PHILIPS TDA9817TS

INTEGRATED CIRCUITS
DATA SHEET
TDA9817; TDA9818
Single/multistandard VIF/SIF-PLL
and FM-PLL/AM demodulators
Product specification
Supersedes data of 2001 Oct 19
2004 Jun 29
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
FEATURES
• AC-coupled limiter amplifier for sound intercarrier signal
• 5 V supply voltage
• Alignment-free FM Phase-Locked Loop (PLL)
demodulator with high linearity
• Applicable for Intermediate Frequencies (IFs) of
38.9, 45.75 and 58.75 MHz
• Sound IF (SIF) input for single reference Quasi Split
Sound (QSS) mode (PLL controlled); SIF AGC detector
for gain controlled SIF amplifier; single reference QSS
mixer able to operate in high performance single
reference QSS mode and in intercarrier mode
• Gain controlled wide band Video IF (VIF) amplifier
(AC-coupled)
• True synchronous demodulation with active carrier
regeneration (very linear demodulation, good
intermodulation figures, reduced harmonics and
excellent pulse response)
• AM demodulator without extra reference circuit
• Stabilizer circuit for ripple rejection and to achieve
constant output signals
• Robustness for over-modulation better than 105% due
to gated phase detector at L/L accent standard and
PLL-bandwidth control at negative modulated standards
• ElectroStatic Discharge (ESD) protection for all pins.
• Voltage Controlled Oscillator (VCO) frequency
switchable between L and L accent (alignment external)
picture carrier frequency
GENERAL DESCRIPTION
The TDA9817 is an integrated circuit for single standard
vision IF signal processing and FM demodulation.
• VIF Automatic Gain Control (AGC) detector for gain
control, operating as peak sync detector for B/G, peak
white detector for L; signal controlled reaction time for L
The TDA9818 is an integrated circuit for multistandard
vision IF signal processing, sound AM and FM
demodulation.
• Tuner AGC with adjustable TakeOver Point (TOP)
• Automatic Frequency Control (AFC) detector without
extra reference circuit
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
TDA9817T
SO24
DESCRIPTION
VERSION
plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
TDA9817TS
SSOP24
plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
TDA9818
SDIP24
plastic shrink dual in-line package; 24 leads (400 mil)
SOT234-1
plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
TDA9818T
TDA9818TS
2004 Jun 29
SO24
SSOP24
2
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
VP
supply voltage
4.5
5
5.5
V
IP
supply current
76
90
104
mA
Vi(VIF)(rms)
vision IF input signal voltage sensitivity −1 dB video at output
(RMS value)
−
60
100
µV
0.97
1.1
1.23
V
7
8
−
MHz
56
60
−
dB
Vo(CVBS)(p-p) video output signal voltage
(peak-to-peak value)
Bv(−3dB)
−3 dB video bandwidth on pin CVBS
S/NW
weighted signal-to-noise ratio for video
αIM(1.1)
intermodulation attenuation at ‘blue’
f = 1.1 MHz
58
64
−
dB
αIM(3.3)
intermodulation attenuation at ‘blue’
f = 3.3 MHz
58
64
−
dB
αH(sup)
suppression of video signal harmonics
35
40
−
dB
Vi(SIF)(rms)
sound IF input signal voltage
sensitivity (RMS value)
−3 dB at intercarrier output
−
50
100
µV
Vo(FM)(rms)
audio output signal voltage for FM
(RMS value)
B/G standard; 27 kHz,
54% modulation
0.4
0.5
0.6
V
M/N standard;
25 kHz modulation
0.36
0.45
0.54
V
0.4
0.5
0.6
V
−
0.2
0.5
%
−
0.5
1.0
%
FM
55
60
−
dB
AM
47
53
−
dB
B/G and L standard;
CL < 50 pF; RL > 1 kΩ; AC load
Vo(AM)(rms)
audio output signal voltage for AM
(RMS value)
L standard; 54% modulation
THDaudio
total harmonic distortion audio signal
54% modulation
FM
AM
S/NW(audio)
2004 Jun 29
weighted signal-to-noise ratio audio
signal
54% modulation
3
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TAGC 14
TOP
CBL
CVAGC
TPLL
22
15(1)
4
6
TUNER
AGC
VIF
AGC
LADJ VCO2
7(1) 19
VCO1
18
VP
AFC
17
21
GND
20
VOLTAGE
REFERENCE
AFC
DETECTOR
VIF1 1
VIF
SAW
VIF2 2
VIF AMPLIFIER
4
SIF1 23
SIF
SAW
SIF2 24
VCO
TWD
FPLL
VIDEO
DEMODULATOR
AND AMPLIFIER
16 CVBS
1.1 V (p-p)
QSS MIXER
INTERCARRIER MIXER
AM DEMODULATOR
SIF AMPLIFIER
SOUND video
TRAP 1 V (p-p)
8 AF
Philips Semiconductors
2 × fpc
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
BLOCK DIAGRAM
2004 Jun 29
L/L accent switch
and adjust
audio
intercarrier
mode
SIF
AGC
TDA9817
TDA9818
INTERCARRIER
MODE SWITCH
FM-PLL
DEMODULATOR
3(1)
12
13
CSAGC
STD
QSS
FMin
9
Vde-em
(1) Not connected for TDA9817T and TDA9817TS.
Fig.1 Block diagram.
mute
switch
11
Cde-em
CDEC
MHA663
Product specification
standards
selection
switch
handbook, full pagewidth
5.5 MHz
10
TDA9817; TDA9818
5
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
PINNING
SYMBOL
PIN
DESCRIPTION
VIF1
1
VIF differential input signal voltage 1
VIF2
2
VIF differential input signal voltage 2
STD
3
standards selection switch; note 1
CVAGC
4
VIF AGC capacitor
CSAGC
5
SIF AGC capacitor
TPLL
6
PLL filter
VIF1
1
24 SIF2
VIF2
2
23 SIF1
STD
3
22 TOP
CVAGC
4
21 VP
CSAGC
5
20 GND
TPLL
6
LADJ
7
AF
8
17 AFC
Vde-em
9
16 CVBS
LADJ
7
L/L accent switch and adjust; note 1
AF
8
audio output
Vde-em
9
de-emphasis output
Cde-em
10
de-emphasis input
CDEC
11
QSS
12
decoupling capacitor
single reference QSS/intercarrier
output voltage
FMin
13
sound intercarrier input voltage
TAGC
14
tuner AGC output
CBL
15
black level detector; note 1
CVBS
16
composite video output voltage
AFC
17
AFC output
VCO1
18
VCO1 resonance circuit
VCO2
19
VCO2 resonance circuit
GND
20
ground
VP
21
supply voltage
TOP
22
tuner AGC takeover point adjust
SIF1
23
SIF differential input signal voltage 1
SIF2
24
SIF differential input signal voltage 2
Cde-em 10
19 VCO2
18 VCO1
15 CBL
14 TAGC
CDEC 11
QSS 12
13 FMin
mha664
Fig.2 Pin configuration SDIP24.
