INTEGRATED CIRCUITS DATA SHEET PCF21xxC family LCD drivers Product specification Supersedes data of 1995 May 03 File under Integrated Circuits, IC12 1997 Mar 28 Philips Semiconductors Product specification LCD drivers PCF21xxC family CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION 3 QUICK REFERENCE DATA 4 ORDERING INFORMATION 5 BLOCK DIAGRAMS 6 PINNING 6.1 6.2 6.3 PCF2100C PCF2111C PCF2112C 7 FUNCTIONAL DESCRIPTION 7.1 7.2 7.3 7.4 7.5 7.6 7.7 PCF2100C PCF2111C PCF2112C Bus control logic Timing Input circuitry Expansion 8 LIMITING VALUES 9 HANDLING 10 DC CHARACTERISTICS 11 AC CHARACTERISTICS 12 PACKAGE OUTLINES 13 SOLDERING 13.1 13.1.1 13.1.2 13.2 13.2.1 13.2.2 13.2.3 Plastic dual in-line packages By dip or wave Repairing soldered joints Plastic small outline packages By wave By solder paste reflow Repairing soldered joints (by hand-held soldering iron or pulse-heated solder tool) 14 DEFINITIONS 15 LIFE SUPPORT APPLICATIONS 1997 Mar 28 2 Philips Semiconductors Product specification LCD drivers 1 PCF21xxC family FEATURES 2 • Supply voltage 2.25 to 6.0 V GENERAL DESCRIPTION The PCF21xxC family are single-chip, silicon gate CMOS LCD driver circuits. A 3-line bus (CBUS) structure enables serial data transfer with microcontrollers. All inputs are CMOS/NMOS compatible. • Low current consumption • Serial data input • CBUS control The devices have the same function and performance as those of the PCF21xx family, which they supersede. The maximum operating voltage required is reduced from 6.5 to 6.0 V. • One-point built-in oscillator • Stand-alone or expanded system • Power-on reset clear • LCD segments – 40 (PCF2100C) – 64 (PCF2111C) – 32 (PCF2112C) • Multiplex rate – 1 : 2 (PCF2100C) – 1 : 2 (PCF2111C) – 1 : 1 (PCF2112C) • Word length – 22 bits (PCF2100C) – 34 bits (PCF2111C) – 34 bits (PCF2112C). 3 QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT 2.25 − 6.0 V outputs open; CBUS inactive − 20 50 µA outputs open; CBUS inactive; Tamb = 25 °C − 20 30 µA power dissipation per output − − 100 mW Tamb operating ambient temperature −40 − +85 °C Tstg storage temperature −65 − +150 °C VDD supply voltage IDD1 supply current 1 IDD2 supply current 2 PO 4 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME PCF2100CP DIP28 plastic dual in-line package; 28 leads (600 mil) SOT117-1 PCF2100CT SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 PCF2111CP DIP40 plastic dual in-line package; 40 leads (600 mil) SOT129-1 PCF2111CT VSO40 plastic very small outline package; 40 leads SOT158-1 PCF2112CP DIP40 plastic dual in-line package; 40 leads (600 mil) SOT129-1 PCF2112CT VSO40 plastic very small outline package; 40 leads SOT158-1 1997 Mar 28 DESCRIPTION 3 VERSION Philips Semiconductors Product specification LCD drivers 5 PCF21xxC family BLOCK DIAGRAMS handbook, full pagewidth 40-SEGMENT LCD BP1 BP2 26 S1 to S20 25 24 to 5 BACKPLANE AND SEGMENT DRIVERS ANALOG VOLTAGE VDD 2 A 28 DLEN 1 CLB 27 DATA BUS CONTROL B LATCHES AND DRIVER CONTROL OSCILLATOR AND DIVIDER C O 3 OSC R SHIFT REGISTER 680 pF PCF2100C O 1 MΩ 4 V SS MLD286 Fig.1 Block diagram; PCF2100C. handbook, full pagewidth 64-SEGMENT LCD BP1 38 BP2 S1 to S32 37 36 to 5 BACKPLANE AND SEGMENT DRIVERS ANALOG VOLTAGE 2 DLEN CLB DATA A 40 1 39 BUS CONTROL B