INTEGRATED CIRCUITS DATA SHEET TDA4861 Vertical deflection power amplifier for monitors Product specification Supersedes data of March 1992 File under Integrated Circuits, IC02 1997 Jan 20 Philips Semiconductors Product specification Vertical deflection power amplifier for monitors TDA4861 FEATURES GENERAL DESCRIPTION • Vertical pre-amplifier with differential inputs The TDA4861 is a vertical power amplifier for differential input signals suitable for colour monitor/TV systems with deflection frequencies up to 140 Hz. • Powerless vertical shift • Flyback voltage generation suitable for two operating modes (doubling the supply voltage or external supply for the short flyback time, this achieves a minimum of power dissipation) • Vertical output stage with thermal and SOAR protection • High deflection frequency up to 140 Hz • High linear sawtooth signal amplification • Possibility of guarding the deflection • Voltage stabilizer. QUICK REFERENCE DATA Measurements referenced to substrate (pin 6). SYMBOL PARAMETER MIN. TYP. MAX. UNIT VP1 supply voltage (pin 1) 9 − 30 V VP2 supply voltage (pin 4) 9 − 60 V VP3 flyback supply voltage (pin 8) 9 − 60 V IP1 supply current (pin 1) − − 10 mA IP2 supply quiescent current (pin 4) − 9 − mA VI input voltage (pins 2 and 3) 1.6 − VP1 − 0.5 V I5(p-p) deflection output current (peak-to-peak value; pin 5) − − 2.8 A Tamb operating ambient temperature −20 − +75 °C ORDERING INFORMATION TYPE NUMBER TDA4861 1997 Jan 20 PACKAGE NAME SIL9P DESCRIPTION plastic single in-line power package; 9 leads 2 VERSION SOT131-2 Philips Semiconductors Product specification Vertical deflection power amplifier for monitors TDA4861 BLOCK DIAGRAM handbook, full pagewidth TDA4861 VERTICAL DRIVER THERMAL AND SOAR PROTECTION FLYBACK DRIVER DIFFERENTIAL INPUT AMPLIFIER VERTICAL OUTPUT FLYBACK GENERATOR VOLTAGE STABILIZER 1 2 VP1 3 BAX13 +8.8 V 4 5 6 7 8 VP2 V-OUT SUB FLB VP3 9 PCO 5.6 Ω 470 µF 150 kΩ 270 Ω 1.8 kΩ 1 MΩ 470 µF 0.1 µF 1.8 kΩ from TDA4850 PULSE CIRCUIT yoke R1 1Ω 470 µF VN −8.1 V 4.3 Ω +52 V 10 kΩ RPCO MHA612 V-shift Assumed values: Iyoke = 1.42 A. Ryoke = 4.17 Ω + 7% + ∆R(T) = 6.12 Ω. Lyoke = 5.25 mH. R1 = 1.0 Ω ±1%. Tamb = 65 °C. Tj(max) = 105 °C. Tyoke = 75 °C. Pyoke = 1.2 W. PIC = 1.8 W. Ptot = 3.0 W. tpFLB = typically 250 µs. Attention: the heatsink of the IC must be isolated against ground (it is connected to pin 6). Fig.1 Block diagram and application circuit with flyback supply voltage VP3 from an external source. Deflection frequency range from 50 to 100 Hz. 1997 Jan 20 3 Philips Semiconductors Product specification Vertical deflection power amplifier for monitors TDA4861 PINNING SYMBOL PIN DESCRIPTION VP1 1 supply voltage 1 INP1 2 input 1 of differential input amplifier INP2 3 input 2 of differential input amplifier VP2 4 supply voltage 2 for vertical output stage V-OUT 5 vertical output SUB 6 substrate FLB 7 flyback generator output VP3 8 flyback supply voltage 3 PCO 9 pulse circuit output handbook, halfpage VP1 1 INP1 2 INP2 3 VP2 4 V-OUT 5 TDA4861 SUB 6 FLB 7 VP3 8 PCO 9 MEH360 Fig.2 Pin configuration. FUNCTIONAL DESCRIPTION Vertical output Differential input amplifier The vertical output stage is a quasi-complementary class-B amplifier with a high linearity. The output contains SOAR (short-circuit protection) and thermal protection. The output current on pin 5 is reduced for a short time (to let the temperature decrease to Tj < 150 °C), when the junction temperature (Tj) exceeds 160 °C. The differential sawtooth input signal (coming from a ramp output of the TDA4850 for example) is