Note
1. Not connected for TDA9817T and TDA9817TS.
2004 Jun 29
TDA9818
5
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
handbook, halfpage
handbook, halfpage
VIF1
1
24 SIF2
VIF1
1
24 SIF2
VIF2
2
23 SIF1
VIF2
2
23 SIF1
STD(1)
3
22 TOP
STD(1)
3
22 TOP
CVAGC
4
21 VP
CVAGC
4
21 VP
CSAGC
5
20 GND
CSAGC
5
20 GND
TPLL
6
TPLL
6
19 VCO2
AF
8
17 AFC
Vde-em
19 VCO2
TDA9818T
TDA9817T 18 VCO1
LADJ(1)
7
AF
8
17 AFC
Vde-em
9
16 CVBS
Cde-em 10
LADJ(1)
9
16 CVBS
Cde-em 10
15 CBL(1)
14 TAGC
CDEC 11
14 TAGC
13 FMin
QSS 12
TDA9818TS
7 TDA9817TS 18 VCO1
(1)
15 CBL
CDEC 11
13 FMin
QSS 12
MGU397
MGU398
(1) Not connected for TDA9817T.
(1) Not connected for TDA9817TS.
Fig.3 Pin configuration SO24.
2004 Jun 29
TDA9817; TDA9818
Fig.4 Pin configuration SSOP24.
6
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
FUNCTIONAL DESCRIPTION
proportional to the phase difference between the VCO and
the input signal. The DC current of either frequency
detector or phase detector is converted into a DC voltage
via the loop filter, which controls the VCO frequency. In the
event of positive modulated signals the phase detector is
gated by composite sync in order to avoid signal distortion
for overmodulated VIF signals.
The integrated circuit comprises the functional blocks as
shown in Fig.1:
• Vision IF amplifier and VIF AGC detector
• Tuner AGC
• Frequency Phase Locked Loop detector (FPLL)
• VCO, Travelling Wave Divider (TWD) and AFC
VCO, Travelling Wave Divider (TWD) and AFC
• Video demodulator and amplifier
The VCO operates with a resonance circuit (with L and C
in parallel) at double the picture carrier frequency. The
VCO is controlled by two integrated variable capacitors.
The control voltage required to tune the VCO from its
free-running frequency to actually double the picture
carrier frequency is generated by the frequency-phase
detector (FPLL) and fed via the loop filter to the first
variable capacitor. This control voltage is amplified and
additionally converted into a current which represents the
AFC output signal. At centre frequency the AFC output
current is equal to zero.
• Sound IF amplifier and SIF AGC
• Single reference QSS mixer
• AM demodulator
• FM-PLL demodulator
• Audio Frequency (AF) signal processing
• Internal voltage stabilizer.
Vision IF amplifier and VIF AGC detector
The vision IF amplifier consists of three AC-coupled
differential amplifier stages. Each differential stage
comprises a feedback network controlled by emitter
degeneration.
For TDA9818: the VCO centre frequency can be
decreased (required for L accent standard) by activating
an additional internal capacitor. This is achieved by using
the L accent switch. In this event the second variable
capacitor can be controlled by a variable resistor at the
L accent switch for setting the VCO centre frequency to the
required L accent value.
The AGC detector generates the required VIF gain control
voltage for constant video output by charging/discharging
the AGC capacitor. Therefore for negative video
modulation the sync level and for positive video
modulation the peak white level of the video signal is
detected. In order to reduce the reaction time for positive
modulation, where a very large time constant is needed,
an additional level detector increases the discharging
current of the AGC capacitor (fast mode) in the event of a
decreasing VIF amplitude step. The additional level
information is given by the black-level detector voltage.
The oscillator signal is divided by 2 with a TWD which
generates two differential output signals with a 90 degree
phase difference independent of the frequency.
Video demodulator and amplifier
The video demodulator is realized by a multiplier which is
designed for low distortion and large bandwidth. The
vision IF input signal is multiplied with the ‘in phase’ signal
of the travelling wave divider output. In the demodulator
stage the video signal polarity can be switched in
accordance with the TV standard.
Tuner AGC
The AGC capacitor voltage is converted to an internal
IF control signal, and is fed to the tuner AGC to generate
the tuner AGC output current at pin TAGC (open-collector
output). The tuner AGC takeover point can be adjusted at
pin TADJ. This allows to match the tuner to the SAW filter
in order to achieve the optimum IF input level.
The demodulator output signal is fed via an integrated
low-pass filter for attenuation of the carrier harmonics to
the video amplifier. The video amplifier is realized by an
operational amplifier with internal feedback and high
bandwidth. A low-pass filter is integrated to achieve an
attenuation of the carrier harmonics for B/G and
L standard. The standard dependent level shift in this
stage delivers the same sync level for positive and
negative modulation. The video output signal at pin CVBS
is 1.1 V (p-p) for nominal vision IF modulation, in order to
achieve 1 V (p-p) at sound trap output.
Frequency Phase Locked Loop detector (FPLL)
The VIF-amplifier output signal is fed into a frequency
detector and into a phase detector via a limiting amplifier.
During acquisition the frequency detector produces a
DC current proportional to the frequency difference
between the input and the VCO signal. After frequency
lock-in the phase detector produces a DC current
2004 Jun 29
TDA9817; TDA9818
7
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
Sound IF amplifier and SIF AGC
FM-PLL demodulator
The sound IF amplifier consists of two AC-coupled
differential amplifier stages. Each differential stage
comprises a controlled feedback network provided by
emitter degeneration.
The FM-PLL demodulator consists of a limiter and an
FM-PLL. The limiter provides the amplification and
limitation of the FM sound intercarrier signal. The result is
high sensitivity and AM suppression. The amplifier
consists of 7 stages which are internally AC-coupled in
order to minimize the DC offset.
The SIF AGC detector is related to the SIF input signal
(average level of AM or FM carrier) and controls the SIF
amplifier to provide a constant SIF signal to the
AM demodulator and single reference QSS mixer. At
L standard (AM sound) the SIF AGC reaction time is set to
‘slow’ for nominal video conditions. But with a decreasing
VIF amplitude step the SIF AGC is set to ‘fast’ mode
controlled by the VIF AGC detector. In FM mode this
reaction time is always ‘fast’.
Furthermore the AF output signal can be muted by
connecting a resistor between the limiter input pin FMin
and ground.
The FM-PLL consists of an integrated relaxation oscillator,
an integrated loop filter and a phase detector. The
oscillator is locked to the FM intercarrier signal, output
from the limiter. As a result of locking, the oscillator
frequency tracks with the modulation of the input signal
and the oscillator control voltage is superimposed by the
AF voltage. The FM-PLL operates as an FM demodulator.
Single reference QSS mixer
The single reference QSS mixer is realized by a multiplier.
The SIF amplifier output signal is fed to the single
reference QSS mixer and converted to intercarrier
frequency by the regenerated picture carrier (VCO). The
mixer output signal is fed via a high-pass for attenuation of
the video signal components to the output pin QSS. With
this system a high performance hi-fi stereo sound
processing can be achieved.