LATCHES AND DRIVER CONTROL OSCILLATOR AND DIVIDER 3 VDD C O OSC R SHIFT REGISTER PCF2111C 1997 Mar 28 4 O 4 V SS MLD285 Fig.2 Block diagram; PCF2111C. 680 pF 1 MΩ Philips Semiconductors Product specification LCD drivers PCF21xxC family handbook, full pagewidth 32-SEGMENT LCD BP S1 to S32 38 36 to 5 BACKPLANE AND SEGMENT DRIVERS ANALOG VOLTAGE 2 DLEN CLB DATA 40 1 39 BUS CONTROL LATCHES AND DRIVER CONTROL OSCILLATOR AND DIVIDER 3 VDD C O OSC R SHIFT REGISTER PCF2112C 1997 Mar 28 5 O 4 V SS MLD287 Fig.3 Block diagram; PCF2112C. 1.5 nF 1 MΩ Philips Semiconductors Product specification LCD drivers 6 PCF21xxC family PINNING 6.1 PCF2100C SYMBOL PIN DESCRIPTION CLB 1 clock burst input (CBUS) VDD 2 supply voltage OSC 3 oscillator input VSS 4 supply voltage ground S20 5 LCD driver output 20 S19 6 LCD driver output 19 S18 7 LCD driver output 18 S17 8 LCD driver output 17 S16 9 S15 handbook, halfpage CLB 1 28 DLEN V DD 2 27 DATA OSC 3 26 BP1 LCD driver output 16 V SS 4 25 BP2 10 LCD driver output 15 S20 5 24 S1 S14 11 LCD driver output 14 S19 6 23 S2 S13 12 LCD driver output 13 S18 7 S12 13 LCD driver output 12 S11 14 LCD driver output 11 S10 15 LCD driver output 10 S9 16 LCD driver output 9 S8 17 LCD driver output 8 S7 18 S6 22 S3 PCF2100C S17 8 21 S4 S16 9 20 S5 S15 10 19 S6 S14 11 18 S7 LCD driver output 7 S13 12 17 S8 19 LCD driver output 6 S12 13 16 S9 S5 20 LCD driver output 5 S11 14 15 S10 S4 21 LCD driver output 4 S3 22 LCD driver output 3 S2 23 LCD driver output 2 S1 24 LCD driver output 1 BP2 25 backplane driver output 2 BP1 26 backplane driver output 1 DATA 27 data input line (CBUS) DLEN 28 data input line enable (CBUS) 1997 Mar 28 MLD295 Fig.4 Pin configuration; SOT117-1 and SOT136-1. 6 Philips Semiconductors Product specification LCD drivers 6.2 PCF21xxC family PCF2111C SYMBOL PIN DESCRIPTION CLB 1 clock burst input (CBUS) VDD 2 supply voltage OSC 3 oscillator input VSS 4 supply voltage ground S32 5 LCD driver output 32 S31 6 LCD driver output 31 S30 7 LCD driver output 30 S29 8 LCD driver output 29 S28 9 S27 handbook, halfpage CLB 1 40 DLEN LCD driver output 28 V DD 2 39 DATA 10 LCD driver output 27 OSC 3 38 BP1 S26 11 LCD driver output 26 V SS 4 37 BP2 S25 12 LCD driver output 25 S32 5 36 S1 S24 13 LCD driver output 24 S31 6 35 S2 S23 14 LCD driver output 23 S30 7 34 S3 S22 15 LCD driver output 22 S21 16 LCD driver output 21 S29 8 33 S4 S20 17 LCD driver output 20 S28 9 32 S5 S19 18 LCD driver output 19 S27 10 S18 19 LCD driver output 18 S26 11 30 S7 S17 20 LCD driver output 17 S25 12 29 S8 S16 21 LCD driver output 16 S24 13 28 S9 S15 22 LCD driver output 15 S23 14 27 S10 S14 23 LCD driver output 14 S13 24 LCD driver output 13 S22 15 26 S11 S12 25 LCD driver output 12 S21 16 25 S12 S11 26 LCD driver output 11 S20 17 24 S13 S10 27 LCD driver output 10 S19 18 23 S14 S9 28 LCD driver output 9 S18 19 22 S15 S8 29 LCD driver output 8 S17 20 21 S16 S7 30 LCD driver output 7 S6 31 LCD driver output 6 S5 32 LCD driver output 5 S4 33 LCD driver output 4 S3 34 LCD driver output 3 S2 35 LCD driver output 2 S1 36 LCD driver output 1 BP2 37 backplane driver output 2 BP1 38 backplane driver output 1 DATA 39 data input line (CBUS) DLEN 40 data input line enable (CBUS) 31 S6 PCF2111C MLD291 1997 Mar 28 Fig.5 Pin configuration; SOT129-1 and SOT158-1. 