PHILIPS TSA5512

INTEGRATED CIRCUITS
DATA SHEET
TSA5512
1.3 GHz Bidirectional I2C-bus
controlled synthesizer
Product specification
File under Integrated Circuits, IC02
October 1992
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
FEATURES
• Complete 1.3 GHz single chip system
• Low power 5 V, 35 mA
• I2C-bus programming
• In-lock flag
• Varicap drive disable
DESCRIPTION
• Low radiation
The TSA5512 is a single chip PLL frequency synthesizer
designed for TV tuning systems. Control data is entered
via the I2C-bus; five serial bytes are required to address
the device, select the oscillator frequency, programme the
eight output ports and set the charge-pump current. Four
of these ports can also be used as input ports (three
general purpose I/O ports, one ADC). Digital information
concerning those ports can be read out of the TSA5512 on
the SDA line (one status byte) during a READ operation. A
flag is set when the loop is “in-lock” and is read during a
READ operation. The device has one fixed I2C-bus
address and 3 programmable addresses, programmed by
applying a specific voltage on Port 3. The phase
comparator operates at 7.8125 kHz when a 4 MHz crystal
is used.
• Address selection for Picture-In-Picture (PIP), DBS
tuner (3 addresses)
• Analog-to-digital converter
• 8 bus controlled ports (6 for TSA5512T), 8 open
collector outputs (4 bidirectional)
• Power-down flag
APPLICATIONS
• TV tuners
• VCR Tuners
ORDERING INFORMATION
EXTENDED TYPE
NUMBER
PACKAGE
PINS
PIN POSITION
MATERIAL
CODE
TSA5512
18
DIL
plastic
SOT102(1)
TSA5512T
16
SO
plastic
SOT109A(2)
TSA5512AT
20
SO
plastic
SOT163A(3)
TSA5512M
20
SSOP
plastic
SOT266(4)
Note
1. SOT102-1; 1996 December 5.
2. SOT109-1; 1996 December 5.
3. SOT163-1; 1996 December 5.
4. SOT266-1; 1996 December 5.
October 1992
2
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
VCC
supply voltage
−
5
−
V
ICC
supply current
−
35
−
mA
∆fr
frequency range
64
−
1300
MHz
VI
input voltage level
80 MHz to 150 MHz
12
−
300
mV
150 MHz to 1 GHz
9
−
300
mV
1 GHz to 1.3 GHz
40
−
300
mV
fXTAL
crystal oscillator frequency
3.2
4.0
4.48
MHz
IO
open-collector output current
5
−
−
mA
Tamb
operating ambient temperature range
−10
−
+80
°C
Tstg
IC storage temperature range
−40
−
+150
°C
October 1992
3
Philips Semiconductors
Product specification
TSA5512
Fig.1 Block diagram.
1.3 GHz Bidirectional I2C-bus controlled
synthesizer
October 1992
4
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
Fig.2 Pin configuration for SOT102.
Fig.3 Pin configuration for SOT109.
Fig.4 Pin configuration for SOT163/SOT266.
October 1992
TSA5512
5
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
PINNING
PIN
SYMBOL
SOT102 SOT109
DESCRIPTION
SOT163
SOT266
PD
1
1
1
charge-pump output
Q1
2
2
2
crystal oscillator input 1
Q2
3
3
3
crystal oscillator reference voltage
n.c.
−
−
4
not connected
SDA
4
4
5
serial data input/output
SCL
5
5
6
serial clock input
P7
6
6
7
port output/input (general purpose)
n.c.
−
−
8
not connected
P6
7
7
9
port output/input for general purpose ADC
P5
8
8
10
port output/input (general purpose)
P4
9
9
11
port output/input (general purpose)
P3
10
10
12
port output/input for address selection
P2
11
11
13
port output
P1
12
−
14
port output
P0
13
−
15
port output
VCC
14
12
16
voltage supply
RFIN1
15
13
17
UHF/VHF signal input 1
RFIN2
16
14
18
UHF/VHF signal input 2 (decoupled)
VEE
17
15
19
ground
UD
18
16
20
drive output
FUNCTIONAL DESCRIPTION
The TSA5512 is controlled via the two-wire I2C-bus. For programming, there is one module address (7 bits) and the R/W
bit for selecting READ or WRITE mode.
WRITE mode: R/W = 0 (see Table 1)
After the address transmission (first byte), data bytes can be sent to the device. Four data bytes are required to fully
program the TSA5512. The bus transceiver has an auto-increment facility which permits the programming of the
TSA5512 within one single transmission (address + 4 data bytes).