fed to the input at pins 2 and 3. The non-inverted signal is attached to pin 3. The vertical feedback signal is superimposed on the inverted input signal on pin 2. Vertical shift is applied at the inputs in a power-less way (see Fig.1). Deflection GUARD Pin 9 will go HIGH if the junction temperature goes too high (see Fig.3). A pulse signal with 50% duty cycle is output on pin 9, if the deflection coil is open-circuit. A flyback pulse signal is output at normal conditions. Flyback generator Signals for the flyback generator and the pulse circuit are generated in the flyback driver stage. The flyback output consists of a Darlington transistor and a flyback diode. The flyback generator can operate in two modes: Further watching can be achieved by means of an external GUARD circuit as shown in Fig.4. The 22 µF capacitor is charged during flyback time (V5 > V8) at normal conditions. In the event of failures, the capacitor is discharged and the GUARD output goes HIGH. 1. An external supply voltage is applied for the short flyback time, thus the power dissipation is minimum (see Fig.1). GUARD output level (see Fig.4): 2. The flyback voltage is generated by doubling the supply voltage (see Fig.5). The 100 µF capacitor C2 connected between pins 4 and 7 is charged up to VP1 during scan, using the external diode and the resistor R2. The cathode of the capacitor C2 is connected to the positive rail during flyback. Thus, the flyback voltage is twice the supply voltage. 1997 Jan 20 • LOW for normal conditions • HIGH for deflection coil short-circuit respectively open-circuit • HIGH when there are neither input or output signals. 4 Philips Semiconductors Product specification Vertical deflection power amplifier for monitors TDA4861 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages referenced to substrate (pin 6); unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VP1 supply voltage (pin 1) − 40 V VP2 supply voltage (pin 4) − 60 V VP3 supply voltage (pin 8) − 60 V V2,3,9 voltage on pins 2, 3 and 9 − VP1 V V5,7 voltage on pins 5 and 7 − 60 V I4 current on pin 4 − 1 A I5 (M) output current on pin 5 (peak value) − ±1.5 A I7 (M) flyback current on pin 7 (peak value) − ±1.5 A I9 current on pin 9 − −8 mA Tstg storage temperature −25 +150 °C Tamb operating ambient temperature −20 +75 °C Tj junction temperature note 1 − 168 °C Ves electrostatic handling for all pins note 2 − ±300 V note 1 Notes 1. Internally limited by thermal protection; switching temperature point at 160 ±8 °C. 2. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor. THERMAL CHARACTERISTICS SYMBOL Rth j-mb PARAMETER thermal resistance from junction to mounting base The heatsink can be estimated according to application circuit (see Fig.1): T j(max) – T amb 105 °C – 65 °C R th j-a = R th j-mb + R th mb-h + R th h-a = ---------------------------------- = ----------------------------------------- = 22.2 K/W . 1.8 W P IC(max) A heatsink is needed at Rth j-mb < 5 K/W and Rth mb-h = 0.5 K/W (using silicon grease) with Rth h-a = 22.2 K/W − (5 + 0.5) K/W = 16.7 K/W. 1997 Jan 20 5 VALUE UNIT 5 K/W Philips Semiconductors Product specification Vertical deflection power amplifier for monitors TDA4861 CHARACTERISTICS VP1 = VP2 = 25 V; VN = V6 = 0 V; Tamb = 25 °C; voltages referenced to substrate (pin 6); unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP1 supply voltage 1 (pin 1) 9 25 30 V VP2 supply voltage 2 (pin 4) 9 25 60 V VP3 supply voltage 3 (pin 8) 9 − 60 V IP1 supply current (pin 1) − − 10 mA IP2 quiescent supply current (pin 4) − 9 − mA