INTEGRATED CIRCUITS DATA SHEET TEA6101/T Antenna diversity circuit Objective specification File under Integrated circuits, IC01 May 1992 Philips Semiconductors Objective specification Antenna diversity circuit TEA6101/T FEATURES GENERAL DESCRIPTION • Ability to switch between up to four antennae Intended for multi-antenna FM car radio reception (antenna diversity system), the TEA6101/T selects the most favourable signal from one of up to four antennae. Founded upon audible signal disturbance the criteria are derived from two signals: high frequency components (e.g. spikes due to noise and multipath reception) and variations in signal level as a result of multipath reception or fluctuations in field strength. • Switching signal derived from two signals: the audio and the level signals • Floating switching threshold adjusts switching rate to prevailing circumstances: – increasing threshold due to excessive noise – increasing threshold due to numerous level variations • Memory for the most favourable antenna signal to overcome unnecessary switching • Signal-dependent `soft` muting circuit • Mode selection to the first antenna receiving an AM signal whilst the diversity system is reset. APPLICATIONS • Car radio receivers • Mobile radio communications equipment QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VP positive supply voltage − 8.5 − V IP positive supply current − 14 − mA VI(p-p) audio input voltage (peak-to-peak value) − − 3 V Ios antenna switch output current (source/sink) − − 7 mA VL −3 dB audio attenuation (soft mute) − 1.45 − V Tamb operating ambient temperature range −30 − +85 °C ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER PINS PIN POSITION MATERIAL CODE TEA6101 18 DIL plastic SOT102(1) TEA6101T 20 SO plastic SOT163A(2) Notes 1. SOT102-1; 1996 September 10. 2. SOT163-1; 1996 September 10. May 1992 2 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 4 3.6 V 20 kΩ audio input 3 Vref not connected modulus output 8 11 noise averaging 10 reference voltage 0.1 µF 13 9 ground 1 20 ADDER VU HIGH - PASS FILTER VI MEMORY 12 kΩ V (min) R1 STABILIZER 1.5 kΩ LOAD Philips Semiconductors Antenna diversity circuit May 1992 supply audio output 0.47 µF offset voltage delay soft mute 7 VOLTAGE REFERENCE ADDER COMPARATOR OFFSET LOW - PASS FILTER MUTE ADDER 33 nF ADDER 3 level input direct 5 3.3 kΩ 6 19 18 4 - STAGE JOHNSON COUNTER 17 16 & ADDER 1 µF & 3.3 nF MONOSTABLE MULTIVIBRATOR & & 20 kΩ 1 offset ADDER offset voltage complete stop reset MODE SELECT TIMING 100 Ω VOLTAGE REFERENCE 33 kΩ R3 TEA6101T & 1.5 kΩ reset R2 12 14 1 µF level averaging 15 47 nF test pin 2 MBA543 - 1 control Objective specification Fig.1 Block diagram. memory timing TEA6101/T handbook, full pagewidth level input via capacitor to antenna switch Philips Semiconductors Objective specification Antenna diversity circuit TEA6101/T PINNING The pin numbers given in parenthesis refer to the TEA6101 SYMBOL PIN DESCRIPTION VP 1 (1) positive supply CTRL 2 (2) control input AUDIN 3 (3) audio input AUDOUT 4 (4) audio output LID 5 (5) level input direct LIC 6 (6) DSM 7 MODOUT handbook, halfpage VP 1 20 GND CTRL 2 19 OUT1 AUDIN 3 18 OUT2 AUDOUT 4 17 OUT3 level input via capacitor LID 5 16 OUT4 (7) delay soft mute LIC 6 15 MT 8 (8) modulus output DSM 7 14 LEAV Vref 9 (9) reference voltage MODOUT 8 13 NOAV n.c. 10 − not connected TEST not connected VREF 12 11 − 9 n.c. 12 (10) test pin n.c. 10 11 n.c. TEST NOAV 13 (11) noise averaging LEAV 14 (12) level averaging MT 15 (13) memory timing OUT4 16 (14) output 4 OUT3 17 (15) output 3 OUT2 18 (16) output 2 OUT1 19 (17) output 1 GND 20 (18) ground TEA6101T MBA542 - 1 Fig.2 Pin configuration (TEA6101T). handbook, halfpage VP 1 18 GND CTRL 2 17 OUT1 AUDIN 3 16 OUT2 AUDOUT 4 15 OUT3 LID 5 LIC 6 13 MT DSM 7 12 LEAV MODOUT 8 11 NOAV V REF 9 10 TEST TEA6101 14 OUT4 MBA541 - 1 Fig.3 Pin configuration (TEA6101). May 1992 4 Philips Semiconductors Objective specification Antenna diversity circuit TEA6101/T This will result in more frequent switching to an alternative antenna whilst the result of the switching operation will be less audible. FUNCTIONAL DESCRIPTION Various forms of disturbance can affect signal reception in car radio receivers: • ignition interference produces spikes on the audio signal. Switching to another antenna will be ineffective. Strong ignition interference, however, will modulate the antenna field strength. In this instance another antenna possessing a directional pattern will suffer less disturbance and switching would be appropriate. Detection of voltage level variation A 1 µF input capacitor and 20 kΩ resistor remove the absolute level voltage to leave only variations to be detected. The level comparator output is HIGH when the variations in level voltage are greater than the offset. Similarly to the audio comparator; the feedback diode, resistor R2, the 1 µF capacitor and the 33 kΩ resistor cause the threshold level to float. During periods of high activity the comparator