ISP1104 Advanced Universal Serial Bus transceiver Rev. 02 — 14 October 2003 Product data 1. General description The ISP1104 Universal Serial Bus (USB) transceiver is compliant with the Universal Serial Bus Specification Rev. 2.0. The ISP1104 can transmit and receive USB data at full-speed (12 Mbit/s). It allows single and differential input modes selectable by a MODE input. It allows USB Application Specific Integrated Circuits (ASICs) and Programmable Logic Devices (PLDs) with power supply voltages from 1.65 V to 3.6 V to interface with the physical layer of the USB. It has an integrated 5 V-to-3.3 V voltage regulator for direct powering via the USB supply line VBUS. It has an integrated voltage detector to detect the presence of the VBUS line voltage (VCC(5.0)). When VBUS (VCC(5.0)) is lost, the D+ and D− pins can be shared with other serial protocols. The ISP1104 is available in HBCC16 package. The ISP1104 is ideal for use in portable electronic devices, such as mobile phones, digital still cameras, personal digital assistants and information appliances. 2. Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Complies with Universal Serial Bus Specification Rev. 2.0 Supports full-speed (12 Mbit/s) serial data rate Integrated 5 V-to-3.3 V voltage regulator for powering via USB line VBUS VBUS voltage presence indication on pin VBUSDET Used as USB device transceiver or USB transceiver Stable RCV output during single-ended zero (SE0) condition Two single-ended receivers with hysteresis Low-power operation Supports I/O voltage range from 1.65 V to 3.6 V ±12 kV ESD protection at pins D+, D-, VCC(5.0) and GND Full industrial operating temperature range from −40 °C to +85 °C Available in HBCC16 lead-free and halogen-free package. 3. Applications ■ Portable electronic devices, such as: ◆ Mobile phone ◆ Digital Still Camera (DSC) ◆ Personal Digital Assistant (PDA) ◆ Information Appliance (IA). ISP1104 Philips Semiconductors Advanced USB transceiver 4. Ordering information Table 1: Ordering information Type number Package Name Description Version ISP1104W HBCC16 plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 × 3 × 0.65 mm SOT639-2 5. Block diagram 3.3 V V CC(I/O) VOLTAGE REGULATOR VCC(5.0) Vreg(3.3) Vpu(3.3) VBUSDET 1.5 kΩ SOFTCON D+ OE 33 Ω (1%) D− 33 Ω (1%) MODE VMO/FSE0(1) LEVEL SHIFTER VPO/VO(1) ISP1104 SUSPND RCV VP VM GND 004aaa035 (1) Pin function depends on the device function, see Section 7.2. Fig 1. Block diagram. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 2 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver 6. Pinning information VM 4 VBUSDET 5 VCC(I/O) SUSPND MODE 6.1 Pinning 6 7 8 9 D− 10 D+ 11 VPO/VO 12 VMO/FSE0 13 Vreg(3.3) ISP1104W 3 OE 1 (exposed diepad) Bottom view 16 15 14 VCC(5.0) 2 Vpu(3.3) RCV GND SOFTCON VP 004aaa036 Fig 2. Pin configuration HBCC16. 6.2 Pin description Table 2: Pin description Symbol[1] Pin Type Description OE 1 I input for output enable (CMOS level with respect to VCC(I/O), active LOW); enables the transceiver to transmit data on the USB bus RCV 2 O differential data receiver output (CMOS level with respect to VCC(I/O)); driven LOW when input SUSPND is HIGH; the output state of RCV is preserved and stable during an SE0 condition VP 3 O single-ended D+ receiver output (CMOS level with respect to VCC(I/O)); for external detection of SE0, error conditions and speed of connected device; driven HIGH when no supply voltage is connected to VCC(5.0) and Vreg(3.3) VM 4 O single-ended D− receiver output (CMOS level with respect to VCC(I/O)); for external detection of SE0, error conditions and speed of connected device; driven HIGH when no supply voltage is connected to VCC(5.0) and Vreg(3.3) input pad; push pull; CMOS output pad; push pull; 4 mA output drive; CMOS output