ISP1105/1106/1107 Advanced Universal Serial Bus transceivers Rev. 06 — 30 November 2001 Product data 1. General description The ISP1105/1106/1107 range of Universal Serial Bus (USB) transceivers are fully compliant with the Universal Serial Bus Specification Rev. 1.1. They are ideal for portable electronics devices such as mobile phones, digital still cameras, Personal Digital Assistants (PDA) and Information Appliances (IA). They allow USB Application Specific ICs (ASICs) and Programmable Logic Devices (PLDs) with power supply voltages from 1.65 V to 3.6 V to interface with the physical layer of the Universal Serial Bus. They have an integrated 5 V to 3.3 V voltage regulator for direct powering via the USB supply VBUS. The ISP1105/1106/1107 range can be used as a USB device transceiver or a USB host transceiver. They can transmit and receive serial data at both full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) data rates. ISP1105 allows single/differential input modes selectable by a MODE input and it is available in HBCC16 package. ISP1106 allows only differential input mode and is available in both TSSOP16 and HBCC16 packages. ISP1107 allows only single-ended input mode and is available in both TSSOP16 and HBCC16 packages. 2. Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Complies with Universal Serial Bus Specification Rev. 1.1 Integrated bypassable 5 V to 3.3 V voltage regulator for powering via USB VBUS VBUS disconnection indication through VP and VM Used as a USB device transceiver or a USB host transceiver Supports full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s) serial data rates Stable RCV output during SE0 condition Two single-ended receivers with hysteresis Low-power operation Supports an I/O voltage range from 1.65 V to 3.6 V 4 kV on-chip ESD protection Full industrial operating temperature range −40 to +85 °C Available in small TSSOP16 (except ISP1105) and HBCC16 packages. ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers 3. Applications ■ Portable electronic devices, such as: ◆ Mobile phone ◆ Digital still camera ◆ Personal Digital Assistant (PDA) ◆ Information Appliance (IA). 4. Ordering information Table 1: Ordering information Type number ISP1105W[1] Package Name Description Version HBCC16 plastic, heatsink bottom chip carrier; 16 terminals; body 3 × 3 × 0.65 mm SOT639-2 TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 ISP1106W ISP1107W ISP1106DH ISP1107DH [1] The ground terminal of ISP1105W is connected to the exposed diepad (heatsink). 4.1 Ordering options Table 2: Selection guide Product Package(s) Description ISP1105 HBCC16 Supports both single-ended and differential input modes[1] ISP1106 TSSOP16 or HBCC16 Supports only the differential input mode[2] ISP1107 TSSOP16 or HBCC16 Supports only the single-ended input mode[3] [1] [2] [3] Refer to Table 5 and Table 6. Refer to Table 6. Refer to Table 5. © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 2 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers 5. Functional diagram 3.3 V V CC(I/O) VOLTAGE REGULATOR VCC(5.0) Vreg(3.3) Vpu(3.3) SOFTCON 1.5 kΩ(2) OE SPEED D+ VMO/FSE0(3) D− VPO/VO(3) MODE(4) SUSPND RCV 33 Ω(1) (1%) 33 Ω(1) (1%) LEVEL SHIFTER ISP1105 ISP1106 ISP1107 VP VM MBL301 GND (1) Use a 39 Ω resistor (1%) for a USB v2.0 compliant output impedance range. (2) Connect to D− for low-speed operation. (3) Pin function depends on device type see Section 7.2. (4) Only for ISP1105. Fig 1. Functional diagram (combined ISP1105, ISP1106 and ISP1107). © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 3 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers 6. Pinning information D− SUSPND 5 10 D+ VM 4 ISP1105W 1 16 15 14 VPO/VO 12 VMO/FSE0 13 Vreg(3.3) VP 3 RCV 2 OE 1 7 8 ISP1106W 9 D− 10 D+ 11 VPO/VO* 12 VMO/FSE0 * 13 Vreg(3.3) ISP1107W* Bottom view MBL303 6 16 15 14 VCC(5.0) OE (exposed diepad) VCC(5.0) 2 GND Vpu(3.3) RCV Bottom view 11 3 SOFTCON VP SPEED 9 VCC(I/O) 8 Vpu(3.3) 7 GND 4 6 SOFTCON VM SPEED 5 VCC(I/O) SUSPND MODE 6.1 Pinning MBL304 The asterisk (*) denotes that the signal names