DISCRETE SEMICONDUCTORS DATA SHEET handbook, halfpage M3D167 BGY916 UHF amplifier module Product specification Supersedes data of 1997 Jul 11 1998 May 27 Philips Semiconductors Product specification UHF amplifier module BGY916 FEATURES PINNING - SOT365A • 26 V nominal supply voltage PIN • 16 W output power into a load of 50 Ω with an RF drive power of 25 mW. APPLICATIONS DESCRIPTION 1 RF input 2 VS1 3 VS2 4 • Base station transmitting equipment operating in the 920 to 960 MHz frequency range. RF output flange ground DESCRIPTION handbook, halfpage The BGY916 is a three-stage UHF amplifier module in a SOT365A package. It consists of one NPN silicon planar transistor die and two silicon MOS-FET dies mounted on a metallized ceramic AlN substrate, together with matching and bias circuitry. 1 2 3 4 MSA447 Fig.1 Simplified outline. QUICK REFERENCE DATA RF performance at Tmb = 25 °C. MODE OF OPERATION CW 1998 May 27 f (MHz) VS1; VS2 (V) PL (W) Gp (dB) η (%) ZS; ZL (Ω) 920 to 960 26 16 ≥28 ≥35 50 2 Philips Semiconductors Product specification UHF amplifier module BGY916 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VS1 DC supply voltage − 28 V VS2 DC supply voltage − 28 V PD input drive power − 80 mW PL load power − 25 W Tstg storage temperature −30 +100 °C Tmb operating mounting base temperature −10 +90 °C CHARACTERISTICS Tmb = 25 °C; VS1 = VS2 = 26 V; PL = 16 W; ZS = ZL = 50 Ω unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT f frequency 920 − 960 MHz IS1 supply current − 50 − mA IS2 supply current − 150 − mA PL load power 16 19 − W Gp power gain 28 30 32 dB ∆Gp gain ripple − 1 4 dB η efficiency 35 40 − % H2 second harmonic − −47 −35 dBc H3 third harmonic − −55 −45 dBc VSWRin input VSWR − 1 : 1.5 2:1 F B PD < −60 dBm 40 dB dynamic range at f = 920 to 960 MHz isolation VS1 = 0 − − −40 dBm stability VSWR ≤ 3 : 1 through all phases; VS2 = 24 to 28 V − − −60 dBc reverse intermodulation Pcarrier = 16 W; Pinterference = 16 µW; fi = fc ±600 kHz − −68 −65 dBc − 5 8 dBc 2 − − MHz noise figure AM bandwidth ruggedness 1998 May 27 VSWR ≤ 5 : 1 through all phases 3 no degradation Philips Semiconductors Product specification UHF amplifier module BGY916 MBG286 50 handbook, halfpage PL (dBm) 40 +3 30 η Gp (dB) +15 +12 +9 +6 40 MBG287 50 handbook, halfpage PD (dBm) 50 η (%) 40 Gp 30 30 0 20 20 20 10 10 10 0 900 920 940 960 f (MHz) 0 900 980 VS1 = VS2 = 26 V; ZS = ZL = 50 Ω; Tmb = 25 °C. Fig.2 940 960 f (MHz) 0 980 VS1 = VS2 = 26 V; PL = 16 W; ZS = ZL = 50 Ω; Tmb = 25 °C. Load power as a function of frequency; typical values. Fig.3 MBG285 20 H 2 , H3 920 Power gain and efficiency as functions of frequency; typical values. MGD185 50 handbook, halfpage handbook, halfpage PL (dBm) (dBc) 30 30 H2 40 10 50 H3 −10 60 70 900 −30 920 940 960 f (MHz) 980 VS1 = VS2 = 26 V; PL = 16 W; ZS = ZL = 50 Ω; Tmb = 25 °C. Fig.4 1998 May 27 0 10 20 VS1 (V) f = 940 MHz; VS2 = 26 V; ZS = ZL = 50 Ω; Tmb = 25 °C. Harmonics as a function of frequency; typical values. Fig.5 4 Load power as a function of supply voltage; typical values. 30 Philips Semiconductors Product specification UHF amplifier module BGY916 handbook, halfpage pin numbers 1 C3 2 Z1 R1 RF input C4 L1 3 R2 L2 Z2 C2 C1 Vs1 Vs2 Fig.6 Test circuit. 