thus switches only on the largest variations. • variation of antenna field strength due to travelling through a zone of variable signal strength will result in a variation in the signal level. Greater noise will be apparent on the audio signal whilst the IF limiter is not limiting. Switching to an alternative antenna input would increase the signal strength. Switching to an alternative antenna • multipath reception occurs when a signal reaches the antenna from two or more directions. Often the signals will be of different phase. In certain circumstances the sum of the reflected signals results in zero and a large spike will be evident on the audio signal. It will then be necessary to switch to an alternative antenna from which the sum of the received signals will be different. When both the level and the audio comparator outputs are HIGH, another output of the Johnson counter will be selected. Since switching to an alternative antenna would cause a disturbance of the audio and level signals the monostable multivibrator will prohibit the counter from selecting another antenna input for 21 µs. The criteria for an antenna diversity system are high frequency components (spikes and noise) on the audio signal in combination with variations in signal level. Memory and timing Approximately similar qualities of signal originating from different antennae could result in unnecessary antenna switching. This is prevented by appointing a priority antenna. The selection of an antenna without priority results in the audio offset being decreased by 1.2 V such that the audio comparator will have a HIGH output voltage. During the period of memory timing the offset increases towards the normal offset value. Should level alterations occur during this period another antenna will be selected. If, however, the memory is timed-out without the occurrence of signal variation, priority will be appointed to the selected antenna. Thus a priority antenna will be selected for the majority of the time during reception of almost all similarly weak antenna signals. Detection of spikes on the audio signal A rectifier, high pass filter, low pass filter and a comparator are used to detect spikes and noise on the audio signal (see Fig.1). The negative spikes are detected by the rectifier whilst a high pass filter removes the audio signal to leave the high frequency signal components at the negative input to the comparator. The signal at the positive input to the comparator consists of an offset together with an audio signal attenuated by the low pass filter. If the amplitude of the spikes exceed that of the attenuated audio plus offset, the output of the comparator is HIGH. When the switching rate of the comparator is HIGH, feedback increases the offset via the diode, the resistor R1, and the 100 nF capacitor. The offset is decreased by the 12 kΩ resistor and the 100 nF capacitor (pin 11 or 13). The result is an offset based upon the comparator switching rate, rapid to increase but slow to decrease, therefore permitting only the largest spikes to trigger the comparator (floating threshold). Mute A mute function should not precede the circuit. This function is therefore assumed by the TEA6101. When used in combination with the TEA6100 the 20 kΩ input of the IF IC together with the 6 kΩ output resistor of the TEA6101 cause an attenuation of 3 dB. The mute circuit therefore has 3 dB amplification of level voltages in excess of 2.75 V. Should high noise be apparent on the audio signal, the offset is decreased by means of the rectifier and high pass filter. May 1992 5 Philips Semiconductors Objective specification Antenna diversity circuit TEA6101/T Mode selection Test pin The diversity system is intended for FM reception. To avoid an audible disturbance if it is used with an AM system, the circuit can be reset. In the reset mode antenna 1 (pin 17 (19)) is selected and both comparators are switched off to prevent pulses reaching the output. Although intended for test purposes the test pin can be used to increase the audio offset (resistor from pin 10 (12) to ground) or to change the compensation factor (resistor between pin 8 (8) and 10 (12)). These modifications permit the behaviour of the antenna switch to be adapted to alternative IF amplifier IC's. For FM search tuning the diversity system may be similarly disabled. The selected antenna will again be retained with the comparators being inhibited. LIMITING VALUES In accordance with the absolute maximum system (IEC 134) SYMBOL PARAMETER MIN. MAX. UNIT VP positive supply voltage 0 12 Ptot total power dissipation − see Fig.3 Tamb operating ambient temperature range −30 +85 °C Tstg storage temperature range −55 +150 °C V THERMAL RESISTANCE SYMBOL PARAMETER THERMAL RESISTANCE Rth c-a from crystal to ambient (SOT102) 75 K/W Rth c-a from crystal to ambient (SOT163A) 150 K/W May 1992 6 Philips Semiconductors Objective specification Antenna diversity circuit TEA6101/T DC CHARACTERISTICS