VO and FSE0 apply to the ISP1107W. Fig 2. Pinning diagram HBCC16 (ISP1105). Fig 3. Pinning diagram HBCC16 (ISP1106 and ISP1107). Vpu(3.3) 1 16 VCC(5.0) SOFTCON 2 15 Vreg(3.3) 14 VMO/FSE0* OE 3 RCV 4 ISP1106DH 13 VPO/VO* VP 5 ISP1107DH* 12 D+ VM 6 11 D− SUSPND 7 10 SPEED GND 8 9 V CC(I/O) MBL302 The asterisk (*) denotes that the signal names VO and FSE0 apply to the ISP1107DH. Fig 4. Pinning diagram TSSOP16 (ISP1106 and ISP1107). © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 4 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers 6.2 Pin description Table 3: Pin description Symbol[1] Pin Type Description ISP1105 HBCC16 ISP1106/7 ISP1106/7 HBCC16 TSSOP16 OE 1 1 3 I input for output enable (CMOS level with respect to VCC(I/O), active LOW); enables the transceiver to transmit data on the USB bus RCV 2 2 4 O differential data receiver output (CMOS level with respect to VCC(I/O)); driven LOW when input SUSPND is HIGH; the output state of RCV is preserved and stable during an SE0 condition VP 3 3 5 O single-ended D+ receiver output (CMOS level with respect to VCC(I/O)); for external detection of single-ended zero (SE0), error conditions, speed of connected device; driven HIGH when no supply voltage is connected to VCC(5.0) and Vreg(3.3) VM 4 4 6 O single-ended D− receiver output (CMOS level with respect to VCC(I/O)); for external detection of single-ended zero (SE0), error conditions, speed of connected device; driven HIGH when no supply voltage is connected to VCC(5.0) and Vreg(3.3) SUSPND 5 5 7 I suspend input (CMOS level with respect to VCC(I/O)); a HIGH level enables low-power state while the USB bus is inactive and drives output RCV to a LOW level MODE 6 I mode input (CMOS level with respect to VCC(I/O)); a HIGH level enables the differential input mode (VPO, VMO) whereas a LOW level enables a single-ended input mode (VO, FSE0). see Table 5 and Table 6 GND -[2] 6 8 - ground supply VCC(I/O) 7 7 9 - supply voltage for digital I/O pins (1.65 to 3.6 V). When VCC(I/O) is not connected, the (D+, D−) pins are in three-state. This supply pin is totally independent of VCC(5.0) and Vreg(3.3) and must never exceed the Vreg(3.3) voltage. SPEED 8 8 10 I speed selection input (CMOS level with respect to VCC(I/O)); adjusts the slew rate of differential data outputs D+ and D− according to the transmission speed: LOW: low-speed (1.5 Mbit/s) HIGH: full-speed (12 Mbit/s) D− 9 9 11 AI/O negative USB data bus connection (analog, differential); for low-speed mode connect to pin Vpu(3.3) via a 1.5 kΩ resistor D+ 10 10 12 AI/O positive USB data bus connection (analog, differential); for full-speed mode connect to pin Vpu(3.3) via a 1.5 kΩ resistor VPO/VO 11 11 13 I driver data input (CMOS level with respect to VCC(I/O), Schmitt trigger); see Table 5 and Table 6 VMO/FSE0 12 12 14 I driver data input (CMOS level with respect to VCC(I/O), Schmitt trigger); see Table 5 and Table 6 © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 5 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers Table 3: Pin description…continued Symbol[1] Vreg(3.3) Pin ISP1105 HBCC16 ISP1106/7 ISP1106/7 HBCC16 TSSOP16 13 13 15 Type Description - Internal regulator option: regulated supply voltage output (3.0 to 3.6 V) during 5 V operation; a decoupling capacitor of at least 0.1 µF is required Regulator bypass option: used as a supply voltage input for 3.3 V operation. (3.3 V ±10%) VCC(5.0) 14 14 16 - Internal regulator option: supply voltage input (4.0 to 5.5 V); can be connected directly to USB supply VBUS Regulator bypass option: connect to Vreg(3.3) Vpu(3.3) 15 15 1 pull-up supply voltage (3.3 V ±10%); connect an external 1.5 kΩ resistor on D+ (full-speed) or D− (low-speed); pin function is controlled by input SOFTCON: - SOFTCON = LOW — Vpu(3.3) floating (high impedance); ensures zero pull-up current SOFTCON = HIGH — Vpu(3.3) = 3.3 V; internally connected to Vreg(3.3) SOFTCON [1] [2] 16 16 2 I software controlled USB connection input; a HIGH level applies 3.3 V to pin Vpu(3.3), which is connected to an external 1.5 kΩ pull-up resistor; this allows USB connect/disconnect signalling to be controlled by software Symbol names with an overscore (e.g. NAME) indicate active LOW signals. Down bonded to the exposed diepad. 