INTEGRATED CIRCUITS DATA SHEET TDA8708B Video analog input interface Product specification Supersedes data of June 1994 File under Integrated Circuits, IC02 1996 Nov 26 Philips Semiconductors Product specification Video analog input interface TDA8708B FEATURES APPLICATIONS • 8-bit resolution • Video signal decoding • Sampling rate up to 32 MHz • Scrambled TV (encoding and decoding) • Binary or two’s complement 3-state TTL outputs • Digital picture processing • TTL-compatible digital inputs and outputs • Frame grabbing. • Internal reference voltage regulator • Power dissipation of 365 mW (typical) GENERAL DESCRIPTION • Input selector circuit (one out of three video inputs) The TDA8708B is an analog input interface for video signal processing. It includes a video amplifier with clamp and gain control, an 8-bit Analog-to-Digital Converter (ADC) with a sampling rate of 32 MHz and an input selector. • Clamp and Automatic Gain Control (AGC) functions for CVBS and Y signals • No sample-and-hold circuit required • The TDA8708B has no white peak control in mode 2 whereas the TDA8708A has control in modes 1 and 2 • In-range output (not TTL levels). QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VCCA analog supply voltage 4.5 5.0 5.5 V VCCD digital supply voltage 4.5 5.0 5.5 V VCCO TTL output supply voltage 4.2 5.0 5.5 V ICCA analog supply current − 37 45 mA ICCD digital supply current − 24 30 mA ICCO TTL output supply current − 12 16 mA ILE DC integral linearity error − − ±1 LSB DLE DC differential linearity error − − ±0.5 LSB fclk(max) maximum clock frequency 30 32 − MHz B maximum −3 dB bandwidth (AGC amplifier) 12 18 − MHz Ptot total power dissipation − 365 500 mW ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8708BT 1996 Nov 26 SO28 DESCRIPTION plastic small outline package; 28 leads; body width 7.5 mm 2 VERSION SOT136-1 Philips Semiconductors Product specification Video analog input interface TDA8708B BLOCK DIAGRAM handbook, full pagewidth video input selection bit 0 video input selection bit 1 14 video input 0 video input 1 video input 2 15 analog voltage output VIDEO AMPLIFIER 19 ADC input clock input 20 5 decoupling input TTL outputs V CCO (+ 5 V) 21 7 16 17 18 9 INPUT SELECTOR 8 - bit ADC AMP. 1 2 clamp capacitor connection 24 3 AGC capacitor connection 25 TTL 4 OUTPUTS 10 TDA8708B 11 12 AGC & CLAMP LOGIC & MODE SELECTION in-range output D6 D5 D4 D3 D2 D1 D0 BLACK LEVEL DIGITAL COMPARATOR 28 SYNC LEVEL DIGITAL COMPARATOR 27 sync level sync pulse 26 black level sync pulse 6 8 digital V CCD (+ 5 V) digital ground Fig.1 Block diagram. 1996 Nov 26 13 PEAK LEVEL DIGITAL COMPARATOR output format/ chip enable (3-state input) D7 3 22 analog V CCA (+ 5 V) 23 analog ground MSA672 Philips Semiconductors Product specification Video analog input interface TDA8708B PINNING SYMBOL PIN DESCRIPTION D7 1 data output; bit 7 (MSB) D6 2 data output; bit 6 D5 3 data output; bit 5 D4 4 data output; bit 4 CLK 5 clock input VCCD 6 digital supply voltage (+5 V) VCCO 7 TTL outputs supply voltage (+5 V) DGND 8 digital ground OF 9 output format/chip enable (3-state input) D7 1 28 IR D6 2 27 GATE A D5 3 26 GATE B D4 4 25 AGC CLK 5 24 CLAMP VCCD 6 23 AGND VCCO 7 DGND 8 21 DEC 9 20 ADCIN D3 10 data output; bit 3 D2 11 data output; bit 2 D1 12 data output; bit 1 D0 13 data output; bit 0 (LSB) I0 14 video input selection bit 0 OF I1 15 video input selection bit 1 D3 10 19 ANOUT VIN0 16 video input 0 D2 11 18 VIN2 VIN1 17 video input 1 D1 12 17 VIN1 VIN2 18 video input 2 D0 13 16 VIN0 ANOUT 19 analog voltage output ADCIN 20 analog-to-digital converter input DEC 21 decoupling input VCCA 22 analog supply voltage (+5 V) AGND 23 analog ground CLAMP 24 clamp capacitor connection AGC 25 AGC capacitor connection GATE B 26 black level synchronization pulse GATE A 27 sync level synchronization pulse IR 28 in-range output 1996 Nov 26 I0 TDA8708B 14 22 VCCA 15 I1 MSA671 Fig.2 Pin configuration. 