PHILIPS 74LVCH16245AEV

74LVC16245A; 74LVCH16245A
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Rev. 08 — 6 November 2008
Product data sheet
1. General description
The 74LVC16245A; 74LVCH16245A are 16-bit transceivers featuring non-inverting
3-state bus compatible outputs in both send and receive directions. The device features
two output enable (nOE) inputs for easy cascading and two send/receive (nDIR) inputs for
direction control. nOE controls the outputs so that the buses are effectively isolated. This
device can be used as two 8-bit transceivers or one 16-bit transceiver.
Inputs can be driven from either 3.3 V or 5 V devices. When disabled, up to 5.5 V can be
applied to the outputs. These features allow the use of these devices in mixed
3.3 V and 5 V applications.
The 74LVCH16245A bus hold on data inputs eliminates the need for external pull-up
resistors to hold unused inputs.
2. Features
n
n
n
n
n
n
n
n
n
n
n
5 V tolerant inputs/outputs for interfacing with 5 V logic
Wide supply voltage range from 1.2 V to 3.6 V
CMOS low power consumption
MULTIBYTE flow-through standard pin-out architecture
Low inductance multiple power and ground pins for minimum noise and ground
bounce
Direct interface with TTL levels
High-impedance when VCC = 0 V
All data inputs have bus hold. (74LVCH16245A only)
Complies with JEDEC standard JESD8-B / JESD36
ESD protection:
u HBM JESD22-A114E exceeds 2000 V
u CDM JESD22-C101C exceeds 1000 V
Specified from −40 °C to +85 °C and −40 °C to +125 °C
NXP Semiconductors
74LVC16245A; 74LVCH16245A
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
3. Ordering information
Table 1.
Ordering information
Type number
74LVC16245ADL
Temperature range Package
Name
Description
Version
−40 °C to +125 °C
SSOP48
plastic shrink small outline package; 48 leads;
body width 7.5 mm
SOT370-1
−40 °C to +125 °C
TSSOP48
plastic thin shrink small outline package;
48 leads; body width 6.1 mm
SOT362-1
−40 °C to +125 °C
VFBGA56
plastic very thin fine-pitch ball grid array package; SOT702-1
56 balls; body 4.5 × 7 × 0.65 mm
−40 °C to +125 °C
HUQFN60U plastic thermal enhanced ultra thin quad flat
package; no leads; 60 terminals; UTLP based;
body 4 x 6 x 0.55 mm
74LVCH16245ADL
74LVC16245ADGG
74LVCH16245ADGG
74LVC16245AEV
74LVCH16245AEV
74LVC16245ABQ
74LVCH16245ABQ
SOT1025-1
4. Functional diagram
2DIR
1DIR
2OE
1OE
2A0
1A0
1B0
1A1
2B0
2A1
2B1
1B1
1A2
2A2
1B2
1A3
2B2
2A3
1B3
1A4
2B3
2A4
2B4
1B4
1A5
2A5
1B5
1A6
2B5
2A6
1B6
2B6
2A7
1A7
1B7
2B7
001aaa789
Fig 1.
Logic symbol
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
2 of 19
74LVC16245A; 74LVCH16245A
NXP Semiconductors
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
G3
3EN1[BA]
3EN2[AB]
G6
6EN1[BA]
6EN2[AB]
1OE
1DIR
2OE
2DIR
1A0
1B0
1
2
1A1
1B1
1A2
1B2
1A3
1B3
1A4
1B4
1A5
1B5
1A6
1B6
1A7
1B7
2A0
2B0
4
5
2A1
2B1
2A2
2B2
2A3
2B3
2A4
2B4
2A5
2B5
2A6
2B6
2A7
2B7
001aaa790
Fig 2.
IEC logic symbol
VCC
data input
to internal circuit
mna705
Fig 3.
Bus hold circuit
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
3 of 19
74LVC16245A; 74LVCH16245A
NXP Semiconductors
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
5. Pinning information
5.1 Pinning
74LVC16245A
74LVCH16245A
1DIR
1
48 1OE
1B0
2
47 1A0
1B1
3
46 1A1
GND
4
45 GND
1B2
5
44 1A2
1B3
6
43 1A3
VCC
7
42 VCC
1B4
8
41 1A4
1B5
9
40 1A5
GND 10
39 GND
1B6 11
38 1A6
1B7 12
37 1A7
2B0 13
36 2A0
2B1 14
35 2A1
GND 15
34 GND
2B2 16
33 2A2
2B3 17
32 2A3
VCC 18
31 VCC
2B4 19
30 2A4
2B5 20
29 2A5
GND 21
28 GND
2B6 22
27 2A6
2B7 23
26 2A7
2DIR 24
74LVC16245A
ball A1
74LVCH16245A
index area
1 2 3 4 5 6
A
B
C
D
E
F
G
H
J
K
25 2OE
001aad111
Transparent top view
001aad110
Fig 4.
