INTEGRATED CIRCUITS DATA SHEET UAA3515A 900 MHz analog cordless telephone IC Product specification File under Integrated Circuits, IC17 2001 Dec 12 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC CONTENTS 1 FEATURES 1.1 1.2 1.3 1.4 1.5 1.6 1.7 Single frequency conversion FM receiver Receiver baseband Synthesizer Transmitter Transmitter baseband Microcontroller interface Power supplies 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 ORDERING INFORMATION 5 BLOCK DIAGRAM 6 PINNING 7 FUNCTIONAL DESCRIPTION 7.1 7.1.1 7.1.2 7.1.3 7.2 7.2.1 7.3 7.4 7.4.1 7.5 7.6 7.7 7.8 7.9 7.9.1 7.9.2 7.9.3 7.9.4 7.9.5 7.9.6 7.9.7 7.9.8 7.9.9 7.9.10 7.9.11 7.9.12 7.9.13 Power supply and power management Power supply Power saving Current consumption FM receiver Data comparator Transmitter Synthesizer Calculation example Receiver baseband TX baseband Voltage regulator Low-battery detection Microcontroller interface Data registers Active modes Clock output divider FM-PLL centre frequency TX and RX gain control registers Carrier detector threshold programming Low-battery detection Power amplifier output level PLL charge pump current Volume control Crystal tuning capacitors Voltage reference adjustment Test mode 2001 Dec 12 8 LIMITING VALUES 9 HANDLING 10 THERMAL CHARACTERISTICS 11 CHARACTERISTICS 12 PACKAGE OUTLINE 13 SOLDERING 13.1 Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods 13.2 13.3 13.4 13.5 2 UAA3515A 14 DATA SHEET STATUS 15 DEFINITIONS 16 DISCLAIMERS Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 1 FEATURES 1.1 UAA3515A 1.4 Transmitter • Internal buffered Power Amplifier (PA) with programmable gain Single frequency conversion FM receiver • Integrated Low Noise Amplifier (LNA) • Data transmission summing amplifier. • Image reject mixer • FM detector (10.7 MHz) with: 1.5 Transmitter baseband – IF limiter • Programmable transmitter gain – wide band PLL demodulator • Microphone amplifier – output amplifier • Compressor with Automatic Level Control (ALC) and hard limiter. – Received Signal Strength Indicator (RSSI) output • Carrier Detector (CD) with programmable threshold 1.6 • Programmable data amplifier (slicer) phase. 1.2 • Three-wire serial interface. Receiver baseband 1.7 • Programmable receiver gain Power supplies • Voltage regulator for internal PLL supplies • Expander • Selectable voltage doubler • Earpiece amplifier with volume control feature • Programmable Low-Battery Detection (LBD) (time-multiplexed with RSSI carrier detector). • Data amplifier. 1.3 Microcontroller interface Synthesizer 2 • Crystal reference oscillator with integrated tuning capacitor APPLICATIONS • Analog cordless telephone sets (900 MHz). • Reference frequency divider • Narrow band receiver PLL including VCO with integrated variable capacitance diodes 3 The UAA3515A is a BiCMOS integrated circuit that performs all functions from antenna to microcontroller in reception and transmission for both base station and handset of a 900 MHz cordless telephone set. In addition, the implemented programming reduces significantly the amount of external components, board space and external adjustments required. • Narrow band transmitter PLL including VCO with integrated variable capacitance diodes • Integrated VCO circuits designed to function with external inductors etched directly as part of the printed-circuit board (cost-saving feature) • Programmable clock divider with output buffer to drive the microcontroller. 4 GENERAL DESCRIPTION ORDERING INFORMATION PACKAGE TYPE NUMBER NAME DESCRIPTION VERSION UAA3515AHL LQFP64 plastic, low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm SOT314-2 2001 Dec 12 3 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... VCC(MIX) VCC(BLO) VRXGND RXLOY RXLOX VCC(VRX) IFA1I LFA1O VCC(IF) IFA2I LFA2O IFGND LIMI PLLO 64 62 61 60 59 57 52 51 50 49 58 56 55 54 53 VCO tune IF AMP 1 MIXGND 1 × RFIX 2 RFIY 3 LNAGND 4 + × IMAGE REJECTION FILTER Amp LIMITER 48 DETO DEMODULATOR 47 LPFD VB EXPANDER RX MUTE RSSI RX GAIN 46 RXAI RSSI QUADRATURE PHASE SHIFTER SBS IF AMP 2 RX VOLTAGE REGULATOR + 90° LNA SFS 45 ECAP 44 VCC(ARX) RXLF 5 43 EARI UAA3515A VCC(CP) CD/LBD RXPD 6 RX PHASE DETECTOR 10-BIT MAIN RX DIVIDER 6-BIT PRESCALER RX EARPIECE AMP CD RSSI 4 VB VOLTAGE REFERENCE ADJUSTMENT VOLTAGE REGULATOR VOLTAGE REFERENCE VB VCC(CP) 10 VCC(PS) 12 TXPD 13 COMPRESSOR HARD LIMITER 39 DATO 38 DATA MICROCONTROLLER SERIAL INTERFACE TX GAIN TX PHASE DETECTOR 10-BIT MAIN TX DIVIDER 6-BIT PRESCALER TX ALC PAGND1 15 VBmod 36 EN VCC 34 CDLBD 10-BIT REFERENCE DIVIDER TX VOLTAGE REGULATOR VB 37 CLK 35 CLKOUT CLOCK DIVIDER TXLF 14 PAO 16 DATA AMP TX MUTE TX VCO VCC VCC VDen VOLTAGE DOUBLER VCC(CP) 41 ARXGND 40 DATI VCC(CP) DGND 9 CPGND 11 42 EARO VB VB RSSI 7 VREG 8 Rint LBD VCC VCO RX 900 MHz analog cordless telephone IC VCC(LNA) MIXO 63 BLOCK DIAGRAM IF 10.7 MHz IF 10.7 MHz Philips Semiconductors 5 andbook, full pagewidth 2001 Dec 12 IF 10.7 MHz 33 XTALO MIC AMP VB VB 18 19 20 21 22 23 24 25 26 PAGND2 MODI MODO VTXGND VCC(VTX) TXLOX TXLOY VCC(ATX) CCAP TXO 27 28 29 30 MICI MICO CMPI VB ATXGND 31 32 XTALI Fig.1 Block diagram. UAA3515A FCA293 Product specification 17 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 6 UAA3515A PINNING SYMBOL PIN DESCRIPTION MIXGND 1 mixer ground RFIX 2 LNA voltage (X) input RFIY 3 LNA voltage (Y) input LNAGND 4 LNA ground RXLF 5 RX PLL filter output RXPD 6 RX phase detector voltage output RSSI 7 RSSI output VREG 8 pin for internal voltage regulator DGND 9 digital ground VCC(CP) 10 internal voltage doubler supply voltage (or positive supply voltage input) for charge pumps CPGND 11 charge pump ground VCC(PS) 12 prescaler positive supply voltage input TXPD 13 TX phase detector voltage input TXLF 14 TX PLL filter output PAGND1 15 power amplifier ground 1 PAO 16 power amplifier output PAGND2 17 power amplifier ground 2 MODI 18 summing amplifier input MODO 19 summing amplifier output VTXGND 20 transmitter VCO ground VCC(VTX) 21 transmitter VCO positive supply voltage input TXLOX 22 transmitter VCO voltage (X) to external inductor TXLOY 23 transmitter VCO voltage (Y) to external inductor VCC(ATX) 24 transmitter audio positive supply voltage input CCAP 25 external capacitor for compressor TXO 26 audio transmitter output MICI 27 microphone amplifier input MICO 28 microphone amplifier output CMPI 29 compressor input VB 30 reference voltage ATXGND 31 transmitter audio ground XTALI 32 crystal input XTALO 33 crystal output CDLBD 34 CD or LBD open collector output (out-of-lock synthesizer receiver and/or transmitter in test mode) CLKOUT 35 clock output (CMOS levels) EN 36 enable input for serial interface CLK 37 clock input for serial interface DATA 38 data input for serial interface 2001 Dec 12 5 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC SYMBOL PIN UAA3515A DESCRIPTION DATO 39 data amplifier open collector output DATI 40 data amplifier input ARXGND 41 audio receiver ground EARO 42 earpiece amplifier output EARI 43 earpiece amplifier input