PHILIPS 74LVC11D

INTEGRATED CIRCUITS
74LVC11
Triple 3-input AND gate
Product specification
1998 Apr 28
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LVC11
FEATURES
DESCRIPTION
• Wide supply voltage range of 1.2 V to 3.6 V
• In accordance with JEDEC standard no. 8-1A.
• Inputs accept voltages up to 5.5 V
• CMOS low power consumption
• Direct interface with TTL levels
• Output capability: standard
• ICC category: SSI
The 74LVC11 is a high-performance, low power, low-voltage Si-gate
CMOS device and superior to most advanced CMOS compatible
TTL families.
The 74LVC11 provides the 3-input AND function.
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25°C; tr = tf 2.5 ns
PARAMETER
SYMBOL
tPHL/tPLH
Propagation delay
nA, nB, nC to nY
CI
Input capacitance
CPD
CONDITIONS
TYPICAL
UNIT
3.7
ns
5.0
pF
26
pF
CL = 50 pF;
VCC = 3.3 V
Power dissipation capacitance per gate
Notes 1 and 2
NOTES:
1. CPD is used to determine the dynamic power dissipation (PD in µW)
PD = CPD × VCC2 × fi (CL × VCC2 × fo) where:
fi = input frequency in MHz; CL = output load capacity in pF;
fo = output frequency in MHz; VCC = supply voltage in V;
(CL × VCC2 × fo) = sum of the outputs.
2. The condition is VI = GND to VCC.
ORDERING INFORMATION
TEMPERATURE RANGE
OUTSIDE NORTH AMERICA
NORTH AMERICA
DWG NUMBER
14-Pin Plastic SO
PACKAGES
–40°C to +85°C
74LVC11 D
74LVC11 D
SOT108-1
14-Pin Plastic SSOP Type II
–40°C to +85°C
74LVC11 DB
74LVC11 DB
SOT337-1
14-Pin Plastic TSSOP Type I
–40°C to +85°C
74LVC11 PW
74LVC11PW DH
SOT402-1
PIN CONFIGURATION
LOGIC SYMBOL (IEEE/IEC)
1A
1
14 VCC
1B
2
13 1C
2A
3
12 1Y
2B
4
11 3C
2C
5
10 3B
2Y
6
9
3A
GND
7
8
3Y
1
2
13
&
3
4
5
&
9
10
11
&
12
6
8
SV00439
SV00416
1998 Apr 28
2
853-2060 19308
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LVC11
PIN DESCRIPTION
PIN
NUMBER
1, 3, 9
2, 4, 10
7
SYMBOL
1A – 3A
1B – 3B
LOGIC DIAGRAM (ONE GATE)
NAME AND FUNCTION
Data inputs
B
Data inputs
C
GND
Ground (0 V)
12, 6, 8
1Y – 3Y
Data outputs
13, 5, 11
1C – 3C
Data inputs
14
VCC
A
SV00421
FUNCTION TABLE
INPUTS
Positive supply voltage
LOGIC SYMBOL
1
1A
2
1B
13
1C
3
2A
4
2B
5
2C
9
3A
10
3B
11
3C
1Y
2Y
3Y
Y
12
6
OUTPUTS
nA
nB
nC
nY
L
L
L
L
L
L
H
L
L
H
L
L
L
H
H
L
H
L
L
L
H
L
H
L
H
H
L
L
H
H
H
H
8
NOTES:
H = HIGH voltage level
L = LOW voltage level
SV00438
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
LIMITS
MIN
MAX
UNIT
VCC
DC supply voltage (for max. speed performance)
2.7
3.6
V
VCC
DC supply voltage (for low-voltage applications)
1.2
3.6
V
VI
DC input voltage range
0
5.5
V
VO
DC output voltage range
0
VCC
V
–40
+85
°C
0
0
20
10
ns/V
Tamb
Operating free-air temperature range
tr, tf
Input rise and fall times
1998 Apr 28
VCC = 1.2 to 2.7V
VCC = 2.7 to 3.6V
3
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LVC11
ABSOLUTE MAXIMUM RATINGS1
In accordance with the Absolute Maximum Rating System (IEC 134)
Voltages are referenced to GND (ground = 0V)
SYMBOL
VCC
PARAMETER
CONDITIONS
RATING
DC supply voltage
UNIT
–0.5 to +6.5
V
IIK
DC input diode current
VI t 0
–50
mA
–0.5 to +5.5
V
"50
mA
–0.5 to VCC +0.5
V
VI
DC input voltage
Note 2
IOK
DC output diode current
VO uVCC or VO t 0
VO
DC output voltage
Note 2
IO