1998 May 27 4 5 RF output MGL161 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... Philips Semiconductors UHF amplifier module 1998 May 27 90 6 1 4 C4 C3 L1 L2 R1 R2 C2 Fig.7 Printed-circuit board component layout. MGL162 BGY916 Dimensions in mm. 3 Product specification 2 handbook, full pagewidth C1 Philips Semiconductors Product specification UHF amplifier module BGY916 List of components (see Figs 6 and 7) COMPONENT DESCRIPTION VALUE C1, C2 electrolytic capacitor 10 µF; 35 V C3, C4 multilayer ceramic chip capacitor 100 nF; 50 V L1, L2 Grade 4S2 Ferroxcube bead CATALOGUE NO. 4330 030 36300 R1, R2 metal film resistor 10 Ω; 0.4 W 2322 195 13109 Z1, Z2 stripline; note 1 50 Ω − Note 1. The striplines are on a double copper-clad printed-circuit board with epoxy dielectric (εr = 4.5); thickness = 1 mm. The module should be mounted to the heatsink using 3 mm bolts with flat washers. The bolts should first be tightened to “finger tight” and then further tightened in alternating steps to a maximum torque of 0.4 to 0.6 Nm. MOUNTING RECOMMENDATIONS To ensure a good thermal contact and to prevent mechanical stresses when bolted down, the flatness of the mounting base is designed to be typically better than 0.1 mm. The mounting area of the heatsink should be flat and free from burrs and loose particles. The heatsink should be rigid and not prone to bowing under thermal cycling conditions. The thickness of a solid heatsink should be not less than 5 mm to ensure a rigid assembly. Once mounted on the heatsink, the module leads can be soldered to the printed-circuit board. A soldering iron may be used up to a temperature of 250 °C for a maximum of 10 seconds at a distance of 2 mm from the plastic cap. ESD precautions must be taken to protect the device from electrostatic damage. A thin, even layer of thermal compound should be used between the mounting base and the heatsink to achieve the best possible contact thermal resistance. Excessive use of thermal compound will result in an increase in thermal resistance and possible bowing of the mounting base; too little will also result in poor thermal conduction. 1998 May 27 7 Philips Semiconductors Product specification UHF amplifier module BGY916 PACKAGE OUTLINE Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads SOT365A v M B D A F y B U v M B q v M C A C U2 P E U1 L 1 2 3 4 bp e1 e w M e c v A d 0 Q 10 20 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp c D d E mm 9.5 9.0 0.56 0.46 0.3 0.2 30.1 29.9 12.8 12.6 18.6 18.4 OUTLINE VERSION e e1 2.54 17.78 F L P Q 3.25 3.15 6.5 6.1 4.1 3.9 4.0 3.8 REFERENCES IEC JEDEC EIAJ SOT365A 1998 May 27 q U 40.74 48.0 40.54 48.4 U1 U2 v w y 15.4 15.2 7.75 7.55 0.2 0.25 0.1 EUROPEAN PROJECTION ISSUE DATE 97-05-25 8 Philips Semiconductors Product specification UHF amplifier module BGY916 DEFINITIONS Data Sheet Status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1998 May 27 9 Philips Semiconductors Product specification UHF amplifier module BGY916 NOTES 1998 May 27 10 Philips Semiconductors Product specification UHF amplifier module BGY916 NOTES 1998 May 27 11 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 125108/00/04/pp12 Date of release: 1998 May 27 Document order number: 9397 750 03925