pad; push pull; 4 mA output drive; CMOS output pad; push pull; 4 mA output drive; CMOS © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 3 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver Table 2: Pin description…continued Symbol[1] Pin Type Description SUSPND 5 I suspend input (CMOS level with respect to VCC(I/O)); a HIGH level enables low-power state while the USB bus is inactive and drives output RCV to a LOW level input pad; push pull; CMOS MODE 6 I mode input (CMOS level with respect to VCC(I/O)); a HIGH level enables the differential input mode (pins VPO and VMO) whereas a LOW level enables a single-ended input mode (pins VO and FSE0); see Table 4 and Table 5 input pad; push pull; CMOS VCC(I/O) 7 - supply voltage for digital I/O pins (1.65 V to 3.6 V); when VCC(I/O) is not connected, the pins D+ and D− are in three-state; this supply pin is totally independent of VCC(5.0) and Vreg(3.3) and must never exceed the Vreg(3.3) voltage VBUSDET 8 O VBUS indicator output (CMOS level with respect to VCC(I/O)); when VBUS > 4.1 V, then VBUSDET = HIGH and when VBUS < 3.6 V, then VBUSDET = LOW output pad; push pull; 4 mA output drive; CMOS D− 9 AI/O negative USB data bus connection (analog, differential) D+ 10 AI/O positive USB data bus connection (analog, differential); connect a 1.5 kΩ resistor to pin Vpu(3.3) VPO/VO 11 I driver data input (CMOS level with respect to VCC(I/O), Schmitt trigger); see Table 4 and Table 5 input pad; push pull; CMOS VMO/FSE0 12 I driver data input (CMOS level with respect to VCC(I/O), Schmitt trigger); see Table 4 and Table 5 input pad; push pull; CMOS Vreg(3.3) 13 - regulated supply voltage output (3.0 V to 3.6 V); a decoupling capacitor of at least 0.1 µF is required VCC(5.0) 14 - supply voltage input (4.0 V to 5.5 V); can be connected directly to the USB supply line VBUS Vpu(3.3) 15 - pull-up supply voltage (3.3 V ± 10 %); connect an external 1.5 kΩ resistor on pin D+ (full-speed); pin function is controlled by input SOFTCON SOFTCON = LOW — Vpu(3.3) floating (high impedance); ensures zero pull-up current SOFTCON = HIGH — Vpu(3.3) = 3.3 V; internally connected to Vreg(3.3) SOFTCON 16 I GND exposed die pad software controlled USB connection input; a HIGH level applies 3.3 V to pin Vpu(3.3), which is connected to an external 1.5 kΩ pull-up resistor; this allows USB connect or disconnect signalling to be controlled by software input pad; push pull; CMOS [1] ground supply; down bonded to the exposed die pad (heatsink); to be connected to the PCB ground Symbol names with an overscore (for example, NAME) indicate active LOW signals. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 4 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver 7. Functional description 7.1 Function selection Table 3: Function table SUSPND OE D+ and D− RCV VP/VM Function L L driving/ receiving active active normal driving (differential receiver active) L H receiving[1] active active receiving H L driving inactive[2] active driving during ‘suspend’ (differential receiver inactive) H H high-Z[1] inactive[2] active low-power state [1] [2] Signal levels on pins D+ and D− are determined by other USB devices and external pull-up or pull-down resistors. In the suspend mode (pin SUSPND = HIGH), the differential receiver is inactive and the output RCV is always LOW. Out-of-suspend (K) signalling is detected via the single-ended receivers VP and VM. 7.2 Operating functions Table 4: Driving function using single-ended input data interface (pin OE = L and pin MODE = L) FSE0 VO Data L L differential logic 0 L H differential logic 1 H L SE0 H H SE0 Table 5: Driving function using differential input data interface (pin OE = L and pin MODE = H) VMO VPO Data L L SE0 L H differential logic 1 H L differential logic 0 H H illegal state Table 6: Receiving function (pin OE = H) D+ and D− RCV VP[1] VM[1] differential logic 0 L L H differential logic 1 H H L SE0 RCV*[2] L L [1] [2] VP = VM = H indicates the sharing mode (VCC(5.0) is disconnected). RCV* denotes the signal level on output RCV just before the SE0 state occurs. This level is stable during the SE0 period. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 5 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver 7.3 Power supply configurations The ISP1104 can be used with different power supply configurations, which can be changed dynamically. Table 8 provides an overview of power supply configurations. Normal mode — Both VCC(I/O) and VCC(5.0) are connected. For 5 V operation, VCC(5.0) is connected to a 5 V source (4.0 V to 5.5 V). The internal voltage regulator then produces 3.3 V for USB connections. VCC(I/O) is independently connected to a voltage source (1.65 V to 3.6 V), depending on the supply voltage of the external circuit. Disable mode — VCC(I/O) is not connected and VCC(5.0) is connected. In this mode, the internal circuits of the ISP1104 ensure that the D+ and D− pins are in three-state and the power consumption drops to the low-power (suspended) state level. Some hysteresis is built into the detection of VCC(I/O) lost. Sharing mode — VCC(I/O) is connected and VCC(5.0) < 3.6 V to differentiate between the USB mode and other modes when sharing the VBUS. In this mode, pins D+ and D− are made three-state and the ISP1104 allows external signals of up to 3.6 V to share the D+ and D− lines. The internal circuits of the ISP1104 ensure that virtually no current (maximum 10 µA) is drawn via the D+ and D− lines. The power consumption through pin VCC(I/O) and pin VCC(5.0) drops to the low-power (suspended) state level. Pins VP and VM are driven HIGH and pins VBUSDET and RCV are driven LOW to indicate this mode. Some hysteresis is built into the detection of VCC(5.0) lost. Table 7: Pin states in disable or sharing mode Pin Disable mode Sharing mode VCC(5.0) 5 V input <3.6 V Vreg(3.3) 3.3 V output pulled-down VCC(I/O) not present 1.65 V to 3.6 V input Vpu(3.3) high impedance (off) high impedance (off) D+, D− high impedance high impedance VP, VM invalid[1] H RCV invalid[1] L VBUSDET invalid[1] L VPO/VO, VMO/FSE0, MODE, SUSPND, OE, SOFTCON high impedance high impedance [1] High impedance or driven LOW. Table 8: Power supply configuration overview VCC(5.0) VCC(I/O) Configuration Special characteristics connected connected normal mode - connected not connected disable mode D+, D− and Vpu(3.3) high impedance; VP, VM, RCV: invalid[1][2] not connected or <3.6 V connected sharing mode D+, D− and Vpu(3.3) high impedance; VP, VM driven HIGH; RCV driven LOW; VBUSDET driven LOW; Vreg(3.3) pulled-down [1] [2] High impedance or driven LOW. Vreg(3.3) may not be operational. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 6 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver 8. Electrostatic discharge (ESD) 8.1 ESD protection The pins that are connected to the USB connector (D+, D−, VCC(5.0) and GND) have a minimum of ±12 kV ESD protection. The ±12 kV measurement is limited by the test equipment. Capacitors of 4.7 µF connected from Vreg(3.3) to GND and VCC(5.0) to GND are required to achieve this ±12 kV ESD protection (see Figure 3). The ISP1104 can withstand ±12 kV using the Human Body Model and ±5 kV using the Contact Discharge Method as specified in IEC 61000-4-2. R C 1 MΩ charge current limit resistor RD 1500 Ω discharge resistance DEVICE UNDER TEST VCC(5.0) A Vreg(3.3) HIGH VOLTAGE DC SOURCE CS 100 pF storage capacitor B 4.7 µF 4.7 µF GND 004aaa145 Fig 3. Human Body ESD test model. 8.2 ESD test conditions A detailed report on test set-up and results is available on request. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 7 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver 9. Limiting values Table 9: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC(5.0) Min Max Unit supply voltage −0.5 +6.0 V VCC(I/O) I/O supply voltage −0.5 +4.6 V VI DC input voltage −0.5 VCC(I/O) + 0.5 V Ilu latch-up current - 100 mA −12000 +12000 V Vesd electrostatic discharge voltage Tstg storage temperature Conditions VI = −1.8 V to +5.4 V [1][2] on pins D+, D−, VCC(5.0) and GND; ILI < 1 µA on other pins; ILI < 1 µA [1] [2] −2000 +2000 V −40 +125 °C Testing equipment limits measurement to only ±12 kV. Capacitors needed on VCC(5.0) and Vreg(3.3) (see Section 8). Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model). 10. Recommended operating conditions Table 10: Recommended operating conditions Symbol Parameter VCC(5.0) Min Typ Max Unit supply voltage 4.0 5.0 5.5 V VCC(I/O) I/O supply voltage 1.65 - 3.6 V 0 - VCC(I/O) V 0 - 3.6 V −40 - +85 °C VI input voltage VI(AI/O) input voltage on AI/O pins Tamb ambient temperature Conditions pins D+ and D− 11. Static characteristics Table 11: Static characteristics: supply pins VCC(5.0) = 4.0 V to 5.5 V; VCC(I/O) = 1.65 V to 3.6 V; VGND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions [1][2] Min Typ Max Unit 3.0 3.3 3.6 V Vreg(3.3) regulated supply voltage output internal regulator option; Iload ≤ 300 µA ICC operating supply current transmitting and receiving at 12 Mbit/s; CL = 50 pF on pins D+ and D− [3] - 4 8 mA ICC(I/O) operating I/O supply current transmitting and receiving at 12 Mbit/s [3] - 1 2 mA ICC(idle) supply current during full-speed idle and SE0 idle: VD+ > 2.7 V, VD− < 0.3 V; SE0: VD+ < 0.3 V, VD− < 0.3 V [4] - - 500 µA ICC(I/O)(static) static I/O supply current idle, SE0 or suspend ICC(susp) ICC-I/O(dis) suspend supply current disable current from VCC to VCC(I/O) - - 20 µA SUSPND = H [4] - - 100 µA VCC(I/O) not connected [4] - - 100 µA - - 20 µA ICC(I/O)(sharing) sharing mode I/O supply current VCC(5.0) not connected © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 8 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver Table 11: Static characteristics: supply pins…continued VCC(5.0) = 4.0 V to 5.5 V; VCC(I/O) = 1.65 V to 3.6 V; VGND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit IDx(sharing) sharing mode load current on pins D+ and D− VCC(5.0) not connected; SOFTCON = L; VDx = 3.6 V - - 10 µA VCC(5.0)th supply voltage detection threshold 1.65 V ≤ VCC(I/O) ≤ 3.6 V supply lost - - 3.6 V supply present 4.1 - - V - 70 - mV supply lost - - 0.5 V supply present 1.4 - - V - 0.45 - V VCC(5.0)hys supply voltage detection hysteresis VCC(I/O) = 1.8 V VCC(I/O)th I/O supply voltage detection threshold Vreg(3.3) = 2.7 V to 3.6 V VCC(I/O)hys [1] [2] [3] [4] I/O supply voltage detection hysteresis Vreg(3.3) = 3.3 V Iload includes the pull-up resistor current via pin Vpu(3.3). The minimum voltage is 2.7 V in the suspend mode. Characterized only, not tested in production. Excluding any load current and Vpu(3.3) or Vsw source current to the 1.5 kΩ and 15 kΩ pull-up and pull-down resistors (200 µA typ.). Table 12: Static characteristics: digital pins VCC(I/O) = 1.65 V to 3.6 V; VGND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VCC(I/O) = 1.65 V to 3.6 V Input levels VIL LOW-level input voltage - - 0.3VCC(I/O) V VIH HIGH-level input voltage 0.6VCC(I/O) - - V IOL = 100 µA - - 0.15 V IOL = 2 mA - - 0.4 V Output levels VOL VOH LOW-level output voltage HIGH-level output voltage IOH = 100 µA VCC(I/O) − 0.15 - - V IOH = 2 mA VCC(I/O) − 0.4 - - V −1 - +1 µA - - 10 pF Leakage current ILI [1] input leakage current Capacitance CIN input capacitance pin to GND Example 1: VCC(I/O) = 1.8 V ± 0.15 V Input levels VIL LOW-level input voltage - - 0.5 V VIH