IRF IRPT5051

PD 6.070A
IRPT5051
PRELIMINARY
POWIRTRAIN
Integrated Power Stage for 15 hp Motor Drives
· 15 hp (11kW) power output
· 380 - 480VAC; 50/60 Hz
· Available as complete system or sub-system assemblies
Power Assembly
·
·
·
·
·
·
3-phase rectifier bridge
3-phase ultrafast IGBT inverter
NTC temperature sensor
Pin-to-base plate isolation 2500 Vrms
Easy-to-mount package
Case temperature range -20°C to 95°C operational
Driver-Plus Board
· Capacitor filter with precharge current limit
· Isolated gate drive circuits
· On-board local power supply for gate driver and
capacitor precharge control
· MOV surge suppression at input
· Isolated inverter current feedback
· Short circuit, earth/ground fault, over-temperature
protection
· Input and output terminals;
optional external brake
· Control interface connector
380 - 480 V
3-phase input
IRPT5051C
variable
frequency/
voltage
AC
motor
POWIRTRAIN
driver
power
supply
POWIRTRAIN
isolated
feedback
isolated PWM signals
isolated
power
supply
PWM
signal
generator
feedback
processing
keyboard
External Control Functions
Revised 11/5/96
Figure 1. The IRPT5051C POWIRTRAIN within a motor
control system
page 1
IRPT5051
System Description
The IRPT5051C POWIRTRAIN provides the complete power
conversion function for a 15hp (11kW) variable frequency AC motor controller. It contains a 3-phase input rectifier, DC link capacitor,
3-phase IGBT inverter, isolated gate drive circuits, shutdown protection, isolated trip and current feedback signals, and capacitor
pre-charge function. Terminal blocks fitted to the POWIRTRAIN
allow for end-user input and output connections.
Output power is pulse-width modulated (PWM) 3-phase, variable frequency, variable voltage controlled by externally
generated user-provided PWM logic input signals, which control
the inverter stage – IGBT switching. The PWM input signal terminals and the output feedback signals are optically isolated from
the power circuit.
Figure 1 is a block diagram of the IRPT5051C POWIRTRAIN
within an AC motor control system. Figure 4 shows the functions
and architecture of the IRPT5051C.
The IRPT5051C combines a lower Insulated Metal Substrate
(IMS) power board, containing the power semiconductors and a
thermistor, with the Driver-Plus Board. The power assembly is
designed to be mounted to a heat sink. Figure 2 shows the
IRPT5051A power assembly.
The Driver-Plus Board interfaces electrically to the IRPT5051A
power assembly via soldered connector pins. All external connections to the POWIRTRAIN are made to terminal blocks on the
Driver-Plus Board (figure 3.)
The IRPT5051C POWIRTRAIN offers several benefits to the
motor control manufacturer:
· It eliminates component selection, design layout, interconnection, gate drive, local power supply, thermal sensing,
current sensing, and protection.
· It provides committed power semiconductor losses and
junction temperatures.
· Parts inventory is reduced.
· Gate drive and protection circuits are designed to closely
match the operating characteristics of the power semiconductors. This allows power losses to be minimized and power
rating to be maximized to a greater extent than is possible by
designing with individual components.
· Optimized layout for performance and efficiency is provided.
· Low inductance system reduces noise and snubber requirements.
· Manufacturing assembly is greatly simplified.
[POWIRTRAIN specifications and ratings are given for system
input and output voltage and current, power losses and heat sink
requirements over a range of operating conditions. POWIRTRAIN
system ratings are verified by IR in final testing.]
The IRPT5051A IMS Power Assembly
The IRPT5051A Power Assembly, shown in figure 2, employs
surface-mount 1600V rated D2Pak input rectifiers and surfacemount SMD-10 1200V IGBT Co-pack switches for the output
page 2
inverter. A thermistor is included in the inverter section for thermal
sensing.
The power stage is designed to minimize inductance in the
power path and reduce noise during inverter operation. The
power level interfaces to the Driver-Plus Board through solder
pins, minimizing assembly and alignment. The power assembly
mounts to a heat sink with five screw mount positions, one in
each corner and a fifth near the center to insure good thermal
contact between the IMS and the heat sink. Wide copper traces
on the IMS insure low impedance interconnects for the power
components.
Figure 2. IRPT5051A Power Assembly
The IRPT5051D Driver-Plus Board
Figure 3 is a photograph of the IRPT5051D Driver-Plus Board
containing the driver, sensing and protection functions. Figure 4
provides detailed functional block diagrams of the IRPT5051D.
