INTEGRATED CIRCUITS DATA SHEET TDA3845; TDA3845T Quasi split-sound circuit and AM demodulator Objective specification File under Integrated Circuits, IC02 January 1993 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator TDA3845; TDA3845T • Stabilizer circuit for ripple rejection and constant output signals FEATURES • Power supply from 5 V (200 mW) to 8 V source also an alternative 12 V source (12 V not for TDA3845T) • ESD protection for all pins • Gain controlled wideband IF amplifier (AC coupled with three stages) • Suitable for all FM standards and L as well as L-accent standard • High precision internal 90° phase shifter for quadrature demodulator • NICAM compatible. • Amplitude detector for gain control which operates as a peak detector for FM sound and as a mean level detector for AM sound (switchable) GENERAL DESCRIPTION The TDA3845 is a quasi split-sound IF circuit which is designed to provide high performance television FM/AM sound. • In-phase wideband synchronous demodulator for AM detection QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT positive supply voltage VP1 pin 14 4.5 5.0 8.8 V VP2 pin 11 (not for TDA3845T) 10.8 12.0 13.2 V − mA IP supply current − 40 V1-16(RMS) minimum IF input voltage (RMS value) − 70 100 µV IF control range 60 63 − dB V12-13(RMS) intercarrier output voltage 5.5 MHz (RMS value) 70 100 − mV (S +W)/W signal-to-weighted-noise ratio (relative to 1 kHz; 50 kHz deviation) at 5.5 MHz for 2T/20T − 60 − dB at 5.742 MHz for 2T/20T − 58 − dB V6-13(RMS) AF output voltage AM (RMS value) 440 550 660 mV (S +W)/W signal-to-weighted-noise ratio; AM mode − 56 − dB THD total harmonic distortion; AM mode − 1 2 % Tamb operating ambient temperature 0 − +70 °C ORDERING INFORMATION EXTENDED TYPE NUMBER PACKAGE PINS PIN POSITION MATERIAL CODE TDA3845 16 DIL plastic SOT38(1) TDA3845T 16 SO16 plastic SOT109A(2) Note 1. SOT38-1; 1996 November 28. 2. SOT109-1; 1996 November 28. January 1993 2 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator TDA3845; TDA3845T (1) See note 10 to the characteristics. (2) Not for TDA3845T, pin 11 not connected. Fig.1 Block diagram. January 1993 3 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator TDA3845; TDA3845T PINNING SYMBOL (1) not for TDA3845T, pin 11 not connected. Fig.2 Pin configuration. PIN DESCRIPTION IF2 1 IF amplifier input 2 n.c. 2 not connected AGC 3 AGC control capacitor OPT 4 optional capacitor (see note 10 to the characteristics) PMD 5 peak/mean detector capacitor AM 6 AM output SW 7 FM/AM switch LCREF 8 LC reference circuit for the picture carrier LCREF 9 LC reference circuit for the picture carrier n.c. 10 not connected VP2 11 positive supply voltage 2 (+12 V); note 1 ICO 12 intercarrier output GND 13 ground (0 V) VP1 14 positive supply voltage 1 (+5 V) n.c. 15 not connected IF1 16 IF amplifier input 1 Note to Pinning 1. Not for TDA3845T, pin 11 not connected. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134) SYMBOL PARAMETER MIN. MAX. UNIT supply voltage VP1 pin 14 4.5 8.8 V VP2 pin 11 (not for TDA3845T) 10.8 13.2 V Tamb operating ambient temperature 0 +70 °C Tstg storage temperature −25 +125 °C January 1993 4 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator TDA3845; TDA3845T CHARACTERISTICS VP1 = 5 V (note 11); Tamb = 25 °C; all measurements are referenced to ground (pin 13); unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply supply voltage VP1 pin 14 4.5 5.0 8.8 V VP2 pin 11 (not for TDA3845T) 10.8 12.0 13.2 V total supply current − 40 48 mA R1-16 input resistance − 2 − kΩ C1-16 input capacitance − 2.5 − pF V1-16(RMS) minimum IF input voltage (RMS value) note 1 − 70 100 µV V1-16(RMS) maximum IF input voltage (RMS value) note 2 70 100 − mV Itot IF amplifier ∆G gain control range 60 63 − dB Gv3-16 gain control voltage range 1.5 − 3.0 V BIF IF bandwidth 50 70 − MHz V1-16 DC potential − 1.7 − V −3 dB Intercarrier mode (FM mode; standard B/G) notes 3, 4 and 5 Reference amplifier V8-9(p-p) picture carrier amplitude (peak-to-peak value) − 270 − mV R8-9 operating resistance − 4 − kΩ V8-9 DC potential − 3.9 − V at 5.5 MHz 70 100 − mV at 5.74 MHz 32 45 − mV − 8 − MHz − 9 − MHz − 3 10 % − 30 − Ω − 1.8 − V − − ±0.7 mA − − −2 mA Intercarrier mixer and output stage V12(RMS) B12 output signal (RMS value) intercarrier bandwidth at −1 dB at −3 dB residual video AM on intercarrier signal R12 output resistance V12 DC potential I12(peak) permissible AC output current (peak value) I12 permissible DC output current January 1993 note 6 note 7 5 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator SYMBOL TDA3845; TDA3845T PARAMETER CONDITIONS MIN. TYP. MAX. UNIT AF signal performance (note 8) (S +W)/W black picture 60/58 68/64 − dB (S +W)/W 