INTEGRATED CIRCUITS PCK2002P 140 MHz PCI-X clock buffer Product data File under Integrated Circuits ICL03 2001 May 09 Philips Semiconductors Product data 140 MHz PCI-X clock buffer PCK2002P PIN CONFIGURATION • General purpose and PCI-X 1:4 clock buffer • 8-pin TSSOP package • See PCK2001 for 48-pin 1:18 buffer part • See PCK2001M for 28-pin 1:10 buffer part • See PCK2001R for 16-pin 1:6 buffer part • Operating frequency: 0 – 140 MHz • Part-to-part skew < 500 ps • Low output skew: <200 ps • 3.3 V operation • ESD classification testing is done to JEDEC Standard JESD22. BUF_IN 1 OE 2 BUF_OUT0 3 VSS 4 PCK2002P FEATURES 8 BUF_OUT3 7 BUF_OUT2 6 VDD 5 BUF_OUT1 TOP VIEW SA00552 PIN DESCRIPTION Protection exceeds 2000 V to HBM per method A114. DESCRIPTION PIN NUMBER I/O TYPE SYMBOL 1 Input BUF_IN 3, 5, 7, 8 Output BUF_OUT (0–3) 6 Input VDD 3.3 V supply 2 Input OE Output Enable 4 Input VSS Ground The PCK2002PL is a 1–4 fanout buffer used as a high-performance, low skew, general purpose and PCI-X clock buffer. It distributes one input clock (BUF_IN) signal to four output clocks (BUF_OUTn). FUNCTION Buffered clock input Buffered clock outputs QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS TYPICAL UNIT tPLH tPHL Propagation delay BUF_IN to BUF_OUTn VCC = 3.3 V, CL = 25 pF 2.9 2.8 ns tr Rise time VCC = 3.3 V, CL = 25 pF, 0.2VDD to 0.6VDD 800 ps tf Fall time VCC = 3.3 V, CL = 25 pF, 0.6VDD to 0.2VDD 600 ps Total supply current VCC = 3.6 V 50 µA ICC ORDERING INFORMATION PACKAGES TEMPERATURE RANGE ORDER CODE DRAWING NUMBER 8-Pin Plastic TSSOP –40 to +85 °C PCK2002PDP SOT505-1 8-Pin Plastic SO –40 to +85 °C PCK2002PD SOT96-1 2001 May 09 2 853-2254 26252 Philips Semiconductors Product data 140 MHz PCI-X clock buffer PCK2002P FUNCTION TABLE OE BUF_IN BUF_OUTn L X L H L L H H H ABSOLUTE MAXIMUM RATINGS1, 2 In accordance with the Absolute Maximum Rating System (IEC 134). Voltages are referenced to VSS (VSS = 0 V). LIMITS SYMBOL VDD PARAMETER CONDITION DC 3.3 V supply voltage UNIT MIN MAX –0.5 +4.3 V IIK DC input diode current VI < 0 — –50 mA VI DC input voltage Note 2 –0.5 VDD + 0.5 V IOK DC output diode current VO DC output voltage IO DC output source or sink current Tstg Storage temperature range Ptot Power dissipation per package plastic medium-shrink SO (SSOP) VO > VDD or VO < 0 — ±50 mA Note 2 –0.5 VDD + 0.5 V VO ≥ 0 to VDD For temperature range: 0 to +70 °C above +55 °C derate linearly with 11.3 mW/K — ±50 mA –65 +150 °C — 850 mW NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER CONDITIONS LIMITS UNIT MIN MAX DC 3.3V supply voltage 3.0 3.6 V CL Capacitive load 20 30 pF VI DC input voltage range 0 VDD V VO DC output voltage range 0 VDD V –40 +85 °C VDD Tamb 2001 May 09 Operating ambient temperature range in free air 3 Philips Semiconductors Product data 140 MHz PCI-X clock buffer PCK2002P DC CHARACTERISTICS LIMITS SYMBOL TEST CONDITIONS PARAMETER VDD (V) VIH HIGH level input voltage 3.0 to 3.6 VIL LOW level input voltage VOH VOL Output HIGH