Audio Frequency signal processing
The AF amplifier consists of two parts:
1. The AF pre-amplifier for FM sound is an operational
amplifier with internal feedback, high gain and high
common mode rejection. The AF voltage from the
PLL demodulator, by principle a small output signal, is
amplified by approximately 33 dB. The low-pass
characteristic of the amplifier reduces the harmonics of
the intercarrier signal at the sound output terminal
pin Vde-em at which the de-emphasis network for FM
sound is applied. An additional DC control circuit is
implemented to keep the DC level constant,
independent of process spread.
For a simplified application without a sound IF SAW filter
the single reference QSS mixer can be switched to the
intercarrier mode by connecting pin SIF2 to ground. In this
mode the sound IF passes the vision IF SAW filter and the
composite IF signal is fed to the single reference QSS
mixer. This IF signal is multiplied with the 90 degree TWD
output signal for converting the sound IF to intercarrier
frequency. This composite intercarrier signal is fed to the
output pin QSS, too. By using this quadrature detection,
the low frequency video signals are removed.
2. The AF output amplifier (10 dB) provides the required
output level by a rail-to-rail output stage. This amplifier
makes use of an input selector for switching to AM,
FM de-emphasis or mute state, controlled by the
standard switching voltage and the mute switching
voltage.
AM demodulator
The AM demodulator is realized by a multiplier. The
modulated SIF amplifier output signal is multiplied in
phase with the limited (AM is removed) SIF amplifier
output signal. The demodulator output signal is fed via an
integrated low-pass filter for attenuation of the carrier
harmonics to the AF amplifier.
2004 Jun 29
Internal voltage stabilizer
The bandgap circuit internally generates a voltage of
approximately 1.25 V, independent of supply voltage and
temperature. A voltage regulator circuit, connected to this
voltage, produces a constant voltage of 3.6 V which is
used as an internal reference voltage.
8
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
VP
PARAMETER
supply voltage
CONDITIONS
MIN.
MAX.
UNIT
TDA9817T, TDA9818 and
TDA9818T: maximum chip
temperature of 120 °C;
note 1
−
5.5
V
TDA9817TS and
TDA9818TS: maximum chip
temperature of 130 °C;
note 1
−
5.5
V
Vn
voltage at pins VIF1, VIF2, STD, CVAGC,
CSAGC, TPLL, Vde-em, Cde-em, CDEC, FMin,
TAGC, CBL, AFC, VP, TOP, SIF1 and SIF2
0
VP
V
tsc(max)
maximum short-circuit time to ground or VP
−
10
s
VTAGC
tuner automatic gain control output voltage
0
13.2
V
Tstg
storage temperature
−25
+150
°C
Tamb
ambient temperature
−20
+70
°C
Vesd
electrostatic handling voltage
−300
+300
V
note 2
Notes
1. IP = 104 mA; Tamb = 70 °C; Rth(j-a) = 65 K/W for TDA9818, Rth(j-a) = 85 K/W for TDA9817T and TDA9818T,
Rth(j-a) = 110 K/W for TDA9817TS and TDA9818TS.
2. Machine model class B (L = 2.5 µH).
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
VALUE
UNIT
TDA9818
65
K/W
TDA9817T; TDA9818T
85
K/W
TDA9817TS; TDA9818TS
110
K/W
thermal resistance from junction to ambient in free air
2004 Jun 29
9
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
CHARACTERISTICS
VP = 5 V; Tamb = 25 °C; see Table 1 for input frequencies and levels; input level Vi(VIF)(rms) = 10 mV (sync level for B/G,
peak white level for L); IF input from 50 Ω via broadband transformer 1 : 1; video modulation DSB; residual carrier
B/G: 10%; L = 3%; video signal in accordance with “CCIR, line 17” or “NTC-7 Composite”; measurements taken in
Fig.15; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply (pin VP)
VP
supply voltage
IP
supply current
note 1
4.5
5
5.5
V
76
90
104
mA
Vision IF amplifier (pins VIF1 and VIF2)
Vi(VIF)(rms)
input signal voltage
sensitivity (RMS value)
B/G standard; −1 dB video
at output
−
60
100
µV
Vi(VIF)(max)(rms)
maximum input signal
voltage (RMS value)
B/G standard; 1 dB video
at output
120
200
−
mV
∆V(IF)(int)
internal IF amplitude
within AGC range;
difference between picture B/G standard;
and sound carrier
∆f = 5.5 MHz
−
0.7
1
dB
GIF(ctrl)
IF gain control range
65
70
−
dB
see Fig.5
Ri(dif)
differential input resistance note 2
1.7
2.2
2.7
kΩ
Ci(dif)
differential input
capacitance
note 2
1.2
1.7
2.5
pF
VI(VIF)
DC input voltage
note 2
−
3.4
−
V
125
130
−
MHz
K−1
True synchronous video demodulator; note 3
fVCO(max)
maximum oscillator
frequency for carrier
regeneration
∆fosc/∆T
oscillator drift as a function oscillator is free-running;
of temperature
IAFC = 0; note 4
−
−
±20 × 10−6
∆fosc/∆VP
oscillator shift as a
function of supply voltage
−
−
±1.5 × 10−3 V−1
VVCO(rms)
oscillator voltage swing at
pins VCO1 and VCO2
(RMS value)
50
80
110
fcr(pc)
picture carrier capture
range
B/G, M/N and L standard
±1.4
±1.8
−
MHz
L accent standard;
fpc = 33.9 MHz;
RLADJ = 5.6 kΩ
±0.9
±1.2
−
MHz
∆fpc(fr)
picture carrier frequency
(free-running) accuracy
L accent standard;
fpc = 33.9 MHz;
RLADJ = 5.6 kΩ
−
±200
±400
kHz
falgn(Laccent)
L accent alignment
frequency range
L accent standard; IAFC = 0 ±400
±600
−
kHz
tacq
acquisition time
BL = 70 kHz; note 5
−
30
ms
2004 Jun 29
f = 2fpc
oscillator is free-running;
note 4
10
−
mV
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
SYMBOL
Vi(VIF)(sens)(rms)
PARAMETER
VIF input signal voltage
sensitivity for PLL to be
locked (RMS value);
pins VIF1 and VIF2
TDA9817; TDA9818
CONDITIONS
maximum IF gain; note 6
MIN.
TYP.
MAX.