7. Functional description 7.1 Function selection Table 4: Function table SUSPND OE (D+, D−) RCV VP/VM Function L L driving & receiving active active normal driving (differential receiver active) L H receiving[1] active active receiving active driving during ‘suspend’[3] (differential receiver inactive) active low-power state [1] [2] [3] H L driving inactive[2] H H high-Z[1] inactive[2] Signal levels on (D+, D−) are determined by other USB devices and external pull-up/down resistors. In ‘suspend’ mode (SUSPND = HIGH) the differential receiver is inactive and output RCV is always LOW. Out-of-suspend (‘K’) signalling is detected via the single-ended receivers VP and VM. During suspend, the slew-rate control circuit of low-speed operation is disabled. The (D+, D−) lines are still driven to their intended states, without slew-rate control. This is permitted because driving during suspend is used to signal remote wake-up by driving a ‘K’ signal (one transition from idle to ‘K’ state) for a period of 1 to 15 ms. © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 6 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers 7.2 Operating functions Table 5: Driving function using single-ended input data interface (OE = L) [for ISP1107 and ISP1105 (MODE = L)] FSE0 VO Data L L differential logic 0 L H differential logic 1 H L SE0 H H SE0 Driving function using differential input data interface (OE = L) [for ISP1106 and ISP1105 (MODE = H)] Table 6: VMO VPO Data L L SE0 L H differential logic 1 H L differential logic 0 H H illegal state Table 7: [1] [2] Receiving function (OE = H) (D+, D−) RCV VP[1] VM[1] differential logic 0 L L H differential logic 1 H H L SE0 RCV*[2] L L VP = VM = H indicates the sharing mode (VCC(5.0)/Vreg(3.3) is disconnected). RCV* denotes the signal level on output RCV just before SE0 state occurs. This level is stable during the SE0 period. 7.3 Power supply configurations The ISP1105/1106/1107 can be used with different power supply configurations, which can be changed dynamically. An overview is given in Table 9. Normal mode — Both VCC(I/O) and VCC(5.0) or (VCC(5.0) and Vreg(3.3)) are connected. For 5 V operation, VCC(5.0) is connected to a 5 V source (4.0 to 5.5 V). The internal voltage regulator then produces 3.3 V for the USB connections. For 3.3 V operation, both VCC(5.0) and Vreg(3.3) are connected to a 3.3 V source (3.0 to 3.6 V). VCC(I/O) is independently connected to a voltage source (1.65 V to 3.6 V), depending on the supply voltage of the external circuit. Disable mode — VCC(I/O) is not connected, VCC(5.0) or (VCC(5.0) and Vreg(3.3)) are connected. In this mode, the internal circuits of the ISP1105/1106/1107 ensure that the (D+, D−) pins are in three-state and the power consumption drops to the low-power (suspended) state level. Some hysteresis is built into the detection of VCC(I/O) lost. Sharing mode — VCC(I/O) is connected, (VCC(5.0) and Vreg(3.3)) are not connected. In this mode, the (D+, D−) pins are made three-state and the ISP1105/1106/1107 allows external signals of up to 3.6 V to share the (D+, D−) lines. The internal circuits of the ISP1105/1106/1107 ensure that virtually no current (maximum 10 µA) is drawn via the (D+, D−) lines. The power consumption through pin VCC(I/O) drops to the © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 7 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers low-power (suspended) state level. Both the VP and VM pins are driven HIGH to indicate this mode. Pin RCV is made LOW. Some hysteresis is built into the detection of Vreg(3.3) lost. Table 8: Pin states in Disable or Sharing mode Pins VCC(5.0)/Vreg(3.3) Disable mode state Sharing mode state 5 V input / 3.3 V output 3.3 V input / 3.3 V input not present VCC(I/O) not present 1.65 V to 3.6 V input Vpu(3.3) high impedance (off) high impedance (off) (D+, D−) high impedance high impedance (VP, VM) invalid[1] H RCV