The TSA5512 can also be partially programmed on the condition that the first data byte following the address is byte 2
or byte 4. The meaning of the bits in the data bytes is given in Table 1. The first bit of the first data byte transmitted
indicates whether frequency data (first bit = 0) or charge pump and port information (first bit = 1) will follow. Until an
I2C-bus STOP condition is sent by the controller, additional data bytes can be entered without the need to re-address the
device. This allows a smooth frequency sweep for fine tuning or AFC purpose. At power-on the ports are set to the high
impedance state.
The 7.8125 kHz reference frequency is obtained by dividing the output of the 4 MHz crystal oscillator by 512.
Because the input of UHF/VHF signal is first divided by 8 the step size is 62.5 kHz. A 3.2 MHz crystal can offer step sizes
of 50 kHz.
October 1992
6
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
Table 1
TSA5512
Write data format
MSB
LSB
Address
1
1
0
0
0
MA1
MA0
0
A
byte 1
Programmable
divider
0
N14
N13
N12
N11
N10
N9
N8
A
byte 2
Programmable
divider
N7
N6
N5
N4
N3
N2
N1
N0
A
byte 3
Charge-pump
and test bits
1
CP
T1
T0
1
1
1
OS
A
byte 4
P7
P6
P5
P4
P3
P2
P1*
P0*
A
byte 5
Output ports
control bits
Note to Table 1
*
not valid for TSA5512T
MA1,MAO
programmable address bits (see Table 4)
A
acknowledge bit
N14 to N0
N = N14 ×
programmable divider bits
214 +
N13 ×
213
+... +N1 ×
21 +
NO
CP
charge-pump current
CP = 0
50 µA
CP = 1
220 µA
P7 to P0 = 1
open-collector output is active
P7 to P0 = 0
outputs are in high impedance state
T1, T0, OS = 0 0 0
normal operation
T1 = 1
P6 = fref, P7 = fDIV
T0 = 1
3-state charge-pump
OS = 1
operational amplifier output is switched off (varicap drive disable)
October 1992
7
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
READ mode: R/W = 1 (see Table 2)
Data can be read out of the TSA5512 by setting the R/W bit to 1. After the slave address has been recognized, the
TSA5512 generates an acknowledge pulse and the first data byte (status word) is transferred on the SDA line (MSB first).
Data is valid on the SDA line during a high position of the SCL clock signal. A second data byte can be read out of the
TSA5512 if the processor generates an acknowledge on the SDA line. End of transmission will occur if no acknowledge
from the processor occurs. The TSA5512 will then release the data line to allow the processor to generate a STOP
condition. When ports P3 to P7 are used as inputs, they must be programmed in their high-impedance state. The POR
flag (power-on reset) is set to 1 when VCC goes below 3 V and at power-on. It is reset when an end of data is detected
by the TSA5512 (end of a READ sequence). Control of the loop is made possible with the in-lock flag FL which indicates
(FL = 1) when the loop is phase-locked. The bits I2, I1 and I0 represent the status of the I/O ports P7, P5 and P4
respectively. A logic 0 indicates a LOW level and a logic 1 a HIGH level (TTL levels). A built-in 5-level ADC is available
on I/O port P6. This converter can be used to feed AFC information to the controller from the IF section of the television
as illustrated in the typical application circuit (Fig.8). The relationship between bits A2, A1 and A0 and the input voltage
on port P6 is given in Table 3.
Table 2
Read data format
MSB
Address
Status byte
LSB
1
1
0
0
0
MA1
MA0
1
A
byte 1
POR
FL
I2
I1
I0
A2
A1
A0
−
byte 2
Note to Table 2
POR
power-on reset flag. (POR = 1 on power-on)
FL
in-lock flag (FL = 1 when the loop is phase-locked)
I2, I1, I0
digital information for I/O ports P7, P5 and P4 respectively
A2, A1 A0
digital outputs of the 5-level ADC. Accuracy is 1/2 LSB (see Table 3)
MSB is transmitted first
Address selection
The module address contains programmable address bits (MA1 and MA0) which together with the I/O port P3 offers the
possibility of having several synthesizers (up to 3) in one system.