VCC(ARX) 44 audio receiver positive supply voltage input ECAP 45 external capacitor for expander RXAI 46 audio receiver input LPFD 47 demodulator loop filter output DETO 48 demodulator amplifier output PLLO 49 demodulator amplifier negative input LIMI 50 limiter input IFGND 51 IF negative supply voltage IFA2O 52 IF second amplifier output IFA2I 53 IF second amplifier input VCC(IF) 54 IF positive supply voltage input IFA1O 55 IF first amplifier output IFA1I 56 IF first amplifier input VCC(VRX) 57 receiver VCO positive supply voltage input RXLOX 58 receiver VCO voltage (X) to external inductor RXLOY 59 receiver VCO voltage (Y) to external inductor VRXGND 60 receiver VCO ground VCC(BLO) 61 receiver LO buffer positive supply voltage input VCC(MIX) 62 mixers positive supply voltage input MIXO 63 mixer output VCC(LNA) 64 LNA positive supply voltage input 2001 Dec 12 6 Philips Semiconductors Product specification 49 PLLO 50 LIMI 51 IFGND 52 IFA2O 53 IFA2I 54 VCC(IF) UAA3515A 55 IFA1O 56 IFA1I 57 VCC(VRX) 58 RXLOX 59 RXLOY 60 VRXGND 61 VCC(BLO) 62 VCC(MIX) handbook, full pagewidth 63 MIXO 64 VCC(LNA) 900 MHz analog cordless telephone IC MIXGND 1 48 DETO RFIX 2 47 LPFD RFIY 3 46 RXAI 45 ECAP LNAGND 4 RXLF 5 44 VCC(ARX) RXPD 6 43 EARI RSSI 7 42 EARO VREG 8 41 ARXGND UAA3515AHL 40 DATI DGND 9 VCC(CP) 10 39 DATO CPGND 11 38 DATA VCC(PS) 12 37 CLK TXPD 13 36 EN TXLF 14 35 CLKOUT Fig.2 Pin configuration. 2001 Dec 12 7 XTALI 32 ATXGND 31 VB 30 CMPI 29 MICO 28 MICI 27 TXO 26 CCAP 25 VCC(ATX) 24 TXLOY 23 TXLOX 22 VCC(VTX) 21 VTXGND 20 33 XTALO MODO 19 PAO 16 MODI 18 34 CDLBD PAGND2 17 PAGND1 15 FCA294 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 7 • Inactive mode: with the exception of the microcontroller interface, all circuits are powered-down. The crystal reference oscillator, the output clock buffer, the voltage regulator and the voltage doubler can be disabled separately. To reduce microcontroller current consumption, the crystal frequency to the clock output can be divided by 128. A low current consumption mode for the crystal oscillator can be programmed. FUNCTIONAL DESCRIPTION 7.1 Power supply and power management 7.1.1 POWER SUPPLY The UAA3515A is used in a cordless telephone handset and in a base unit. The handset unit is battery powered and operates on three NiCd cells. The minimum supply voltage (VCC) is 2.9 V. 7.1.2 Latch memory is maintained in all modes. Blocks that are powered are shown in Table 1 per operating mode. POWER SAVING When the UAA3515A is used in a handset, it is important to minimize current consumption. The main operating modes are: The crystal oscillator, the clock output buffer, the voltage reference adjustment, the power amplifier, the voltage doubler, the earpiece, the hard limiter and the ALC can be activated separately. Blocks that can be activated in each mode are shown in Table 2. • Active mode (talk): all blocks are powered • RX mode: all circuits in the receiver part are powered Table 1 UAA3515A Power operating modes CIRCUIT BLOCK ACTIVE MODE RX MODE INACTIVE MODE Voltage reference adjustment power ON power ON power OFF RF receiver power ON power ON power OFF RX PLL power ON power ON power OFF RX and TX audio paths power ON power OFF power OFF RF TX (and PA, when enabled) power ON power OFF power OFF ACTIVE MODE RX MODE INACTIVE MODE power ON power ON power ON Table 2 Powered circuit blocks CIRCUIT BLOCK Crystal oscillator; note 1 Clock output buffer power ON power ON power ON Voltage reference enable; note 2 power ON power ON power ON Power amplifier (PA2 = 1) power ON power OFF power OFF Voltage doubler enable; note 3 power ON power ON power ON Hard limiter and ALC not disabled power ON power OFF power OFF Earpiece amplifier (earpiece enable = 1); note 4 power ON power ON power OFF Notes 1. In RX and active mode, the crystal oscillator is activated automatically. An external frequency can be forced at the crystal pins XTALI and XTALO. 2. In RX and active mode, the voltage reference is enabled automatically (whether bit VREG enable is logic 0 or 1). 3. If the voltage doubler is enabled, the crystal oscillator is activated automatically. 4. In inactive mode the amplifier is disabled automatically. 2001 Dec 12 8 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 7.1.3 UAA3515A CURRENT CONSUMPTION The control bit values for selection of each mode and typical current consumption for the modes are shown in Table 3. When clock out is activated there is an extra power demand proportional to the programmed output level (see Table 4 for examples). When bit Xtal high = 0 (oscillator is in low current consumption mode), the crystal in use must have losses less than 20 Ω to ensure oscillator start-up. Table 3 Typical current consumption VCC = 3.3 V; Tamb = 25 °C; f(i)xtal = 10.24 MHz. POWER OPERATING MODE CONDITIONS TYPICAL CURRENT CONSUMPTION Active mode 76 mA RX mode 58 mA Inactive mode xtal active = 0; VREG enable = 0; note 1 <10 µA xtal active = 1; VREG enable = 0; Xtal high = 0; note 1 230 µA xtal active = 1; VREG enable = 0; Xtal high = 1; note 1 330 µA xtal active = 1; VREG enable = 1; Xtal high = 1; note 1 550 µA xtal active = 1; VREG enable = 1; Xtal high = 0; note 2 690 µA Notes 1. Voltage doubler and clock output buffer disabled. 2. Voltage doubler enabled, clock output buffer disabled. Table 4 Examples of additional current consumption VCC = 3.3 V; Tamb = 25 °C; f(i)xtal = 10.24 MHz; CL(CLKOUT) = 14 pF. CURRENT CONSUMPTION ADDITIONAL TO TYPICAL VALUE DIVIDER RATIO 7.2 CLKO level = 0 CLKO level = 1 1, 2, 2.5, 4 or 128 770 µA 530 µA off 0 0 FM receiver The FM receiver (see Fig.3) has a single frequency conversion architecture with integrated image rejection mixer that makes an external RF filter unnecessary. The Side Band Select (SBS) feature allows choice of frequency for RXLO to be in or out of the ISM band allowing use of the same IC type for both base station and handset. IF channel filtering (a compromise between price and performance) can be implemented simply using two or three external 10.7 MHz filters. The integrated FM PLL demodulator with limiter decreases significantly the number of pins and external components required. 2001 Dec 12 9 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... RXLOY RXLOX VCC(VRX) IFA1I IFA1O IFA2I IFA2O LIMI LPFD PLLO 63 59 58 57 55 53 52 50 47 RFIY 3 SFS IF AMP 2 AMP LIMITER × VOLTAGE REGULATOR + 90° 49 48 DETO LOOP FILTER LNA VCO VB 10 SBS UAA3515A QUADRATURE PHASE SHIFTER 40 DATI Philips Semiconductors MIXO IF AMP 1 RFIX 2 IF 10.7 MHz IF 10.7 MHz 56 900 MHz analog cordless telephone IC handbook, full pagewidth 2001 Dec 12 IF 10.7 MHz RSSI DATA AMP RXLF 5 39 DATO RXPD 6 DUAL PLL FREQUENCY SYNTHESIZER CD/LBD VCO RX VCC VCC LBD VB 34 CDLBD OL RX/TX RSSI 7 CD VB 33 XTALO 32 XTALI FCA295 Product specification UAA3515A Fig.3 FM receiver block diagram. Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 7.2.1 7.3 DATA COMPARATOR The data comparator is an inverting hysteresis comparator. An external bandpass filter is connected between pins DETO and DATI (AC-coupled). The open-collector output is current limited to control the output signal slew rate. An external resistor of 180 kΩ should be connected between pin DATO and VCC. An external capacitor in parallel with this resistor will reduce the slew rate. handbook, full pagewidth UAA3515A Transmitter The transmitter architecture is of the direct modulation type. The transmit VCO can be frequency modulated by speech or data (see Fig.4). An amplifier sums the modulating signal with the data TX signal before the VCO. Frequency control is affected by integrated variable capacitance diodes. To obtain the correct frequency, external inductors in series with the bonding wires and leadframe are required. The power amplifier is capable of driving a 50 Ω load. The level of the output signal PAO is programmed with two bits via the serial bus interface. VCC LP UAA3515A PAO 16 XTAL CS DUAL PLL FREQUENCY SYNTHESIZER TXPD 13 TX VCO TXLF 14 SUMMING AMPLIFIER VBmod VB TX VOLTAGE REGULATOR 18 19 21 22 23 26 MODI MODO VCC(VTX) TXLOX TXLOY TXO FCA296 Data TX Fig.4 Transmitter block diagram. 2001 Dec 12 11 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 7.4 Synthesizer UAA3515A 7.4.1 CALCULATION EXAMPLE Given: The crystal local oscillator and reference divider (see Fig.5) provide the reference frequency for the RX and TX PLLs. The 10-bit reference divider is programmed with respect to the crystal frequency and the desired RX and TX frequencies. The microcontroller operating frequency of 4.096 MHz is derived from a 16.384 MHz crystal frequency. The clock divider ratio can be programmed to 1, 2, 2.5, 4 or to 128; ratio 128 is chosen in sleep mode to save current in the microcontroller section. Clock output (pin CLKOUT) is an emitter follower output. RF input frequency fi(RF) = 903 MHz VCO RX fVCO(RX) = 892.3 MHz fIF = 10.7 MHz VCO TX fVCO(TX) = 925.6 MHz Internal comparison frequency = 20 kHz (fXTAL = 10.24 MHz) We have: Reference divider = 512 (1000000000) The 16-bit TX counter is programmed for the desired transmit channel frequency. Similarly, the 16-bit RX counter is programmed for the desired local oscillator frequency. The divider counter comprises a 6-bit prescaler with division ratios (R) from 64 to 127, and a 10-bit CMOS divider with division ratios (C) from 8 to 1023. The full counter provides division ratios from 512 to 65535. Settings of RX and TX counters are calculated as follows: 6 892.3 × 10 M RX = ----------------------------- = 44615 3 20 × 10 C RX = 697 (1010111001) and R RX = 7 (000111) and 6 925.6 × 10 M TX = ----------------------------- = 46280 3 20 × 10 M C = int -----64 C TX = 723 (1011010011) and R TX = 8 (001000) R = M − C × 64 VCOs and variable capacitance diodes are integrated. Resonance inductors are shared between bonding wires, leadframe of the package and external inductors. Costs can be reduced by etching external inductors directly onto the printed-circuit board. (where M is the division ratio between VCO frequency and the reference frequency). An on-chip selectable voltage doubler is provided to enable a larger tuning range of both VCOs. The phase detectors have current drive type outputs with selection possibilities between 400 and 800 µA. 2001 Dec 12 12 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... VCC(VRX) VCC(CP) 58 57 10 VDen VCC(CP) RXPD 6 RX PHASE DETECTOR 10-BIT MAIN RX DIVIDER 6-BIT PRESCALER RX RX VOLTAGE REGULATOR VCO RX VOLTAGE DOUBLER VB VCC(CP) 13 TXPD 13 TX PHASE DETECTOR 10-BIT MAIN TX DIVIDER 6-BIT PRESCALER TX CLOCK DIVIDER TX VCO 10-BIT REFERENCE DIVIDER TXLF 14 VB TX VOLTAGE REGULATOR 35 CLKOUT Philips Semiconductors RXLOX 59 900 MHz analog cordless telephone IC andbook, full pagewidth 2001 Dec 12 RXLF 5 RXLOY MODO UAA3515A 21 22 23 VCC(VTX) TXLOX TXLOY 32 XTALI FCA297 Product specification UAA3515A Fig.5 Synthesizer block diagram. 33 XTALO Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 7.5 Receiver baseband UAA3515A The earpiece amplifier is a rail-to-rail inverting operational amplifier. The non-inverting input is connected to the internal reference voltage at pin VB. Software volume control on the earpiece amplifier is achieved by using an integrated switched feedback resistor Rint. The volume control tuning range is 14 dB. Hardware volume control is achieved by switching externally the earpiece feedback resistor Rext. This section covers the RX audio path from pins RXAI to EARO (see Fig.6). The RXAI input signal is AC-coupled. The microcontroller sets the value of the RX gain in 32 linear steps of 0.5 dB. The RX baseband has a mute function and an expander with characteristics as shown in Fig.7. For audio level adjustment and, potentially for software volume control, setting the RX gain provides a dynamic range of 31 dB. This is achieved by the expander slope that multiplies the RX gain by a factor of two for each gain step thus giving 1 dB steps measured at the earpiece amplifier output. handbook, full pagewidth EXPANDER RX MUTE RX GAIN 46 RXAI 45 ECAP 44 VCC(ARX) 43 EARI Cext Rint 42 EARO VB UAA3515A EARPIECE AMPLIFIER FCA298 Fig.6 RX baseband block diagram. 2001 Dec 12 14 Rext Philips Semiconductors Product specification 900 MHz analog cordless telephone IC UAA3515A FCA168 20 handbook, halfpage Vo(EARO) (dBV) 0 −20 y = 2 × + 20 −40 −60 −40 −30 −20 −10 0 Vi(RXAI) (dBV) RX gain adjusted to 0 dB. No external resistor. VCTL = 00. EXPout = −7 dB at THD < 4%. Fig.7 Expander characteristic. 7.6 TX baseband The TX baseband has a compressor with the characteristic shown in Fig.9. The ALC provides a ‘soft’ limit to the output signal swing as the input voltage increases slowly (i.e. a sine wave is maintained at the output). A hard limiter clamps the compressor output voltage at 1.26 V (peak-to-peak). The ALC and the hard limiter can be disabled via the microcontroller interface. The hard limiter is followed by a mute circuit. The TX gain is digitally programmable in 32 steps of 0.5 dB. This section covers the TX audio path from pins MICI to TXO (see Fig.8). The input signal at pin MICI is AC-coupled. There is another AC-coupling at the microphone amplifier output. The microphone amplifier is an inverting operational amplifier whose gain can be set by external resistors. The non-inverting input is connected to the internal reference voltage VB. External resistors are used to set the gain and frequency response. 