DI P 8 SOT97-1 plastic dual in-line package; 8 leads (300 mil) 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code DIP8 Package type industry code DIP8 Package style descriptive code DIP (dual in-line package) Package style suffix code NA (not applicable) Package body material type P (plastic) IEC package outline code 050G01 JEDEC package outline code MO-001 JEITA package outline code SC-504-8 Mounting method type T (through-hole mount) Issue date 13-2-2003 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 9.2 - 9.5 9.8 mm E package width 6.2 - 6.34 6.48 mm A seated height [tbd] - [tbd] 4.2 mm A2 package height [tbd] - [tbd] 3.2 mm e nominal pitch - - 2.54 - mm n2 actual quantity of termination - - 8 - SOT97-1 NXP Semiconductors plastic dual in-line package; 8 leads (300 mil) 2. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L Z e (e 1) b 8 c w M b1 MH b2 5 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.02 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT97-1 050G01 MO-001 SC-504-8 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Fig. 1. Package outline DIP8 (SOT97-1) SOT97-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/4 SOT97-1 NXP Semiconductors plastic dual in-line package; 8 leads (300 mil) 3. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT97-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/4 SOT97-1 NXP Semiconductors plastic dual in-line package; 8 leads (300 mil) 4. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Legal information......................................................... 3 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 February 2016 SOT97-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/4