circuit that protects itself and external components during overload condition.
4) UVLO
The BU9000xGWZ has a Under Voltage Lock Out circuit that turn off device when VIN>2.05V(typ.)
5) FORCED PWM MODE
Setting MODE pin high (>1.4V) places the regulator in forced PWM.This control provides noise reduction and output
stability.Do not leave the MODE pin floating.
6) FORCED PFM MODE ( BU90005GWZ)
Setting MODE pin low (<0.4V) places the regulator in forced PFM. It is effective in light load mode.
7) TSD
The BU9000xGWZ has a thermal shutdown feature to protect the device if the junction temperature exceeds 150℃.In
thermal shutdown, the DRIVER is disabled.
This circuit is only to cut off the IC from thermal runaway, and has not been design to protect or guarantee the IC. Therefore,
the user should not plan to activate this circuit with continued operation in mind.
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Rating
Unit
VIN
7
V
VEN, VFB,
VLX, VMODE
7
V
Pd
0.39(*1)
W
Operating temperature range
Topr
-40 to +85
℃
Storage temperature range
Tstg
-55 to +125
℃
Tjmax
+125
℃
Maximum input power supply voltage
Maximum voltage at EN, FB, LX, MODE
Power dissipation
Junction temperature
(*1) When mounted on the specified PCB (55mm x 63mm), Deducted by 3.9m W/c when used over Ta=25c
●Recommended Operating Rating(s)
Parameter
Symbol
Input voltage
VIN
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
Rating
Min.
Typ.
Max.
4.0
-
5.5
2.3
-
5.5
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Unit
V
Serise
BU90002GWZ
BU90003～BU90009GWZ
TSZ02201-0F2F0AG00010-1-2
7.Jul.2015 Rev.007
Datasheet
BU9000xGWZ series
●Electrical Characteristic(s) (unless otherwise specified VIN=3.6V, Ta=25℃)
Item
Symbol
Min.
Rating
Typ.
Max.
Unit
Condition
【Switching regulator】
Output voltage accuracy
Maximum load current
-2
-
+2
IoutMAX1
IoutMAX2
IoutMAX3
-2
-
-
+3
1.0
0.8
0.6
IoutMAX4
-
-
0.1
A
65
120
240
usec
( BU90002GWZ, BU90003GWZ,
BU90004GWZ, BU90005GWZ,
BU90006GWZ, BU90007GWZ,
BU90009GWZ )
55
110
220
usec
( BU90008GWZ )
5.4
6.0
6.6
MHz
4.8
5.4
6.0
MHz
No load, MODE:H
3.6
4.0
4.4
MHz
No load, MODE:H
3.2
3.6
4.0
MHz
No load, MODE:H
3.8
4.3
4.8
MHz
No load, MODE:H
-
250
300
220
250
400
450
350
380
mOhm
mOhm
mOhm
mOhm
VOUTA
%
A
A
A
MODE:H(PWM Operation)
MODE:L(PFM Operation)
3.0V≦VIN＜5.5V
2.7V≦VIN＜3.0V
2.3V≦VIN＜2.7V
MODE:L(PFM Operation)
(BU90005GWZ,)
【Soft start】
Soft start time
Tss
【Frequency control】
Switching frequency
fosc
No load, MODE:H
( BU90002GWZ,BU90005GWZ,
BU90006GWZ)
( BU90004GWZ )
( BU90003GWZ, BU90007GWZ )
( BU90008GWZ )
( BU90009GWZ )
【Driver】
PchFET on resistance
NchFET on resistance
RonP1
RonP2
RonN1
RonN2
-
VIN=5.0V
VIN=3.6V
VIN=5.0V
VIN=3.6V
【Control】
Operation
VENH
1.4
-
VIN
V
Non Operation
VENL
0
-
0.4
V
Operation
VMODEH
1.4
-
VIN
V
Forced PWM
Non Operation
VMODEL
0
-
0.4
V
Automatic PFM/PWM
Uvth
Uvhy
1.95
50
2.05
100
2.15
150
V
mV
Current limit threshold
ILIMIT
1.5
1.7
1.9
A