2001 Dec 12 15 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC handbook, full pagewidth UAA3515A UAA3515A COMPRESSOR MICROPHONE AMPLIFIER VB HARD LIMITER TX MUTE TX GAIN 26 TXO ALC 27 28 29 25 MICI MICO CMPI CCAP FCA299 Fig.8 TX baseband block diagram. FCA170 0 handbook, halfpage (3) VTXO (dBV) −10 (2) y = 1/2 × − 5 (1) −20 −30 (1) Slowly changing ALC signals: VCPMI = −16 dBV; VTXO = −13 dBV. (2) VCPMI = −2.5 dBV; VTXO = −11.5 dBV. −40 −60 −40 −20 0 20 VCMPI (dBV) (3) Hard limiting signals: VCPMI = −4 dBV; VTXO = −1.26 V (p-p). Fig.9 Compressor characteristic showing TXO as a function of CMPI. 2001 Dec 12 16 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 7.7 7.9 Voltage regulator Pin VREG provides the internal supply voltage for the RX and TX PLLs. It is regulated at 2.7 V nominal voltage. Two capacitors of 4.7 µF and 100 nF must be connected to pin VREG to filter and stabilize this regulated voltage. The tolerance of the regulated voltage is initially ±8% but is improved to ±2% after the internal bandgap voltage reference is adjusted through the microcontroller. 7.8 UAA3515A Microcontroller interface The DATA, CLK and EN pins provide a 3-wire unidirectional serial interface for programming the reference counters, the transmit and receive channel divider-counters and the control functions. The interface consists of 19-bit shift registers connected to a matrix of registers organized as 7 words of 16 bits (all are control registers). The leading 16 bits include the data D15 to D0. The trailing 3 bits set up the address AD2 to AD0. The data is entered with the most significant bit D15 first and the last bit is AD0. Low-battery detection The low-battery detector measures the voltage level of the VCC using a resistance divider and a comparator. One input of the comparator is connected to VB, the other to the middle point of the resistance divider. The comparator has a built-in hysteresis to prevent spurious switching. The precision of the detection depends on the divider accuracy, the comparator offset and the accuracy of the reference voltage VB. The output is multiplexed at pin CDLBD. When the battery voltage level is under the threshold voltage the output CDLBD is going LOW. Pins DATA and CLK are used to load data into the shift register. Figure 10 shows the timing required on all pins. Data is clocked into the shift registers on negative clock transitions. A new clock divider ratio is enabled using an extra EN rising edge. Minimum hold time is 50 ns and during this time no clock cycle is allowed. These extra EN edges can be applied to all the data programmed but will have no effect on the serial interface programming. The pins DATA, CLK and EN are supplied by VREG. The ESD protection diodes on these pins are connected to VCC. 2001 Dec 12 17 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC UAA3515A data bits (16) handbook, full pagewidth DATA D15 D14 address bits (3) D13 AD1 AD0 t SU;DC 50% 50% CLK t HD;EC t END t w(1) t SU;CE EN 50% data bits latched FCA193 (1) The minimum pulse width should be equal to the period of the comparison frequency. The synthesizer prevents the internal EN signal occurring during a comparison phase to avoid any phase error jump. The enable pulse width can be reduced to 100 ns for words that do not influence the synthesizer (words 1, 2 and 3) Fig.10 Digital signals timing requirement (except clock divider programming). data bits (16) handbook, full pagewidth DATA D15 D14 address bits (3) D13 AD1 AD0 t SU;DC CLK 50% 50% t HD;EC t SU;CE EN t END 50% data bits latched FCA194 Fig.11 Digital signals timing requirement for clock divider programming. 2001 Dec 12 18 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... Table 5 shows the data latches and addresses that select each of the registers; bit D15 is the MSB, this is written and loaded first. Table 5 Data register addresses: note 1 ADDR D15 000 SBS D14 D13 D12 D11 VCTL[1 and 0] ear piece enable D10 D9 D8 D7 RX gain control [4 to 0] D6 D5 SFS DATA phase D4 D3 RX prescaler [5 to 0] RX main divider [9 to 0] 010 note 2 reference divider [9 to 0] TX prescaler [5 to 0] 100 note 2 101 VREG enable(3) 110 CLKO level PA output [2 to 0] D0 TX main divider [9 to 0] note 2 doubler enable active modes [1 and 0] D1 FM PLL VCO tuning [4 to 0] 001 011 D2 TX gain control [4 to 0] Xtal high TX mute CD levels [4 to 0] 19 TX RX charge charge pump pump current current hard ALC Xtal limiter disable active enable LBD levels [2 to 0] voltage reference adjust [2 to 0] test mode [2 to 0] RX mute LBD active note 2 note 2 clock div [2 to 0] Xtal tuning cap [3 to 0] Philips Semiconductors DATA REGISTERS 900 MHz analog cordless telephone IC 2001 Dec 12 7.9.1 Notes 1. With a 10 kΩ pull-up resistor connected to pin EN or the microcontroller, guarantees that VIH > 0.9VCC for the EN signal 2. Undefined zone; should always be programmed with 0. 3. In the inactive mode programming VREG enable from 1 to 0 might reset all of the registers. We therefore recommend that this register be set to 1 and not to change it. Table 6 Data register default values at power-on (undefined zones shown programmed with 0) D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 000 001 010 011 100 101 110 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 1 0 1 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 1 1 0 0 1 0 0 1 0 0 0 1 0 1 1 0 1 0 1 0 1 1 1 0 1 1 0 0 1 1 0 1 1 0 0 0 0 0 1 0 0 0 0 1 0 0 0 0 0 1 1 0 0 1 1 0 1 0 0 0 1 x 1 1 1 0 1 0 x 1 1 0 0 0 0 x 1 Product specification D15 UAA3515A ADDR Philips Semiconductors Product specification 900 MHz analog cordless telephone IC Table 7 UAA3515A Data register content description DATA REGISTER NAME SBS(1) SFS CLKO level(3) Xtal active Xtal high(4) DATA phase(5) ALC disable Hard limiter enable RX mute TX mute VREG enable Doubler enable(6) Earpiece enable BIT DESCRIPTION 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 sideband select: (LO + IF) frequency is rejected sideband select: (LO − IF) frequency is rejected second filter select: the second IF filter is selected second filter select: the second IF filter is deselected; note 2 clock output signal is regulated with respect to VREG; VCLKOUT(p-p) = 1 V clock output signal is regulated with respect to VCC; VCLKOUT(p-p) = 1.4 V crystal oscillator is active crystal oscillator is disable oscillator is in normal operation oscillator is in low current consumption mode DATA signal is inverted DATA signal is not inverted (inverter bypassed) ALC disabled normal operation hard limiter enabled hard limiter disabled RX channel muted normal operation TX channel muted normal operation VREG enabled VREG disabled and tied to VCC (in inactive mode) voltage doubler is enabled voltage doubler is disabled earpiece enabled (can be used in RX mode for specific features) earpiece disabled Notes 1. Sideband select enables the user to have the RX local oscillator in or out of the ISM band and to use the same IC in both handset and base. 2. A 4.5 dB insertion loss in the filter is assumed. 3. The clock output signal will be AC-coupled with the XTALI pin of the microcontroller. The external resonator from the microcontroller can be removed. Caution needs to be taken that no radiation is present on the PCB 4. In inactive mode, the crystal oscillator is a major contributor to the full current consumption. When Xtal high = 0, the current mode can be programmed to save current and in inactive mode this comes to full current consumption at 230 µA (see Section 7.1.3). When Xtal high = 1, the crystal oscillator current is increased by 100 µA. 5. Depending on the SBS-bit and the protocol chosen, the data may be inverted between the base and handset data transmission. 