7 Philips Semiconductors Product specification LCD drivers 6.3 PCF21xxC family PCF2112C SYMBOL PIN DESCRIPTION CLB 1 clock burst input (CBUS) VDD 2 supply voltage OSC 3 oscillator input VSS 4 supply voltage ground S32 5 LCD driver output 32 S31 6 LCD driver output 31 S30 7 LCD driver output 30 S29 8 LCD driver output 29 S28 9 S27 handbook, halfpage CLB 1 40 DLEN LCD driver output 28 V DD 2 39 DATA 10 LCD driver output 27 OSC 3 38 BP S26 11 LCD driver output 26 V SS 4 37 n.c. S25 12 LCD driver output 25 S32 5 36 S1 S24 13 LCD driver output 24 S31 6 35 S2 S23 14 LCD driver output 23 S30 7 34 S3 S22 15 LCD driver output 22 S21 16 LCD driver output 21 S29 8 33 S4 S20 17 LCD driver output 20 S28 9 32 S5 S19 18 LCD driver output 19 S27 10 S18 19 LCD driver output 18 S26 11 30 S7 S17 20 LCD driver output 17 S25 12 29 S8 S16 21 LCD driver output 16 S24 13 28 S9 S15 22 LCD driver output 15 S23 14 27 S10 S14 23 LCD driver output 14 S13 24 LCD driver output 13 S22 15 26 S11 S12 25 LCD driver output 12 S21 16 25 S12 S11 26 LCD driver output 11 S20 17 24 S13 S10 27 LCD driver output 10 S19 18 23 S14 S9 28 LCD driver output 9 S18 19 22 S15 S8 29 LCD driver output 8 S17 20 21 S16 S7 30 LCD driver output 7 S6 31 LCD driver output 6 S5 32 LCD driver output 5 S4 33 LCD driver output 4 S3 34 LCD driver output 3 S2 35 LCD driver output 2 S1 36 LCD driver output 1 n.c. 37 not connected BP 38 backplane driver output DATA 39 data input line (CBUS) DLEN 40 data input line enable (CBUS) 31 S6 PCF2112C MLD292 1997 Mar 28 Fig.6 Pin configuration; SOT129-1 and SOT158-1. 8 Philips Semiconductors Product specification LCD drivers 7 PCF21xxC family FUNCTIONAL DESCRIPTION 7.3 An LCD segment or LED output is activated when the corresponding DATA bit is HIGH. 7.1 When DATA bit 33 is HIGH, the latches are loaded. CLB pulse 35 transfers data from the shift register to the selected latches. PCF2100C 7.4 When DATA bit 21 is HIGH, the A-latches (BP1) are loaded. With DATA bit 21 LOW, the B-latches (BP2) are loaded. CLB pulse 23 transfers data from the shift register to the selected latches. 7.2 PCF2112C Bus control logic The following tests are carried out by the bus control logic: 1. Test on leading zero 2. Test on number of DATA bits 3. Test of disturbed DLEN and DATA signals during transmission. PCF2111C When DATA bit 33 is HIGH, the A-latches (BP1) are loaded. With DATA bit 33 LOW, the B-latches (BP2) are loaded. CLB pulse 35 transfers data from the shift register to the selected latches. If one of the test conditions is not fulfilled, no action follows the load condition (load pulse with DLEN LOW) and the driver is ready to receive new data. handbook, full pagewidth DLEN CLB 1 2 3 4 5 6 7 8 32 20 33 21 test leading zero 34 22 35 23 PCF2111C and PCF2112C PCF2100C load pulse DATA bit number 0 output 1 S1 2 S2 3 S3 4 S4 5 S5 6 S6 7 S7 31 S31 32 S32 33 PCF2111C and PCF2112C 1 S1 2 S2 3 S3 4 S4 5 S5 6 S6 7 S7 19 S19 20 S20 21 PCF2100C leading zero load bit Fig.7 CBUS data format. 