44 HV QF N SOT1113-1 plastic thermal enhanced very thin quad flat package; no leads; 44 terminals 10 June 2016 Package information 1. Package summary Terminal position code Q (quad) Package type descriptive code HVQFN44 Package type industry code HVQFN44 Package style descriptive code HVQFN (thermal enhanced very thin quad flatpack; no leads) Package body material type P (plastic) IEC package outline code --- JEDEC package outline code --- JEITA package outline code --- Mounting method type S (surface mount) Issue date 23-7-2010 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 8.9 - 9 9.1 mm E package width 8.9 - 9 9.1 mm A seated height 0.8 - 0.85 1 mm A2 package height - - - - e nominal pitch - - 0.65 - n2 actual quantity of termination - - 44 - mm SOT1113-1 NXP Semiconductors plastic thermal enhanced very thin quad flat package; no leads; 44 terminals 2. Package outline HVQFN44: plastic thermal enhanced very thin quad flat package; no leads 44 terminals; body 9 x 9 x 0.85 mm D B SOT1113-1 A terminal 1 index area E A A1 c detail X e1 e L # v # w b 12 22 11 C C A B C y1 C y 23 e e2 Eh 1 33 terminal 1 index area 44 34 X Dh 0 5 scale Dimensions Unit mm 10 mm A(1) A1 b max 1.00 0.05 0.35 nom 0.85 0.03 0.30 min 0.80 0.00 0.25 c D(1) Dh E(1) 0.2 9.1 9.0 8.9 7.25 7.15 7.05 9.1 9.0 8.9 Eh e e1 7.25 7.15 0.65 7.05 6.5 e2 L v 6.5 0.63 0.55 0.47 0.1 w y 0.05 0.08 y1 01 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. References Outline version IEC JEDEC JEITA SOT1113-1 --- --- --- sot1113-1_po European projection Issue date 09-07-17 10-07-23 Fig. 1. Package outline HVQFN44 (SOT1113-1) SOT1113-1 Package information All information provided in this document is subject to legal disclaimers. 10 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT1113-1 NXP Semiconductors plastic thermal enhanced very thin quad flat package; no leads; 44 terminals 3. Soldering Footprint information for reflow soldering of HVQFN44 package SOT1113-1 Hx Gx 6.65 SPx P D X SPy Hy Gy 1.85 6.65 SLy SPy tot By Ay nSPy C nSPx 3.2 SPx tot SLx Bx solder land 0.6 Ax 0.3 solder paste deposit detail X solder land plus solder paste nSPx nSPy 3 3 occupied area Dimensions in mm P Ax 0.65 9.95 Issue date Ay Bx By C D Gx Gy Hx Hy SLx SLy SPx tot SPy tot SPx SPy 9.95 8.0 8.0 0.975 0.3 9.25 9.25 10.2 10.2 7.25 7.25 4.15 4.15 1.1 1.1 12-02-09 12-02-29 sot1113-1_fr Fig. 2. Reflow soldering footprint for HVQFN44 (SOT1113-1) SOT1113-1 Package information All information provided in this document is subject to legal disclaimers. 10 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT1113-1 NXP Semiconductors plastic thermal enhanced very thin quad flat package; no leads; 44 terminals 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT1113-1 Package information All information provided in this document is subject to legal disclaimers. 10 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT1113-1 NXP Semiconductors plastic thermal enhanced very thin quad flat package; no leads; 44 terminals 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 10 June 2016 SOT1113-1 Package information All information provided in this document is subject to legal disclaimers. 10 June 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5