【Output discharge】
Output discharge resistance
【Circuit current】
DRES
15
30
60
Ohm
EN pin control
voltage
MODE pin
control voltage
(BU90005GWZ : Forced PFM)
【UVLO】
Protect threshold voltage
Hysteresis
【Current limit】
IINS1
-
45
65
uA
IINS2
-
55
80
uA
Operating quiescent current
PMOS current detect,
Open loop
EN=0V, FB=0.5V
No load, EN:H, MODE:L,
VOUT=3.6V forced
Not switching
( BU90003GWZ, BU90004GWZ,
BU90005GWZ, BU90007GWZ,
BU90008GWZ, BU90009GWZ )
No load, EN:H, MODE:L,
VOUT=3.6V forced
Not switching
( BU90002GWZ,BU90006GWZ )
IQ1
-
5.2
-
mA
No load, EN:H, MODE:H,
PWM operation
L:LQM21MPN1R0NG0
( BU90003GWZ )
IQ2
-
5.6
-
mA
SHD
-
0
1
uA
No load, EN:H, MODE:H,
PWM operation
L:LQM21MPN1R0NG0
( BU90004GWZ )
Shutdown current
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EN=0V
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Datasheet
BU9000xGWZ series
●Electrical Characteristic curves (Reference data)
BU90002GWZ (3.3V OUTPUT)
Parts
L:LQM21MPN1R0NG0 (2.0mm×1.6mm×1.0mm Murata)
COUT:GRM155R60J475M(1.0mm×0.5mm×0.5mm Murata)
EN
2V/div
EN
2V/div
VOUT
2V/div
VOUT
2V/div
20us
IL
500mA/div
100us
Figure 6. Shut down
Figure 5. Start up
Vout
50mV/div
ac coupled
Vout
50mV/div
ac coupled
10us
4us
IOUT
50mA/div
IOUT
200mA/div
Figure 7. Load transient response 5mA to 50mA
tr=tf=100ns, MODE : Low
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Figure 8. Load transient response 50mA to 350mA
tr=tf=100ns, MODE : Low
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Datasheet
BU9000xGWZ series
Vout
20mV/div
ac coupled
Vout
50mV/div
ac coupled
400ns
4us
LX
5V/div
IOUT
200mA/div
IL
500mA/div
Figure 10. PFM mode Operation
Iout=40mA
Figure 9. Load transient response 150mA to 500mA
tr=tf=100ns, MODE : High
Vout
20mV/div
ac coupled
MODE
2V/div
4us
80ns
Vout
20mV/div
ac coupled
LX
5V/div
IL
500mA/div
IL
500mA/div
Figure 11. PWM mode Operation
Iout=100mA
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Figure 12. Mode Change Response
MODE : High to Low
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Datasheet
BU9000xGWZ series
100
95
4us
MODE
2V/div
Efficiency[%]
90
Vout
20mV/div
ac coupled
85
80
75
70
IL
500mA/div
65
60
1
10
100
1000
Load current[mA]
Figure 13. Mode Change Response
MODE : Low to High
Figure 14. Efficiency vs Load current
VIN=5V PWM/PFM Auto mode
3.38
30
3.37
Vout Ripple Voltage[mv]
25
Output Voltage[v]
3.36
3.35
3.34
3.33
20
15
10
5
3.32
0
3.31
0
200
400
600
800
1000
0
200
400
600
800
Load current[mA]
Load current[mA]
Figure 15. Load regulation
VIN=5V PWM/PFM Auto mode
Figure 16. Vout Ripple Voltage
VIN=5V PWM/PFM Auto mode
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7.Jul.2015 Rev.007
Datasheet
BU9000xGWZ series
●Electrical characteristic curves (Reference data)
BU90003GWZ (1.2V OUTPUT)
EN
2V/div
EN
2V/div
VOUT
500mV/div
40us
VOUT
500m/div
IL
200mA/div
100us
Figure 17. Start up
Figure 18. Shut down
Vout
50mV/div
1.2V offset
Vout
50mV/div
1.2V offset