1997 Mar 28 9 MLD296 Philips Semiconductors Product specification LCD drivers 7.5 PCF21xxC family Timing OFF / OFF ON / OFF OFF / ON ON / ON VDD 0.5 (VDD VSS ) BP1 VSS ) BP2 VSS VDD 0.5 (VDD VSS VDD SX VSS VDD VSS 0.5 (VDD VSS ) 0 0.5 (VDD (VDD VSS ) VSS ) BP1 SX BP2 SX VDD VSS 0.5 (VDD VSS ) 0 0.5 (VDD (VDD VSS ) VSS ) 1 f LCD Fig.8 Timing diagram for PCF2100C and PCF2111C. handbook, halfpage OFF ON VDD BP VSS VDD Segment X (SX) VSS VDD VSS 0 (VDD BP VSS ) 1 f LCD Fig.9 Timing diagram for PCF2112C. 1997 Mar 28 SX 10 MLD299 MLD294 Philips Semiconductors Product specification LCD drivers 7.6 PCF21xxC family Input circuitry BUS DRIVER handbook, halfpage PCF21XXC VDD2 VDD R 100 kΩ VSS VSS MLD284 VSS line is common. In systems where it is expected that VDD2 > VDD1 + 0.5 V, a resistor should be inserted to reduce the current flowing through the input protection. Maximum input current ≤40 µA. Fig.10 Input circuitry. 7.7 Expansion handbook, full pagewidth LCD BP1 BP2 S1 to S32 BP1 BP2 S1 to S32 BP1 BP2 S1 to S32 VDD DLEN CLB DLEN PCF2111C DATA MASTER OSC CLB VSS DLEN PCF2111C DATA OSC CLB VSS SLAVE1 DATA CLB DLEN1 DLEN2 DLEN3 PCF2111C DATA OSC VSS SLAVE1 MLD293 By connecting OSC to VSS the BP pins become inputs and generate signals synchronized to the single oscillator frequency, thus allowing expansion of several members of the PCF21xxC family up to the BP drive capability of the master. The PCF2112C can only function as a master for other PCF2112Cs. Fig.11 Expansion possibility (using PCF2111C). 1997 Mar 28 11 Philips Semiconductors Product specification LCD drivers PCF21xxC family 8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDD supply voltage −0.5 VI input voltage DLEN, CLB, DATA and OSC VSS − 0.5 VDD + 0.5 V VO output voltage BP1, BP2 and S1 to S32 VSS − 0.5 VDD + 0.5 V +8.0 V IDD, ISS supply current −50 +50 mA II DC input current −20 +20 mA IO DC output current −25 +25 mA Ptot total power dissipation per package − 500 mW PO power dissipation per output − 100 mW Tstg storage temperature −65 +150 °C note 1 Note 1. Derate by 7.7 mW/K when Tamb > 60 °C. 9 HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. See “Handling MOS devices”. ESD in accordance with “MIL STD 883C, Method 3015”. 1997 Mar 28 12 Philips Semiconductors Product specification LCD drivers PCF21xxC family 10 DC CHARACTERISTICS VDD = 2.25 to 6.0 V; VSS = 0 V; Tamb = −40 to +80 °C; RO = 1 MΩ; CO = 680 pF; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VDD supply voltage IDD supply current VPOR power-on reset voltage level 2.25 − 6.0 V note 1; see Fig.13 − 20 50 µA note 1; Tamb = 25 °C; see Fig.13 − 20 30 µA note 2 − 1.0 1.6 V − − 0.8 V Inputs CLB, DATA and DLEN VIL LOW level input voltage VIH HIGH level input voltage 2.0 − − V ILI input leakage current VI = VSS or VDD − − ±1 µA Ci input capacitance note 3 − − 10 pF oscillator start-up current VI = VSS 0.5 1.2 5.0 µA Input OSC Iosc LCD outputs VBP DC voltage of backplane drivers − ±20 − mV ZO(BP) backplane driver output impedance note 4; VDD = 5 V − 0.5 5.0 kΩ ZO(S) segment driver output impedance note 4; VDD = 5 V − 1 7 kΩ Notes 1. Outputs open; CBUS inactive. 2. Resets all logic, when VDD < VPOR. 3. Periodically sampled (not 100% tested). 