Pin configuration SOT370-1 (SSOP48) and
SOT362-1 (TSSOP48)
Fig 5.
Pin configuration SOT702-1 (VFBGA56)
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
4 of 19
74LVC16245A; 74LVCH16245A
NXP Semiconductors
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
terminal 1
index area
D1
A32
A1
D5
A31
A30
B20
A29
B19
A28
B18
A27
D4
D8
A26
A2
A25
B1
B17
B2
B16
A3
A24
A4
A23
B15
B3
A5
A22
74LVC16245A
74LVCH16245A
B4
A6
B14
A21
B5
B13
A7
A20
B6
B12
A8
A19
B7
B11
GND(1)
A9
A10
D6
D2
A11
B9
B8
A12
A13
A18
B10
A14
A15
D7
A17
A16
D3
001aai894
Transparent top view
(1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input.
Fig 6.
Pin configuration SOT1025-1 (HUQFN60U)
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
5 of 19
74LVC16245A; 74LVCH16245A
NXP Semiconductors
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
SOT370-1 and
SOT362-1
SOT702-1
1DIR, 2DIR 1, 24
SOT1025-1
A30, A13
direction control input
1B0 to 1B7 2, 3, 5, 6, 8, 9, 11, B2, B1, C2, C1, D2, D1,
12
E2, E1
A1, K1
B20, A31, D5, D1, A2,
B2, B3, A5
data input/output
2B0 to 2B7 13, 14, 16, 17, 19, F1, F2, G1, G2, H1, H2,
20, 22, 23
J1, J2
A6, B5, B6, A9, D2, D6,
A12, B8
data input/output
GND
4, 10, 15, 21, 28,
34, 39, 45
B3, B4, D3, D4, G3, G4,
J3, J4
A32, A3, A8, A11, A16,
A19, A24, A27
ground (0 V)
VCC
7, 18, 31, 42
C3, C4, H3, H4
A1, A10, A17, A26
supply voltage
1OE, 2OE
48, 25
A6, K6
A29, A14
output enable input (active LOW)
1A0 to 1A7 47, 46, 44, 43, 41, B5, B6, C5, C6, D5, D6,
40, 38, 37
E5, E6
B18, A28, D8, D4, A25,
B16, B15, A22
data input/output
2A0 to 2A7 36, 35, 33, 32, 30, F6, F5, G6, G5, H6, H5,
29, 27, 26
J6, J5
A21, B13, B12, A18, D3, data input/output
D7, A15, B10
n.c.
A4, A7, A20, A23, B1,
B4, B7, B9, B11, B14,
B17, B19
-
A2, A3, A4, A5, K2, K3,
K4, K5
not connected
6. Functional description
Table 3.
Function table[1]
Inputs
Outputs
nOE
nDIR
nAn
nBn
L
L
A=B
inputs
L
H
inputs
B=A
H
X
Z
Z
[1]
H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
6 of 19
74LVC16245A; 74LVCH16245A
NXP Semiconductors
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
IIK
input clamping current
VI
input voltage
IOK
output clamping current
output voltage
VO
Conditions
VI < 0 V
[1]
Min
Max
Unit
−0.5
+6.5
V
−50
-
mA
−0.5
+6.5
V
-
±50
mA
output HIGH or LOW
[2]
−0.5
VCC + 0.5
V
output 3-state
[2]
−0.5
+6.5
V
-
±50
mA
VO > VCC or VO < 0 V
IO
output current
VO = 0 V to VCC
ICC
supply current
-
100
mA
IGND
ground current
−100
-
mA
Tstg
storage temperature
−65
+150
°C
Ptot
total power dissipation
Tamb = −40 °C to +125 °C;
(T)SSOP48 package
[3]
-
500
mW
VFBGA56 package
[4]
-
1000
mW
HUQFN60U package
[4]
-
1000
mW
[1]
The minimum input voltage ratings may be exceeded if the input current ratings are observed.
[2]
The output voltage ratings may be exceeded if the output current ratings are observed.
[3]
Above 60 °C the value of Ptot derates linearly with 5.5 mW/K.
[4]
Above 70 °C the value of Ptot derates linearly with 1.8 mW/K.