4 Philips Semiconductors Product specification Video analog input interface TDA8708B The voltage across the capacitor connected to the AGC pin controls the gain of the video amplifier. This is the gain control loop. FUNCTIONAL DESCRIPTION The TDA8708B provides a simple interface for decoding video signals. The sync level comparator is active during a positive-going pulse at the GATE A input. This means that the sync pulse of the composite video signal is used as an amplitude reference. The bottom of the sync pulse is adjusted to obtain a digital output of logic 0 at the converter output. As the black level is at digital level 64, the sync pulse will have a digital amplitude of 64 LSBs. The TDA8708B operates in configuration mode 1 (see Fig.4) when the video signals are weak (i.e. when the gain of the AGC amplifier has not yet reached its optimum value). This enables a fast recovery of the synchronization pulses in the decoder circuit. When the pulses at the GATE A and GATE B inputs become distinct (GATE A and GATE B pulses are synchronization pulses occurring during the sync period and rear porch respectively) the TDA8708B automatically switches to configuration mode 2 (see Fig.5). The use of nominal signals will prevent the output from exceeding a digital code of 213. The clamp level control is accomplished by using the same techniques as used for the gain control. The black-level digital comparator is active during a positive-going pulse at the GATE B input. The clamp capacitor will be charged or discharged to adjust the digital output to code 64. When the TDA8708B is in configuration mode 1, the gain of the AGC amplifier will be roughly adjusted (sync level to a digital output level of 0 and the peak level to a digital output level of 255). In configuration mode 2 the digital output of the ADC is compared to internal digital reference levels. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VCCA analog supply voltage −0.3 +7.0 V VCCD digital supply voltage −0.3 +7.0 V VCCO TTL output supply voltage −0.3 +7.0 V ∆VCC supply voltage differences: VCCA − VCCD −1.0 +1.0 V VCCO − VCCD −1.0 +1.0 V VCCA − VCCO −1.0 +1.0 V −0.3 VCCA V VI input voltage IO output current 0 +10 mA Tstg storage temperature −55 +150 °C Tamb operating ambient temperature 0 +70 °C Tj junction temperature 0 +125 °C THERMAL CHARACTERISTICS SYMBOL Rth j-a 1996 Nov 26 PARAMETER thermal resistance from junction to ambient in free air 5 VALUE UNIT 70 K/W Philips Semiconductors Product specification Video analog input interface TDA8708B CHARACTERISTICS VCCA = V22 to V23 = 4.5 to 5.5 V; VCCD = V6 to V8 = 4.5 to 5.5 V; VCCO = V7 to V8 = 4.2 to 5.5 V; AGND and DGND shorted together; VCCA to VCCD = −0.5 to +0.5 V; VCCO to VCCD = −0.5 to +0.5 V; VCCA to VCCO = −0.5 to +0.5 V; Tamb = 0 to +70 °C; typical readings taken at VCCA = VCCD = VCCO = 5 V and Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supplies VCCA analog supply voltage 4.5 5.0 5.5 V VCCD digital supply voltage 4.5 5.0 5.5 V VCCO TTL output supply voltage 