UNIT
−
30
70
µV
0.97
1.1
1.23
V
1.9
2.33
3.0
Composite video amplifier (pin CVBS); sound carrier off
Vo(CVBS)(p-p)
output signal voltage
(peak-to-peak value)
V/S
ratio between video
(black-to-white) and sync
level
∆Vo(CVBS)
output signal voltage
difference
difference between B/G
and L standard
−
−
±12
%
Vsync
sync voltage level
B/G and L standard
1.4
1.5
1.6
V
Vclip(u)
upper video clipping
voltage level
VP − 1.1
VP − 1
−
V
Vclip(l)
lower video clipping
voltage level
−
0.7
0.9
V
Ro
output resistance
−
−
10
Ω
Ibias(int)
internal DC bias current for
emitter-follower
2.2
3.0
−
mA
Io(sink)(max)
maximum AC and DC
output sink current
1.6
−
−
mA
Io(source)(max)
maximum AC and DC
output source current
2.9
−
−
mA
∆Vo(CVBS)(B/G)
deviation of CVBS output
signal voltage at
B/G standard
50 dB gain control
−
−
0.5
dB
30 dB gain control
−
−
0.1
dB
∆Vo(BL)(B/G)
black level tilt in
B/G standard
gain variation; note 7
−
−
1
%
∆Vo(BL)(L)
vertical black level tilt for
worst case in L standard
vision carrier modulated by −
test line (VITS) only; gain
variation; note 7
−
1.9
%
Gdif
differential gain
“CCIR, line 330”
−
2
5
%
ϕdif
differential phase
“CCIR, line 330”
−
1
2
deg
Bv(−1dB)
−1 dB video bandwidth
B/G and L standard;
CL < 50 pF; RL > 1 kΩ;
AC load
5
6
−
MHz
Bv(−3dB)
−3 dB video bandwidth
B/G and L standard;
CL < 50 pF; RL > 1 kΩ;
AC load
7
8
−
MHz
S/NW
weighted signal-to-noise
ratio
see Fig.7; note 8
56
60
−
dB
S/N
unweighted signal-to-noise see Fig.7; note 8
ratio
49
53
−
dB
2004 Jun 29
see Fig.10
note 2
11
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
SYMBOL
αIM(1.1)
PARAMETER
TDA9817; TDA9818
CONDITIONS
MIN.
TYP.
MAX.
UNIT
intermodulation
attenuation at ‘blue’
f = 1.1 MHz; see Fig.8;
note 9
58
64
−
dB
intermodulation
attenuation at ‘yellow’
f = 1.1 MHz; see Fig.8;
note 9
60
66
−
dB
intermodulation
attenuation at ‘blue’
f = 3.3 MHz; see Fig.8;
note 9
58
64
−
dB
intermodulation
attenuation at ‘yellow’
f = 3.3 MHz; see Fig.8;
note 9
59
65
−
dB
∆funwanted(p-p)
robustness for unwanted
frequency deviation of
picture carrier
(peak-to-peak value)
L standard;
residual carrier: 3%;
serration pulses: 50%;
note 2
−
−
12
kHz
∆ϕ
robustness for modulator
imbalance
L standard;
residual carrier: 0%;
serration pulses: 50%;
note 2
−
−
3
%
αvc(rms)
residual vision carrier
(RMS value)
fundamental wave and
harmonics; B/G and
L standard
−
2
5
mV
αH(sup)
suppression of video
signal harmonics
note 10a
35
40
−
dB
αH(spur)
spurious elements
note 10b
40
−
−
dB
PSRR
power supply ripple
rejection at pin CVBS
video signal; grey level;
see Fig.13
B/G standard
30
35
−
dB
L standard
26
30
−
dB
1
1.25
mA
2.5
3.1
µA
αIM(3.3)
VIF AGC detector (pins CVAGC and CBL)
Ich
charging current
B/G and L standard; note 7 0.75
additional charging current L standard in event of
missing VITS pulses and
no white video content
Idch
discharging current
1.9
B/G standard
15
20
25
µA
normal mode L
225
300
375
nA
fast mode L
30
40
50
µA
tresp(inc)
AGC response to an
increasing VIF step
B/G and L standard;
note 11
−
0.05
0.1
ms/dB
tresp(dec)
AGC response to a
decreasing VIF step
B/G standard
−
2.2
3.5
ms/dB
fast mode L
−
1.1
1.8
ms/dB
normal mode L; note 11
−
150
240
ms/dB
L standard
−2
−6
−10
dB
1.95
2.0
2.05
V
1.6
1.66
1.72
V
∆IF
VIF amplitude step for
activating fast AGC mode
Vth(CBL)
threshold voltage level
see Fig.10
additional charging current
L standard
L standard; fast mode L
2004 Jun 29
12
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
SYMBOL
PARAMETER
TDA9817; TDA9818
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Tuner AGC (pin TAGC)
IF input signal voltage for
minimum starting point of
tuner takeover
(RMS value)
input at pins VIF1
and VIF2; RTOP = 22 kΩ;
ITAGC = 0.4 mA
−
2
5
mV
IF input signal voltage for
maximum starting point of
tuner takeover
(RMS value)
input at pins VIF1
and VIF2; RTOP = 0 Ω;
ITAGC = 0.4 mA
50
100
−
mV
Vo(TAGC)
permissible output voltage
from external source;
note 2
−
−
13.2
V
Vsat(TAGC)
saturation voltage
ITAGC = 1.5 mA
−
−
0.2
V
∆VTOP(TAGC)/∆T variation of takeover point
by temperature
ITAGC = 0.4 mA
−
0.03
0.07
dB/K
ITAGC(sink)
see Fig.5
no tuner gain reduction;
VTAGC = 13.2 V
−
−
5
µA
maximum tuner gain
reduction
1.5
2
2.6
mA
−
6
8
dB
33.9 MHz
0.5
0.75
1.0
µA/kHz
38.9 MHz
0.5
0.75
1.0
µA/kHz
45.75 MHz
0.45
0.65
0.85
µA/kHz
58.75 MHz
0.38
0.55
0.72
Vi(rms)
∆GIF
sink current
IF slip by automatic gain
control
tuner gain current from
20% to 80%
AFC circuit (pin AFC); see Fig.9; note 12
CRstps
∆fIF/∆T
Vo(AFC)
control steepness ∆IAFC/∆f note 13
frequency variation by
temperature
output voltage
µA/kHz
10−6
K−1
K−1
B/G and L standard;
IAFC = 0; note 4
−
−
±20 ×
L accent standard;
IAFC = 0; note 4
−
−
±60 × 10−6
upper limit
VP − 0.6 VP − 0.3 −
V
lower limit
−
0.3
0.6
V
Io(source)(AFC)
output source current
150
200
250
µA
Io(sink)(AFC)
output sink current
150
200
250
µA
∆IAFC(p-p)
residual video modulation
current
(peak-to-peak value)
−
20
30
µA
2004 Jun 29
B/G and L standard
13
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
SYMBOL
PARAMETER
TDA9817; TDA9818
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Sound IF amplifier (pins SIF1 and SIF2)
Vi(SIF)(rms)
Vi(max)(rms)
input signal voltage
sensitivity (RMS value)
maximum input signal
voltage (RMS value)
FM mode; −3 dB at
−
intercarrier output pin QSS
50
100
µV
AM mode; −3 dB at
AF output pin AF
50
100
µV
FM mode; 1 dB at
65
intercarrier output pin QSS
100
−
mV
AM mode; 1 dB at
AF output pin AF
65
100
−
mV
FM and AM mode;
see Fig.6
60
66
−
dB
−
GSIF(ctrl)
SIF gain control range
Ri(dif)
differential input resistance note 2
1.7
2.2
2.7
kΩ
Ci(dif)
differential input
capacitance
1.2
1.7
2.5
pF
VI(SIF)
DC input voltage
−
3.4
−
V
αSIF,VIF
crosstalk attenuation
between SIF and VIF
inputs
between pins VIF1
and VIF2, and pins SIF1
and SIF2; note 14
50
−
−
dB
FM mode
8
12
16
µA
note 2
SIF AGC detector (pin CSAGC)
Ich(CSAGC)
charging current
Idch(CSAGC)
discharging current
AM mode
0.8
1.2
1.6
µA
FM mode
8
12
16
µA
normal mode AM
1
1.4
1.8
µA
fast mode AM
60
85
110
µA
QSS mode;
sound carrier 1;
sound carrier 2 off
100
140
180
mV
L standard; without
modulation
100
140
180
mV
intercarrier mode;
sound carrier 1;
sound carrier 2 off
−
note 15
−
mV
Single reference QSS intercarrier mixer (B/G standard; pin QSS)
Vo(rms)
Vo(peak)
IF intercarrier output level
(RMS value)
IF intercarrier output level
(peak value)
QSS mode
141
198
225
mV
L standard;
80% AM modulation
255
356
458
mV
Bs(−3dB)
−3 dB intercarrier
bandwidth
upper limit
7.5
9
−
MHz
αsc(rms)
residual sound carrier
(RMS value)
QSS mode; fundamental
wave and harmonics
−
2
5
mV
intercarrier mode;
fundamental wave and
harmonics
−
2
5
mV
2004 Jun 29
14
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
SYMBOL
αvc(rms)
PARAMETER
residual vision carrier
(RMS value)
TDA9817; TDA9818
CONDITIONS
MIN.