6. Minimum supply voltage for the IC is 2.9 V which limits the voltage swing on both charge pumps to approximately 2.3 V. With the voltage doubler or with an external high supply voltage on pin VCC(CP), the extra voltage availability can be used to enhance the tuning range of the VCOs variable capacitance diodes. To save current in inactive mode, XTAL voltage doubler clock is the same as CLKO clock (can be programmed to --------------- ); in other modes the voltage doubler 128 clock is XTALI divided by two. 2001 Dec 12 20 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 7.9.2 ACTIVE MODES Table 8 When the clock output signal is used, an external RC filter connected to pin CLKOUT can be added to limit clock waveform edges and therefore clock radiation on the printed-circuit board. Active mode bit selection; note 1 BIT 1 BIT 0 DESCRIPTION 0 X inactive mode 1 0 RX mode 1 1 active mode To supply the clock to the microcontroller and save current in the handset, an external low power resonator may be used and the clock output disabled (000) as well as the crystal oscillator (Xtal active = 0). In power saving mode, the divider ratio can be programmed down to 128 to reduce the microcontroller power consumption. Note 1. See details on activated blocks in Section 7.1.2. 7.9.3 UAA3515A CLOCK OUTPUT DIVIDER The crystal oscillator produces a reference frequency that is divided and buffered to drive a microcontroller. Table 9 gives the division ratios. The buffer is a CMOS output which can drive up to 20 pF at 10 MHz in both CLKO level modes. Table 9 Clock division register BIT 2 BIT 1 BIT 0 SELECT CLOCK DIVISION RATIO 0 0 0 0 output disabled 0 0 1 1 2 0 1 0 2 2.5 0 1 1 3 4 1 0 0 4 1 1 0 1 5 128 2001 Dec 12 21 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 7.9.4 UAA3515A FM-PLL CENTRE FREQUENCY This register allows the centre frequency of the VCO to be calibrated within the FM PLL to align the frequency as close as possible to the nominal 10.7 MHz frequency. Table 10 FM-PLL VCO tuning register BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 SELECT CENTRE FREQUENCY SHIFT (MHz) 0 0 0 0 0 0 3.0 0 0 0 0 1 1 2.8 0 0 0 1 0 2 2.6 0 0 0 1 1 3 2.4 0 0 1 0 0 4 2.2 0 0 1 0 1 5 2.0 0 0 1 1 0 6 1.8 0 0 1 1 1 7 1.6 0 1 0 0 0 8 1.4 0 1 0 0 1 9 1.2 0 1 0 1 0 10 1.0 0 1 0 1 1 11 0.8 0 1 1 0 0 12 0.6 0 1 1 0 1 13 0.4 0 1 1 1 0 14 0.2 0 1 1 1 1 15 0 1 0 0 0 0 16 −0.2 1 0 0 0 1 17 −0.4 1 0 0 1 0 18 −0.6 1 0 0 1 1 19 −0.8 1 0 1 0 0 20 −1.0 1 0 1 0 1 21 −1.2 1 0 1 1 0 22 −1.4 1 0 1 1 1 23 −1.6 1 1 0 0 0 24 −1.8 1 1 0 0 1 25 −2.0 1 1 0 1 0 26 −2.2 1 1 0 1 1 27 −2.4 1 1 1 0 0 28 −2.6 1 1 1 0 1 29 −2.8 1 1 1 1 0 30 −3.0 1 1 1 1 1 31 −3.2 2001 Dec 12 22 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 7.9.5 UAA3515A TX AND RX GAIN CONTROL REGISTERS The TX and RX audio signal paths each have a programmable gain block. If a TX or RX voltage gain other than the nominal power-up default is desired it can be programmed through the microcontroller interface. The gain blocks can be used during final telephone testing to adjust electronically gain tolerances in the telephone system. The RX gain and the TX gain controls have steps of 0.5 dB covering a dynamic range of −7.5 to +8.0 dB. Measured on the earpiece amplifier output, RX gain steps are multiplied by 2 due to the expander slope. A dynamic range of −15 to +16 dB at the earpiece amplifier supports a volume control feature that can be implemented in the telephone and compensate for gain tolerances. Volume control can also be performed externally with hardware switches on various resistor values. Table 11 RX and TX gain control registers BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 GAIN CONTROL RX GAIN (dB) EARO (dB) TX GAIN (dB) 0 0 0 0 0 0 −7.5 −15.0 −7.5 0 0 0 0 1 1 −7.0 −14.0 −7.0 0 0 0 1 0 2 −6.5 −13.0 −6.5 0 0 0 1 1 3 −6.0 −12.0 −6.0 0 0 1 0 0 4 −5.5 −11.0 −5.5 0 0 1 0 1 5 −5.0 −10.0 −5.0 0 0 1 1 0 6 −4.5 −9.0 −4.5 0 0 1 1 1 7 −4.0 −8.0 −4.0 0 1 0 0 0 8 −3.5 −7.0 −3.5 0 1 0 0 1 9 −3.0 −6.0 −3.0 0 1 0 1 0 10 −2.5 −5.0 −2.5 0 1 0 1 1 11 −2.0 −4.0 −2.0 0 1 1 0 0 12 −1.5 −3.0 −1.5 0 1 1 0 1 13 −1.0 −2.0 −1.0 0 1 1 1 0 14 −0.5 −1.0 −0.5 0 1 1 1 1 15 0 0 0 1 0 0 0 0 16 0.5 1.0 0.5 1 0 0 0 1 17 1.0 2.0 1.0 1 0 0 1 0 18 1.5 3.0 1.5 1 0 0 1 1 19 2.0 4.0 2.0 1 0 1 0 0 20 2.5 5.0 2.5 1 0 1 0 1 21 3.0 6.0 3.0 1 0 1 1 0 22 3.5 7.0 3.5 1 0 1 1 1 23 4.0 8.0 4.0 1 1 0 0 0 24 4.5 9.0 4.5 1 1 0 0 1 25 5.0 10.0 5.0 1 1 0 1 0 26 5.5 11.0 5.5 1 1 0 1 1 27 6.0 12.0 6.0 1 1 1 0 0 28 6.5 13.0 6.5 1 1 1 0 1 29 7.0 14.0 7.0 1 1 1 1 0 30 7.5 15.0 7.5 1 1 1 1 1 31 8.0 16.0 8.0 2001 Dec 12 23 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 7.9.6 UAA3515A CARRIER DETECTOR THRESHOLD PROGRAMMING When the LBD active register = 0, the carrier detector is enabled and the signal CDout is sent to the output pin CDLBD. If RSSI is above the programmed RSSI level, CDLBD = 0; if RSSI is below the programmed level then CDLBD = 1. The carrier detector gives an indication if a carrier signal is present on the selected channel. The carrier detector has a nominal value and tolerance, if a different carrier detect threshold value is desired, this can be programmed through the microcontroller interface. If the carrier detect range is to be scaled, an external resistor should be connected between pin RSSI and ground. CD control = 10011 which corresponds to RSSI = 0.86 V (typical DC value). Table 12 CD levels register BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 SELECT RSSI VOLTAGE THRESHOLD DETECT (V) 0 0 0 0 0 0 0.1 0 0 0 0 1 1 0.14 0 0 0 1 0 2 0.18 0 0 0 1 1 3 0.22 0 0 1 0 0 4 0.26 0 0 1 0 1 5 0.3 0 0 1 1 0 6 0.34 0 0 1 1 1 7 0.38 0 1 0 0 0 8 0.42 0 1 0 0 1 9 0.46 0 1 0 1 0 10 0.5 0 1 0 1 1 11 0.54 0 1 1 0 0 12 0.58 0 1 1 0 1 13 0.62 0 1 1 1 0 14 0.66 0 1 1 1 1 15 0.7 1 0 0 0 0 16 0.74 1 0 0 0 1 17 0.78 1 0 0 1 0 18 0.82 1 0 0 1 1 19 0.86 1 0 1 0 0 20 0.9 1 0 1 0 1 21 0.94 1 0 1 1 0 22 0.98 1 0 1 1 1 23 1.02 1 1 0 0 0 24 1.06 1 1 0 0 1 25 1.1 1 1 0 1 0 26 1.14 1 1 0 1 1 27 1.18 1 1 1 0 0 28 1.22 1 1 1 0 1 29 1.26 1 1 1 1 0 30 1.3 1 1 1 1 1 31 1.34 2001 Dec 12 24 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 7.9.7 UAA3515A LOW-BATTERY DETECTION When the LBD active register = 1, the low battery detector is enabled and the signal BDout passes to the output CDLBD. If VCC is below the programmed LBD level, CDLBD = 0; if not below the programmed level, CDLBD = 1. The power-up default value is 110. Table 13 LBD level register BIT 2 BIT 1 BIT 0 SELECT LOW BATTERY VOLTAGE DETECTION; NOMINAL VALUE (V) 0 0 0 0 3.5 0 0 1 1 3.4 0 1 0 2 3.3 0 1 1 3 3.2 1 0 0 4 3.1 1 0 1 5 3.0 1 1 0 6 2.9 1 1 1 7 2.8 7.9.8 POWER AMPLIFIER OUTPUT LEVEL The power amplifier output register has two bits to modify the output power and one bit to disable the power amplifier (PA