Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MC33689DDWB SOIC 32 300ML SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2015-11-23 2013A1.20 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles No No No e0 MC33689DDWB SOIC 32 300ML ALL 0.510000 g EACH 1 220 C 30 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 3 - Item(s) does not contain RoHS restricted substances per the definition above except for lead in solders and selected exemptions, if any Accepted Daniel Binyon 2012/51/EU 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight SubstanceClass Substance CAS Die Encapsulant 0.3589 SubPart% ARTICLEPPM ARTICLE% Die Encapsulant Antimony/Antimony Compounds Antimony trioxide 1309-64-4 0.00509782 g Die Encapsulant Pigments and Dyes 1,8-diazabicyclo[5.4.0]undec-7-ene 6674-22-2 0.00058249 g 14204 1.4204 9995 0.9995 1623 0.1623 1142 Die Encapsulant Flame Retardants Other brominated flame retardants - 0.00473353 0.1142 g 13189 1.3189 9281 Die Encapsulant Plastics/polymers Poly[(o-cresyl glycidyl ether)-co-formaldehyde] 29690-82-2 0.9281 0.03568363 g 99425 9.9425 69967 Die Encapsulant Solvents, additives, and other materials Carbon Black 6.9967 1333-86-4 0.00100133 g 2790 0.279 1963 Die Encapsulant Lead/Lead Compounds 0.1963 Lead 7439-92-1 0.00000467 g 13 0.0013 9 Die Encapsulant 0.0009 Solvents, additives, and other materials (3,4-Epoxycyclohexyl)ethyltrimethoxysilane 3388-04-3 0.00047339 g 1319 0.1319 928 0.0928 Die Encapsulant Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.02002662 g 55800 5.58 39267 3.9267 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.29129652 g 811637 81.1637 571181 57.1181 Epoxy Die Attach Exemption SubstanceWeight UoM SubPart PPM g 0.0011 g Epoxy Die Attach Cadmium/Cadmium Compounds Cadmium 7440-43-9 0 g 3 0.0003 0 0 Epoxy Die Attach Plastics/polymers Phenolic Polymer Resin, Epikote 155 9003-36-5 0.00020505 g 186411 18.6411 402 0.0402 Epoxy Die Attach Lead/Lead Compounds Lead 7439-92-1 0.00000001 g 7 0.0007 0 0 Epoxy Die Attach Metals Silver, metal 7440-22-4 0.00089494 g 813579 81.3579 1754 0.1754 Copper Lead Frame 0.1359 g Copper Lead Frame Metals Copper, metal 7440-50-8 0.13100148 g 963955 96.3955 256865 25.6865 Copper Lead Frame Solvents, additives, and other materials Phosphorus, elemental (not containing red allotrope) 7723-14-0 0.00011212 g 825 0.0825 219 0.0219 Copper Lead Frame Metals Iron, metal 7439-89-6 0.00319365 g 23500 2.35 6262 0.6262 Copper Lead Frame Lead/Lead Compounds Lead 7439-92-1 0.0000231 g 170 0.017 45 0.0045 Copper Lead Frame Metals Silver, metal 7440-22-4 0.001359 g 10000 1 2664 0.2664 Copper Lead Frame Metals Tin, metal 7440-31-5 0.00004077 g 300 0.03 79 0.0079 Copper Lead Frame Metals Zinc, metal 7440-66-6 0.00016988 g 1250 0.125 333 0.0333 1000000 100 2156 0.2156 Bonding Wire 0.0011 Bonding Wire Silicon Semiconductor Die g Metals Gold, metal 7440-57-5 0.0011 0.0098 g g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000196 g 20000 2 384 0.0384 Silicon Semiconductor Die Glass Silicon, doped - 0.009604 g 980000 98 18831 1.8831 Lead Frame Plating 0.0032 g Lead Frame Plating Lead/Lead Compounds Lead 7439-92-1 0.00016 g 50000 5 313 0.0313 Lead Frame Plating Metals Tin, metal 7440-31-5 0.00304 g 950000 95 5960 0.596 LINKS MCD LINK Freescale website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement FREESCALE ENVIRONMENTAL INFORMATION EPP website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.freescale.com http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ROHS_Freescale_Response.pdf http://www.freescale.com/chinarohs http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_REACH_Freescale_Response.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_ELV_Freescale_Reponse.pdf http://www.freescale.com/files/abstract/corporate/ehs_epp/ENV_CONFLICT_METAL_Freescale_Response.pdf http://www.freescale.com/epp http://www.freescale.com/webapp/sps/site/overview.jsp?code=ENVIRON_FAQ https://www.freescale.com/webapp/servicerequest.create_SR.framework?defaultCategory=Hardware Product Support&defaultTopic=Environmentally Preferred Prod http://www.freescale.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MC33689DDWB_IPC1752_v11.xml http://www.freescale.com/mcds/MC33689DDWB_IPC1752A.xml