Measurements using application circuit (Fig 1) at Tamb = 25 °C and VP = 8.5 V. Voltages with respect to pin 18 (20); pin numbers in parenthesis refer to TEA6101T; all currents positive into the IC unless otherwise specified. SYMBOL PARAMETER VP positive supply voltage IP positive supply current Ptot total power dissipation Vpins voltage at pin: May 1992 CONDITION MIN. 7.5 ISO = 0 mA TYP. 8.5 MAX. 12 UNIT V − 14 − mA − 119 − mW 1 (1) − 8.5 − V 2 (2) − 7.8 − V 3 (3) − 3.6 − V 4 (4) − 5.4 − V 5 (5) − 0 − V 6 (6) − 5.3 − V 7 (7) − 0.6 − V 8 (8) − 5.2 − V 9 (9) − 5.4 − V − (10) − n.c. − − (11) − n.c. − 10 (12) − 5.1 − V 11 (13) − 5.4 − V 12 (14) − 5.3 − V 13 (15) − 0 − V 14 (16) − 0 − V 15 (17) − 0 − V 16 (18) − 0 − V 17 (19) − 7.5 − V 18 (20) − 0 − V 7 Philips Semiconductors Objective specification Antenna diversity circuit TEA6101/T AC CHARACTERISTICS VP = 8.5 V; Tamb = 25 °C; unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Mute SOFT MUTE (VL) − 20 − ZI input impedance (pin 3 (3)) kΩ MR mute range note 1 17 19.3 − V Vaud/VI mute gain VL = 2.75 V − 2.7 − dB VL = 1.45 V −1 0.6 2 dB − 455 − mV − 370 − µA HARD MUTE (VMUTE) Vmute −60 dB output attenuation +Im mute ON sink current Vmute = 1 V, VL = 0 V −Im mute `OFF` source current Vmute = 0 V 3 − − µA THD total harmonic distortion Vi = 200 mV; VL = 2.5 V − 0.09 − % VI(p-p) audio input voltage THD > 10% − 3 − V (peak-to-peak value) (S+N)/N signal-to-noise ratio; measured with dB(A) curve Vaud = 600 mV; 1 kHz; VL = 3 V − 95 − dB Vaud/Vp ripple rejection note 2; 300 Hz; 100 mV; VL = 2.5 V 28 32 − dB Vref output reference voltage − 5.3 − V Voff1 audio comparator offset voltage − +250 − mV Vt = 0 V − −1100 − mV Vt = 3 V − −348 − mV − 56 − mV 16 21 28 µs − 30 − µA Voff1 = Vmin − Vap with priority with no priority Level comparator Vref−Vil voltage for high comparator output t monostable multivibrator time period started with both comparator outputs HIGH Timing/memory −It source current Ct value delay capacitor − − 50 nF Tt timing duration Ct = 47 nF − 6 − ms +It reset current Vt = 3 V − 17.7 − mA Vt change of priority antenna − 3.7 − V Antenna switch outputs −Ios output source current − − 7 mA +Ios output sink current − − 7 mA May 1992 8 Philips Semiconductors Objective specification Antenna diversity circuit SYMBOL VSO TEA6101/T PARAMETER CONDITIONS MIN. TYP. MAX. UNIT selected output voltage VNSO ISO = −10 mA VP−2 V − − V ISO = 0.5 mA VP−1 V − − V ISO = +10 mA − − 0.7 V ISO = 0 mA − − 0.1 V − − 1 V − − 12 µA voltage at first antenna (pin 17 (19)) 4.2 − VP V keep selected antenna voltage 1.6 − 3.5 V not selected output voltage Mode selection ENABLE Vr all functions active −Ir input current Vr = 1 V RESET (ACTIVE AT OPEN INPUT) Vr STOP Vr Notes to the AC characteristics 1. V aud ( aV L = 2.75V ) ----------------------------------------------------V aud ( aV L = 0.1V ) 2. When VP (pin 1 (1)) is filtered with R = 25 Ω and C = 100 µF the ripple rejection becomes 46 dB MBA540 - 1 2.0 handbook, halfpage P tot (W) 1.5 (1) 1.0 (2) 0.5 0 25 0 25 75 125 175 o T amb ( C) (1) SOT102 (2) SOT163A Fig.4 Derating curve. May 1992 9 Philips Semiconductors Objective specification Antenna diversity circuit TEA6101/T PACKAGE OUTLINES DIP18: plastic dual in-line package; 18 leads (300 mil) SOT102-1 ME seating plane D A2 A A1 L c e Z w M b1 (e 1) b b2 MH 10 18 pin 1 index E 1 9 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 1.40 1.14 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 0.85 inches 0.19 0.020 0.15 0.055 0.044 0.021 0.015 0.055 0.044 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.033 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 93-10-14 95-01-23 SOT102-1 May 1992 EUROPEAN PROJECTION 10 Philips Semiconductors Objective specification Antenna diversity circuit TEA6101/T SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E A X c HE y v M A Z 11 20 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 10 e bp detail X w M 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.51 0.49 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT163-1 075E04 MS-013AC May 1992 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 11 Philips Semiconductors Objective specification Antenna diversity circuit TEA6101/T Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. WAVE SOLDERING This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Wave soldering techniques can be used for all SO packages if the following conditions are observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. DIP SOLDERING BY DIPPING OR BY WAVE • The longitudinal axis of the package footprint must be parallel to the solder flow. The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. • The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. REPAIRING SOLDERED JOINTS A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. May 1992 12 Philips Semiconductors Objective specification Antenna diversity circuit TEA6101/T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. May 1992 13