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCC
supply voltage
maximum speed
performance
2.7
-
3.6
V
functional
1.2
-
3.6
V
0
-
5.5
V
output HIGH or LOW
0
-
VCC
V
VI
input voltage
VO
output voltage
output 3-state
0
-
5.5
V
Tamb
ambient temperature
in free air
−40
-
+125
°C
∆t/∆V
input transition rise and fall rate
VCC = 1.2 V to 2.7 V
0
-
20
ns/V
VCC = 2.7 V to 3.6 V
0
-
10
ns/V
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
7 of 19
74LVC16245A; 74LVCH16245A
NXP Semiconductors
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
−40 °C to +85 °C
Conditions
Min
VIH
VIL
VOH
VOL
Typ[1]
−40 °C to +125 °C Unit
Max
Min
Max
HIGH-level input
voltage
VCC = 1.2 V
VCC
-
-
VCC
-
V
VCC = 2.7 V to 3.6 V
2.0
-
-
2.0
-
V
LOW-level input
voltage
VCC = 1.2 V
-
-
0
-
0
V
VCC = 2.7 V to 3.6 V
-
-
0.8
-
0.8
V
VCC − 0.2
VCC
-
VCC − 0.3
-
V
IO = −12 mA; VCC = 2.7 V
2.2
-
-
2.05
-
V
IO = −18 mA; VCC = 3.0 V
2.4
-
-
2.25
-
V
IO = −24 mA; VCC = 3.0 V
2.2
-
-
2.0
-
V
IO = 100 µA;
VCC = 2.7 V to 3.6 V
-
0
0.20
-
0.3
V
IO = 12 mA; VCC = 2.7 V
-
-
0.40
-
0.6
V
HIGH-level output VI = VIH or VIL
voltage
IO = −100 µA;
VCC = 2.7 V to 3.6 V
LOW-level output
voltage
VI = VIH or VIL
IO = 24 mA; VCC = 3.0 V
-
-
0.55
-
0.8
V
[2]
-
±0.1
±5
-
±20
µA
[2][3]
-
±0.1
±5
-
±20
µA
II
input leakage
current
VI = 5.5 V or GND; VCC = 3.6 V
IOZ
OFF-state output
current
VI = VIH or VIL;
VO = 5.5 V or GND;
VCC = 3.6 V
IOFF
power-off leakage VI or VO = 5.5 V; VCC = 0.0 V
supply
-
±0.1
±10
-
±20
µA
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 3.6 V
-
0.1
10
-
40
µA
∆ICC
additional supply
current
per input pin; VI = VCC − 0.6 V;
IO = 0 A; VCC = 2.7 V to 3.6 V
-
5
500
-
5000
µA
CI
input capacitance VCC = 0 V to 3.6 V;
VI = GND to VCC
-
5.0
-
-
-
pF
CI/O
input/output
capacitance
VCC = 0 V to 3.6 V;
VI = GND to VCC
-
10
-
-
-
pF
IBHL
bus hold current
LOW
VCC = 3.0 V; VI = 0.8 V
[4][5]
75
-
-
60
-
µA
IBHH
bus hold current
HIGH
VCC = 3.0 V; VI = 2.0 V
[4][5]
−75
-
-
−60
-
µA
IBHLO
bus hold
overdrive current
LOW
VCC = 3.6 V
[4][6]
500
-
-
500
-
µA
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
8 of 19
NXP Semiconductors
74LVC16245A; 74LVCH16245A
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Table 6.
Static characteristics …continued
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol
IBHHO
[1]
Parameter
−40 °C to +85 °C
Conditions
bus hold
overdrive current
HIGH
[4][6]
VCC = 3.6 V
−40 °C to +125 °C Unit
Min
Typ[1]
Max
Min
Max
−500
-
-
−500
-
µA
All typical values are measured at VCC = 3.3 V (unless stated otherwise) and Tamb = 25 °C.
[2]
The bus hold circuit is switched off when VI > VCC allowing 5.5 V on the input terminal.
[3]
For I/O ports the parameter IOZ includes the input leakage current.
[4]
Valid for data inputs of bus hold parts only (74LVCH16245A). Note that control inputs do not have a bus hold circuit.
[5]
The specified sustaining current at the data input holds the input below the specified VI level.
[6]
The specified overdrive current at the data input forces the data input to the opposite input state.
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 9.