invalid[1] L high impedance high impedance Inputs (VO/VPO, FSE0/VMO, SPEED, MODE[2], SUSPND, OE, SOFTCON) [1] [2] High impedance or driven LOW. ISP1105 only. Table 9: Power supply configuration overview VCC(5.0) or Vreg(3.3) VCC(I/O) Configuration Special characteristics connected connected Normal mode - connected not connected Disable mode (D+, D−) and Vpu(3.3) high impedance; VP, VM, RCV: invalid[1] not connected connected Sharing mode (D+, D−) and Vpu(3.3) high impedance; VP, VM driven HIGH; RCV driven LOW [1] High impedance or driven LOW. 7.4 Power supply input options The ISP1105/1106/1107 range has two power supply input options: Internal regulator — VCC(5.0) is connected to 4.0 to 5.5 V. The internal regulator is used to supply the internal circuitry with 3.3 V (nominal). The Vreg(3.3) pin becomes a 3.3 V output reference. Regulator bypass — VCC(5.0) and Vreg(3.3) are connected to the same supply. The internal regulator is bypassed and the internal circuitry is supplied directly from the Vreg(3.3) power supply. The voltage range is 3.0 to 3.6 V to comply with the USB specification. The supply voltage range for each input option is specified in Table 10. © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 8 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers Table 10: Power supply input options Input option VCC(5.0) Vreg(3.3) VCC(I/O) Internal regulator supply input for internal voltage reference regulator output (4.0 to 5.5 V) (3.3 V, 300 µA) supply input for digital I/O pins (1.65 V to 3.6 V) Regulator bypass connected to Vreg(3.3) with maximum voltage drop of 0.3 V (2.7 to 3.6 V) supply input for digital I/O pins (1.65 V to 3.6 V) supply input (3.0 V to 3.6 V) 8. Limiting values Table 11: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Min Max Unit VCC(5.0) supply voltage −0.5 +6.0 V VCC(I/O) I/O supply voltage −0.5 +4.6 V Vreg(3.3) regulated supply voltage −0.5 +4.6 V VI DC input voltage −0.5 VCC(I/O) + 0.5 V Ilatchup latch-up current - 100 mA - ±4000 V - ±2000 V −40 +125 °C electrostatic discharge Vesd Conditions VI = −1.8 to 5.4 V ILI < 1 µA voltage[1] pins D+, D−, VCC(5.0), Vreg(3.3), GND other pins Tstg [1] storage temperature Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model). Refer to EIA/JEDEC Standard specification EIA/JESD22-A114-A. Table 12: Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit VCC(5.0) supply voltage (Internal regulator option) 5 V operation 4.0 5.0 5.5 V Vreg(3.3) supply voltage (Regulator bypass option) 3.3 V operation 3.0 3.3 3.6 V VCC(I/O) I/O supply voltage 1.65 - 3.6 V VI input voltage 0 - VCC(I/O) V VI(AI/O) input voltage on analog I/O pins (D+/D−) 0 - 3.6 V Tamb operating ambient temperature −40 - +85 °C © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 9 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers 9. Static characteristics Table 13: Static characteristics: supply pins VCC = 4.0 to 5.5 V or Vreg(3.3) = 3.0 to 3.6 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; see Table 10 for valid voltage level combinations; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions [1] Min Typ Max Unit 3.0[2] 3.3 3.6 V Vreg(3.3) regulated supply voltage output Internal regulator option; Iload ≤ 300 µA ICC operating supply current full-speed transmitting and receiving at 12 Mbit/s; CL = 50 pF on D+/D− - 4 8[3] mA ICC(I/O) operating I/O supply current full-speed transmitting and receiving at 12 Mbit/s - 1 2[3] mA ICC(idle) supply current during full-speed idle and SE0 full-speed idle: VD+ > 2.7 V, VD− < 0.3 V; SE0: VD+ < 0.3 V, VD− < 0.3 V - - 500 µA ICC(I/O)(static) static I/O supply current full-speed idle, SE0 or suspend ICC(susp) ICC(dis) suspend supply current SUSPND = HIGH disable mode supply current VCC(I/O) not connected [4] - - 20 µA [4] - - 20 µA [4] - - 20 µA ICC(I/O)(sharing) sharing mode I/O supply current VCC(5.0) or Vreg(3.3) not connected - - 20 µA IDx(sharing) sharing mode load current on pins D+ and D− VCC(5.0) or Vreg(3.3) not connected; SOFTCON = LOW; VDx = 3.6 V - - 10 µA Vth(reg3.3) regulated supply voltage detection threshold 