TYP.
MAX.
UNIT
QSS mode; fundamental
wave and harmonics
−
2
5
mV
intercarrier mode;
fundamental wave and
harmonics
−
5
20
mV
αH(sup)
suppression of video
signal harmonics
intercarrier mode;
fvideo ≤ 5 MHz
39
−
−
dB
Ro(QSS)
output resistance
note 2
−
−
25
Ω
VO(QSS)
DC output voltage
−
2.0
−
V
Iint(QSS)
DC internal bias current for
emitter follower
1.9
2.5
−
mA
Isink(max)(QSS)
maximum AC and DC
output sink current
1.4
1.9
−
mA
Isource(max)(QSS)
maximum AC and DC
output source current
3.0
3.5
−
mA
−
−
100
µV
−
250
400
µV
200
−
−
mV
46
50
−
dB
Limiter amplifier (pin FMin); note 16
Vi(FMin)(rms)
input signal voltage for
lock-in (RMS value)
Vi(FMin)(rms)
input signal voltage
(RMS value)
+ N
S
- weighted
 ------------N 
= 40 dB
allowed input signal
voltage (RMS value)
αAM
AM suppression
50 µs de-emphasis;
AM: f = 1 kHz; m = 0.3
refer to 27 kHz
(54% FM deviation)
Ri(FMin)
input resistance
note 2
VI(FMin)
DC input voltage
480
600
720
Ω
−
2.8
−
V
upper limit
7.0
−
−
MHz
lower limit
−
−
4.0
MHz
upper limit
9.0
−
−
MHz
lower limit
−
−
3.5
MHz
−
−
4
µs
FM-PLL demodulator
fcr
catching range of PLL
fhr
holding range of PLL
tacq
acquisition time
2004 Jun 29
15
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
SYMBOL
PARAMETER
TDA9817; TDA9818
CONDITIONS
MIN.
TYP.
MAX.
UNIT
FM operation (B/G standard; pin AF); notes 16 and 16a
Vo(AF)(rms)
AF output signal voltage
(RMS value)
27 kHz
(54% FM deviation);
see Fig.15; note 17
Rx = 470 Ω
200
250
300
mV
Rx = 0 Ω
400
500
600
mV
25 kHz
(50% FM deviation);
Rx = 0 Ω; see Fig.15;
note 17
360
450
540
mV
Vo(AF)(clip)
AF output clipping signal
voltage level
THD < 1.5%
1.0
−
1.2
V
THD < 1.5%; note 17
−
−
±53
kHz
−
3 × 10−3
7 × 10−3
dB/K
−
3.0
V
∆fAF
frequency deviation
∆Vo/∆T
temperature drift of
AF output signal voltage
Vde-em(DC)
DC voltage at decoupling
capacitor
voltage dependent on VCO 1.2
frequency; note 18
RAF
output resistance
note 2
−
−
100
Ω
VAF
DC output voltage
−
2.3
−
V
Isink(max)(AF)
maximum AC and DC
output sink current
−
−
0.5
mA
Isource(max)(AF)
maximum AC and DC
output source current
−
−
0.5
mA
BAF(−3dB)
−3 dB audio frequency
bandwidth
without de-emphasis
capacitor
100
125
−
kHz
THD
total harmonic distortion
27 kHz
(54% FM deviation)
−
0.2
0.5
%
S/NW
weighted signal-to-noise
ratio
FM-PLL only; with 50 µs
de-emphasis; 27 kHz
(54% FM deviation);
“CCIR 468-4”
55
60
−
dB
αsc(rms)
residual sound carrier
(RMS value)
fundamental wave and
harmonics
−
−
75
mV
αAF
mute attenuation of
AF signal
B/G and L standard
70
75
−
dB
∆VAF
DC jump voltage of
AF output terminal for
switching AF output to
mute state and vice versa
FM-PLL in lock mode
−
±50
±150
mV
PSRR
power supply ripple
rejection at pin AF
Rx = 0 Ω; f = 70 Hz;
see Figs 13 and 15
20
26
−
dB
2004 Jun 29
16
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
SYMBOL
PARAMETER
TDA9817; TDA9818
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Single reference QSS AF performance for FM operation (B/G standard); see Table 1; notes 19, 20 and 21
S/NW
weighted signal-to-noise
ratio
pc/sc1 ratio at pins VIF1
and VIF2; 27 kHz
(54% FM deviation);
“CCIR 468-4”
black picture
40
−
−
dB
53
58
−
dB
white picture
50
55
−
dB
6 kHz sine wave
(black-to-white
modulation)
42
48
−
dB
sound carrier
subharmonics;
f = 2.75 MHz ±3 kHz
45
51
−
dB
Intercarrier AF performance for FM operation (standard B/G); see Table 1; notes 19, 20 and 22
S/NW
weighted signal-to-noise
ratio
pc/sc1 ratio at pins VIF1
27
and VIF2; 27 kHz (54% FM
deviation); “CCIR 468-4”
−
−
dB
black picture
47
51
−
dB
white picture
47
51
−
dB
6 kHz sine wave
(black-to-white
modulation)
40
46
−
dB
sound carrier
subharmonics;
f = 2.75 MHz ±3 kHz
35
39
−
dB
AM operation (L standard; pin AF); note 23
Vo(AF)(rms)
AF output signal voltage
(RMS value)
54% modulation
400
500
600
mV
THD
total harmonic distortion
54% modulation
−
0.5
1.0
%
BAF(−3dB)
−3 dB AF bandwidth
100
125
−
kHz
S/NW
weighted signal-to-noise
ratio
47
53
−
dB
VAF
DC potential voltage
−
2.3
−
V
PSRR
power supply ripple
rejection at pin AF
20
26
−
dB
DC potential for logic
B/G standard
HIGH or pin not connected
2.8
−
VP
V
DC potential for logic LOW L/L accent standard
0
−
0.8
V
LOW level input current
190
250
310
µA
“CCIR 468-4”
see Fig.13
Switching level for standard switch (pin STD)
Vlogic
IIL
2004 Jun 29
Vi = 0 V
17
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
Notes
1. Values of video and sound parameters are decreased at VP = 4.5 V.
2. This parameter is not tested during production and is only given as an application information for designing the
television receiver.