4.2 5.0 5.5 V ICCA analog supply current − 37 45 mA ICCD digital supply current ICCO TTL output supply current − 24 30 mA TTL load (see Fig.8) − 12 16 mA Video amplifier inputs VIN0 TO VIN2 INPUTS VI(p-p) input voltage (peak-to-peak value) AGC load with external capacitor; note 1 0.6 − 1.5 V Zi input impedance fi = 6 MHz 10 20 − kΩ Ci input capacitance fi = 6 MHz − 1 − pF I0 AND I1 TTL INPUTS (see Table 1) VIL LOW level input voltage 0 − 0.8 V VIH HIGH level input voltage 2.0 − VCCD V IIL LOW level input current VI = 0.4 V −400 − − µA IIH HIGH level input current VI = 2.7 V − − 20 µA 0 − 0.8 V GATE A AND GATE B TTL INPUTS (see Figs 4 and 5) VIL LOW level input voltage VIH HIGH level input voltage 2.0 − VCCD V IIL LOW level input current VI = 0.4 V −400 − − µA IIH HIGH level input current VI = 2.7 V − − 20 µA tW pulse width see Fig.5 2 − − µs AGC voltage for minimum gain − 2.8 − V AGC voltage for maximum gain − 4.0 − V − V AGC INPUT (PIN 25) V25(min) V25(max) AGC output current see Table 2 CLAMP INPUT (PIN 24) V24 clamp voltage for code 128 output I24 clamp output current 1996 Nov 26 − 3.5 see Table 3 6 Philips Semiconductors Product specification Video analog input interface SYMBOL PARAMETER TDA8708B CONDITIONS MIN. TYP. MAX. UNIT Video amplifier outputs ANOUT OUTPUT (PIN 19) V19(p-p) AC output voltage (peak-to-peak value) VVIN = 1.33 V (p-p); V25 = 3.6 V − 1.33 − V I19 internal current source RL = ∞ 2.0 2.5 − mA IO(p-p) output current driven by the load VANOUT = 1.33 V (p-p); note 2 − − 1.0 mA V19 DC output voltage for black level note 3 − VCCA − 2.24 − V Z19 output impedance − 20 − Ω Video amplifier dynamic characteristics αct crosstalk between VIN inputs VCCA = 4.75 to 5.25 V − −50 −45 dB Gdiff differential gain VVIN = 1.33 V (p-p); V25 = 3.6 V − 2 − % ϕdiff differential phase VVIN = 1.33 V (p-p); V25 = 3.6 V − 0.8 − deg B −3 dB bandwidth 12 − − MHz S/N signal-to-noise ratio note 4 60 − − dB SVRR1 supply voltage ripple rejection note 5 − 45 − dB ∆G gain range see Fig.10 −4.5 − +6.0 dB Gstab gain stability as a function of supply voltage and temperature see Fig.10 − − 5 % Analog-to-digital converter inputs CLK INPUT (PIN 5) VIL LOW level input voltage 0 − 0.8 V VIH HIGH level input voltage 2.0 − VCCD V IIL LOW level input current Vclk = 0.4 V −400 − − µA IIH HIGH level input current Vclk = 2.7 V − − 100 µA |Zi| input impedance fclk = 10 MHz − 4 − kΩ CI input capacitance fclk = 10 MHz − 4.5 − pF OF INPUT (3-STATE; see Table 4) VIL LOW level input voltage 0 − 0.2 V VIH HIGH level input voltage 2.6 − VCCD V V9 input voltage in high impedance state − 1.15 − V IIL LOW level input current −370 −300 − µA IIH HIGH level input current − 300 450 µA 1996 Nov 26 7 Philips Semiconductors Product specification Video analog input interface SYMBOL TDA8708B PARAMETER CONDITIONS MIN. TYP. MAX. UNIT ADCIN INPUT (PIN 20; see Table 5) V20 input voltage digital output = 00 − VCCA − 2.42 − V V20 input voltage digital output = 255 − VCCA − 1.41 − V V20(p-p) input voltage amplitude (peak-to-peak value) − 1.0 − V I20 input current − 1.0 10 µA Zi input impedance fi = 6 MHz − 50 − MΩ Ci input capacitance fi = 6 MHz − 1 − pF Analog-to-digital converter outputs IR OUTPUT (PIN 28) VOL LOW level output voltage − − 1.7 V VOH HIGH level output voltage 1.9 − − V IO output current −500 − − µA DIGITAL OUTPUTS D0 TO D7 VOL LOW level output voltage IOL = 2 mA 0 − 0.6 V VOH HIGH level output voltage IOL = −0.4 mA 2.4 − VCCD V IOZ output current in 3-state mode 