voltage Output LOW voltage Tamb = –40 to +85 °C OTHER UNIT MIN MAX 2.0 VDD + 0.3 V — — 3.0 to 3.6 — — VSS – 0.3 0.8 V 3.0 to 3.6 IOH = –1 mA — VDD – 0.2 — V 3.0 IOH = –24 mA — 2.0 — V 3.0 IOH = –12 mA — 2.4 — V 3.0 to 3.6 IOL= 1 mA — — 0.2 V 3.0 IOL= 24 mA — — 0.8 V 3.0 IOL= 12 mA — — 0.55 V 3.0 VOUT = 1 V — –50 — mA 3.3 VOUT = 1.65 V — — –150 mA 3.0 VOUT = 2.0 V — 60 — mA IOH O Output HIGH current IOL O Output LOW current 3.3 VOUT = 1.65 V — — 150 mA ±II Input leakage current 3.6 VI = VDD or GND — — ±5 µA ICC Quiescent supply current 3.6 VI = VDD or GND IO = 0 — 100 µA 2001 May 09 4 Philips Semiconductors Product data 140 MHz PCI-X clock buffer PCK2002P AC CHARACTERISTICS SYMBOL LIMITS Tamb = –40 to +85 °C TEST CONDITIONS PARAMETER UNIT NOTES MIN TYP6 MAX 2 6.0 — — ns 3 6.0 — — ns 2 2.9 — — ns 3 3.0 — — ns TH CLK HIGH time TL CLK LOW time TH CLK HIGH time TL CLK LOW time TR Output rise slew rate 4 1.4 1.7 4.0 V/ns TF 66 MHz 140 MHz Output fall slew rate 4 1.5 2.2 4.0 V/ns TPLH Buffer LH propagation delay 5 1.8 2.9 3.4 ns TPHL Buffer HL propagation delay 5 1.8 2.8 3.4 ns TSKW Bus CLK skew 1 — — 200 ps Device to device skew 1 — — 500 ps TDDSKW NOTES: 1. CLK skew is only valid for equal loading of all outputs. 2. TH is measured at 0.5 VDD as shown in Figure 2. 3. TL is measured at 0.35 VDD as shown in Figure 2. 4. TR and TF are measured as a transition through the threshold region 0.2 VDD to 0.6 VDD and 0.6 VDD to 0.2 VDD. 5. Input edge rate for these tests must be faster than 1 V/ns. 6. All typical values are at VCC = 3.3 V and Tamb = 25 °C. AC WAVEFORMS TEST CIRCUIT VM = 50% VDD CL = 25 pF VOL and VOH are the typical output voltage drop that occur with the output load. VDD VDD BUF_IN INPUT VM VI tPLH 0.6 VDD 140 Ω VM 0.2 VDD 0.2 VDD SW00813 TR TF Figure 3. Load circuitry for switching times SW00811 Figure 1. Load circuitry for switching times. tp th 0.5 VDD 0.4 VDD 0.35 VDD tl SW00812 Figure 2. Buffer Output clock 2001 May 09 CL 0.6 VDD VM BUF_OUT D.U.T. RT tPHL 140 Ω VO PULSE GENERATOR VM VDD 5 Philips Semiconductors Product data 140 MHz PCI-X clock buffer PCK2002P TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm 2001 May 09 6 SOT505-1 Philips Semiconductors Product data 140 MHz PCI-X clock buffer PCK2002P SO8: plastic small outline package; 8 leads; body width 3.9 mm 2001 May 09 7 SOT96-1 Philips Semiconductors Product data 140 MHz PCI-X clock buffer PCK2002P Data sheet status Data sheet status [1] Product status [2] Definitions Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. [1] Please consult the most recently issued datasheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. Definitions Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Disclaimers Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Copyright Philips Electronics North America Corporation 2001 All rights reserved. Printed in U.S.A. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381 Date of release: 05-01 Document order number: 2001 May 09 8 9397 750 08348