without input signal Pre-amplifier V2,3 input voltage (pins 2 and 3) I2,3 input quiescent current without input signal 1.6 − VP1 − 0.5 V − 100 − nA Flyback generator V7 output voltage I7(M) flyback output current (maximum value; pin 7) V1-5 threshold voltage to switch flyback tpFLB flyback pulse time upper value; I7 = −1 A − VP3 − 2.2 − V − − ±1.3 A on/off threshold − 1.4 − V see Figs 1 and 3 − 250 − µs − V Vertical output; see Fig.3 V5 output voltage upper value; I5 = −1 A VP2 − 2.3 VP2 − 2 lower value; I5 = 1 A − 1.5 upper value; I5 = −1.4 A − VP2 − 2.3 − V 1.7 − V lower value; I5 = 1.4 A − 1.7 V I5(p-p) vertical output current (peak-to-peak value; pin 5) − − 2.8 A LIN non-linearity of output signal − − 1 % 0.4 − VP1 − 0.4 V Pulse circuit output; see Fig.3 V9 output voltage V9 output voltage for thermal protection active VP1 − 0.4 − − V V1-5 voltage to insert flyback pulse on pin 9 normal condition − − 1.4 V tp9 pulse width deflection open-circuit − 50 − % normal condition − − µs 1997 Jan 20 RPCO = 10 kΩ; see Fig.1 6 tpFLB Philips Semiconductors Product specification Vertical deflection power amplifier for monitors handbook, full pagewidth TDA4861 INP1 input signal on pin 2 t INP2 input signal on pin 3 V-OUT t tpFLB = 250 µs output signal on pin 5 t PCO output signal on pin 9 for normal condition tp9 t PCO 50% output signal on pin 9 for deflection unit open-circuit t PCO output signal on pin 9 for thermal protection active t Fig.3 Vertical timing. 1997 Jan 20 7 MEH361 Philips Semiconductors Product specification Vertical deflection power amplifier for monitors TDA4861 APPLICATION INFORMATION VP3 handbook, full pagewidth 8 VP BAX13 TDA4861 >1 kΩ 2.2 Ω 5 GUARD output HIGH = error 3.3 kΩ BC548 2N5819 22 µF vertical output signal 220 kΩ MEH362 Fig.4 GUARD circuit application on vertical output. handbook, full pagewidth TDA4861 VOLTAGE STABILIZER 1 VERTICAL DRIVER THERMAL AND SOAR PROTECTION FLYBACK DRIVER DIFFERENTIAL INPUT AMPLIFIER VERTICAL OUTPUT FLYBACK GENERATOR 2 3 VP1 4 5 6 7 8 VP2 V-OUT SUB FLB VP3 470 µF PCO 5.6 Ω 150 kΩ 270 Ω 0.1 µF 1.8 kΩ 1.8 kΩ from TDA4850 9 C2 100 µF BAX13 +9 V PULSE CIRCUIT 1 MΩ 5.25 mH yoke R1 1Ω R2 240 Ω 10 kΩ 470 µF VN −7.8 V V-shift Fig.5 Application for flyback voltage generation by doubling the supply voltage. 1997 Jan 20 8 RPCO MEH359 Philips Semiconductors Product specification Vertical deflection power amplifier for monitors TDA4861 VP1 handbook, full pagewidth INP1 INP2 VP2 1 2 3 4 V-OUT SUB 5 6 7 VP3 PCO 8 9 TDA4861 MHA611 Fig.6 Internal circuitry. 1997 Jan 20 9 Philips Semiconductors Product specification Vertical deflection power amplifier for monitors TDA4861 PACKAGE OUTLINE SIL9P: plastic single in-line power package; 9 leads SOT131-2 non-concave Dh x D Eh view B: mounting base side d A2 seating plane B E j A1 b L c 1 9 e Z Q w M bp 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A1 max. A2 b max. bp c D (1) d Dh E (1) e Eh j L Q w x Z (1) mm 2.0 4.6 4.2 1.1 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 2.54 6 3.4 3.1 17.2 16.5 2.1 1.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-03-11 SOT131-2 1997 Jan 20 EUROPEAN PROJECTION 10 Philips Semiconductors Product specification Vertical deflection power amplifier for monitors TDA4861 The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1997 Jan 20 11 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. 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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 547047/1200/03/pp12 Date of release: 1997 Jan 20 Document order number: 9397 750 01474