0.4 V < VO < VCCD −20 − +20 µA see Fig.6; note 6 30 32 − MHz Switching characteristics fclk(max) maximum clock input frequency Analog signal processing (fclk = 32 MHz); see Fig.8 Gdiff differential gain V20 = 1.0 V (p-p); see Fig.7; note 7 − 2 − % ϕdiff differential phase see Fig.7; note 7 − 2 − deg f1 fundamental harmonics (full-scale) fi = 4.43 MHz; note 7 − − 0 dB fall harmonics (full-scale); all components fi = 4.43 MHz; note 7 − −55 − dB SVRR2 supply voltage ripple rejection note 8 − 1 5 %/V Transfer function (see Fig.8) ILE DC integral linearity error − − ±1 LSB DLE DC differential linearity error − − ±0.5 LSB ILE AC integral linearity error − − ±2 LSB − 2 − ns note 9 Timing (fclk = 32 MHz) see Figs 6, 7 and 8 DIGITAL OUTPUTS (CL = 15 pF; IOL = 2 mA; RL = 2 kΩ) tds sampling delay time th output hold time 6 8 − ns td output delay time − 16 20 ns tdEZ 3-state delay time; output enable − 19 25 ns tdDZ 3-state delay time; output disable − 14 20 ns 1996 Nov 26 8 Philips Semiconductors Product specification Video analog input interface TDA8708B Notes 1. 0 dB is obtained at the AGC amplifier when applying Vi(p-p) = 1.33 V. 2. The output current at pin 19 should not exceed 1 mA. The load impedance RL should be referenced to VCCA and defined as: a) AC impedance ≥1 kΩ and the DC impedance >2.7 kΩ. b) The load impedance should be coupled directly to the output of the amplifier so that the DC voltage supplied by the clamp is not disturbed. 3. Control mode 2 is selected. V ANOUTC ( p – p ) S 4. Signal-to-noise ratio measured with 5 MHz bandwidth: ---- = 20 log ------------------------------------------------- at B = 5 MHz . V ANOUTY (RMS noise) N 5. The voltage ratio is expressed as: ∆V CCA G SVRR1 = 20 log ------------------ × -------- for VI = 1 V (p-p), gain at 100 kHz = 1 and 1 V supply variation. V CCA ∆G 6. It is recommended that the rise and fall times of the clock are ≥2 ns. In addition, a ‘good layout’ for the digital and analog grounds is recommended. 7. These measurements are realized on analog signals after a digital-to-analog conversion (TDA8702 is used). 8. The supply voltage rejection is the relative variation of the analog signal (full-scale signal at input) for 1 V of supply variation: ∆ ( V I ( 00 ) – V I ( FF ) ) + ( V I ( 00 ) – V I ( FF ) ) SVRR2 = ----------------------------------------------------------------------------------------------------∆V CCA 9. Full-scale sine wave (fi = 4.4 MHz; fclk = 27 MHz). 1996 Nov 26 9 Philips Semiconductors Product specification Video analog input interface TDA8708B Table 1 Video input selection (CVBS) Table 3 CLAMP output current I1 I0 SELECTED INPUT 0 0 VIN0 0 1 VIN1 1 0 VIN2 1 1 1 VIN2 1 DIGITAL OUTPUT 1 1 0 X(2) 1 0 MODE output < 0 130 µA 1 output > 0 −2.5 µA 1 0 X 0 µA 2 0 1 output < 64 +50 µA 2 64 < output −50 µA 2 Note MODE(1) IAGC ICLAMP X(1) Table 2 AGC output current GATE A GATE B DIGITAL OUTPUT GATE A GATE B 1. X = don't care. output < 255 −2.5 µA 1 output > 255 130 µA 1 − 0 µA 2 +2.5 µA OF output < 0 2 −2.5 µA 0 active, two’s complement output > 0 2 1 high impedance circuit(1) active, binary Table 4 OF input coding open Notes 1. Mode 2 can only be initialized with successive pulses on GATE A and GATE B (see Fig.5). D0 TO D7 Note 1. Use C ≥ 10 pF to DGND. 2. X = don’t care. Table 5 Output coding and input voltage (typical values) BINARY OUTPUTS STEP VADCIN TWO’S COMPLEMENT D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 Underflow − 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 VCCA − 2.41 V 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 1 − 0 0 0 0 0 0 0 1 1 0 0 0 0 0 0 1 . − . . . . . . . . . . . . . . . . . − . . . . . . . . . . . . . . . . 