3. Loop bandwidth BL = 70 kHz (natural frequency fn = 12 kHz; damping factor d ≈ 3; calculated with sync level within
gain control range). Resonance circuit of VCO: Q0 > 50; Cext = 8.2 pF ±0.25 pF; Cint ≈ 8.5 pF (loop voltage
approximately 2.7 V).
4. Temperature coefficient of external LC circuit is equal to zero.
5. Vi(VIF)(rms) = 10 mV; ∆f = 1 MHz (VCO frequency offset related to picture carrier frequency); white picture
video modulation.
6. VIF signal for nominal video signal.
7. The leakage current of the AGC capacitor should not exceed 1 µA at B/G standard, respectively 10 nA current at
L standard. Larger currents will increase the tilt.
8. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin CVBS). B = 5 MHz
weighted in accordance with “CCIR 567”.
9. The intermodulation figures are defined:
V o at 4.4 MHz
α 1.1 = 20 log  -------------------------------------- + 3.6 dB ; α1.1 value at 1.1 MHz referenced to black/white signal;
 V o at 1.1 MHz
V o at 4.4 MHz
α 3.3 = 20 log  -------------------------------------- ; α3.3 value at 3.3 MHz referenced to colour carrier.
 V o at 3.3 MHz
10. Measurements taken with SAW filter K3953 (sound carrier suppression: 40 dB); loop bandwidth BL = 70 kHz:
a) Modulation VSB; sound carrier off; fvideo > 0.5 MHz.
b) Sound carrier on; SIF SAW filter K9453; fvideo = 10 kHz to 10 MHz.
11. Response speed valid for a VIF input level range of 200 µV up to 70 mV.
12. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is
given in Fig.9. The AFC-steepness can be changed by the resistors at pin AFC.
13. Depending on the ratio ∆C/C0 of the LC resonant circuit of VCO (Q0 > 50; note 3; C0 = Cint + Cext).
14. Source impedance: 2.3 kΩ in parallel to 12 pF (SAW filter); fIF = 38.9 MHz.
15. Without using an SIF SAW filter the mixer can be switched to intercarrier mode by connecting pin SIF1 and/or
pin SIF2 to ground. In this mode the SIF passes the VIF SAW filter and IF intercarrier levels are depending on the
sound shelf of the VIF SAW filter. The intercarrier output signal at pin QSS can be calculated by the following formula
taking into account the video output signal at pin CVBS (Vo(CVBS)(p-p) = 1.1 V typical) as a reference:
1
V o(rms) = 1.1 V ( p – p ) × ----------- × 10
2 2
V i(sc)
------------ ( dB ) + 6 dB ± 3 dB
V i(pc)
-------------------------------------------------------------20
where:
1
a) ----------- = correction term for RMS value
2 2
V i(sc)
b) -------------- (dB) = sound-to-picture carrier ratio at VIF inputs in dB
V i(pc)
c) 6 dB = correction term of internal circuitry
d) ±3 dB = tolerance of video output and intercarrier output amplitude Vo(rms)
2004 Jun 29
18
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
e) Example for SAW filter G1962: sound shelf value = 20 dB,
V i(sc)
------------- = – 27 dB ⇒ V o(rms) = 32 mV (typical value)
V i(pc)
16. Input level for second IF from an external generator with 50 Ω source impedance. AC-coupled with 10 nF capacitor,
fmod = 1 kHz, 27 kHz (54% FM deviation) of audio references. A VIF/SIF input signal is not permitted. Pins CVAGC
and CSAGC have to be connected to positive supply voltage for minimum IF gain. S/N and THD measurements are
taken at 50 µs de-emphasis at pin Vde-em (modulator pre-emphasis has to be activated). The FM demodulator
steepness ∆Vo(AF)/∆fAF is positive.
a) Second IF input level 10 mV (RMS value).
17. Measured with an FM deviation of 27 kHz the typical AF output signal is 500 mV (RMS) (Rx = 0 Ω). By using
Rx = 470 Ω the AF output signal is attenuated by 6 dB [250 mV (RMS)]. For handling a frequency deviation of more
than 53 kHz the AF output signal has to be reduced by using Rx in order to avoid clipping (THD < 1.5%). For an
FM deviation up to 100 kHz an attenuation of 6 dB is recommended with Rx = 470 Ω.
18. The leakage current of the decoupling capacitor (2.2 µF) should not exceed 1 µA.
19. For all S/N measurements the used vision IF modulator has to meet the following specifications:
a) Incidental phase modulation for black-to-white jump less than 0.5 degrees
b) QSS AF performance, measured with the television demodulator AMF2 (audio output, weighted S/N ratio) better
than 60 dB (deviation 27 kHz) for 6 kHz sine wave black-to-white video modulation
c) Picture-to-sound carrier ratio; pc/sc1 = 13 dB (transmitter).
20. The pc/sc1 ratio is calculated as the addition of TV transmitter pc/sc1 ratio and SAW filter pc/sc1 ratio. This pc/sc1
ratio is necessary to achieve the S/NW values as noted. A different pc/sc1 ratio will change these values.
21. Measurements taken with SAW filter K3953 for vision IF (suppressed sound carrier) and K9453 for sound IF
(suppressed picture carrier). Input level Vi(SIF)(rms) = 10 mV, 27 kHz (54% FM deviation).
22. Measurements taken with SAW filter G1962 (sound shelf: 20 dB) for vision and sound IF. Pin SIF1 and/or pin SIF2
has to be connected to ground for switching the single reference QSS mixer to intercarrier mode.
23. Measurements taken with SAW filter K9453 (Siemens) for AM sound IF (suppressed picture carrier).
Table 1
Input frequencies and carrier ratios
DESCRIPTION
picture or IF carrier
sound carrier
picture-to-sound carrier
2004 Jun 29
SYMBOL
B/G STANDARD
M/N STANDARD
L STANDARD
L ACCENT
STANDARD
UNIT
fpc or fIF
38.9
45.75/58.75
38.9
33.9
MHz
fsc1
33.4
41.25/54.25
32.4
40.4
MHz
fsc2
33.158
−
−
−
MHz
sc1
13
7
10
10
dB
sc2
20
−
−
−
dB
19
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
MHA665
70
handbook, full pagewidth
gain
0.06
(dB)
60
Vi(VIF)(rms)
(mV)
50
0.6
40
Ituner
(mA)
0
30
(1)
6
(2)
(3)
(4)
20
1
10
60
0
2
−10
1
(1) Ituner; RTOP = 22 kΩ.
(2) Gain.
1.5
2
2.5
3
3.5
4
VCVAGC (V)
4.5
(3) Ituner; RTOP = 11 kΩ.
(4) Ituner; RTOP = 0 Ω.
Fig.5 Typical VIF and tuner AGC characteristics.