10us
4us
IOUT
200mA/div
IOUT
200mA/div
Figure 20. Load transient response 50mA to 350mA
tr=tf=100ns, MODE : Low
Figure 19. Load transient response 5mA to 200mA
tr=tf=100ns, MODE : Low
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Datasheet
BU9000xGWZ series
Vout
20mV/div
ac coupled
4us
Vout
50mV/div
ac coupled
400ns
LX
2V/div
IOUT
500mA/div
IL
500mA/div
Figure 21. Load transient response 400mA to 1000mA
tr=tf=100ns, MODE : Low
Figure 22. PFM mode Operation Iout=50mA
2us
Vout
20mV/div
ac coupled
MODE
2V/div
80ns
Vout
50mV/div
ac coupled
LX
2V/div
IL
500mA/div
IL
200mA/div
Figure 23. Fig.23 PWM mode Operation Iout=100mA
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Figure 24. Mode Change Response
MODE : High to Low
TSZ02201-0F2F0AG00010-1-2
7.Jul.2015 Rev.007
Datasheet
BU9000xGWZ series
100
2us
90
MODE
2V/div
80
VIN=2.7V
VIN=3.6V
VIN=4.2V
Efficiency[%]
70
Vout
50mV/div
ac coupled
60
50
40
30
IL
200mA/div
20
10
0
0.1
1
10
100
1000
Load current[mA]
Figure 25. Mode Change Response
MODE : Low to High
Figure 26. Efficiency vs Load current
PWM/PFM Auto mode
1.236
Output Voltage[V]
1.224
VIN=4.2
VIN=3.6
VIN=2.7
1.212
1.200
1.188
0
200
400
600
800
1000
Load current[mA]
Figure 27. Load regulation
PWM/PFM Auto mode
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Datasheet
BU9000xGWZ series
●Electrical characteristic curves (Reference data)
BU90004GWZ (1.80V OUTPUT)
EN
5V/div
EN
5V/div
VOUT
1V/div
VOUT
1V/div
40us
100us
IL
200mA/div
Figure 28. Start up
Figure 29. Shut down
Vout
50mV/div
ac coupled
Vout
50mV/div
ac coupled
4us
4us
IOUT
200mA/div
IOUT
200mA/div
Figure 30. Load transient response 5mA to 200mA
tr=tf=100ns, Mode : Low
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Figure 31. Load transient response 50mA to 350mA
tr=tf=100ns, Mode :Low
TSZ02201-0F2F0AG00010-1-2
7.Jul.2015 Rev.007
Datasheet
BU9000xGWZ series
4us
Vout
50mV/div
ac coupled
Vout
20mV/div
ac coupled
400ns
IOUT
200mA/div
LX
2V/div
Figure 32. Load transient response 200mA to 600mA
tr=tf=100ns, MODE : Low
80ns
Vout
20mV/div
ac coupled
Figure 33. PFM mode Operation IIout=50mA
MODE
5V/div
4us
Vout
50mV/div
ac coupled
LX
2V/div
LX
200mA/div
Figure 34. PWM mode Operation Iout=100mA
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Figure 35. Mode Change Response
MODE : High to Low
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Datasheet
BU9000xGWZ series
100
90
2us
MODE
5V/div
80
VIN=2.7V
VIN=3.6V
VIN=4.2V
Efficiency[%]
70
Vout
50mV/div
ac coupled
60
50
40
30
20
LX
200mA/div
10
0
0.1
1
10
100
1000
Load current[mA]
Figure 37. Efficiency vs Load current
PWM/PFM Auto mode
Figure 36. Mode Change Response
MODE : Low to High
1.854
Output Voltage[V]
1.836
VIN=2.7V
VIN=3.6V
VIN=4.2V
1.818
1.800
1.782
1.764
0
200
400
600
800
1000
Load current[mA]
Figure 38. Load regulation
PWM/PFM Auto mode
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Datasheet
BU9000xGWZ series