output bit 2 = 0). Duplexer matching (300 Ω to 50 Ω) is performed using a parallel inductive/series capacitive network. Output power on 50 Ω is specified in Table 14. To get power on the antenna, duplexer insertion loss should be removed. At maximum power, 3 mA extra DC current is consumed compared with the current at the minimum power settings. Table 14 PA output register BIT 2 BIT 1 BIT 0 SELECT PA OUTPUT POWER (dBm) 2nd HARMONIC (dBm) 3rd HARMONIC (dBm) 4th HARMONIC (dBm) 0 X X − PA inactive − − − 1 0 0 0 1.0 −17 −327 −34 1 0 1 1 1.9 −19 −29 −34 1 1 0 2 2.5 −23 −33 −36 1 1 1 3 3.1 −23 −36 −40 7.9.9 PLL CHARGE PUMP CURRENT Performance of the PLLs can be improved by increasing charge pump current. Then a programmable current on both RX and TX charge pump can be programmed. RX and TX charge pump currents are programmed independently. When the RX or TX charge pump current register = 0, charge pump current is 400 µA; when it is set to 1, charge pump current is 800 µA. 2001 Dec 12 25 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 7.9.10 UAA3515A VOLUME CONTROL The register VCTL enables the volume control of the earpiece amplifier to be set to a predefined gain. This is achieved by switched feedback resistor Rint. The optional resistor Rext, connected between pins EARI and EARO provides the hardware control. Table 15 Volume control bit selection 7.9.11 BIT 1 BIT 0 Rint (kΩ) Rext (kΩ) GEAR (dB) 0 0 14 none 0 0 1 24 none 4.7 1 0 41 none 9.3 1 1 70.2 none 14 1 1 70.2 100 9.4 1 1 70.2 33 4.1 1 1 70.2 15 −1 CRYSTAL TUNING CAPACITORS On-chip crystal reference tuning is provided to compensate for frequency spread over process and temperature changes. An external capacitor should be connected at pin XTALI; the value of the capacitor should be approximately 3 pF less than the capacitance of pin XTALO. Internally, a programmable capacitance is available in parallel with the XTALI pin. Tuning capacitance values are in the range 0 to 4.5 pF; see Table 16. Table 16 Xtal tuning cap register BIT 3 BIT 2 BIT 1 BIT 0 SELECT CAPACITANCE (pF) 0 0 0 0 0 0.2 0 0 0 1 1 0.5 0 0 1 0 2 0.8 0 0 1 1 3 1.1 0 1 0 0 4 1.4 0 1 0 1 5 1.7 0 1 1 0 6 2.0 0 1 1 1 7 2.3 1 0 0 0 8 2.6 1 0 0 1 9 2.9 1 0 1 0 10 3.2 1 0 1 1 11 3.5 1 1 0 0 12 3.8 1 1 0 1 13 4.1 1 1 1 0 14 4.4 1 1 1 1 15 4.7 2001 Dec 12 26 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 7.9.12 UAA3515A VOLTAGE REFERENCE ADJUSTMENT An internal 1.5 V bandgap voltage reference provides the voltage reference for the low battery detect circuits, the VREG voltage regulator, the VB reference and all internal analog references. In inactive mode, the adjustment is disabled. Table 17 Voltage reference adjust register BIT 2 BIT 1 BIT 0 SELECT NOMINAL VOLTAGE REFERENCE 0 0 0 0 −7% 0 0 1 1 −5% 0 1 0 2 −3% 0 1 1 3 −1% 1 0 0 4 1% 1 0 1 5 3% 1 1 0 6 5% 1 1 1 7 7% 7.9.13 TEST MODE Test mode bits are used only for test in production and application tuning. The test bits must be set to 0 for normal operation. Out-of-lock of synthesizers RX or TX can be monitored indirectly on pin CDLBD: the width of the ‘glitch’ that occurs with out-of-lock gives a direct indication of the phase error on the PLL RX and/or TX. To tune the external inductors of the RX and TX VCOs, a defined division ratio has to be programmed into the dividers, and then the image frequency of the VCO can be read on pin CDLBD. Test mode can also be used to check the division ratio: a frequency can be forced on the VCO or crystal pins and the programmed frequency can be read on pin CDLBD. There is a divide-by-2 stage before the CDLBD pin, therefore all frequencies are divided-by-2. When both charge pumps are in the high-impedance state, the VCOs can be measured as stand alone. Table 18 Test mode register BIT 2 BIT 1 BIT 0 0 0 0 normal operation 0 0 1 XOR between internal signals ‘up’ and ‘down’ of the RX synthesizer 0 1 0 XOR between internal signals ‘up’ and ‘down’ of the TX synthesizer 0 1 1 XOR between internal signals ‘up’ and ‘down’ of the RX or TX synthesizers 1 0 0 reference divider output divided by 2 1 0 1 prescaler and main divider RX divided by 2 1 1 0 prescaler and main divider TX divided by 2 1 1 1 both synthesizer charge pumps are in high-impedance-state 2001 Dec 12 SELECT 27 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC UAA3515A 8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER MIN. MAX. UNIT VCC supply voltage −0.3 +6.0 V Tstg storage temperature −55 +125 °C Tamb ambient temperature −20 +80 °C 9 HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. Do not operate or store near strong electrostatic fields. Meets Class 1 ESD test requirements (human body model) in accordance with “EIA/JESD22-A114-B (June 2001)” and class A ESD test requirements (machine model) in accordance with “EIA/JESD22-A115-B (October 1997)”. 10 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) 2001 Dec 12 PARAMETER CONDITIONS VALUE UNIT thermal resistance from junction to ambient in free air 68 K/W 28 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC UAA3515A 11 CHARACTERISTICS VCC = VCC(PS) = VCC(ATX) = VCC(ARX) = VCC(IF) = VCC(BLO) = VCC(MIX) = VCC(LNA) = 3.3 V; Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VCC positive supply voltage to pins VCC(PS); VCC(ATX); VCC(ARX); VCC(IF); VCC(BLO); VCC(MIX); VCC(LNA) 2.9 3.3 5.5 V − VCC − V inactive mode 2.5 2.7 2.9 V before Vref adjustment 2.5 2.7 2.9 V PLL VOLTAGE REGULATOR Vo(VREG) regulated output voltage VREG enable = 0 VREG enable = 1 after Vref adjustment Io(VREG) output current CVREG = 1 µF 2.65 2.7 2.75 V − − 3 mA LOW BATTERY DETECTION: LBD active = 1 VLBD detection voltage range 2.8 − 3.5 V ∆VLBD number of detection voltage steps − 8 − steps Vhys comparator hysteresis V VB [ V CC ( high ) – V CC ( low ) ] × ---------V th − 18 − mV ∆VCC/VCC LBD accuracy measured after Vref adjusted; LBD = 010 − 0.5 5 % Receiver section LNA AND IMAGE REJECTION MIXER; fi(RX) = 903 MHz Ri(RX) RF input resistance balanced − 110 − Ω Ci(RX) RF input capacitance balanced − 0.7 − pF fi(RX) RF input frequency 902 903 928 MHz RLi(RX) return loss on match RF input note 1 10 − − dB Gconv(p)(RX) conversion power gain balun input to MIXO pin; matched to 330 Ω − 22 − dB CP1RX 1 dB input compression point note 1 − −23 − dBm IP3RX 3rd order intercept point − −13 − dBm NFRX overall noise figure, RF front end − 4 5 dB IR image frequency rejection in band of interest 26 45 − dB RL(RX) IF resistive output load on pin MIXO − 330 − Ω CL(RX) IF capacitive output load on pin MIXO − − 3 pF 2001 Dec 12 IF section excluded 29 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC SYMBOL PARAMETER UAA3515A CONDITIONS MIN. TYP. MAX. UNIT IF AMPLIFIER SECTION: f0 = 10.7 MHz GIFAMP1 voltage or power gain of first IF amplifier 330 Ω matched input and output; SFS = 1; measured at amplifier output − 22.5 − dB NFIFAMP1 noise figure of first IF amplifier 330 Ω matched input and output − 7 − dB GIFAMP2 voltage or power gain of second IF amplifier 330 Ω matched input