The relationship between MA1 and MA0 and the input voltage I/O port P3 is given in Table 4
October 1992
8
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
Table 3
TSA5512
ADC levels
VOLTAGE APPLIED ON THE PORT P6
A2
A1
A0
0.6 VCC to 13.5 V
1
0
0
0.45 VCC to 0.6 VCC
0
1
1
0.3 VCC to 0.45 VCC
0
1
0
0.15 VCC to 0.3 VCC
0
0
1
0 to 0.15 VCC
0
0
0
Table 4
Address selection
MA1
MA0
VOLTAGE APPLIED ON PORT P3
0
0
0 to 0.1 VCC
0
1
always valid
1
0
0.4 to 0.6 VCC
1
1
0.9 VCC to 13.5 V
LIMITING VALUES
In accordance with Absolute Maximum Rating System (IEC 134); all pin numbers refer to DIL18 version
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
VCC
supply voltage
−0.3
6
V
V1
charge-pump output voltage
−0.3
VCC
V
V2
crystal (Q1) input voltage
−0.3
VCC
V
V4
serial data input/output voltage
−0.3
6
V
V5
serial clock input voltage
−0.3
6
V
V6-13
P7 to P0 input/output voltage
−0.3
+16
V
V15
prescaler input voltage
−0.3
VCC
V
V18
drive output voltage
−0.3
VCC
V
I6-13
P7 to P0 output current (open collector)
−1
15
mA
I4
SDA output current (open collector)
−1
5
mA
Tstg
IC storage temperature range
−40
+150
°C
Tj
maximum junction temperature
−
150
°C
THERMAL RESISTANCE
SYMBOL
Rth
j-a
October 1992
PARAMETER
THERMAL RESISTANCE
from junction to ambient in free air
DIL18
80 K/W
SO16
110 K/W
SO20
80 K/W
SSOP20
120 K/W
9
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
CHARACTERISTICS
VCC = 5 V; Tamb = 25 °C, unless otherwise specified
All pin numbers refer to DIL18 version
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Functional range
VCC
supply voltage range
4.5
−
5.5
V
Tamb
operating ambient
temperature range
−10
−
+80
°C
f
input frequency
64
−
1300
MHz
N
divider
256
−
32767
ICC
supply current
25
35
50
mA
fXTAL
crystal oscillator
frequency range
3.2
4.0
4.48
MHz
ZI
input impedance (pin 2)
−480
−400
−320
Ω
f = 80 to 150 MHz
12/−25
−
300/2.6
mV/dBm
f = 150 to 1000 MHz
9/−28
−
300/2.6
mV/dBm
f = 1000 to 1300 MHz
40/−15
−
300/2.6
mV/dBm
input level
crystal series resonance
resistance ≤ 150 Ω
VCC = 4.5 V to 5.5 V;
Tamb = −10 to +80 °C;
see typical sensitivity curve
Fig.6
RI
prescaler input resistance
(see Fig.7)
−
50
−
Ω
CI
input capacitance
−
2
−
pF
Output ports (open collector) P0 to P7 (see note 1)
ILO
output leakage current
VO = 13.5 V
−
−
10
µA
VOL
LOW level output voltage
IOL = 5 mA; note 2
−
−
0.7
V
Input port P3
IOH
HIGH level input current
VOH = 13.5 V
−
−
10
µA
IOL
LOW level input current
VOL = 0 V
−10
−
−
µA
−
−
0.8
V
Input ports P4, P5 and P7
VIL
LOW level input voltage
VIH
HIGH level input voltage
2.7
−
−
V
IIH
HIGH level input current
VIH = 13.5 V
−
−
10
µA
IIL
LOW level input current
VIL = 0 V
−10
−
−
µA
Input port P6
IIH
HIGH level input current
VIH = 13.5 V
−
−
10
µA
IIL
LOW level input current
VIL = 0 V
−10
−
−
µA
SCL and SDA inputs
VIH
HIGH level input voltage
3.0
−
5.5
V
VIL
LOW level input voltage
−
−
1.5
V
October 1992
10
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
SYMBOL
PARAMETER
CONDITIONS
TSA5512
MIN.
TYP.
MAX.
UNIT
SCL and SDA inputs
IIH
IIL
HIGH level input current
LOW level input current
VIH = 5 V; VCC = 0 V
−
−
10
µA
VIH = 5 V; VCC = 5 V
−
−
10
µA
VIL = 0 V; VCC = 0 V
−10
−
−
µA
VIL = 0 V; VCC = 5 V
−10
−
−
µA
Output SDA (pin 4; open collector)
ILO
output leakage current
VO = 5.5 V
−
−
10
µA
VO
output voltage
IO = 3 mA
−
−
0.4
V
Charge-pump output PD (pin 1)
IOH
HIGH level output current
(absolute value)
CP = 1
90
220
300
µA
IOL
LOW level output current
(absolute value)
CP = 0
22
50
75
µA
V1
output voltage
in-lock
1.5
−
2.5
V
I1leak
off-state leakage current
T0 = 1
−5
−
5
nA
Operational amplifier output UD (test mode T0 = 1)
V18
output voltage
VIL = 0 V
−
−
100
mV
V18
output voltage when
switched-off
OS = 1; VIL = 2 V
−
−
200
mV
G
operational amplifier
current gain;
I18/(I1 - I1leak)
OS = 0; VIL = 2 V;