The switching power supply delivers a nominal 18V DC output, referenced to the negative DC bus, N. This feeds the gate
drive, relay control and under voltage (UV) circuits, which are optically isolated from the control input section, and therefore require
their own local power source.
The gate drive circuits deliver on/off gate drive signals to the
IGBTs' gates, corresponding with input PWM control signals IN1
through IN6.
The PWM gate normally allows the input PWM control signals to pass to the input opto-isolators of the gate drive circuits.
The conduction periods of the inverter switches essentially mimic
those demanded by the PWM input signals.
During power-up and power-down, or in the event of overcurrent (OI) or overtemperature (OT), the latch inhibits the PWM
IRPT5051
gate, deactivating the gate drive circuits and shutting off the inverter.
The relay control circuit delivers an on/off signal via an
opto-isolator to the relay driver which controls the relay (K1).
The relay contact is open during power-up, inserting the resistor
R in series with the DC bus capacitor and limiting the capacitor
charging current. In normal operation, the relay contact is closed.
If the AC line voltage falls below 300V or if one input phase is
lost, or if the DC line voltage falls to less than 82% of the peak
line voltage, the relay contact opens.
The UV circuit senses the voltage of the local power supply,
and sends a signal via an opto-isolator to the latch in the event of
undervoltage. The UV circuit normally activates the latch only
during power-up and power-down, preventing the IGBTs from
being turned on when the local power supply voltage is too low
for proper IGBT switching.
The current signal processing circuit receives inputs from
current transformers connected in series with the input lines and
the DC bus capacitor. The output of the current signal processing
circuit, IFB, is essentially an isolated replica of the inverter input
current. An isolated current feedback signal, IFB, is provided as
an output of the IRPT5051A. If the inverter current exceeds the
trip level of 65A, IFB also activates the latch.
The thermistor activates the latch if the temperature of the
IMS substrate exceeds a set level. The 15V isolated power supply
used to power the IRPT5051 should be the same as the one for
the PWM gnereation, otherwise the protection functions will be
disabled.
Figure 3. IRPT5051D Driver-Plus Board
page 3
IRPT5051
IMS POWER BOARD
INPUT RECTIFIER
P
OUTPUT INVERTER
Q1
Q3
Q5
THERMISTOR
Q4
Q2
Q6
RS T
RP P
RT1
RT2 N
G1 E1 G2 E2
G3 E3 G4 E4
G5 E5 G6 E6
U VW
RS T
RP P
RT1
RT2 N
G1 E1 G2 E2
G3 E3 G4 E4
G5 E5 G6 E6
U VW
LINE SENSE
PRECHARGER
DC LINK CAPS
RELAY
CONTACT
(K1)
SWITCHING
POWER
SUPPLY
CT
CAP SENSE
+18
RELAY CONTROL
AND U/V
GATE DRIVER CIRCUITS
OPTO ISOLATION
OPTO ISOLATION
RELAY DRIVER
AND
RELAY COIL
(K1)
CT
CT
CURRENT
SIGNAL
PROCESSING
16
CT
19 20 17
15
7
8 9
LATCH
OI, OT, UV
SIGNAL
TB
12 13 14 18
PWM GATE
1
2
3
4
5
6
GND R S T
POWER TB
CN6A
N PU V W
+15 COM
-15
IFB
CN5
BUS SFT KIFB
RIPPLE CHG
RESET OI OT UV
IN1 IN2
Driver
- PlusBoard
Board
Driver-Plus
Figure 4. IRPT5051C Basic Architecture
page 4
IN3 IN4 IN5 IN6
CN5
POWER TB
CN6B
IRPT5051
Specifications
PARAMETER
Input Power
Voltage
Frequency
Input Current
Output Power
Voltage
Nominal Motor hp (kW)
Nominal Motor Current
DC Link
VALUES
380V -15% to 480V +10%, 3-phase
50 - 60Hz
40A rms
300 A peak
0 - 480V rms
15hp (11kW)
25A rms
DC link voltage
850V maximum
Control Power
15V ±5%, 200mA positive supply
15V ±5%, 10mA, negative supply