●Electrical characteristic curves (Reference data)
BU90005GWZ (2.50V OUTPUT)
EN
1V/div
EN
2V/div
40us
VOUT
1V/div
100us
VOUT
1V/div
IL
200mA/div
Figure 39. Start up
Figure 40. Shut down
Vout
100mV/div
ac coupled
Vout
50mV/div
ac coupled
4us
4us
IOUT
200mA/div
IOUT
100mA/div
Figure 41. Load transient response 5mA to 100mA
tr=tf=100ns, MODE : Low
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Figure 42. Load transient response 50mA to 350mA
tr=tf=100ns, MODE : High
TSZ02201-0F2F0AG00010-1-2
7.Jul.2015 Rev.007
Datasheet
BU9000xGWZ series
Vout
50mV/div
ac coupled
Vout
100mV/div
ac coupled
1us
LX
2V/div
10us
IOUT
200mA/div
IL
500mA/div
Figure 43. Load transient response 200mA to 600mA
tr=tf=100ns, MODE : High
Vout
20mV/div
ac coupled
80ns
Figure 44. PFM mode Operation Iout=50mA
MODE
2V/div
LX
2V/div
Vout
50mV/div
ac coupled
IL
200mA/div
IL
200mA/div
Figure 45. PWM mode Operation Iout=100mA
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TSZ22111・15・001
4us
Figure 46. Mode Change Response
MODE : High to Low
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Datasheet
BU9000xGWZ series
100
90
MODE
2V/div
80
4us
VIN=2.7V
VIN=3.6V
VIN=4.2V
Efficiency[%]
70
Vout
50mV/div
ac coupled
60
50
40
30
20
IL
200mA/div
10
0
0.1
1
10
100
Load current[mA]
Figure 47. Mode Change Response
MODE : Low to High
Figure 48. Efficiency vs Load current
PFM mode
100
90
VIN=2.7V
VIN=3.6V
VIN=4.2V
80
Efficiency[%]
70
60
50
40
30
20
10
0
0.1
1
10
100
1000
Load current[mA]
Figure 49. Efficiency vs Load current
PWM mode
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TSZ02201-0F2F0AG00010-1-2
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Datasheet
BU9000xGWZ series
●Electrical characteristic curves (Reference data)
BU90008GWZ (1.000V OUTPUT)
EN
2V/div
EN
2V/div
VOUT
500ｍV/div
VOUT
500mV/div
40us
100us
IL
200mA/div
Figure 51. Shut down
Figure 50. Start up
Vout
50mV/div
ac coupled
Vout
50mV/div
ac coupled
20us
20us
IOUT
200mA/div
IOUT
200mA/div
Figure 52. Load transient response 5mA to 100mA
tr=tf=100ns, MODE : Low
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Figure 53. Load transient response 50mA to 350mA
tr=tf=100ns, MODE : High
TSZ02201-0F2F0AG00010-1-2
7.Jul.2015 Rev.007
Datasheet
BU9000xGWZ series
Vout
20mV/div
ac coupled
Vout
50mV/div
ac coupled
LX
2V/div
20us
1us
IOUT
500mA/div
IL
200mA/div
Figure 55. PFM mode Operation Iout=50mA
Figure 54. Load transient response 200mA to 600mA
tr=tf=100ns, MODE : High
Vout
20mV/div
ac coupled
MODE
2V/div
200ns
LX
2V/div
4us
Vout
50mV/div
ac coupled
IL
200mA/div
IL
200mA/div
Figure 56. PWM mode Operation Iout=100mA
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Figure 57. Mode Change Response
MODE : High to Low
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Datasheet
BU9000xGWZ series
100
90
MODE
2V/div
4us
80
Efficiency [%]
70
Vout
50mV/div
ac coupled
60
50
40
30
IL
200mA/div
VIN=2.7V
20
VIN=3.6V
10
VIN=4.2V
0
0.1
1
10
100
1000
Load current [mA]