4. Outputs measured one at a time. 1997 Mar 28 13 Philips Semiconductors Product specification LCD drivers PCF21xxC family 11 AC CHARACTERISTICS VDD = 2.25 to 6.0 V; VSS = 0 V; Tamb = −40 to +80 °C; RO = 1 MΩ; CO = 680 pF; all timing values are referenced to VIH and VIL levels with an input voltage swing of VSS to VDD; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Inputs CLB, DATA and DLEN (see Fig.12) tSUDA data set-up time 3 − − µs tHDDA data hold time 3 − − µs tSUEN enable set-up time 1 − − µs tSUDI disable set-up time 2 − − µs tSULD load pulse set-up time 2.5 − − µs tBUSY busy time 3 − − µs tWH CLB HIGH time 1 − − µs tWL CLB LOW time 5 − − µs tCLB CLB cycle time 10 − − µs tr rise time − − 10 µs tf fall time − − 10 µs LCD timing (see Figs. 12, 14, 15, 16 and 17) fLCD LCD frame frequency PCF2100C, PCF2111C PCF2112C 60 75 100 Hz CO = 1.5 nF 30 35 50 Hz tBS transfer time with test loads VDD = 5 V − 20 100 µs tPLCD driver delay time with test loads VDD = 5 V − 20 100 µs 1997 Mar 28 14 1997 Mar 28 t WL V IH min t WH SUDA leading zero t t SUEN tr 1 V IL max V IL max t CLB tf IL max t WL t HDDA V V IH min t SUDA tr 2 (1) Load pulse 23 for PCF2100C (see Fig.7). (2) Load pulse 35 for PCF2111C and PCF2112C (see Fig.7). DATA CLB DLEN V IH min data S1 tf t HDDA IL max load bit 22 34 15 BP (PCF2112C) VDD 2 SX t SULD V IL max IH min BP1, BP2 (except PCF 2112C) t SUDI V disable t BS load pulse 23 (1) 35 (2) t PCLD t BUSY MLD297 (V DD = 5 V) (V DD = 5 V) (V DD = 5 V) 0.5 V 0.5 V 0.5 V 0.5 V 0.5 V 0.5 V LCD drivers Fig.12 CBUS timing. V V IH min handbook, full pagewidth enable Philips Semiconductors Product specification PCF21xxC family Philips Semiconductors Product specification LCD drivers PCF21xxC family MLD283 20 MLD282 80 handbook, halfpage handbook, halfpage f LCD (1) I DD (Hz) (2) (µA) 16 78 (3) (1) (2) (3) typ typ 76 74 12 72 8 70 0 2 4 6 V DD (V) 8 0 2 4 6 VDD (V) 8 (1) Tamb = −40 °c. (2) Tamb = +85 °c. (3) Tamb = +25 °c. (1) Tamb = −40 °c. (2) Tamb = +25 °c. (3) Tamb = +85 °c. Fig.13 Supply current as a function of supply voltage. Fig.14 Display frequency as a function of supply voltage; CO = 680 pF (except PCF2112C). MLD289 37 MLD281 10 3 handbook, halfpage handbook, halfpage f LCD (Hz) f (1) 36 LCD (Hz) (2) typ (2) typ (1) 102 35 (3) 34 33 0 2 4 10 10 1 6 V 8 DD (V) 1 C O (nF) 10 (1) Tamb = −40 °c. (2) Tamb = +25 °c. (3) Tamb = +85 °c. (1) RO = 1 MΩ. (2) RO = 100 kΩ. Fig.15 Display frequency as a function of supply voltage; CO = 1.5 nF (only PCF2112C). Fig.16 Display frequency as a function of RO and CO; Tamb = 25 °C; VDD = 5 V. 1997 Mar 28 16 Philips Semiconductors Product specification LCD drivers PCF21xxC family MLD288 2 handbook, halfpage R O (kΩ) handbook, halfpage BP (PCF2112C), BP1, BP2 1.5 I L = 25 µA typ 1 S1 to S32 (1) (2) I L = 15 µA (3) RS (1) (2) R BP (3) 0.5 MLD298 0 0 2 4 6 V 8 DD (V) (1) Tamb = +85 °c. (2) Tamb = +25 °c. (3) Tamb = −40 °c. Fig.18 Output resistance of backplane and segments. Fig.17 Test loads. MLD290 18 handbook, halfpage I OL (mA) (1) 16 (2) typ 14 (3) 12 10 8 0 2 4 6 VDD (V) 8 (1) Tamb = −40 °c. (2) Tamb = +25 °c. (3) Tamb = +85 °c. Fig.19 LOW level output current as a function of supply voltage (only PCF2112C). 