Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MC33882VW HSOP 30 11*16*3.2P0.8 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2015-05-05 6040A1.10 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) Yes No No e4 7a MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles MC33882VW HSOP 30 11*16*3.2P0.8 ALL 1.860700 g EACH 3 245 C 30 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version Exemptions in this part List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 4 - Item(s) does not contain RoHS restricted substances per the definition above except for selected exemptions Accepted Daniel Binyon 2012/51/EU 7a:Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Copper Lead Frame 1.092 Copper Lead Frame Metals Copper, metal 7440-50-8 1.08942178 g Copper Lead Frame Metals Gold, metal 7440-57-5 0.00001201 g Copper Lead Frame Solvents, additives, and other materials Phosphorus, elemental (not containing red allotrope) 7723-14-0 0.00006334 Copper Lead Frame Metals Iron, metal 7439-89-6 Copper Lead Frame Lead/Lead Compounds Lead Copper Lead Frame Nickel (external applications only) Copper Lead Frame Copper Lead Frame Die Encapsulant Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 997639 99.7639 585501 58.5501 11 0.0011 6 0.0006 g 58 0.0058 34 0.0034 0.00164018 g 1502 0.1502 881 0.0881 7439-92-1 0.00001529 g 14 0.0014 8 0.0008 Nickel 7440-02-0 0.00067486 g 618 0.0618 362 0.0362 Metals Palladium, metal 7440-05-3 0.00009064 g 83 0.0083 48 0.0048 Metals Zinc, metal 7440-66-6 0.0000819 g 75 0.0075 44 0.0044 g 0.7411 g Die Encapsulant Antimony/Antimony Compounds Antimony trioxide 1309-64-4 0.01082451 g 14606 1.4606 5817 0.5817 Die Encapsulant Bismuth/Bismuth Compounds Bismuth 7440-69-9 0.00685518 g 9250 0.925 3684 0.3684 Die Encapsulant Brominated Flame Retardants (other than PBBs or PBDEs) TBBA-epichlorhydrin oligomer 40039-93-8 0.00432951 g 5842 0.5842 2326 0.2326 Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.00216475 g 2921 0.2921 1163 0.1163 Die Encapsulant Solvents, additives, and other materials Other organic phosphorous compounds - 0.00685518 g 9250 0.925 3684 0.3684 Die Encapsulant Solvents, additives, and other materials Other organic Silicon Compounds - 0.00685518 g 9250 0.925 3684 0.3684 Die Encapsulant Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.02886436 g 38948 3.8948 15512 1.5512 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.61337435 g 827654 82.7654 329647 32.9647 Die Encapsulant Metals Zinc, metal 7440-66-6 0.00685518 g 9250 0.925 3684 0.3684 Die Encapsulant Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.01082451 g 14606 1.4606 5817 0.5817 Die Encapsulant Solvents, additives, and other materials Proprietary Material-Other miscellaneous substances. - 0.04329729 g 58423 5.8423 23269 2.3269 Bonding Wire, Copper 0.0022 g Bonding Wire, Copper Metals Copper, metal 7440-50-8 0.002134 g 970000 97 1146 0.1146 Bonding Wire, Copper Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000066 g 30000 3 35 0.0035 Solder Die Attach 0.0139 7a g Solder Die Attach Cadmium/Cadmium Compounds Cadmium 7440-43-9 0.00000003 g 2 0.0002 0 0 Solder Die Attach Metals Chromium(VI) 18540-29-9 0.00000003 g 2 0.0002 0 0 Solder Die Attach Lead/Lead Compounds Lead 7439-92-1 0.01327356 g 954933 95.4933 7133 0.7133 Solder Die Attach Mercury/Mercury Compounds Mercury 7439-97-6 0.00000003 g 2 0.0002 0 0 Solder Die Attach Metals Silver, metal 7440-22-4 0.00034797 g 25034 2.5034 187 0.0187 Solder Die Attach Metals Tin, metal 7440-31-5 0.00027838 g 20027 2.0027 149 0.0149 Silicon Semiconductor Die 0.0115 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.00023 g 20000 2 123 0.0123 Silicon Semiconductor Die Glass Silicon, doped - 0.01127 g 980000 98 6056 0.6056 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MC33882VW_IPC1752_v11.xml http://www.freescale.com/mcds/MC33882VW_IPC1752A.xml