15V, 10mA, ±10% (max rise/fall time 150nsec)
720Ω ±5%
2.5 µsecs, minimum
1.0 µsec
20ms
Control Inputs
PWM input signals IN1 - IN6
Input resistance IN1 - IN6
Pulse deadtime
Minimum input pulse duration
Maximum pulse duration for
each upper IGBT
RESET
SFT CHG
Protection
65A peak, ±10%
100°C, ±5%
40A peak, ±10%
1.5 µsec typical
Current feedback signal, IFB
100mV/A ±10%
max. DC offset 200mV
active high, 15V CMOS
active high, 15V CMOS
15V high 4.7k pull-up, <0.5V low at 1.0mA;
high-to-low transition at Vbus=82% peak
of line voltage
15V high, 10k pull-up, during UV
<0.5 low at 1mA with no UV
15V high when relay coil energized; low when
relay coil de-energized
Overcurrent trip signal, OI
Overtemp trip signal, OT
BUS RIPPLE
UV
Relay coil feedback, K1FB
Capacitor Precharge
DC bus capacitor precharge time 400msecs max
Module
Isolation Voltage
Operating Case Temperature
Mounting Torque
System Environment
TA = 40°C, Rth SA = 0.075 °C/W
10 ms half-cycle non-repetitive surge
defined by external PWM control
Vin = 440VAC
PWM frequency = 4kHz, fo=60Hz,
TA = 40°C, Rth SA = 0.075 °C/W
input signals uninhibited internally
input signals inhibited internally
15V active high, CMOS input (min duration 1µsec)
2 mA pull-down to energize relay
(overrides internal control)
Output current trip level
Overtemperature trip level
Ground current trip level
Short circuit shutdown time
Feedback Signals
CONDITIONS
2500VRMS, 60Hz, 1 minute
-20°C to 95°C
5 N-m
Ambient Operating Temp. Range 0 to 40°C
Storage Temp. range
-20 to 60°C
output terminals shorted
measured from input line closure;
line voltage > 300V
pin to baseplate isolation
M5 screw type
90%RH max. (non-condensing)
90%RH max. (non-condensing)
page 5
IRPT5051
4 00
0 .12
15 hp
(11kW)
3 50
3 00
0 .1
0 .08
2 50
Power, 100% output current
RthSA
3 Hz
min
2 00
0 .06
1 50
0 .04
RthSA
1.5 Hz
min
0 .02
Total Power Dissipation (Watts)
Thermal Resistance (RthS-A°C/W)
0 .14
1 00
50
Note: RthSA is for 100% current
0
0
1
2
3
PWM Frequency (kHz)
4
5
Figure 5a. 15hp/25A output Heat Sink Thermal Resistance and Power Dissipation vs. PWM Frequency
Operating Conditions: Vin=440Vrms, MI=1.15, PF=0.8, TA=40°C, ZthSA limits temperature rise (∆Tc) during 1 minute overload to 10°C
4 00
0 .25
0 .2
10 hp
(7.5kW)
0 .15
3 00
2 50
Power, 150% output current
RthSA
3 Hz
min
0 .1
2 00
1 50
Power, 100% output current
1 00
0 .05
RthSA
1.5 Hz
min
Note: RthSA is for 150% current
Total Power Dissipation (Watts)
Thermal Resistance (RthS-A°C/W)
3 50
50
0
0
1
2
3
PWM Frequency (kHz)
4
5
Figure 5b. 10hp/16.5A output Heat Sink Thermal Resistance and Power Dissipation vs. PWM Frequency
page 6
IRPT5051
0.4
300
Thermal Resistance (RthS-A°C/W)
0.35
250
0.3
RthSA
3 Hz
min
0.25
200
Power, 150% output current
0.2
150
RthSA
1.5 Hz
min
0.15
0.1
Power, 100% output current
100
Total Power Dissipation (Watts)
7.5 hp
(5.5kW)
50
0.05
0
Note: RthSA is for 150% current
1
2
0
3
4
5
PWM Frequency (kHz)
6
Figure 5c. 7.5hp/12A output Heat Sink Thermal Resistance and Power Dissipation vs. PWM Frequency
0 .6
300
0 .5
250
0 .4
200
Power, 150% output current
0 .3
150
RthSA
3 Hz
min
0 .2
0 .1
Power, 100% output current
100
50
RthSA
1.5 Hz
min
Note: RthSA is for 150% current
Total Power Dissipation (Watts)
Thermal Resistance (RthS-A°C/W)
5 hp
(3.65kW)
0
0
2
4
6
8
PWM Frequency (kHz)
10
12
14
Figure 5d. 5hp/8.4A output Heat Sink Thermal Resistance and Power Dissipation vs. PWM Frequency
page 7
IRPT5051
Mounting, Hookup and Application Instructions
Mounting
Control Connections
Unless supplied connected, first connect the IRPT5051D and the
IRPT5051A power assembly.