and output; SFS = 1; measured at amplifier output − 25 − dB NFIFAMP2 noise figure of second IF amplifier 330 Ω matched input and output − 14 − dB GIFAMP gain of IF amplifier section 330 Ω matched input and output; SFS = 0 − 43 − dB NFIFAMP noise figure of IF amplifier section − 7.5 − dB PLL DEMODULATOR: f0 = 10.7 MHz; fdev = ±25 kHz; fmod = 1 kHz ∆fVCO/∆V VCO gain after calibration − 760 − kHz/V fVCO VCO centre frequency (free running) open loop; all conditions 7.0 10.7 15.0 MHz ∆fVCO VCO frequency adjustment see Table 10 − 32 − steps fVCO(step) VCO centre frequency step size − 200 − kHz BWdemod demodulator −3 dB bandwidth 10 − − kHz fdev(max) maximum frequency deviation − − ±75 kHz RL(DETO) demodulator external load on pin DETO 5 − − kΩ Vo(DETO)(RMS) PLL output voltage on pin DETO (RMS value) − 100 350 mV Vo(DETO)(DC) PLL output DC voltage on microcontroller adjustable DC pin DETO component 1.2 1.4 1.6 V loop filter: see note 2 TX mode; RL(DETO) = 10 kΩ; amplifier gain = 10; note 3 FM RECEIVER: f0 = 903 MHz; fdev = ±25 kHz; fmod = 1 kHz; RL(EARO) = 150 Ω in series with 10 µF (all with CCITT filter) sRFI 2001 Dec 12 receiver sensitivity measured at antenna; duplexer insertion loss = 3 dB; input level for 12 dB SINAD; bandwidth = 100 kHz RX mode − −115 − dBm TX mode; PA = 10; VEARO(RMS) = 200 mV; TX to RX duplexer isolation is 35 dB minimum − −113.5 − dBm 30 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC SYMBOL PARAMETER UAA3515A CONDITIONS MIN. TYP. MAX. UNIT S/NFM signal-to-noise ratio TX mode; Vi(RF) = −80 and −40 dBm; PA = 10; CLKO level = 0; VEARO(RMS) = 200 mV 40 45 − dB THDFM total harmonic distortion TX mode; fdev = ±60 kHz; Vi(RF) = −80 and −40 dBm; PA = 10; CLKO level = 0; VEARO(RMS) = 500 mV; measured without CCITT filter − 0.6 2 % − 68 − dB − − V − − 0.1VCC V RSSI AND CARRIER DETECTION: VB = 1.5 V RSSI output current dynamic range VOH HIGH-level output voltage Vi(LIM)(RMS) = 0 mV; CD = 10011 0.9VCC at pin CDLBD VOL LOW-level output voltage at pin CDLBD Rint internal resistance between pin RSSI and VCC − 175 − kΩ Vdet voltage detection range 0.05 − 1.6 V ∆Vdet voltage detection step − 40 − mV Vhys hysteresis − 45 − mV Vth(CD) carrier sense threshold − 32 − steps Vi(LIM) = 0.1 V (RMS); CD = 10011 microcontroller programmable DATA COMPARATOR Vi(DATC)(p-p) comparator input signal (peak-to-peak value) 100 − − mV Vhys(DATC) hysteresis 25 40 75 mV Vth(DATC) pin DATI threshold voltage − VCC − 0.9 − Zi(DATC) pin DATI input impedance 150 240 − kΩ VOH HIGH-level output voltage Vi(DATI) = VCC − 1.4 V 0.9VCC − − V VOL LOW-level output voltage Vi(DATI) = VCC − 0.4 V − − 0.1VCC V IOHsink pin DATO output sink current Vi(DATI) = VCC − 0.4 V; Vo(DATO) = 0.1VCC − 40 − µA − 94 240 mV − − kΩ 2.2 − V V Transmitter section SUMMING AMPLIFIER Vo(p-p) pin MODO output voltage (peak-to-peak value) Rfb external feedback resistor between pins MODI and MODO 10 Vbias pin MODI bias voltage 2001 Dec 12 − 31 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC SYMBOL PARAMETER UAA3515A CONDITIONS MIN. TYP. MAX. UNIT TX VOLTAGE-CONTROLLED OSCILLATOR AND POWER AMPLIFIER fVCO(TX) VCO free running frequency note 1 − 910 − QL(VCO)(TX) quality factor of external inductor L = 3.9 nH; fVCO = 902 to 928 MHz 30 − − ∆f VCO ( TX ) -------------------------∆V TXLF VCO gain VTXLF = 0.5 V − 50 − MHz/V VTXLF = 1.5 V − 25 − MHz/V ∆f VCO ( TX ) -------------------------∆V mod VCO modulation gain VMODO = 2.2V − 530 − kHz/V VCO and power amplifier phase noise Po = 0 dBm; fcarrier = 925.6 MHz; TX to RX duplexer isolation is 35 dB minimum; Lext = 3.9 nH (both base and handset); loop filter: see note 4 foffset = 20 MHz −139 −150 − dBc/Hz foffset = 10 kHz − −85 − dBc/Hz NVCO(TX) − −60 − dBc/Hz − 2 − dB − 4 − steps − Ro = 50 Ω, LP = 22 nH, CS = 1.6 pF (see Fig.4); remove duplexer insertion loss to get power on the antenna 1 − dBm foffset = 1 kHz Po(PA) PA output power range ∆Po(PA) PA output power adjustment Po(PA)(max) PA maximum output power MHz Ro = 50 Ω, LP = 22 nH; CS = 1.6 pF (see Fig.4) TRANSMIT SYSTEM THDTX total harmonic distortion after demodulation fdev = ±60 kHz; VMODO = 225 mV (p-p); CCITT filter included − 1 2 % αct(RX−TX) RXVCO crosstalk on PA output with respect to output power note 1 − −45 − dBc Synthesizer CRYSTAL OSCILLATOR: external capacitor on pin XTALO is 8.2 pF; on pin XTALI is 5.6 pF (indicative) f(i)XTAL crystal input frequency CXTALI input capacitance on pin XTALI CXTALO ∆CTUNE 2001 Dec 12 4 10.24 20 MHz indicative; XTAL tuning cap = 8 (see Table 5) − 4 − pF input capacitance on pin XTALO indicative − 1.5 − pF crystal tuning capacitance range on XTALI pin − 4.5 − pF 32 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC SYMBOL NTUNE PARAMETER UAA3515A CONDITIONS number of capacitance tuning steps MIN. TYP. MAX. − 16 − 8 − 1023 UNIT steps REFERENCE AND CLOCK DIVIDER RDR reference divider ratio CDR clock divider ratio 5 steps (2, 2.5, 4, 1 and 128) 1 − 128 CL(CLKOUT) clock output load capacitance external to pin CLKOUT − − 20 pF VCLKOUT(p-p) CLKOUT voltage swing (peak-to-peak value) CLKO level = 0 − 1.4 − V CLKO level = 1 − 1 − V − s MHz tsw(f1-f2) − switching time from frequency f1 to f2 2 ----f2 RF TX AND RX PRESCALER AND MAIN DIVIDERS fRF RF input frequency 902 903 928 RPDR prescaler divider ratio 64 − 127 RMDR main divider ratio 8 − 1023 Charge pump current IRXCPsink RX charge pump sink current RXCPI = 0 − 400 − µA RXCPI = 1 − 800 − µA IRXCPsource RX charge pump source current RXCPI = 0 − −400 − µA RXCPI = 1 − −800 − µA TX charge pump sink current TXCPI = 0 − 400 − µA TXCPI = 1 − 800 − µA TX charge pump source current TXCPI = 0 − −400 − µA TXCPI = 1 − −800 − µA fVCO oscillator free running frequency note 1 − 910 − MHz QL(VCO)(RX) external inductor quality factor f = 920 MHz; L = 3.9 nH 30 − − ∆f VCO ( RX ) --------------------------∆V RXLF VCO gain Lext = 4.7 nH at 890 MHz (3.9 nH for 935 MHz operation) VRXLF = 0.5 V − 55 − MHz/V VRXLF = 1.5 V − 30 − MHz/V NVCO(RX) VCO RX phase noise; (indicative: cannot be measured directly) foffset = 1 kHz − −58 − dBc/Hz foffset = 10 kHz − −82 − dBc/Hz foffset = 100 kHz − −102 − dBc/Hz ITXCPsink ITXCPsource RX VCO 2001 Dec 12 fcarrier = 892.3 MHz; Lext = 4.7 nH (3.9 nH for 935 MHz operation); loop filter: see note 5 33 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC SYMBOL PARAMETER UAA3515A CONDITIONS MIN. TYP. MAX. UNIT VOLTAGE DOUBLER (Doubler enable = 1) − 5.2 − V RX or TX mode − 300 − µA CDR = 128 − 130 − µA VCC(CP) charge pump supply voltage from voltage doubler VCC = 3 V ICC(CP) voltage doubler current consumption PLL locked RX baseband RX AUDIO PATH (see Fig.6): VVB = 1.5 V; fmod = 1 kHz; RX gain set for 0 dB at VI(RXAI) = −20 dB; earpiece amplifier gain set by VCTL to 4.7 dB; with no external resistor and Cext = 560 pF; measured with a CCITT filter, except THD; ZL(EARO) = 150 Ω in series with 10 µF on RX gain amplifier −7.5 on EARO −15 − +16 dB − 32 − steps Vi(RXAI) = −20 dBV − −70 −60 dB ∆GRX RX gain adjustment