Figure 58. Mode Change Response
MODE : Low to High
Figure 59. Efficiency vs Load current
PFM mode
1.020
Output Voltage [V]
1.010
1.000
VIN=2.7V
0.990
VIN=3.6V
VIN=4.2V
0.980
0
200
400
600
800
1000
Load current[mA]
Figure 60. Efficiency vs Load current
PWM mode
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Datasheet
BU9000xGWZ series
●Electrical characteristic curves (Reference data)
BU90009GWZ (1.300V OUTPUT)
EN
2V/div
EN
2V/div
VOUT
500ｍV/div
VOUT
500mV/div
40us
100us
IL
200mA/div
Figure 62. Shut down
Figure 61. Start up
Vout
50mV/div
ac coupled
Vout
50mV/div
ac coupled
20us
20us
IOUT
100mA/div
IOUT
200mA/div
Figure 63. Load transient response 5mA to 50mA
tr=tf=100ns, MODE : Low
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Figure 64. Load transient response 50mA to 350mA
tr=tf=100ns, MODE : Low
TSZ02201-0F2F0AG00010-1-2
7.Jul.2015 Rev.007
Datasheet
BU9000xGWZ series
Vout
20mV/div
ac coupled
Vout
50mV/div
ac coupled
LX
2V/div
20us
1us
IOUT
200mA/div
IL
200mA/div
Figure 66. PFM mode Operation
Iout=50mA
Figure 65. Load transient response 150mA to 500mA
tr=tf=100ns, MODE : High
Vout
20mV/div
ac coupled
MODE
2V/div
4us
Vout
50mV/div
ac coupled
LX
2V/div
200ns
IL
200mA/div
IL
200mA/div
Figure 67. PWM mode Operation Iout=100mA
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Figure 68. Mode Change Response
MODE : High to Low
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Datasheet
BU9000xGWZ series
100
90
MODE
2V/div
4us
80
Efficiency [%]
70
Vout
50mV/div
ac coupled
60
50
40
30
IL
200mA/div
VIN=2.7V
20
VIN=3.6V
10
VIN=4.2V
0
0.1
1
10
100
1000
Load current [mA]
Figure 69. Mode Change Response
MODE : Low to High
Figure 70. Efficiency vs Load current
PWM/PFM Auto mode
1.326
Output Voltage[V]
1.313
1.300
VIN=2.7V
1.287
VIN=3.6V
VIN=4.2V
1.274
0
200
400
600
800
1000
Load current[mA]
Figure 71. Load regulation
PWM/PFM Auto mode
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Datasheet
BU9000xGWZ series
●PC Board layout
The suggested PCB layout for the BU9000xGWZ are shown in Figure. The following guidelines should be used to ensure a
proper layout.
1) The input capacitor CIN should be connect as closely possible to VIN pin and GND pin.
2) From the output voltage to the FB pin line should be as separate as possible.
3) COUT and L should be connected as closely as possible. The connection of L to the LX pin should be as short as
possible.
Figure 72. PCB layout
●External parts selection
Inductor selection
The inductance significantly depends on output ripple current. As shown by following equation, the ripple current decreases
as the inductor and/or switching frequency increase.
⊿IL=
(VIN-VOUT)×VOUT
L×VIN×f
f: switching frequency
⊿IL: inductor current ripple
L: inductance
As a minimum requirement, the DC current rating of the inductor should be equal to the maximum load current plus half of
the inductor current ripple as shown by the following equation.