1. Remove all particles and grit from the heat sink and power
substrate.
2. Spread a .004" to .005" layer of silicone grease on the heat
sink, covering the entire area that the power substrate will occupy.
3. Place the power substrate onto the heat sink with the
mounting holes aligned and press it firmly into the silicone
grease.
4. Place the 5 M5 mounting screws through the PCB and
power substrate and into the heat sink and tighten with fingers.
All input and output control connections are made via a female
connector to CN6.
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5
2
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1
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4
3
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Figure 6. Power Assembly Mounting Screw Sequence
5. Tighten the screws to 2 Nm torque, according to the sequence shown below.
6. Re-tighten the screws to 4-5 Nm using the same sequence
as in step 5.
Figure 7a. Control Signal Connector
page 8
Power Connections
3-phase input connections are made to terminals R,S and T. Inverter
output terminal connections are made to terminals U,V and W.
Positive and negative dc bus connections are brought out to terminals P (positive) and N (negative). An external braking circuit
can be connected across terminals P and N.
Logic Sequence During Power-Up
When 3-phase input power is first switched on, PWM inputs to
the IRPT5051 must be inhibited until all the following logic conditions are met:
1. external 15V supply is established
2. UV feedback signal is low, indicating local power supply
for gate drive circuits is established
3. K1FB signal is high, indicating capacitor precharge relay is
energized.
When these conditions are simultaneously met, a 15V RESET
pulse should be applied to the RESET input.
PWM input signals can now be released to the IRPT5051. The
first PWM input signal to each of the lower IGBT inputs (IN2,
IN4, IN6) should have at least 50µs duration, to allow the bootstrap capacitors to charge.
Logic Sequence During Power-Down
The following sequence is recommended for normal power down:
1. reduce motor speed to zero by PWM control
2. inhibit PWM inputs
3. disconnect main power.
Figure 7b. Input and Output Terminal Blocks
IRPT5051
IRPT5051D Mechanical Specifications
NOTE: Dimensions are in inches (millimeters)
10.000 [254.0]
1.900 [48.26]
20-11
CN5
PCB
1-10
CAPACITOR
HEATSINK
POWER ASSEMBLY
CAPACITOR
-
+
CN6B
CN6A
GND
6.000 [152.4]
-
3.000 [76.2]
5.850 [148.59]
+
R
S
T
U
V
W
N
P
1.20 [30.48]
3.90 [99.06]
7X .500 [12.7]
1.250 [31.75]
7.875 [200.03]
2.035 [51.69]
CN6A
CN6B
MAX.
POWER ASSEMBLY
FAN
CAPACITOR
5.500 [139.7]
.475 [12.07]
7.060 [179.32]
HEATSINK
AIR FLOW
2X
3.000 [76.2]
page 9
IRPT5051
IRPT5051A Mechanical Specifications
NOTE: Dimensions are in inches (millimeters)
5.300 [134.62]
CN2
CN1
S
G
S
G
S
G
RT1
Q1
D1
D2
A
A
3.700 [93.98]
E
Q3
E
E
Q5
E
E
E
CN3
D3
D4
A
A
S
G
S
S
G
G
CN4
Q2
D5
D6
A
Q4
Q6
A
E
E
E
E
E
E
.500 [12.7]
3.969 [100.813]
4.069 [103.353]
4.169 [105.893]
3.369 [85.573]
THRU HOLES
3.469 [88.113]
2.269 [57.633]
2.369 [60.173]
1.069 [27.153]
1.169 [29.693]
1.269 [32.233]
1.369 [34.773]
1.469 [37.313]
1.569 [39.853]
1.669 [42.393]
1.769 [44.933]
1.869 [47.473]
.250 [6.350]
2.769 [70.333]
2.869 [72.873]
2.969 [75.413]
MAX.