1.65 V ≤ VCC(I/O) ≤ Vreg(3.3); 2.7 V ≤ Vreg(3.3) ≤ 3.6 V supply lost - - 0.8 V supply present 2.4[5] - - V - 0.45 - V supply lost - - 0.5 V supply present 1.4 - - V - 0.45 - V Vhys(reg3.3) regulated supply voltage detection hysteresis VCC(I/O) = 1.8 V Vth(I/Osup) I/O supply voltage detection threshold Vreg(3.3) = 2.7 to 3.6 V Vhys(I/Osup) [1] [2] [3] [4] [5] I/O supply voltage detection hysteresis Vreg(3.3) = 3.3 V Iload includes the pull-up resistor current via pin Vpu(3.3). In ‘suspend’ mode, the minimum voltage is 2.7 V. Characterized only, not tested in production. Excluding any load current and Vpu(3.3)/Vsw source current to the 1.5 kΩ and 15 kΩ pull-up and pull-down resistors (200 µA typ.). When VCC(I/O) < 2.7 V, the minimum value for Vth(reg3.3)(present) is 2.0 V. © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 10 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers Table 14: Static characteristics: digital pins VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCC(I/O) = 1.65 to 3.6 V Input levels VIL LOW-level input voltage - - 0.3VCC(I/O) V VIH HIGH-level input voltage 0.6VCC(I/O) - - V Output levels VOL LOW-level output voltage VOH HIGH-level output voltage IOL = 100 µA - - 0.15 V IOL = 2 mA - - 0.4 V IOH = 100 µA VCC(I/O) − 0.15 - - V IOH = 2 mA VCC(I/O) − 0.4 - - V - - ±1 µA Leakage current ILI input leakage current Example 1: VCC(I/O) = 1.8 V ± 0.15 V Input levels VIL LOW-level input voltage - - 0.5 V VIH HIGH-level input voltage 1.2 - - V IOL = 100 µA - - 0.15 V Output levels VOL VOH LOW-level output voltage HIGH-level output voltage IOL = 2 mA - - 0.4 V IOH = 100 µA 1.5 - - V IOH = 2 mA 1.25 - - V Example 2: VCC(I/O) = 2.5 V ± 0.2 V Input levels VIL LOW-level input voltage - - 0.7 V VIH HIGH-level input voltage 1.7 - - V Output levels VOL LOW-level output voltage VOH HIGH-level output voltage IOL = 100 µA - - 0.15 V IOL = 2 mA - - 0.4 V IOH = 100 µA 2.15 - - V IOH = 2 mA 1.9 - - V Example 3: VCC(I/O) = 3.3 V ± 0.3 V Input levels VIL LOW-level input voltage - - 0.9 V VIH HIGH-level input voltage 2.15 - - V IOL = 100 µA - - 0.15 V IOL = 2 mA - - 0.4 V IOH = 100 µA 2.85 - - V IOH = 2 mA 2.6 - - V pin to GND - - 10 pF Output levels VOL LOW-level output voltage VOH HIGH-level output voltage Capacitance CIN input capacitance © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 11 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers Table 15: Static characteristics: analog I/O pins (D+, D−) VCC = 4.0 to 5.5 V or Vreg(3.3) = 3.0 to 3.6 V; VGND = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Input levels Differential receiver VDI differential input sensitivity |VI(D+) − VI(D−)| 0.2 - - V VCM differential common mode voltage includes VDI range 0.8 - 2.5 V Single-ended receiver VIL LOW-level input voltage - - 0.8 V VIH HIGH-level input voltage 2.0 - - V Vhys hysteresis voltage 0.4 - 0.7 V RL = 1.5 kΩ to +3.6 V - - 0.3 V RL = 15 kΩ to GND 2.8[1] - 3.6 V - - ±1 µA - - 20 pF Output levels LOW-level output voltage VOL VOH HIGH-level output voltage Leakage current OFF-state leakage current ILZ Capacitance transceiver capacitance pin to GND ZDRV driver output impedance steady-state drive [2] 34 39 44 Ω ZDRV2 driver output impedance for USB 2.0 steady-state drive [3] 40.5 45 49.5 Ω ZINP input impedance 10 - - MΩ RSW internal switch resistance at pin Vpu(3.3) - - 10 Ω termination voltage for upstream port pull-up (RPU) 3.0[5] - 3.6 V CIN Resistance Termination VTERM[4] [1] [2] [3] [4] [5] VOH(min) = Vreg(3.3) − 0.2 V. Includes external resistors of 33 Ω ±1% on both D+ and D−. Includes external resistors of 39 Ω ±1% on both D+ and D−. This range complies with Universal Serial Bus Specification Rev. 2.0. This voltage is available at pins Vreg(3.3) and Vpu(3.3). In ‘suspend’ mode the minimum voltage is 2.7 V. © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 12 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers 10. Dynamic characteristics Table 16: Dynamic characteristics: analog I/O pins (D+, D−)[1] VCC = 4.0 to 5.5 V or Vreg(3.3) = 3.0 to 3.6 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; see