HIGH-level input voltage 1.2 - - V IOL = 100 µA - - 0.15 V IOL = 2 mA - - 0.4 V Output levels VOL LOW-level output voltage © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 9 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver Table 12: Static characteristics: digital pins…continued VCC(I/O) = 1.65 V to 3.6 V; VGND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VOH HIGH-level output voltage IOH = 100 µA 1.5 - - V IOH = 2 mA 1.25 - - V Example 2: VCC(I/O) = 2.5 V ± 0.2 V Input levels VIL LOW-level input voltage - - 0.7 V VIH HIGH-level input voltage 1.7 - - V Output levels LOW-level output voltage VOL VOH HIGH-level output voltage IOL = 100 µA - - 0.15 V IOL = 2 mA - - 0.4 V IOH = 100 µA 2.15 - - V IOH = 2 mA 1.9 - - V Example 3: VCC(I/O) = 3.3 V ± 0.3 V Input levels VIL LOW-level input voltage - - 0.9 V VIH HIGH-level input voltage 2.15 - - V IOL = 100 µA - - 0.15 V IOL = 2 mA - - 0.4 V IOH = 100 µA 2.85 - - V IOH = 2 mA 2.6 - - V Output levels LOW-level output voltage VOL VOH [1] HIGH-level output voltage If VCC(I/O) ≥ Vreg(3.3), then the leakage current will be higher than the specified value. Table 13: Static characteristics: analog I/O pins D+ and D− VCC(5.0) = 4.0 V to 5.5 V; VGND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Input levels Differential receiver VDI differential input sensitivity |VI(D+) − VI(D−)| 0.2 - - V VCM differential common mode voltage includes VDI range 0.8 - 2.5 V Single-ended receiver VIL LOW-level input voltage - - 0.8 V VIH HIGH-level input voltage 2.0 - - V Vhys hysteresis voltage 0.4 - 0.7 V - - 0.3 V 2.8 - 3.6 V −1 - +1 µA Output levels VOL LOW-level output voltage RL = 1.5 kΩ to +3.6 V VOH HIGH-level output voltage RL = 15 kΩ to GND [1] Leakage current ILZ OFF-state leakage current © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 10 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver Table 13: Static characteristics: analog I/O pins D+ and D−…continued VCC(5.0) = 4.0 V to 5.5 V; VGND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit transceiver capacitance pin to GND - - 20 pF ZDRV driver output impedance steady-state drive 34 39 44 Ω ZINP input impedance 10 - - MΩ RSW internal switch resistance at pin Vpu(3.3) - - 10 Ω 3.0 - 3.6 V Capacitance CIN Resistance [2] Termination VTERM [1] [2] [3] [4] [3][4] termination voltage for upstream port pull-up (Rpu) VOH(min) = Vreg(3.3) − 0.2 V. Includes external resistors of 33 Ω ±1 % on both pins D+ and D−. This voltage is available at pins Vreg(3.3) and Vpu(3.3). The minimum voltage is 2.7 V in the suspend mode. 12. Dynamic characteristics Table 14: Dynamic characteristics: analog I/O pins D+ and D− VCC(5.0) = 4.0 V to 5.5 V; VCC(I/O) = 1.65 V to 3.6 V; VGND = 0 V; Tamb = −40 °C to +85 °C; see Figure 8; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Driver characteristics tFR rise time CL = 50 pF to 125 pF; 10 % to 90 % of |VOH − VOL|; see Figure 4 4 - 20 ns tFF fall time CL = 50 pF to 125 pF; 90 % to 10 % of |VOH − VOL|; see Figure 4 4 - 20 ns FRFM differential rise/fall time matching (tFR/tFF) excluding the first transition from idle state 90 - 111.1 % VCRS output signal crossover voltage excluding the first transition from idle state; see Figure 5 1.3 - 2.0 V tPLH(drv) driver propagation delay (VPO/VO, VMO/FSE0 to D+, D−) LOW-to-HIGH; see Figure 5 - - 18 ns tPHL(drv) driver propagation delay (VPO/VO, VMO/FSE0 to D+, D−) HIGH-to-LOW; see Figure 5 - - 18 ns tPHZ driver disable delay (OE to D+, D−) HIGH-to-OFF; see Figure 6 - - 15 ns tPLZ driver disable delay (OE to D+, D−) LOW-to-OFF; see Figure 6 - - 15 ns [1] Driver timing © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 11 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver Table 14: Dynamic characteristics: analog I/O pins D+ and D−…continued