254 − 1 1 1 1 1 1 1 0 0 1 1 1 1 1 1 0 255 VCCA − 1.41 V 1 1 1 1 1 1 1 1 0 1 1 1 1 1 1 1 Overflow − 1 1 1 1 1 1 1 1 0 1 1 1 1 1 1 1 1996 Nov 26 10 Philips Semiconductors Product specification Video analog input interface TDA8708B handbook, full pagewidth 0.25 V 5 MHz sine wave 1.0 V 0.25 V 64 µs MBB959 Fig.3 Test signal on the ADCIN pin for differential gain and phase measurements. k, full pagewidthdigital MBB969 output level peak-level gain control 255 black-level clamping sync-level gain control 0 time GATE A GATE B MODE 1 Fig.4 Control mode 1. 1996 Nov 26 11 Philips Semiconductors Product specification Video analog input interface TDA8708B handbook, full pagewidth digital MSA674 output level 255 black-level clamping 64 sync-level control 0 tW GATE A time tW GATE B MODE 2 Fig.5 Control mode 2. handbook, full pagewidth clock input reference level (1.5 V) CLK input t ds sample N 1 sample N 2 sample N sample N 1 analog input (ADCIN) th 2.4 V data outputs data N 3 D0 to D7) data N 2 data N 1 data N data N 1 0.4 V td Fig.6 Timing diagram for data output. 1996 Nov 26 12 MBB958 Philips Semiconductors Product specification Video analog input interface handbook, full pagewidth TDA8708B open OF input data outputs (D0 to D7) 2.4 V high impedance binary two's complement 0.4 V t dDZ t dEZ MBB968 Fig.7 Output format timing diagram. V CCO handbook, halfpage 2 kΩ D0 to D7 15 pF IN916 or IN3064 MBD865 DGND Fig.8 Load circuit for timing measurement; data outputs (OF = LOW or open-circuit). 1996 Nov 26 13 Philips Semiconductors Product specification Video analog input interface TDA8708B V CCO handbook, halfpage 2 kΩ S1 D0 to D7 C 5 kΩ IN916 or IN3064 S2 MBB955 DGND Fig.9 Load circuit for timing measurement; 3-state outputs (OF: fi = 1 MHz; VOF = 3 V). MSA676 12 G (dB) 8 5% 4 0 (1) (2) 4 8 2.6 3 3.4 3.8 4.2 4.6 V 25 (V) (1) Typical value (VCCA = VCCD = 5 V; Tamb = 25 °C). (2) Minimum and maximum values (temperature and supply). Fig.10 Gain control curve. 1996 Nov 26 14 VCCD VCCD VCCA pins 1 to 4 and 10 to 13 data outputs pin 6 VCCD DGND pin 7 VCCO DGND AGND VCCD DGND DGND pin 5 clock input pin 22 VCCA pin 24 CLAMP VCCA 1.5 V DGND TDA8708B 15 4 V BE chip enable pin 9 OF I1 I1 VCCD pin 8 DGND I2 pin 23 AGND AGND binary/ two's complement VCCA VCCA VREF Philips Semiconductors VCCD Video analog input interface VCCO pin 25 AGC pins 26 or 27 GATE A or GATE B INTERNAL PIN CIRCUITRY 1996 Nov 26 pin 28 IR VCCA VCCA V top DGND VCCA Vmid 20 kΩ pins 14 or 15 I 0 ,I 1 AGND AGND Vbottom AGND Fig.11 Internal pin configuration. pin 20 ADCIN AGND pin 21 DEC MSA675 Product specification pin 19 ANOUT AGND VREF TDA8708B pins 16 to 18 VIN0, VIN1 and VIN2 handbook, full pagewidth 2.5 mA Philips Semiconductors Product specification Video analog input interface TDA8708B APPLICATION INFORMATION Additional information can be found in the laboratory report of TDA8708A “FBL/AN9308”. handbook, full pagewidth 1 28 (2) 2 27 horizontal sync 3 26 horizontal clamp 4 25 5 24 6 23 7 22 data outputs 220 nF 100 Ω 33 pF clock 18 nF 22 nF 1 µF (1) 5V 22 Ω 22 nF 10 nF 8 5V 1µH TDA8708B 5V 21 1 µF 9 20 10 pF LOW PASS FILTER 10 19 11 18 12 17 13 16 14 15 (3) 4.7 µF data outputs 4.7 µF 4.7 µF 75 Ω 75 Ω 75 Ω MSA673 (1) It is recommended to decouple VCCO through a 22 Ω resistor especially when the output data of TDA8708B interfaces with a capacitive CMOS load device. (2) When IR is not used, it must be connected to ground via a 47 pF capacitor. (3) See Figs 13 and 15 for examples of the low-pass filters. Fig.12 Application diagram. 