MHA666
110
handbook, full pagewidth
100
(dBµV)
100
Vi(SIF)(rms)
(mV)
10
90
80
70
1
60
50
0.1
40
30
0.01
20
1
1.5
2
2.5
3
3.5
Fig.6 Typical SIF AGC characteristic (FM and AM mode).
2004 Jun 29
20
4
VCSAGC (V)
4.5
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
MED684
75
handbook, halfpage
S/N
(dB)
50
25
0
−60
−40
−20
0
20
Vi(VIF)(rms)(dB)
0.06
0.6
6 10
60
600
Vi(VIF)(rms)(mV)
Fig.7 Typical signal-to-noise ratio as a function of IF input voltage.
3.2 dB
handbook, halfpage
10 dB
13.2 dB
13.2 dB
27 dB
27 dB
sc cc
pc
sc cc
BLUE
pc
YELLOW
MED685
sc = sound carrier, with respect to sync level.
cc = chrominance carrier, with respect to sync level.
pc = picture carrier, with respect to sync level.
The sound carrier levels are taking into account a sound shelf attenuation of 20 dB (SAW filter G1962).
Fig.8 Input signal conditions.
2004 Jun 29
21
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
VP = 5 V
−200
IAFC
TDA9817
17
TDA9818
0
2.5
100
nF
(source current)
−100
22 kΩ
22 kΩ
MHA667
VAFC IAFC
(V) (µA)
handbook, full pagewidth
VP
TDA9817; TDA9818
VAFC
100
(sink current)
200
38.5
38.9
39.3 f (MHz)
Fig.9 Measurement conditions and typical AFC characteristic.
handbook, full pagewidth
2.6 V
white level
1.83 V
black level
1.5 V
sync level
B/G and M/N standard
2.6 V
white level
2.0 V
threshold level
1.83 V
black level
1.66 V
threshold level
sync level
1.5 V
L standard
MHA668
Fig.10 Typical video signal levels on output pin CVBS (sound carrier off).
2004 Jun 29
22
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
MHA669
10
TDA9817; TDA9818
MHA670
10
handbook, halfpage
handbook, halfpage
(1)
(1)
(dB)
THD
(%)
(dB)
−10
(2)
−30
(3)
1.6
−10
1.2
−30
0.8
(2)
−50
−50
0.4
(3)
−70
−70
30
50
70
90
110
Vi (dBµV)
30
50
0
90
110
Vi (dBµV)
70
(1) Signal.
(2) AM rejection.
(3) Noise.
(1) Signal.
(2) THD.
(3) Noise.
Fig.11 Typical audio level, noise and AM rejection
(54% FM deviation) for FM.
Fig.12 Typical audio level, noise and THD
(54% AM modulation) for AM.
handbook, full pagewidth
VP = 5 V
100 mV
(fripple = 70 Hz)
VP = 5 V
TDA9817
TDA9818
MHA671
t
Fig.13 Ripple rejection condition.
2004 Jun 29
23
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
140
handbook, full pagewidth
10
antenna input
(dBµV)
IF signals
RMS value
(V)
video 1.1 V (p-p)
1
120
(1)
100
10−1
SAW insertion
loss 14 dB
IF slip
6 dB
80
10−2 (TOP)
tuning gain
control range
70 dB
VIF AGC
10−3
0.66 × 10−3
60
SAW insertion
loss 14 dB
10−4
40
40 dB
RF gain
10−5
0.66 × 10−5
20
10
VHF/UHF tuner
VIF
VIF amplifier, demodulator
and video
tuner
SAW filter
TDA9817; TDA9818
MHA672
(1) Depends on TOP.
Fig.14 Front end level diagram.
2004 Jun 29
24
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
INTERNAL CIRCUITRY
Table 2
PIN
NO.
Equivalent pin circuits and pin voltages
PIN
SYMBOL
DC VOLTAGE
(V)
1
VIF1
3.4
2
VIF2
3.4
EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)
+
1
1.1 kΩ
800 Ω
650 µA
+
1.1 kΩ
2
650 µA
3.4 V
MHA673
3
STD(1)
0 to VP
3.6 V
26 kΩ
3
3.6 V
16 kΩ
24 kΩ
MHA674
4
CVAGC
1.5 to 4.0
40 µA
4
Ib
1 mA
2.5 µA
0.3/20/40 µA
MHA675
2004 Jun 29
25
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
PIN
NO.
5
PIN
SYMBOL
CSAGC
DC VOLTAGE
(V)
TDA9817; TDA9818
EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)
1.5 to 4.0
+
15 µA
5
Ib
+
+
+
±1 µA
MHA676
6
PLL
1.5 to 4.0
+
+
+
+
+
Ib
6
VCO
200 µA
MHA677
7
LADJ(1)
0 to VP
+
100 µA
7.6 kΩ
+
7
9 kΩ
17 kΩ
100 µA
9 kΩ
7.2 kΩ
3.6 V
1V
2.5 V
MHA678
2004 Jun 29
26
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
PIN
NO.
8
PIN
SYMBOL
AF
DC VOLTAGE
(V)
TDA9817; TDA9818
EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)
2.3
+
+
21.7 kΩ
8
25 pF
23.7 kΩ
120 Ω
MHA679
9
Vde-em
2.3
10
Cde-em
2.3
5.6 kΩ
+
8.4 kΩ
10 pF
9
39 kΩ
8.4 kΩ
290 Ω
27.4 kΩ
5.6 kΩ
+
10
3.5 kΩ
MHA680
11
CDEC
1.2 to 3.0
+
+
+
90 µA
11
1 kΩ
MHA681
2004 Jun 29
27
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
PIN
NO.
12
PIN
SYMBOL
QSS
DC VOLTAGE
(V)
TDA9817; TDA9818
EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)
2.0
+
150 Ω
1.9 mA
12
14.7 kΩ
MHA682
13
FMin
2.65
400 Ω
13
640 Ω
40 kΩ
35 µA
2.65 V
600 µA
MHA683
14
TAGC
0 to 13.2
14
MHA684
15
CBL(1)
0 to 3.2
+
5 µA
+
2.5 µA
+
0.15 µA
+
2.5 µA
15
30 µA
+
10 µA
+
16 µA
10 µA
2.5 µA
MHA685
2004 Jun 29
28
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
PIN
NO.
16
PIN
SYMBOL
CVBS
DC VOLTAGE
(V)
TDA9817; TDA9818
EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)
sync level: 1.5
+
100 Ω
2.1 pF
3.0 mA
16
MHA686
17
AFC
0.3 to VP − 0.3
+
+
IAFC
±200 µA
17
MHA687
18
VCO1
2.7
19
VCO2
2.7
+
420 Ω
420 Ω
+
50 Ω
18
B/G
2.8 V
20 kΩ
20 kΩ
L accent
19
500 µA
MHA688
20
GND
0
21
VP
VP
2004 Jun 29
29
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
PIN
NO.