1997 Mar 28 17 Philips Semiconductors Product specification LCD drivers PCF21xxC family 12 PACKAGE OUTLINES seating plane handbook, full pagewidthdual in-line package; 28 leads (600 mil) DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 5.1 0.51 4.0 1.7 1.3 0.53 0.38 0.32 0.23 36.0 35.0 14.1 13.7 2.54 15.24 3.9 3.4 15.80 15.24 17.15 15.90 0.25 1.7 inches 0.20 0.020 0.16 0.066 0.051 0.020 0.014 0.013 0.009 1.41 1.34 0.56 0.54 0.10 0.60 0.15 0.13 0.62 0.60 0.68 0.63 0.01 0.067 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT117-1 051G05 MO-015AH 1997 Mar 28 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 18 Philips Semiconductors Product specification LCD drivers PCF21xxC family seating plane DIP40: plastic dual in-line package; 40 leads (600 mil) SOT129-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 21 40 pin 1 index E 1 20 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c mm 4.7 0.51 4.0 1.70 1.14 0.53 0.38 0.36 0.23 52.50 51.50 inches 0.19 0.020 0.16 0.067 0.045 0.021 0.015 0.014 0.009 2.067 2.028 D (1) e e1 L ME MH w Z (1) max. 14.1 13.7 2.54 15.24 3.60 3.05 15.80 15.24 17.42 15.90 0.254 2.25 0.56 0.54 0.10 0.60 0.14 0.12 0.62 0.60 0.69 0.63 0.01 0.089 E (1) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT129-1 051G08 MO-015AJ 1997 Mar 28 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 19 Philips Semiconductors Product specification LCD drivers PCF21xxC family SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 15 28 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 14 e bp 0 detail X w M 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.050 0.42 0.39 0.055 0.043 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013AE 1997 Mar 28 EIAJ EUROPEAN PROJECTION ISSUE DATE 91-08-13 95-01-24 20 o 8 0o Philips Semiconductors Product specification LCD drivers PCF21xxC family VSO40: plastic very small outline package; 40 leads SOT158-1 D E A X c y HE v M A Z 40 21 Q A2 A (A 3) A1 θ pin 1 index Lp L 1 detail X 20 w M bp e 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z (1) mm 2.70 0.3 0.1 2.45 2.25 0.25 0.42 0.30 0.22 0.14 15.6 15.2 7.6 7.5 0.762 12.3 11.8 2.25 1.7 1.5 1.15 1.05 0.2 0.1 0.1 0.6 0.3 0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60 0.30 0.29 0.03 0.48 0.46 0.067 0.089 0.059 inches 0.11 0.045 0.024 0.008 0.004 0.004 0.041 0.012 θ Notes 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-01-24 SOT158-1 1997 Mar 28 EUROPEAN PROJECTION 21 o 7 0o Philips Semiconductors Product specification LCD drivers PCF21xxC family Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. 13 SOLDERING 13.1 Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 13.3.2 This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). 13.2 13.2.1 Wave soldering techniques can be used for all SO and VSO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 13.2.2 Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. 13.3 13.3.1 13.3.3 REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO and VSO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO and VSO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 1997 Mar 28 WAVE SOLDERING 22 Philips Semiconductors Product specification LCD drivers PCF21xxC family 14 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Short-form specification The data in this specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 15 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Mar 28 23 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 417067/1200/02/pp24 Date of release: 1997 Mar 28 Document order number: 9397 750 01649