HT SS OP 32 SOT549-1 plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad 8 February 2016 Package information 1. Package summary Terminal position code D (double) Package type descriptive code HTSSOP32 Package type industry code HTSSOP32 Package style descriptive code HTSSOP (thermal enhanced thin shrink small outline package) Package style suffix code NA (not applicable) Package body material type P (plastic) JEDEC package outline code MO-153 Mounting method type S (surface mount) Issue date 2-11-2005 Table 1. Package summary Symbol Parameter Min Typ Nom Max Unit D package length 10.9 - 11 11.1 mm E package width 6 - 6.1 6.2 mm A seated height [tbd] - 1.1 1.1 mm A2 package height 0.85 - 0.9 0.95 mm n2 actual quantity of termination - - 32 - SOT549-1 NXP Semiconductors plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad 2. Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-1 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2 Eh (A3) A1 A pin 1 index θ Lp L 1 detail X 16 w M bp e 2.5 0 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT A max. A1 A2 A3 bp c D(1) Dh E(2) Eh e HE L Lp v w y Z θ mm 1.1 0.15 0.05 0.95 0.85 0.25 0.30 0.19 0.20 0.09 11.1 10.9 5.1 4.9 6.2 6.0 3.6 3.4 0.65 8.3 7.9 1 0.75 0.50 0.2 0.1 0.1 0.78 0.48 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT549-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 03-04-07 05-11-02 MO-153 Fig. 1. Package outline HTSSOP32 (SOT549-1) SOT549-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 2/5 SOT549-1 NXP Semiconductors plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad 3. Soldering Footprint information for reflow soldering of HTSSOP32 package SOT549-1 Hx Gx P2 0.125 nSPx 0.125 SPx nSPy Hy Gy SLy SPy tot By SPy Ay SPx tot C D2 (4×) P1 SLx D1 (28×) Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder land plus solder paste occupied area nSPx nSPy 4 3 Gy Hx Hy 6.500 11.400 8.850 DIMENSIONS in mm P1 P2 Ay By C D1 D2 SLx SLy 0.650 0.700 8.600 6.200 1.200 0.400 0.500 5.200 3.800 Issue date SPx tot SPy tot 5.100 3.700 SPx 1.000 SPy Gx 0.800 10.600 09-12-28 12-01-26 sot549-1_fr Fig. 2. Reflow soldering footprint for HTSSOP32 (SOT549-1) SOT549-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 3/5 SOT549-1 NXP Semiconductors plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad 4. Legal information Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. SOT549-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 4/5 SOT549-1 NXP Semiconductors plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad 5. Contents 1. Package summary........................................................ 1 2. Package outline............................................................ 2 3. Soldering....................................................................... 3 4. Legal information......................................................... 4 © NXP Semiconductors N.V. 2016. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 February 2016 SOT549-1 Package information All information provided in this document is subject to legal disclaimers. 8 February 2016 © NXP Semiconductors N.V. 2016. All rights reserved 5/5