VCC(5.0) = 4.0 V to 5.5 V; VCC(I/O) = 1.65 V to 3.6 V; VGND = 0 V; Tamb = −40 °C to +85 °C; see Figure 8; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit tPZH driver enable delay (OE to D+, D−) OFF-to-HIGH; see Figure 6 - - 15 ns tPZL driver enable delay (OE to D+, D−) OFF-to-LOW; see Figure 6 - - 15 ns Receiver timings Differential receiver tPLH(rcv) propagation delay (D+, D− to RCV) LOW-to-HIGH; see Figure 7 - - 15 ns tPHL(rcv) propagation delay (D+, D− to RCV) HIGH-to-LOW; see Figure 7 - - 15 ns Single-ended receiver tPLH(se) propagation delay (D+, D− to VP, VM) LOW-to-HIGH; see Figure 7 - - 18 ns tPHL(se) propagation delay (D+, D− to VP, VM) HIGH-to-LOW; see Figure 7 - - 18 ns [1] Characterized only, not tested. Limits guaranteed by design. 1.65 V logic input t FR, t LR t FF, t LF 0V t PLH(drv) VOH 90 % 90 % t PHL(drv) VOH differential data lines 10 % VCRS VCRS 10 % VOL MGS963 Fig 4. Rise and fall times. VOL MGS964 Fig 5. Timing of VPO/VO and VMO/FSE0 to D+ and D−. 2.0 V 1.65 V logic input 0.9 V 0.9 V differential data lines 0.9 V 0.9 V VOH t PLH(rcv) t PLH(se) t PHZ t PLZ t PZH t PZL VOL t PHL(rcv) t PHL(se) VOH VOH −0.3 V logic output VCRS VOL +0.3 V Fig 6. Timing of OE to D+ and D−. MGS966 0.9 V 0.9 V VOL MGS965 Fig 7. Timing of D+ and D− to RCV, VP and VM. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data VCRS 0.8 V 0V differential data lines VCRS Rev. 02 — 14 October 2003 12 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver 13. Test information Vpu(3.3) test point 1.5 kΩ D.U.T. D+/D− 33 Ω 004aaa037 15 kΩ CL Load capacitance CL = 50 pF (minimum or maximum timing). Fig 8. Load on pins D+ and D−. test point 33 Ω 500 Ω D.U.T. 50 pF V MBL142 V = 0 V for tPZH and tPHZ. V = Vreg(3.3) for tPZL and tPLZ. Fig 9. Load on pins D+ and D− for enable and disable times. test point D.U.T. 25 pF MGS968 Fig 10. Load on pins VM, VP and RCV. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 13 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver 14. Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm b D B SOT639-2 v M C A B w M C A f terminal 1 index area v M C A B w M C b1 E b3 b2 v M C A B w M C v M C A B w M C detail X e1 Dh C e y y1 C 5 9 e e4 Eh e2 1/2 e4 1 13 16 A1 X 1/2 e3 A2 e3 A 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 b b1 b2 b3 D Dh E Eh e e1 e2 e3 e4 f v w y y1 mm 0.8 0.10 0.05 0.7 0.6 0.33 0.27 0.33 0.27 0.38 0.32 0.38 0.32 3.1 2.9 1.45 1.35 3.1 2.9 1.45 1.35 0.5 2.5 2.5 2.45 2.45 0.23 0.17 0.08 0.1 0.05 0.2 OUTLINE VERSION REFERENCES IEC SOT639-2 JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 01-11-13 03-03-12 MO-217 Fig 11. HBCC16 package outline. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 14 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver 15. Packaging The ISP1104W (HBCC16 package) is delivered on a type A carrier tape, see Figure 12. The tape dimensions are given in Table 15. The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not designed for use in a baking process. The cumulative tolerance of 10 successive sprocket holes is ±0.02 mm. The camber must not exceed 1 mm in 100 mm. 4 idth W A0 K0 B0 P1 Type A direction of feed W K0 A0 4 B0 elongated sprocket hole P1 Type B direction of feed MLC338 Fig 12. Carrier tape dimensions. Table 15: Type A carrier tape dimensions for the ISP1104W Dimension Value Unit A0 3.3 mm B0 3.3 mm K0 1.1 mm P1 8.0 mm W 12.0 ± 0.3 mm © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 15 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver 16. Additional soldering information 16.1 (H)BCC packages: footprint The surface material of the terminals on the resin protrusion consists of a 4-layer metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1 µm min.) ensures solderability, the Ni layer (5 µm