Table 10 for valid voltage level combinations; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Driver characteristics Full-speed mode (SPEED = HIGH) tFR rise time CL = 50 to 125 pF; 10 to 90% of |VOH − VOL|; see Figure 5 4 - 20 ns tFF fall time CL = 50 to 125 pF; 90 to 10% of |VOH − VOL|; see Figure 5 4 - 20 ns FRFM differential rise/fall time matching (tFR/tFF) excluding the first transition from Idle state 90 - 111.1 % VCRS output signal crossover voltage excluding the first transition from Idle state; see Figure 8 1.3 - 2.0 V [2] Low-speed mode (SPEED = LOW) tLR rise time CL = 50 to 600 pF; 10 to 90% of |VOH − VOL|; see Figure 5 75 - 300 ns tLF fall time CL = 50 to 600 pF; 90 to 10% of |VOH − VOL|; see Figure 5 75 - 300 ns LRFM differential rise/fall time matching (tLR/tLF) excluding the first transition from Idle state 80 - 125 % VCRS output signal crossover voltage excluding the first transition from idle state; see Figure 8 1.3 - 2.0 V [2] Driver timing Full-speed mode (SPEED = HIGH) tPLH(drv) driver propagation delay LOW-to-HIGH; see Figure 8 - - 18 ns tPHL(drv) (VO/VPO, FSE0/VMO to D+,D−) HIGH-to-LOW; see Figure 8 - - 18 ns tPHZ driver disable delay HIGH-to-OFF; see Figure 6 - - 15 ns tPLZ (OE to D+,D−) LOW-to-OFF; see Figure 6 - - 15 ns tPZH driver enable delay OFF-to-HIGH; see Figure 6 - - 15 ns tPZL (OE to D+,D−) OFF-to-LOW; see Figure 6 - - 15 ns Low-speed mode (SPEED = LOW) Not specified: low-speed delay timings are dominated by the slow rise/fall times tLR and tLF. © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 13 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers Table 16: Dynamic characteristics: analog I/O pins (D+, D−)[1]…continued VCC = 4.0 to 5.5 V or Vreg(3.3) = 3.0 to 3.6 V; VCC(I/O) = 1.65 to 3.6 V; VGND = 0 V; see Table 10 for valid voltage level combinations; Tamb = −40 to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Receiver timings (full-speed and low-speed mode) Differential receiver tPLH(rcv) propagation delay LOW-to-HIGH; see Figure 7 - - 15 ns tPHL(rcv) (D+,D− to RCV) HIGH-to-LOW; see Figure 7 - - 15 ns Single-ended receiver tPLH(se) propagation delay LOW-to-HIGH; see Figure 7 - - 18 ns tPHL(se) (D+,D− to VP, VM) HIGH-to-LOW; see Figure 7 - - 18 ns [1] [2] Test circuit: see Figure 11. Characterized only, not tested. Limits guaranteed by design. 1.65 V logic input t FR, t LR VOH 0V t FF, t LF 90% 10% VOH 10% MGS963 Fig 5. Rise and fall times. VOH −0.3 V VCRS VOL +0.3 V VOL MGS966 Fig 6. Timing of OE to D+, D−. 2.0 V differential data lines t PHZ t PLZ t PZH t PZL 90% differential data lines VOL 0.9 V 0.9 V 1.65 V VCRS VCRS logic input 0.8 V t PLH(rcv) t PLH(se) 0V t PHL(rcv) t PHL(se) t PLH(drv) VOH logic output t PHL(drv) VOH 0.9 V VOL Fig 7. Timing of D+, D− to RCV, VP, VM. differential data lines 0.9 V MGS965 VCRS VCRS VOL MGS964 Fig 8. Timing of VO/VPO, FSE0/VMO to D+, D−. © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data 0.9 V 0.9 V Rev. 06 — 30 November 2001 14 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers 11. Test information test point 33 Ω(1) 500 Ω D.U.T. 50 pF V MBL142 V = 0 V for tPZH, tPHZ V = Vreg(/3.3) for tPZL, tPLZ (1) Complies with USB 1.1. For USB 2.0 a resistor of 39 Ω must be used. Fig 9. Load for enable and disable times. test point D.U.T. 25 pF MGS968 Fig 10. Load for VM, VP and RCV. Vpu(3.3) 1.5 kΩ (1) D.U.T. test point D+/D− 33 Ω(2) CL 15 kΩ MGS967 Load capacitance: CL = 50 pF or 125 pF (full-speed mode, minimum or maximum timing) CL = 50 pF or 600 pF (low-speed mode, minimum or maximum timing) (1) Full-speed mode: connected to D+, low-speed mode: connected to D−. (2) Complies with USB 1.1. For USB 2.0 a resistor of 39 Ω must be used. Fig 11. Load for D+, D−. © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 15 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers 12. Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm b D B SOT639-2 v M C A B w M C A f terminal 1 index area v M C A B w M C b1 E b2 b2 v M C A B w M C v M C A B w M C detail X e1 C Dh e y y1 C 5 9 e e4 Eh e2 1/2 e4 1 13 16 A1 X 1/2 e3 A2 e3 A 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 b b1 b2 D Dh E Eh e e1 e2 e3 e4 f v w y y1 mm 0.8 0.10 0.05 0.7 0.6 0.33 0.27 0.33 0.27 0.38 0.32 3.1 2.9 1.45 1.35 3.1 2.9 1.45 1.35 0.5 2.5 2.5 2.45 2.45 0.23 0.17 0.08 0.1 0.05 0.2 OUTLINE VERSION REFERENCES IEC SOT639-2 JEDEC JEITA MO-217 EUROPEAN PROJECTION ISSUE DATE 01-11-13 Fig 12. HBCC16 package outline. © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 16 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 E D A X c y HE v M A Z 9 16 Q (A 3) A2 A A1 pin 1 index θ Lp L 1 8 detail X w M bp e 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) θ mm 1.10 0.15 0.05 0.95 0.80 0.25 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 1.0 0.75 0.50 0.4 0.3 0.2 0.13 0.1 0.40 0.06 8 0o o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC SOT403-1 JEDEC EIAJ MO-153 EUROPEAN PROJECTION ISSUE DATE 95-04-04 99-12-27 Fig 13. TSSOP16 package outline. © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 17 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers 13. Packaging The ISP1105/1106/1107W (HBCC16 package) is delivered on a Type A carrier tape, see Figure 14. The tape dimensions are given in Table 17. The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not designed for use in a baking process. The cumulative tolerance of 10 successive sprocket holes is ±0.02 mm. The camber must not exceed 1 mm in 100 mm. 4 idth W A0 K0 B0 P1 Type A direction of feed 4 W A0 K0 B0 elongated sprocked hole P1 Type B direction of feed MLC338 Fig 14. Carrier tape dimensions. Table 17: Type A carrier tape dimensions for ISP1105/1106/1107W Dimension Value Unit A0 3.3 mm B0 3.3 mm K0 1.1 mm P1 8.0 mm W 12.0 ±0.3 mm © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 18 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 14.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C small/thin packages. 14.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 19 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 14.5 Package related soldering information Table 18: Suitability of surface mount IC packages for wave and reflow soldering methods Package Soldering method BGA, HBGA, LFBGA, SQFP, TFBGA Reflow[1] not suitable suitable suitable[2] HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not PLCC[3], SO, SOJ suitable LQFP, QFP, TQFP SSOP, TSSOP, VSO [1] [2] [3] [4] [5] suitable suitable not recommended[3][4] suitable not recommended[5] suitable All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Wave Rev. 06 — 30 November 2001 20 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers 15. Additional soldering information 15.1 (H)BCC packages: footprint The surface material of the terminals on the resin protrusion consists of a 4-layer metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1 µm min.) ensures solderability, the Ni layer (5 µm min.) prevents diffusion, and the Pd layer on top (0.5 µm min.) ensures effective wire bonding. Terminal PCB land Solder resist mask Stencil mask All dimensions in mm Normal 0.05 b1 Solder land 0.05 b1 b Solder resist b Solder stencil 0.05 0.05 Corner 0.05 b2 b2 0.05 For exact dimensions see package outline drawing (SOT639-2) b2 b2 0.05 0.05 Cavity 0.05 0.3 (8×) Stencil print thickness: 0.1 to 0.12 mm Eh 0.1 (4×) Eh 004aaa123 Dh Dh 0.05 Cavity: exposed diepad, either functioning as heatsink or as ground connection; only for HBCC packages. Fig 15. (H)BCC footprint and solder resist mask dimensions. 