1996 Nov 26 16 Philips Semiconductors Product specification Video analog input interface TDA8708B 22 µH 22 µH dbook, full pagewidth 12 pF 680 Ω ANOUT (pin 19) 12 pF ADCIN (pin 20) 2.2 kΩ Vi 27 pF 68 pF 27 pF Vo MBB966 - 1 VCCA (pin 22) This filter can be adapted to various applications with respect to performance requirements. An input and output impedance of at least 680 Ω and 2.2 kΩ must in any event be applied. Fig.13 Example of a low-pass filter for CVBS and Y signals. Characteristics of Fig.14: • Order 5; adapted CHEBYSHEV • Ripple ρ ≤ 0.4 dB MSA682 0 • f = 6.5 MHz at −3 dB handbook, halfpage α (dB) • fnotch = 9.75 MHz. 40 80 120 160 0 10 20 f (MHz) 30 Fig.14 Frequency response for filter shown in Fig.13. 1996 Nov 26 17 Philips Semiconductors Product specification Video analog input interface 680 Ω ADOUT (pin 19) handbook, full pagewidth TDA8708B 82 µH ADCIN (pin 20) 2.2 kΩ Vi 15 pF 15 pF Vo MSA678 VCCA (pin 22) This filter can be adapted to various applications with respect to performance requirements. An input and output impedance of at least 680 Ω and 2.2 kΩ must in any event be applied. Fig.15 Example of an economical low-pass filter for CVBS and Y signals. Characteristics of Fig.16: • Order 5; adapted CHEBYSHEV • Ripple ρ ≤ 0.4 dB MSA681 0 handbook, halfpage • f = 6.5 MHz at −3 dB. α (dB) 10 20 30 40 0 10 20 f (MHz) 30 Fig.16 Frequency response for filter shown in Fig.15. 1996 Nov 26 18 Philips Semiconductors Product specification Video analog input interface TDA8708B PACKAGE OUTLINE SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 15 28 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 14 e bp 0 detail X w M 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 inches 0.10 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 Z (1) θ 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013AE 1996 Nov 26 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 19 Philips Semiconductors Product specification Video analog input interface TDA8708B SOLDERING Wave soldering Introduction Wave soldering techniques can be used for all SO packages if the following conditions are observed: There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Reflow soldering Reflow soldering techniques are suitable for all SO packages. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 1996 Nov 26 20 Philips Semiconductors Product specification Video analog input interface TDA8708B DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Nov 26 21 Philips Semiconductors Product specification Video analog input interface TDA8708B NOTES 1996 Nov 26 22 Philips Semiconductors Product specification Video analog input interface TDA8708B NOTES 1996 Nov 26 23 Philips Semiconductors – a worldwide company Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstraße 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 247 9145, Fax. +7 095 247 9144 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 São Paulo, SÃO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Internet: http://www.semiconductors.philips.com © Philips Electronics N.V. 1996 SCA52 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 537021/1200/04/pp24 Date of release: 1996 Nov 26 Document order number: 9397 750 01456