I18 = 10 µA
2000
−
−
Notes to the characteristics
1. When a port is active, the collector voltage must not exceed 6 V.
2. Measured with all open-collector ports active.
October 1992
11
Philips Semiconductors
Product specification
TSA5512
Fig.5 Typical application (DIL18).
1.3 GHz Bidirectional I2C-bus controlled
synthesizer
October 1992
12
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
Fig.6 Prescaler typical input sensitivity curve; VCC = 4.5 to 5.5 V; Tamb = −10 to +80 °C.
Fig.7 Prescaler Smith chart of typical input impedance; VCC = 5 V; reference value = 50 Ω.
October 1992
13
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
FLOCK FLAG DEFINITION (FL)
When the FL flag is 1, the maximum frequency deviation (∆f) from stable frequency can be expressed as follows:
∆f = ± ( K VCO ⁄ K O ) × I CP × ( C1 + C2 ) ⁄ ( C1 × C2 )
Where:
KVCO
=
oscillator slope (Hz/V)
ICP
=
charge-pump current (A)
KO
=
4 × 10E6
C1 and C2
=
loop filter capacitors (see Fig.8)
Fig.8 Loop filter.
FLOCK FLAG APPLICATION
• KVCO = 16 MHz/V (UHF band)
• ICP = 220 mA
• C1 = 180 nF
• C2 = 39 nF
• ∆f = ± 27.5 kHz.
Table 5
Flock flag settings
MIN.
MAX.
UNIT
Time span between actual phase lock and FL-flag setting
1024
1152
µs
Time span between the loop losing lock and FL-flag resetting
0
128
µs
October 1992
14
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
PACKAGE OUTLINE
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
w M
b1
(e 1)
b
b2
MH
10
18
pin 1 index
E
1
9
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
1.40
1.14
0.32
0.23
21.8
21.4
6.48
6.20
2.54
7.62
3.9
3.4
8.25
7.80
9.5
8.3
0.254
0.85
inches
0.19
0.020
0.15
0.055
0.044
0.021
0.015
0.055
0.044
0.013
0.009
0.86
0.84
0.26
0.24
0.10
0.30
0.15
0.13
0.32
0.31
0.37
0.33
0.01
0.033
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
93-10-14
95-01-23
SOT102-1
October 1992
EUROPEAN
PROJECTION
15
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
HE
v M A
Z
16
9
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
8
e
0
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.069
0.010 0.057
0.004 0.049
0.01
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.050
0.039
0.016
0.028
0.020
0.01
0.01
0.004
0.028
0.012
inches
0.244
0.041
0.228
θ
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT109-1
076E07S
MS-012AC
October 1992
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-23
97-05-22
16
o
8
0o
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
HE
y
v M A
Z
11
20
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
10
e
bp
detail X
w M
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.30
0.10
2.45
2.25
0.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.10
0.012 0.096
0.004 0.089
0.01
0.019 0.013
0.014 0.009
0.51
0.49
0.30
0.29
0.419
0.043
0.050
0.055
0.394
0.016
inches
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT163-1
075E04
MS-013AC
October 1992
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
17
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
D
SOT266-1
E
A
X
c
y
HE
v M A
Z
11
20
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
10
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.5
0.15
0
1.4
1.2
0.25
0.32
0.20
0.20
0.13
6.6
6.4
4.5
4.3
0.65
6.6
6.2
1.0
0.75
0.45
0.65
0.45
0.2
0.13
0.1
0.48
0.18
10
0o
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
90-04-05
95-02-25
SOT266-1
October 1992
EUROPEAN
PROJECTION
18
o
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled
synthesizer
method. Typical reflow temperatures range from
215 to 250 °C.
SOLDERING
Introduction
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
WAVE SOLDERING
Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
If wave soldering cannot be avoided, the following
conditions must be observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.
Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
REPAIRING SOLDERED JOINTS
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
SO and SSOP
REPAIRING SOLDERED JOINTS
REFLOW SOLDERING
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering techniques are suitable for all SO and
SSOP packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
October 1992
TSA5512
19
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I2C-bus controlled synthesizer
TSA5512
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
October 1992
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