DC output source or sink current
VO = 0 to VCC
IGND, ICC
Tstg
PTOT
"50
mA
"100
mA
–65 to +150
°C
500
500
mW
DC VCC or GND current
Storage temperature range
Power dissipation per package
– plastic mini-pack (SO)
– plastic shrink mini-pack (SSOP and TSSOP)
above +70°C derate linearly with 8 mW/K
above +60°C derate linearly with 5.5 mW/K
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions voltages are referenced to GND (ground = 0V)
LIMITS
SYMBOL
PARAMETER
TEST CONDITIONS
Temp = -40°C to +85°C
MIN
VIH
HIGH level Input voltage
VIL
LOW level Input voltage
VOH
O
VCC = 1.2V
VCC
VCC = 2.7 to 3.6V
2.0
TYP1
VCC = 1.2V
GND
V
0.8
VCC = 2.7V; VI = VIH or VIL; IO = –12mA
VCC*0.5
VCC = 3.0V; VI = VIH or VIL; IO = –100µA
VCC*0.2
VCC = 3.0V; VI = VIH or VIL; IO = –12mA
VCC*0.6
VCC = 3.0V; VI = VIH or VIL; IO = –24mA
VCC*1.0
VCC
VCC = 2.7V; VI = VIH or VIL; IO = 12mA
VOL
LOW level output voltage
VCC = 3.0V; VI = VIH or VIL; IO = 100µA
ICC
∆ICC
Input leakage current
VCC = 3
3.6V;
6V; VI = 5
5.5V
5V or GND
Quiescent supply current
VCC = 3.6V; VI = VCC or GND; IO = 0
Additional quiescent supply current per
input pin
VCC = 2.7V to 3.6V; VI = VCC –0.6V; IO = 0
NOTE:
1. All typical values are at VCC = 3.3V and Tamb = 25°C.
1998 Apr 28
4
V
0.40
GND
VCC = 3.0V; VI = VIH or VIL; IO = 24mA
II
MAX
V
VCC = 2.7 to 3.6V
HIGH level output voltage
UNIT
0.20
V
0.55
"0 1
"0.1
"5
µA
0.1
10
µA
5
500
µA
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LVC11
AC CHARACTERISTICS
GND = 0 V; tr = tf 2.5 ns; CL = 50 pF; RL = 500; Tamb = –40C to +85C
LIMITS
SYMBOL
tPHL/tPLH
PARAMETER
VCC = 3.3V ±0.3V
WAVEFORM
Propagation delay
nA, nB, nC to nY
1, 2
VCC = 2.7V
MIN
TYP1
MAX
MIN
MAX
–
3.7
6.2
–
7.0
UNIT
ns
NOTE:
1. These typical values are at VCC = 3.3V and Tamb = 25°C.
AC WAVEFORMS
TEST CIRCUIT
VM = 1.5 V at VCC 2.7 V
VM = 0.5 VCC at VCC < 2.7 V
VOL and VOH are the typical output voltage drop that occur with the
output load.
2 * VCC
Open
GND
500Ω
Vl
nA, nB, nC INPUT
S1
VCC
VO
VI
PULSE
GENERATOR
VM
D.U.T.
GND
t PHL
50pF
RT
t PLH
CL
500Ω
VOH
nY OUTPUT
VOL
VM
SWITCH POSITION
SV00423
TEST
Waveform 1. Input (nA, nB, nC) to
output (nY) propagation delays.
tPLH/tPHL
S1
Open
VCC
VI
< 2.7V
VCC
2.7–3.6V
2.7V
SV00903
Waveform 2.
1998 Apr 28
5
Load circuitry for switching times.
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LVC11
SO14: plastic small outline package; 14 leads; body width 3.9 mm
1998 Apr 28
6
SOT108-1
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LVC11
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
1998 Apr 28
7
SOT337-1
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LVC11
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
1998 Apr 28
8
SOT402-1
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LVC11
NOTES
1998 Apr 28
9
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LVC11
Data sheet status
Data sheet
status
Product
status
Definition [1]
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
 Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
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Document order number:
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Date of release: 08-98
9397-750-04483