ILPEAK= IOUTMAX +
⊿IL
2
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Datasheet
BU9000xGWZ series
1 ) Recommended inductor selection
・Iout≦1A
LQM2MPN1R0NG0 (2.0mm×1.6mm×1.0mm Murata)
MIPSZ2016D1R0FH (2.0mm×1.6mm×1.0mm FDK)
DFE252012C1R0 (2.5mm×2.0mm×1.2mm TOKO)
・Iout≦0.6A
LQM21PN1R0NGC (2.0mm×1.2mm×1.0mm Murata)
MIPSZ2012D1R0 (2.0mm×1.2mm×1.0mm FDK)
MIPSTZ1608D1R0 (1.6mm×0.8mm×0.8mm FDK)
MLP2012H1R0M (2.0mm×1.2mm×1.0mm TDK)
CKP2012N1R0N (2.0mm×1.2mm×1.0mm Taiyo Yuden)
2 ) Recommended input capacitor(CIN) selection
GRM155R60J225M(1.0mm×0.5mm×0.5mm Murata)
GRM155R60J475M(1.0mm×0.5mm×0.5mm Murata)
GRM155R60G106M(1.0mm×0.5mm×0.5mm Murata)
3 ) Recommended output capacitor(COUT) selection
GRM155R60J475M(1.0mm×0.5mm×0.5mm Murata)
GRM155R60G106M(1.0mm×0.5mm×0.5mm Murata)
○Cautions on the output capacitor selection
The BU9000xGWZ is designed to fixed soft-start time and operate with a maximum output capacitance of 10uF.
If the capacitance connected to the output is larger than 10uF, an overshoot of the output voltage will be caused.
It is possible to cause damage on the connected device.
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Datasheet
BU9000xGWZ series
●I/O equivalence circuit(s)
A2
B1
EN
VIN
B2
VIN
LX
B3
VIN
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MODE
FB
VIN
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Datasheet
BU9000xGWZ series
●Caution of use
1) Absolute maximum ratings
An excess in the absolute maximum rating, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If
any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.
2) GND voltage
The potential of GND pin must be minimum potential in all condition. As an exception, the circuit design allows voltages
up to -0.3 V to be applied to the IC pin.
3) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
4) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
5) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
6) Mutual impedance
Power supply and ground wiring should reflect consideration of the need to lower mutual impedance and minimize ripple
as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and
capacitance).
7) Thermal shutdown Circuit (TSD Circuit)
This model IC has a built-in TSD circuit. This circuit is only to cut off the IC from thermal runaway, and has not been
design to protect or guarantee the IC. Therefore, the user should not plan to activate this circuit with continued operation
in mind.
8) Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic
diode or transistor. For example, as shown in the figures below, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used.
9) Disturbance light
In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due to
photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from
being exposed to light.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a
reference to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
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Datasheet
BU9000xGWZ series
●Ordering Information
B
U
9
0
0
0
Part Number
x
G
W
Z
Package
GWZ: UCSP35L1
E2
Packaging and forming specification
E2: Embossed tape and reel
(UCSP35L1)
●Marking Diagram(s)(TOP VIEW)
Series
BU90002GWZ
Part Number Marking
AB4
BU90003GWZ
AB6
BU90004GWZ
AB7
BU90005GWZ
AB8
BU90006GWZ
AB9
BU90007GWZ
ACM
BU90008GWZ
ADW
BU90009GWZ
ADV
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Datasheet
BU9000xGWZ series
●Physical Dimension, Tape and Reel Information
Package Name
UCSP35L1
(Unit： mm）
< Tape and Reel Information >
Tape
Embossed carrier tape
Quantity
3,000pcs
Direction of feed
E2
The direction is the pin 1 of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
1234
1234
Reel
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1234
1pin
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1234
1234
Direction of feed
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Datasheet
BU9000xGWZ series
●Revision History
Date
Revision
04.Jul.2012
001
New Release
16.Oct.2013
002
Page18
1 ) Recommended inductor selection
MIPSZ2016D1R0FH, MIPSZ2012D1R0 added.
003
Page4
Electrical Characteristic(s)
Operating quiescent current
IQ1(BU90003GWZ PWM operation), IQ2(BU90004GWZ PWM operation) added.
29.May.2014
004
Page19
I/O equivalence circuit added.
Page20⇒Page22
Physical Dimension, Tape and Reel Information
8.Dec.2014
005
Page20
Caution of use
9) Disturbance light added.
28.Oct.2013
Changes
BU90008GWZ added.
15.May.2015
006
Page 2
Figure 3. Block Diagram(s)
Range of the output capacitor capacity added.
Page21
Cautions on the output capacitor selection added.
BU90009GWZ added.
7.Jul.2015
007
Page 4
Output discharge resistance
Correction of errors
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Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
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Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2.
ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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