CONNECTOR CLEARANCE
BOTTOM SIDE ONLY
4X
5X
3.550 [90.170]
CN2
3.450 [87.630]
3.350 [85.090]
CN1
B
3.075 [78.105]
2.975 [75.565]
2.875 [73.025]
2.775 [70.485]
2.675 [67.945]
1 2 3 4 5 6
7 8
12 13
17 18 19
23 24
29 30
A
1
2
.050 [1.27]
3
4
83X
CN4
2.375 [60.325]
2.275 [57.785]
2.175 [55.245]
B
7
8
9
1
1.954 [49.632]
CN3
10
5 6
14
15
19
A
23 24
4
A
B
1.654 [42.012]
1.575 [40.005]
1.475 [37.465]
1.375 [34.925]
7
8
9
15
16
17
.875 [22.225]
.775 [19.685]
.675 [17.145]
.575 [14.605]
2.350 [5.690]
2.250 [57.150]
2.150 [54.610]
2.050 [52.070]
1.950 [49.530]
1.854 [47.092]
1.754 [44.552]
1.650 [41.910]
1.550 [39.370]
1.450 [36.830]
1.350 [34.290]
1.250 [31.750]
1
2
3
10
22
23
24
.250 [6.350]
.000
SUPPORT & SCREW CLEARANCE
TOP & BOTTOM SIDES
page 10
4.669 [118.593]
4.860 [123.444]
4.960 [125.984]
5.050 [128.27]
5.060 [128.524]
5.160[131.064]
4.369 [110.973]
4.469 [113.513]
3.569 [90.653]
3.069 [77.953]
2.945 [78.803]
2.569 [65.253]
2.669 [67.793]
2.069 [52.553]
2.169 [55.093]
NOTES:
1. MATERIAL: FR4, .065 [1.651]THICK MAX.
.850 [21.590]
.950 [24.130]
1.050 [26.670]
1.150 [29.210]
.000
5X
.250 [6.350]
.250 [ 6.350] R
Driver-Plus Board Hole Position and Sizes for Power Assembly
5X
IRPT5051
Part Number Identification and Ordering Instructions
IRPT5051A Power Assembly
IRPT5051D Driver-Plus Board
IMS assembly incorporating 1600V input rectifiers in D 2Paks,
1200V ultra-fast IGBT inverter with ultra-fast freewheeling diodes in SMD10 packages, along with a temperature sensing
thermistor. The assembly is fully tested to meet all data sheet
specifications.
Printed circuit board assembled with DC link capacitors, relay
in-rush circuit, high power terminal blocks, surge suppression
MOVs, IGBT gate drivers, protection circuitry and low power
supply. The PCB is functionally tested with standard power assembly to meet all system specifications.
IRPT5051C Complete POWIRTRAIN
IRPT5051E Design Kit
Power Assembly (IRPT5051A) and Driver-Plus Board
(IRPT5051D) pre-assembled and tested to meet all system specifications.
Complete POWIRTRAIN (IRPT5051C) with full set of design
documentation, including schematic diagram. bill of material,
mechanical layout, schematic file, Gerber files and design tips.
Functional Information
Capacitor Precharge
When the input line voltage is first switched on, the charging
current of the dc bus capacitors is limited by a 100 Ohm precharge resistor. When the bus capacitor has charged to
approximately 85% of the peak line voltage, the capacitor precharge control circuit energizes the relay K1, bypassing the 100Ω
pre-charge resistor, so long as the line voltage exceeds 300V rms
and all three input phase voltages are present.
The relay feedback signal, K1FB is the voltage across the relay coil. This is 15V high when the relay is energized, and low
when the relay is de-energized.
At start-up, the input PWM signals should be inhibited externally until K1FB becomes high, since if the inverter is operated
before the pre-charge resistor is bypassed, this resistor will be
overloaded.
The relay will drop out during operation if the dc bus voltage
falls to less than 82% of the peak line voltage; if one or more input line voltages is lost; or if the input voltage falls below 300V.
K1FB then becomes low and the PWM input signals should be
inhibited externally to avoid overloading the pre-charge resistor.
The BUS RIPPLE feedback signal is high when the relay is
de-energized, and low when it is energized. If one of the input
phases is lost, the relay drops out and the BUS RIPPLE signal
oscillates from high to low at line frequency.
The relay can be energized, if required, during single-phase
operation by pulling down the SFT CHG terminal via an external
open-collector transistor. The pull-down current is 2mA.
Discharging the Bus Capacitors
When the input power is switched off, the ‘top’ bus capacitor
is discharged by a 10k resistor.
The ‘lower’ bus capacitor is discharged by a 10K resistor until
its voltage reaches approximately 80V. Thereafter, discharge of
the ‘lower’ capacitor is via a 110k resistor.