22
PIN
SYMBOL
TOP
DC VOLTAGE
(V)
TDA9817; TDA9818
EQUIVALENT CIRCUIT (WITHOUT ESD PROTECTION CIRCUIT)
0 to 1.9
30 kΩ
20 kΩ
3.6 V
9 kΩ
22
1.9 V
MHA689
23
SIF1
3.4
24
SIF2
3.4
+
23
+
100 µA
1.1 kΩ
400 µA
5 kΩ
10 kΩ
1.8 V
1.1 kΩ
+
24
800 Ω
3.4 V
400 µA
MHA690
Note
1. Not connected for TDA9817T and TD9817TS.
2004 Jun 29
30
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22 kΩ
100 nF
1:1
SIF
input
50
Ω
1
5
2
4
22 kΩ
1.1 V (p-p)
video
GND
tuner AGC
TOP
(1)
10 nF
22
kΩ
100
nF
CBL
5.6 kΩ
3
24
23
22
21
19
20
18
17
15(2)
16
10 nF
14
13
TDA9817
TDA9818
31
intercarrier
mode
1
2
3(2)
4
5
mute
switch
7(2)
6
8
9
10
12
11
1:1
1
VIF
input
50
Ω
5
2
330
Ω
4
2.2
µF
3
2.2
µF
AF
22 output
kΩ
220
nF
2.4
kΩ
22 nF
Rx
CDEC
Philips Semiconductors
AFC
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TEST AND APPLICATION INFORMATION
2004 Jun 29
VP
22
µF
QSS
intercarrier
output
560 Ω
5.5 MHz(3)
MHA691
L/L accent
switch
and adjust
handbook, full pagewidth
loop
filter
Fig.15 Test circuit.
de-emphasis
≈50 µs
Product specification
(1) See Table 3.
(2) Not connected for TDA9817T and TDA9817TS.
(3) Depends on TV standard.
SIF
AGC
TDA9817; TDA9818
standards VIF
selection AGC
switch
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22 kΩ
100 nF
15
µH
22 kΩ
tuner AGC
GND
IF
input
TOP
SAW
FILTER
K9453
(1)
10 nF
22
kΩ
330
Ω
CBL
100
nF
5.6 kΩ
SIF
(3)
23
24
22
21
19
20
18
17
15(2)
16
10 nF
14
13
TDA9817
TDA9818
32
intercarrier
mode
1
2
3(2)
4
5
mute
switch
7(2)
6
8
9
10
12
11
VIF
50
Ω
SAW
FILTER
K3953
330
Ω
2.2
µF
(3)
2.2
µF
AF
22 output
kΩ
220
nF
2.4
kΩ
22 nF CDEC
Philips Semiconductors
1 V (p-p)
video
AFC
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
2004 Jun 29
VP
Rx
22
µF
QSS
intercarrier
output
560 Ω
5.5 MHz(3)
MHA692
L/L accent
switch
and adjust
handbook, full pagewidth
loop
filter
Fig.16 Application circuit.
de-emphasis
≈50 µs
Product specification
(1) See Table 3.
(2) Not connected for TDA9817T and TDA9817TS.
(3) Depends on TV standard.
SIF
AGC
TDA9817; TDA9818
standards VIF
selection AGC
switch
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
Table 3
TDA9817; TDA9818
Oscillator circuit for the different TV standards
PARAMETER
EUROPE
USA
JAPAN
IF frequency
38.9 MHz
45.75 MHz
58.75 MHz
VCO frequency
77.8 MHz
91.5 MHz
117.5 MHz
Oscillator circuit
18
CVCO
C(C9)
8.5 pF
8.2 pF
19
e.g. Toko coil
Philips ceramic
capacitor
2004 Jun 29
18
L(F4)
251 nH
CVCO
C(C9)
8.5 pF
10 pF
19
MHA693
18
L(F4)
163 nH
MHA694
CVCO
C(C9)
8.5 pF
15 pF
19
L(F4)
78 nH
MHA695
5KM 369SNS-2010Z
5KMC V369SCS-2370Z
MC 139 NE545SNAS100108
2222 632 51828
inside of coil
15 pF SMD; size = 0805
33
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
PACKAGE OUTLINES
SDIP24: plastic shrink dual in-line package; 24 leads (400 mil)
SOT234-1
ME
seating plane
D
A2
A
A1
L
c
e
Z
b1
(e 1)
w M
MH
b
13
24
pin 1 index
E
1
12
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.7
0.51
3.8
1.3
0.8
0.53
0.40
0.32
0.23
22.3
21.4
9.1
8.7
1.778
10.16
3.2
2.8
10.7
10.2
12.2
10.5
0.18
1.6
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
95-02-04
03-02-13
SOT234-1
2004 Jun 29
EUROPEAN
PROJECTION
34
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A
X
c
HE
y
v M A
Z
13
24
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
e
detail X
w M
bp
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
mm
2.65
0.3
0.1
2.45
2.25
0.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.4
1.1
0.4
1.1
1.0
0.25
0.25
0.1
0.01
0.019 0.013
0.014 0.009
0.61
0.60
0.30
0.29
0.05
0.419
0.043
0.055
0.394
0.016
inches
0.1
0.012 0.096
0.004 0.089
0.043
0.039
0.01
0.01
Z
(1)
0.9
0.4
0.035
0.004
0.016
θ
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT137-1
075E05
MS-013
2004 Jun 29
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
35
o
8
o
0
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
D
SOT340-1
E
A
X
c
HE
y
v M A
Z
24
13
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
L
1
12
bp
e
detail X
w M
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
8.4
8.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2
0.13
0.1
0.8
0.4
8
o
0
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
OUTLINE
VERSION
SOT340-1
2004 Jun 29
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-150
36
o
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended. Driven by legislation and environmental
forces the worldwide use of lead-free solder pastes is
increasing.
• below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
– for all the BGA, HTSSON..T and SSOP-T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Surface mount packages
REFLOW SOLDERING
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
2004 Jun 29
37
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
MANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 °C.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
2004 Jun 29
TDA9817; TDA9818
38
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
PACKAGE(1)
MOUNTING
WAVE
Through-hole mount CPGA, HCPGA
REFLOW(2) DIPPING
suitable
−
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable(3)
−
−
Through-holesurface mount
PMFP(4)
not suitable
not suitable
−
Surface mount
BGA, HTSSON..T(5), LBGA, LFBGA, SQFP,
SSOP-T(5), TFBGA, USON, VFBGA
not suitable
suitable
−
DHVQFN, HBCC, HBGA, HLQFP, HSO,
HSOP, HSQFP, HSSON, HTQFP, HTSSOP,
HVQFN, HVSON, SMS
not suitable(6)
suitable
−
PLCC(7), SO, SOJ
suitable
suitable
−
not
recommended(7)(8)
suitable
−
SSOP, TSSOP, VSO, VSSOP
not
recommended(9)
suitable
−
CWQCCN..L(11), PMFP(10), WQCCN32L(11)
not suitable
not suitable
−
LQFP, QFP, TQFP
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. Hot bar soldering or manual soldering is suitable for PMFP packages.
5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
7. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
2004 Jun 29
39
Philips Semiconductors
Product specification
Single/multistandard VIF/SIF-PLL and
FM-PLL/AM demodulators
TDA9817; TDA9818
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Jun 29
40
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected]
SCA76
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R25/03/pp41
Date of release: 2004
Jun 29
Document order number:
9397 750 13463