range ∆GRX(steps) RX gain adjustment steps programmable through microcontroller interface ∆GRX(mute) RX gain with mute on GEXP expander gain − +8 dB Vi(RXAI) = −20 dBV −1 0 +1 dB Vi(RXAI) = −30 dBV −22 −20 −18 dB Vi(RXAI) = −35 dBV −34 −30 −26 dB THD < 4% − −13 − dBV Vi(RXAI)(max) maximum input voltage Vo(EXP)(max) maximum expander indicative; THD < 4% output voltage (indicative: cannot be measured directly) − −7 − dBV NRX RX audio path noise BW = 300 Hz to 3.4 kHz − −83 − dBVp Zi(RXAI) input impedance note 3 TX mode − 15 − kΩ RX mode 100 − − kΩ tatt(EXP) expander attack time CECAP = 0.47 µF − 2.0 − ms trel(EXP) expander release time CECAP = 0.47 µF − 5.0 − ms αct(TX-RX) TX compressor to RX expander crosstalk attenuation measured between pins CMPI and EARO; VRXAI = 0; VCMPI = −20 dBV − 80 − dB VEARO(max)(p-p) maximum output voltage (peak-peak value) THD < 4% − 2.2 − V RL(EARO) load resistance on pin EARO for stable earpiece amplifier in series with 10 µF capacitor − 0.15 100 kΩ GEAR earpiece amplifier gain set by internal resistors without external components (Rext and Cext) Rint = 14 kΩ -1 0 +1 dB Rint = 24 kΩ 3.7 4.7 5.7 dB Rint = 41 kΩ 8.3 9.3 10.3 dB Rint = 70.2 kΩ 13 14 15 dB 2001 Dec 12 34 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC SYMBOL PARAMETER GEAR(dyn) dynamic earpiece amplifier gain THDARX audio receiver total harmonic distortion UAA3515A CONDITIONS Vi(RXAI) = −20 dBV MIN. TYP. MAX. UNIT 13 14 15 dB − 0.2 2 % −12 − − dBV 0 − 34 dB TX baseband MICROPHONE AMPLIFIER: VVB = 1.5 V; fmod = 1 kHz VMICO(max) maximum output voltage ∆GV voltage gain range RL = 10 kΩ; THD < 4% TX AUDIO PATH (see Fig.8): VVB = 1.5 V; fmod = 1 kHz; TX gain set for 10 dB at VCMPI = −30 dBV GCOMP compressor gain level ∆GCOMP change in compressor gain referenced to VCMPI = −30 dBV ALC disable = 1; hard limiter enable = 0 8 10 12 dB −10 −8 dB VCMPI = −70 dBV − 23 − dB − 1.26 − V VCMPI = −12 dBV − −12.5 − dBV VCMPI = −10 dBV − −12.3 − dBV hard limiter output voltage ALC disable = 1; (peak-to-peak value) hard limiter enable = 1; VCMPI = −4 dBV VTXO(max) maximum output voltage range ALC disable = 0 VCMPI = −2.5 dBV input impedance on pin CMPI dB −12 VHLIM(p-p) ZCMPI 11 VCMPI = −10 dBV maximum compressor gain compressor total harmonic distortion 10 VCMPI = −50 dBV GCOMP(max) THDCOMP 9 ALC disable = 1; VCMPI = −10 dBV − −11.5 − dBV − 0.3 1 % − 15 − kΩ tatt(COMP) compressor attack time CCCAP = 0.47 µF − 4.0 − ms trel(COMP) compressor release time CCCAP = 0.47 µF − 8.0 − ms αct(RX-TX) RX expander to TX compressor crosstalk attenuation measured between pins RXAI and TXO; VCMPI = 0; VRXAI = −10 dBV − 65 − dB ∆GTX TX gain adjustment range programmable through microcontroller interface −7.5 − +8 dB ∆GTX(steps) TX gain adjustment steps programmable through microcontroller interface − 32 − steps ∆GTX(mute) TX gain with mute on − −70 −60 dB Zo(TXO) output impedance at pin TXO − 500 − Ω 2001 Dec 12 ALC disable = 1; VCMPI = −10 dBV 35 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC SYMBOL PARAMETER UAA3515A CONDITIONS MIN. TYP. MAX. UNIT Microcontroller interface DC CHARACTERISTICS FOR DIGITAL PINS VIL LOW-level input voltage serial interface − VIH HIGH-level input voltage serial interface V VREG ----------------1.5 − 0.5 V − VCC V IIL LOW-level input current serial interface; VIL = 0.3 V −5 − − µA IIH HIGH-level input current serial interface; VIH = VREG − 0.3 V − − 5 µA IOL LOW-level output current pin CDLBD 20 − − µA VOL LOW-level output voltage pin CDLBD; RL = 470 kΩ − − 0.1VCC V VOH HIGH-level output voltage pin CDLBD; RL = 470 kΩ 0.9VCC − − V Ci input capacitance serial bus − − 8 pF Co output capacitance pins RXPD and TXPD − − 8 pF SERIAL INTERFACE TIMING; CLK, DATA and EN (see Fig.10) tsu(CLK-EN) clock to enable set-up time 50% signal level 50 − − ns tsu(DATA-CLK) input data to clock set-up time 50% signal level 50 − − ns th(EN-CLK) enable to clock hold time 50% signal level 50 − − ns fCLK clock frequency − − 3 MHz tr input rise time 10% to 90% − − 50 ns tf input fall time 10% to 90% − − 50 ns tEND delay from last falling clock edge 100 − − ns tw enable pulse width see Fig.10 1 ---------------fcomp − − ns tstrt microcontroller interface start-up time 90% of VVREG to DATA, CLK and EN present − − 200 µs Notes 1. Measured and guaranteed only on the Philips UAA3515A test board. 2. Loop filter: C1 = 1.8 nF; R2 = 4.7 kΩ; C2 = 150 nF (see “Report CTT01001”, available on request). 3. RXAI level will be higher in RX mode than in TX mode. 4. Loop filter: C1 = 3.9 nF; R2 = 6.8 kΩ; C2 = 47 nF (see “Report CTT01001”, available on request). 5. Loop filter: C1 = 470 nF; R2 = 1.8 kΩ; C2 = 4.7 µF (see “Report CTT01001”, available on request). 2001 Dec 12 36 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC UAA3515A 12 PACKAGE OUTLINE LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2 c y X A 48 33 49 32 ZE e E HE A A2 (A 3) A1 wM θ bp pin 1 index 64 Lp L 17 1 detail X 16 ZD e v M A wM bp D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e mm 1.60 0.20 0.05 1.45 1.35 0.25 0.27 0.17 0.18 0.12 10.1 9.9 10.1 9.9 0.5 HD HE 12.15 12.15 11.85 11.85 L Lp v w y 1.0 0.75 0.45 0.2 0.12 0.1 Z D (1) Z E (1) θ 1.45 1.05 7 0o 1.45 1.05 o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT314-2 136E10 MS-026 2001 Dec 12 EIAJ EUROPEAN PROJECTION ISSUE DATE 99-12-27 00-01-19 37 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. 13 SOLDERING 13.1 Introduction to soldering surface mount packages • For packages with leads on two sides and a pitch (e): This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 13.2 The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages. 13.3 13.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: 2001 Dec 12 UAA3515A 38 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC 13.5 UAA3515A Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable(2) HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not PLCC(3), SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO REFLOW(1) suitable suitable suitable not recommended(3)(4) suitable not recommended(5) suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2001 Dec 12 39 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC UAA3515A 14 DATA SHEET STATUS DATA SHEET STATUS(1) PRODUCT STATUS(2) DEFINITIONS Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 15 DEFINITIONS 16 DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2001 Dec 12 40 Philips Semiconductors Product specification 900 MHz analog cordless telephone IC NOTES 2001 Dec 12 41 UAA3515A Philips Semiconductors Product specification 900 MHz analog cordless telephone IC NOTES 2001 Dec 12 42 UAA3515A Philips Semiconductors Product specification 900 MHz analog cordless telephone IC NOTES 2001 Dec 12 43 UAA3515A Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA73 © Koninklijke Philips Electronics N.V. 2001 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 403506/01/pp44 Date of release: 2001 Dec 12 Document order number: 9397 750 08997