Symbol Parameter
tpd
propagation
delay
−40 °C to +85 °C
Conditions
nAn to nBn; nBn to nAn; see Figure 7
VCC = 2.7 V
ten
enable time
[2]
nOE to nAn, nBn; see Figure 8
VCC = 2.7 V
tdis
disable time
[2]
nOE to nAn, nBn; see Figure 8
Min
Max
-
13.0
-
-
-
VCC = 2.7 V
1.0
2.7
4.7
1.0
6.0
ns
1.0
2.2
4.5
1.0
6.0
ns
-
15.0
-
-
-
ns
1.5
3.6
6.7
1.5
8.5
ns
1.0
2.8
5.5
1.0
7.0
ns
-
11.0
-
-
-
ns
[2]
1.5
3.4
6.6
1.5
8.5
ns
1.5
3.2
5.6
1.5
7.0
ns
74LVC_LVCH16245A_8
Product data sheet
ns
[1]
VCC = 1.2 V
VCC = 3.0 V to 3.6 V
Max
[1]
VCC = 1.2 V
VCC = 3.0 V to 3.6 V
Typ
[1]
VCC = 1.2 V
VCC = 3.0 V to 3.6 V
−40 °C to +125 °C Unit
Min
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
9 of 19
74LVC16245A; 74LVCH16245A
NXP Semiconductors
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Table 7.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 9.
Symbol Parameter
CPD
[1]
power
dissipation
capacitance
−40 °C to +85 °C
Conditions
−40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
-
30
-
-
-
[3]
per buffer; VI = GND to VCC
VCC = 3.3 V
pF
tpd is the same as tPLH and tPHL.
ten is the same as tPZL and tPZH.
tdis is the same as tPLZ and tPHZ.
[2]
Typical values are measured at Tamb = 25 °C and VCC = 3.3 V.
[3]
CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz; fo = output frequency in MHz
CL = output load capacitance in pF
VCC = supply voltage in Volts
N = number of inputs switching
Σ(CL × VCC2 × fo) = sum of the outputs.
11. Waveforms
VI
nAn, nBn
input
VM
GND
t PHL
t PLH
VOH
nBn, nAn
output
VM
VOL
mna477
Measurement points are given in Table 8.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 7.
The input (nAn, nBn) to output (nBn, nAn) propagation delays
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
10 of 19
74LVC16245A; 74LVCH16245A
NXP Semiconductors
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
VI
nOE input
VM
GND
tPLZ
tPZL
VCC
output
LOW-to-OFF
OFF-to-LOW
VM
VX
VOL
tPHZ
VOH
tPZH
VY
output
HIGH-to-OFF
OFF-to-HIGH
GND
VM
outputs
enabled
outputs
enabled
outputs
disabled
mna362
Measurement points are given in Table 8.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 8.
Table 8.
3-state enable and disable times.
Measurement points
Supply voltage
Input
Output
VCC
VI
VM
VM
VX
VY
1.2 V
VCC
0.5 × VCC
0.5 × VCC
VOL + 0.1 V
VOH − 0.1 V
2.7 V
2.7 V
1.5 V
1.5 V
VOL + 0.3 V
VOH − 0.3 V
3.0 V to 3.6 V
2.7 V
1.5 V
1.5 V
VOL + 0.3 V
VOH − 0.3 V
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
11 of 19
74LVC16245A; 74LVCH16245A
NXP Semiconductors
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
tW
VI
90 %
negative
pulse
VM
VM
10 %
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
VM
VM
10 %
0V
tW
VEXT
VCC
VI
RL
VO
G
DUT
RT
CL
RL
001aae331
Test data is given in Table 9.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 9.
Table 9.