min.) prevents diffusion, and the Pd layer on top (0.5 µm min.) ensures effective wire bonding. Terminal PCB land Solder resist mask Stencil mask All dimensions in mm Normal 0.05 b1 Solder land 0.05 b1 b Solder resist b Solder stencil 0.05 0.05 Corner 0.05 b2 b2 0.05 For exact dimensions see package outline drawing (SOT639-2) b2 b2 0.05 0.05 Cavity 0.05 0.3 (8×) Stencil print thickness: 0.1 to 0.12 mm Eh 0.1 (4×) Eh 004aaa123 Dh Dh 0.05 Cavity: exposed die pad, either functioning as heatsink or as ground connection; only for HBCC packages. Fig 13. (H)BCC footprint and solder resist mask dimensions. 16.2 (H)BCC packages: reflow soldering profile The conditions for reflow soldering of (H)BCC packages are as follows: • Preheating time: minimum 90 s at T = 145 to 155 °C • Soldering time: minimum 90 s (BCC) or minimum 100 s (HBCC) at T > 183 °C • Peak temperature: – Ambient temperature: Tamb(max) = 260 °C – Device surface temperature: Tcase(max) = 255 °C. © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 16 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver 17. Revision history Table 16: Revision history Rev Date 02 20031014 CPCN Description - Product data (9397 750 11229) Modifications: • • • • • • • • • 01 20020826 - Changed USB 1.1 reference to USB 2.0; also added data transfer rates Section 2: updated Figure 1, Figure 8 and Figure 9: removed the figure note on 33 Ω Table 2: updated the description for pin 8; added pad details Section 7.3 sharing mode: updated the first sentence Table 8: updated Table 9: added a table note Table 11: changed ICC(dis) to ICC-I/O(dis); also, changed the description Table 13: removed ZDRV2, and also the relevant (old) table note 3. Product data (9397 750 09784) © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Product data Rev. 02 — 14 October 2003 17 of 19 ISP1104 Philips Semiconductors Advanced USB transceiver 18. Data sheet status Level Data sheet status[1] Product status[2][3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19. Definitions 20. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Contact information For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: [email protected]. Product data Fax: +31 40 27 24825 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. 9397 750 11229 Rev. 02 — 14 October 2003 18 of 19 Philips Semiconductors ISP1104 Advanced USB transceiver Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 8 8.1 8.2 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 16.5 17 17.1 17.2 18 19 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 5 Function selection. . . . . . . . . . . . . . . . . . . . . . . 5 Operating functions. . . . . . . . . . . . . . . . . . . . . . 5 Power supply configurations . . . . . . . . . . . . . . . 6 Electrostatic discharge (ESD). . . . . . . . . . . . . . 7 ESD protection . . . . . . . . . . . . . . . . . . . . . . . . . 7 ESD test conditions . . . . . . . . . . . . . . . . . . . . . 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Recommended operating conditions. . . . . . . . 8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 8 Dynamic characteristics . . . . . . . . . . . . . . . . . 11 Test information . . . . . . . . . . . . . . . . . . . . . . . . 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17 Package related soldering information . . . . . . 17 Additional soldering information . . . . . . . . . . 19 (H)BCC packages: footprint . . . . . . . . . . . . . . 19 (H)BCC packages: reflow soldering profile. . . 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 21 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 © Koninklijke Philips Electronics N.V. 2003. Printed in The Netherlands All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 14 October 2003 Document order number: 9397 750 11229