2T/20T pulses with white bars 57/55 60/58 − dB (S +W)/W 6 kHz sinewave (black-to-white modulation) 53/51 57/55 − dB (S +W)/W 250 kHz square wave (black-to-white modulation) 50/44 56/50 − dB AM mode (standard L) note 9 S/N weighted in accordance with CCIR 468-3 V6(RMS) AF output signal (RMS value) BAF AF bandwidth THD total harmonic distortion −3 dB; note 12 440 550 660 mV 0.02 − 120 kHz − 1 2 % (S +W)/W signal-to-weighted-noise ratio 50 56 − dB R6 output resistance − 200 − Ω V6 DC potential − 1.8 − V I6(peak) permissible AC output current (peak value) − − ±0.3 mA I6 permissible DC output current − − −1 mA VP1 used 1.8 − VP1 V VP2 used 1.8 − 5.5 V − − 0.8 V note 10 note 7 Standard switch (note 4) V7 V7 peak signal AGC (FM mode) or switch open-circuit V7 mean signal AGC (AM mode) I7 switch current at 0 V − − −200 µA at VP1 − − 10 µA − − 2.5 mA 30 40 − dB − 10 20 Hz at VP2 via a 2.2 kΩ series resistor Ripple rejection (note 13) AM/AF signal αRR voltage ripple on VP/ voltage ripple on output signal FM phase noise ∆f(RMS) January 1993 intercarrier signal 6 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator SYMBOL TDA3845; TDA3845T PARAMETER CONDITIONS MIN. TYP. MAX. UNIT AM mode (standard L) note 9 S/N weighted in accordance with CCIR 468-3 V6(RMS) AF output signal (RMS value) 440 550 660 mV BAF AF bandwidth 0.02 − 120 kHz THD total harmonic distortion (S +W)/W signal-to-weighted-noise ratio − 1 2 % 50 56 − dB R6 output resistance − 200 − Ω V6 DC potential I6(peak) permissible AC output current (peak value) − 1.8 − V − − ±0.3 mA I6 permissible DC output current − − −1 mA VP1 used 1.8 − VP1 V VP2 used 1.8 − 5.5 V − − 0.8 V at 0 V − − −200 µA at VP1 − − 10 µA − − 2.5 mA 30 40 − dB − 10 20 Hz −3 dB; note 12 note 10 note 7 Standard switch (note 4) V7 V7 peak signal AGC (FM mode) or switch open-circuit V7 mean signal AGC (AM mode) I7 switch current at VP2 via a 2.2 kΩ series resistor Ripple rejection (note 13) AM/AF signal αRR voltage ripple on VP/ voltage ripple on output signal FM phase noise ∆f(RMS) January 1993 intercarrier signal 7 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator TDA3845; TDA3845T Notes to the characteristics 1. Start of gain control (LOW IF input signal) at −3 dB intercarrier signal reduction at pin 12, AGC mode set to FM or −3 dB AF signal reduction at pin 6, AGC mode set to AM. 2. End of gain control (HIGH IF input signal) at +1 dB intercarrier signal expansion at pin 12, AGC mode set to FM or +1 dB AF signal expansion at pin 6, AGC mode set to AM. 3. Picture carrier (38.9 MHz) to sound carriers (33.4 MHz/33.158 MHz) ratio: 13/20 dB. IF input signal (picture carrier at sync pulse); V1-16 = 10 mV (RMS). Transmitter mode: DSB. Reference for the (S + W)/W ratio (0 dB) corresponds to the sound modulation where f = 1 kHz and frequency deviation ∆f = ± 50 kHz. With reduced frequency deviation ∆f = ± 27 kHz and the (S + W)/W figures will decrease by 5.4 dB. 4. If the device is used only for the B/G standard (no AM), the capacitor at pin 5 can be omitted (pin 5 has to be disconnected). In this event the AGC will always operate as a peak signal AGC and is independent of the voltage at pin 7. The AM mode can also be used for the B/G standard, consequently standard switching is not required. However, the intercarrier level depends on the video modulation and the AF performance may decrease. When the IC is operated from a 12 V power supply pin 7 can be connected to a 12 V logic level via a 2.2 kΩ resistor. 5. LC reference circuit for the picture carrier (pins 8 and 9); 68 pF/0.247 µH; in series with 27 pF: Q loaded = 40 (Qo = 90); tuned to 38.9 MHz yields quadrature demodulation for the picture carrier which provides optimum video suppression at the intercarrier output (e.g. black-to-white jump of the video modulation.The series capacitor provides a notch at the sound carrier frequency in order to produce more attenuation for the sound carrier in the PC reference channel. The ratio of parallel to series capacitance depends on the ratio of picture to sound carrier frequency which has to be adapted to other TV transmission standards, if required, in accordance with the formula: C S = C P ( f PC ⁄ f SC ) 2 – C P Where: CS = series capacitor C = parallel capacitor fPC = picture carrier frequency fSC = sound carrier frequency The result is an improved ‘intercarrier buzz’ in the stereo system B/G, particularly with 250 kHz video modulation (up to 10 dB improvement in sound Channel 2), or to suppress 350 kHz video modulated beat in the digitally modulated NICAM subcarrier In order to optimize the AF signal performance, fine tuning to the optimum S/W at the sound Channel 2 may be achieved by a 250 kHz video modulated