15.2 (H)BCC packages: reflow soldering profile The conditions for reflow soldering of (H)BCC packages are as follows: • Preheating time: minimum 90 s at T = 145 to 155 °C • Soldering time: minimum 90 s (BCC) or minimum 100 s (HBCC) at T > 183 °C • Peak temperature: – Ambient temperature: Tamb(max) = 260 °C – Device surface temperature: Tcase(max) = 255 °C. © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 21 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers 16. Revision history Table 19: Revision history Rev Date 06 20011130 CPCN Description - Product data; sixth version. Supersedes ISP1105_1106_1107-05 of 3 Sept 2001 (9397 750 08643). Modifications: • Changed the HBCC16 package version from SOT639-1 to SOT639-2 in: – Table 1 “Ordering information” on page 2. – Section 12 “Package outline” on page 16. – Figure 15 “(H)BCC footprint and solder resist mask dimensions.” on page 21. • 05 20010903 - Product data; fifth version. Supersedes ISP1105_1106_1107-04 of 2 Aug 2001 (9397 750 08643). Modifications: • 04 20010802 - Section 7.4 “Power supply input options”: Removed the last sentence “The internal regulator is not used in single-ended mode and is shutdown.” from the Internal regulator definition. Replaced front-page logo with new USB basic-speed logo. Preliminary data; fourth version. Supersedes ISP1105_1106_1107-03 of 4 July 2001 (9397 750 08515). Modifications: • • Section 1 “General description”: removed backward compatibility with PDIUSBP11A. Section 2 “Features”: – Removed backward compatibility with PDIUSBP11A. – Added ‘on-chip’ for the ESD protection. – Changed the I/O voltage range from ‘1.8 V, 2.5 V or 3.3 V’ into ‘1.65 V to 3.6 V’. • • Section 6.2 “Pin description”: changed the description for pin VCC(I/O). Section 7.3 “Power supply configurations”: changed VCC(I/O) range from ‘1.8 V, 2.5 V or 3.3 V’ into ‘1.65 to 3.6 V’ in the description of Normal mode, in Table 8 and in Table 10. • Table 13 “Static characteristics: supply pins”: removed table note for ICC referencing the USB On-The-Go specification. • Table 14 “Static characteristics: digital pins”: changed the commonly supported types of VCC(I/O) into examples. • • Section 15.1 “(H)BCC packages: footprint”: added paragraph on terminal composition. Section 15.2 “(H)BCC packages: reflow soldering profile”: changed peak temperature from 220 °C ±5 °C to 260 °C (ambient) and 255 °C (device surface). 03 20010704 - Preliminary data; third version. Supersedes ISP1107-02 of 5 February 2001 (9397 750 07879). Modification: 02 20010205 - Objective specification; second version. Supersedes ISP1107-01 of 23 February 2000 (9397 750 06899). ISP1107 stand-alone datasheet only. 01 20000223 - Objective specification; initial version. ISP1107 stand-alone datasheet only. • ISP1107, ISP1106 and ISP1105 combined into one datasheet. © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Product data Rev. 06 — 30 November 2001 22 of 24 ISP1105/1106/1107 Philips Semiconductors Advanced USB transceivers 17. Data sheet status Data sheet status[1] Product status[2] Definition Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 18. Definitions 19. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Contact information For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: [email protected]. Product data Fax: +31 40 27 24825 © Koninklijke Philips Electronics N.V. 2001. All rights reserved. 9397 750 08872 Rev. 06 — 30 November 2001 23 of 24 Philips Semiconductors ISP1105/1106/1107 Advanced USB transceivers Contents 1 2 3 4 4.1 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 15.1 15.2 16 17 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 Function selection. . . . . . . . . . . . . . . . . . . . . . . 6 Operating functions. . . . . . . . . . . . . . . . . . . . . . 7 Power supply configurations . . . . . . . . . . . . . . . 7 Power supply input options . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 Static characteristics. . . . . . . . . . . . . . . . . . . . 10 Dynamic characteristics . . . . . . . . . . . . . . . . . 13 Test information . . . . . . . . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 20 Package related soldering information . . . . . . 20 Additional soldering information . . . . . . . . . . 21 (H)BCC packages: footprint . . . . . . . . . . . . . . 21 (H)BCC packages: reflow soldering profile. . . 21 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 22 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 23 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 © Koninklijke Philips Electronics N.V. 2001. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 30 November 2001 Document order number: 9397 750 08872