Undervoltage
The undervoltage circuit monitors the voltage of the local
gate driver power supply and sends a high input signal during
undervoltage which sets the latch and inhibits the PWM input
signals.
This signal, brought out on pin 18 of CN5, is high during undervoltage. After it has gone low during power-up, a 15V
RESET signal must be applied to reset the latch and allow the
PWM input signals to pass to the gate drive circuits.
PWM input signals must be 15V positive logic. They must
source 10mA into the opto-isolators of the IGBT gate driver circuits.
When inhibited by the internal PWM gate during power up,
power down and fault conditions, each PWM input signal becomes loaded by a 720 Ohm resistor.
Maximum rise and fall times of the PWM input signals should
be 150 nsecs.
Minimum dead time between outgoing and incoming PWM
signals to the IGBTs in a given inverter leg should be 2.5µsecs.
This is necessary to avoid inverter shoot-through.
The minimum duration of any PWM input pulse should be
1µsec.
Typical propagation delay between the PWM input and drive
output at the gate of the IGBT is 300ns.
Bootstrap Supplies for the Gate Drive Circuits
The gate drive circuits for the upper IGBTs are powered
from floating bootstrap capacitors. Each bootstrap capacitor is
page 11
IRPT5051
charged via the corresponding lower IGBT when this is switched
on.
Prior to initial application of the PWM input signals at startup, the bootstrap capacitors are uncharged. Thus, an upper IGBT
will not be turned on until after the corresponding lower IGBT
has first been turned on to charge the bootstrap capacitor for the
upper IGBT.
The minimum initial conduction period of each lower IGBT
at start-up should be about 50µsec, to allow sufficient time for
initial charging of the bootstrap capacitors.
In normal operation, the bootstrap capacitor maintains adequate gate drive voltage for a period of 20 milliseconds.
The maximum duration of the PWM input pulses (1N1, 1N3
and 1N5) should not exceed this period.
Peak line-to-line fault current in excess of a nominal value of
65A and peak line-to-ground current in excess of 40A sets the
latch and internally inhibits the IGBT gate drive. The overcurrent
feedback signal, OI, simultaneously goes high. Reaction time to a
bolted short circuit is typically about 1µsec.
The LED1 lights up when any of the fault signals (UV, OI,
OT) set the latch, indicating a fault condition. When the RESET
signal is applied to the latch, the LED1 goes OFF if the fault that
is setting the latch clears.
The internal PWM inhibit condition is cleared by applying
15V signal to the RESET terminal for a minimum period of 1
microsecond.
Overtemperature Trip
If the temperature of the IMS substrate exceeds a nominal
value of 100°C, the overtemperature circuit sets the latch and internally inhibits the PWM input signals. The overtemperature
feedback signal, OT, simultaneously goes high.
The internal PWM inhibit condition is cleared by applying a
15V signal to the RESET terminal for a minimum period of 1
microsecond.
Heat Sink Requirements
Figures 5a through 5d (pp. 6-7) show the thermal resistance of
the heat sink required for various output power levels and PWM
switching frequencies. Maximum total losses of the unit are also
shown.
This data is based on the following key operating conditions:
● The maximum continuous combined losses of the rectifier
and inverter occur at full pulse-width modulation. These
maximum losses set the maximum continuous operating
temperature of the heat sink.
● The maximum combined losses of the rectifier and inverter at full pulse-width modulation under overload set
the incremental temperature rise of the heat sink during
overload.
● The minimum output frequency at which full overload
current is to be delivered sets the peak IGBT junction
temperatures.
At low output frequency IGBT junction temperature tends to
follow the instantaneous fluctuations of the output current. Thus,
peak junction temperature rise increases as output frequency decreases.
Voltage Rise During Braking
The motor will feed energy back to the dc link during electrical braking, forcing the dc bus voltage to rise above the level
defined by the input line voltage.
Deceleration of the motor must be controlled by appropriate
PWM control to keep the dc bus voltage within the rated maximum value of 850V.
An external dissipative braking circuit, which keeps the bus
voltage within the rated value, can be connected across the P and
N terminals if required. ❏
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331
EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020
IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111
IR FAR EAST: K&H Bldg., 2F, 3-30-4 Nishi-Ikeburo 3-Chome, Toshima-Ki, Tokyo Japan 171 Tel: 81 3 3983 0086
IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371
http://www.irf.com/
Data and specifications subject to change without notice.
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