square wave. 6. Residual video AM is defined as: m = (A−B)/A A = intercarrier level at sync pulse B = intercarrier level at 100% white video modulation 7. If higher AC output current is required an external resistor must be connected between the output pin and ground in order to increase the bias current of the emitter follower. The permissible maximum DC output current must not be exceeded. January 1993 8 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator TDA3845; TDA3845T 8. For all S/N measurements the used vision IF modulator must conform to the following: Incidental phase modulation for black-to-white jump should be less than 0.5 degrees. Intercarrier performance, measured with the television demodulator AMF2 (intercarrier mode weighted S/N ratio) better than 60 dB for 6 kHz sinewave black-to-white video modulation. Weighted S/N ratio of the demodulated intercarrier signals in accordance with CCIR 468-3, measured with de-emphasis of 50 µs. The indicated (S + W)/W ratio X/Y concerns the sound channels 1 and 2 that means demodulated intercarrier signals of 5.5 and 5.74 MHz respectively. 9. Sound carrier frequency in the range of 30 to 40 MHz modulated with f = 1 kHz and a modulation depth of 80%. IF input signal (sound carrier) V1-16 = 10 mV (RMS). 10. The capacitor at pin 4 can be omitted, however, the (S + W)/W figure for the AM sound (standard L) will be up to 8 dB worse in the IF voltage range 1 mV to 100 mV. 11. When the supply at VP2 = 12 V the performance will be comparable with the performance when VP1 = 5 to 8 V. The power supply pin that is not in use should be disconnected. 12. The maximum value given as minimum 120 kHz and typical 700 kHz. 13. Voltage ripple < 200 mV (p-p) at 70 Hz. January 1993 9 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator TDA3845; TDA3845T (1) See note 5 to the characteristics. Fig.3 Test circuit for the +5 V supply. (1) See note 5 to the characteristics. Fig.4 Test circuit for the +12 V supply; not for TDA3845T. January 1993 10 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator TDA3845; TDA3845T APPLICATION INFORMATION (1) See note 5 to the characteristics. Fig.5 Application diagram for the +12 V supply; not for TDA3845T. (1) See note 5 to the characteristics. Fig.6 Application diagram for the +5 V supply. January 1993 11 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator TDA3845; TDA3845T Fig.7 AM IF filter for standard L. Fig.8 AM IF filter for standard L-accent. IF filter proposal for AM sound (see Figs 7 and 8) With an IF filter in accordance with this proposal, the video buzz suppression on the audio output is better than 50 dB (in accordance with CCIR 468-3, m = 54%) for the worst case video modulation with 6 kHz sinewave black-to-white. Note to figures 7 and 8. Where SC = sound carrier and PC = picture carrier. January 1993 12 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator (1) Not for TDA3845T; pin 11 not connected. Fig.9 Internal pin circuitry. TDA3845; TDA3845T January 1993 13 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator TDA3845; TDA3845T Picture modulation; 6 kHz sinewave. Intercarrier signal; sound Channel 1 = 5.5 MHz, sound Channel 2 = 5.74 MHz. Fig.10 Response curve of the signal-to-weighted noise ratio of the demodulated intercarrier signal. MLB058 2 handbook, full pagewidth THD (%) 1 0 10 10 2 10 3 10 4 Fig.11 Response curve for the total harmonic distortion of the AM signal. January 1993 14 f (Hz) 10 5 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator TDA3845; TDA3845T PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE January 1993 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 15 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator TDA3845; TDA3845T SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 D E A X c y HE v M A Z 16 9 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 8 e 0 detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0098 0.39 0.014 0.0075 0.38 0.16 0.15 0.050 0.24 0.23 0.041 0.039 0.016 0.028 0.020 0.01 0.01 0.004 0.028 0.012 inches 0.069 0.0098 0.057 0.0039 0.049 θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT109-1 076E07S MS-012AC January 1993 EIAJ EUROPEAN PROJECTION ISSUE DATE 91-08-13 95-01-23 16 o 8 0o Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator TDA3845; TDA3845T to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. SOLDERING Introduction Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: DIP • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied January 1993 17 Philips Semiconductors Objective specification Quasi split-sound circuit and AM demodulator TDA3845; TDA3845T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. January 1993 18