Load circuit for measuring switching times
Test data
Supply voltage
Input
Load
VEXT
VI
tr, tf
CL
RL
tPLH, tPHL
tPLZ, tPZL
tPHZ, tPZH
1.2 V
VCC
≤ 2.5 ns
50 pF
500 Ω
open
2 × VCC
GND
2.7 V
2.7 V
≤ 2.5 ns
50 pF
500 Ω
open
2 × VCC
GND
3.0 V to 3.6 V
2.7 V
≤ 2.5 ns
50 pF
500 Ω
open
2 × VCC
GND
[1]
The circuit performs better when RL = 1 kΩ,
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
12 of 19
74LVC16245A; 74LVCH16245A
NXP Semiconductors
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
12. Package outline
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm
SOT370-1
D
E
A
X
c
y
HE
v M A
Z
25
48
Q
A2
A1
A
(A 3)
θ
pin 1 index
Lp
L
24
1
detail X
w M
bp
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.8
0.4
0.2
2.35
2.20
0.25
0.3
0.2
0.22
0.13
16.00
15.75
7.6
7.4
0.635
10.4
10.1
1.4
1.0
0.6
1.2
1.0
0.25
0.18
0.1
0.85
0.40
8
o
0
o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT370-1
REFERENCES
IEC
JEDEC
JEITA
MO-118
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 10. Package outline SOT370-1 (SSOP48)
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
13 of 19
74LVC16245A; 74LVCH16245A
NXP Semiconductors
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
SOT362-1
E
D
A
X
c
HE
y
v M A
Z
48
25
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
detail X
24
w M
bp
e
2.5
0
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z
θ
mm
1.2
0.15
0.05
1.05
0.85
0.25
0.28
0.17
0.2
0.1
12.6
12.4
6.2
6.0
0.5
8.3
7.9
1
0.8
0.4
0.50
0.35
0.25
0.08
0.1
0.8
0.4
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT362-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 11. Package outline SOT362-1 (TSSOP48)
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
14 of 19
74LVC16245A; 74LVCH16245A
NXP Semiconductors
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm
B
D
SOT702-1
A
ball A1
index area
A
E
A2
A1
detail X
e1
C
∅v M C A B
b
e
∅w M C
y1 C
1/2 e
y
K
J
H
e
G
F
e2
E
D
1/2 e
C
X
B
A
ball A1
index area
1
2
3
4
5
6
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
b
D
E
e
e1
e2
v
w
y
y1
mm
1
0.3
0.2
0.7
0.6
0.45
0.35
4.6
4.4
7.1
6.9
0.65
3.25
5.85
0.15
0.08
0.08
0.1
OUTLINE
VERSION
SOT702-1
REFERENCES
IEC
JEDEC
JEITA
0
2.5
5 mm
scale
EUROPEAN
PROJECTION
ISSUE DATE
02-08-08
03-07-01
MO-225
Fig 12. Package outline SOT702-1 (VFBGA56)
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
15 of 19
74LVC16245A; 74LVCH16245A
NXP Semiconductors
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
HUQFN60U: plastic thermal enhanced ultra thin quad flat package; no leads
60 terminals; UTLP based; body 4 x 6 x 0.55 mm
B
D
SOT1025-1
A
terminal 1
index area
E
A
A1
detail X
e2
v
w
C A B
C
M
M
e1
v
w
b
M
M
C A B
C
C
1/2 e
e
L1
L
D2
D6
A11
B8
y1 C
D3
D7
A16
B10
y
eR
A10
A17
B7
e
B11
e3
Eh
e4
1/2 e
B1
B17
A1
A26
terminal 1
index area
D5
D1
A32
B20
B18
D8
D4
A27
Dh
X
k
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
b
D
Dh
E
Eh
e
e1
e2
e3
e4
eR
k
mm
0.6
0.05
0.00
0.35
0.25
4.1
3.9
1.9
1.8
6.1
5.9
3.9
3.8
0.5
1
2.5
3
4.5
0.5
0.25
0.15
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT1025-1
---
---
---
L
L1
v
0.35 0.125
0.07
0.25 0.025
EUROPEAN
PROJECTION
w
y
y1
0.05
0.08
0.1
ISSUE DATE
07-08-28
07-11-14
Fig 13. Package outline SOT1025-1 (HUQFN60U)
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
16 of 19
74LVC16245A; 74LVCH16245A
NXP Semiconductors
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
13. Abbreviations
Table 10.
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
TTL
Transistor-Transistor Logic
14. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74LVC_LVCH16245A_8
20081106
Preliminary data sheet
-
74LVC_LVCH16245A_7
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Added type number 74LVC16245ABQ and 74LVCH16245ABQ (HUQFN60U package)
74LVC_LVCH16245A_7
20031125
Product specification
-
74LVC_LVCH16245A_6
74LVC_LVCH16245A_6
20030130
Product specification
-
74LVC_LVCH16245A_5
74LVC_LVCH16245A_5
20021030
Product specification
-
74LVC_H16245A_4
74LVC_H16245A_4
19970925
Product specification
-
74LVC16245A_
74LVCH16245A_3
74LVC16245A_
74LVCH16245A_3
19970925
Product specification
-
74LVC16245A_2
74LVC16245A_2
19970801
Product specification
-
74LVC16245A_1
74LVC16245A_1
-
-
-
-
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
17 of 19
NXP Semiconductors
74LVC16245A; 74LVCH16245A
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74LVC_LVCH16245A_8
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 08 — 6 November 2008
18 of 19
NXP Semiconductors
74LVC16245A; 74LVCH16245A
16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
17. Contents
1
2
3
4
5
5.1
5.2
6
7
8
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Recommended operating conditions. . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information. . . . . . . . . . . . . . . . . . . . . 18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 6 November 2008
Document identifier: 74LVC_LVCH16245A_8