MIC261201 28V, 12A Hyper Speed Control™ Synchronous DC/DC Buck Regulator SuperSwitcher II™ General Description Features The Micrel MIC261201 is a constant-frequency, synchronous buck regulator featuring a unique adaptive on-time control architecture. The MIC261201 operates over an input supply range of 4.5V to 28V and provides a regulated output of up to 12A of output current. The output voltage is adjustable down to 0.8V with a guaranteed accuracy of ±1%, and the device operates at a switching frequency of 600kHz. • Micrel’s Hyper Speed Control™ architecture allows for ultrafast transient response while reducing the output capacitance and also makes (High VIN)/(Low VOUT) operation possible. This adaptive tON ripple control architecture combines the advantages of fixed-frequency operation and fast transient response in a single device. The MIC261201 offers a full suite of protection features to ensure protection of the IC during fault conditions. These include undervoltage lockout to ensure proper operation under power-sag conditions, internal soft-start to reduce inrush current, foldback current limit, “hiccup mode” shortcircuit protection and thermal shutdown. An open-drain Power Good (PG) pin is provided. All support documentation can be found on Micrel’s web site at: www.micrel.com. • • • • • • • • • • • • Hyper Speed Control™ architecture enables - High Delta V operation (VIN = 28V and VOUT = 0.8V) - Small output capacitance 4.5V to 28V voltage input 12A output current capability, up to 95% efficiency Adjustable output from 0.8V to 5.5V ±1% feedback accuracy Any Capacitor® Stable – zero-to-high ESR 600kHz switching frequency No external compensation Power Good (PG) output Foldback current-limit and “hiccup mode” short-circuit protection Supports safe startup into a pre-biased load –40°C to +125°C junction temperature range 28-pin 5mm × 6mm MLF® package Applications • Distributed power systems • Communications/networking infrastructure • Set-top box, gateways and routers • Printers, scanners, graphic cards and video card ___________________________________________________________________________________________________________ Typical Application Efficiency (VIN = 12V) vs. Output Current 100 95 5.0V 3.3V 2.5V 1.8V 1.5V 1.2V 1.0V 0.9V 0.8V EFFICIENCY (%) 90 85 80 75 70 65 60 V IN = 12V 55 50 0 3 6 9 12 15 OUTPUT CURRENT (A) Hyper Speed Control, SuperSwitcher II, and Any Capacitor are trademarks of Micrel, Inc. MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc. Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com July 2011 M9999-071311-A Micrel, Inc. MIC261201 Ordering Information Part Number MIC261201YJL Voltage Switching Frequency Junction Temperature Range Package Lead Finish Adjustable 600kHz −40°C to +125°C 28-Pin 5mm × 6mm MLF® Pb-Free Pin Configuration 28-Pin 5mm × 6mm MLF® (YJL) Pin Description Pin Number Pin Name Pin Function 5V Internal Linear Regulator (Output): PVDD supply is the power MOSFET gate drive supply voltage and created by internal LDO from VIN. When VIN < +5.5V, PVDD should be tied to PVIN pins. A 2.2µF ceramic capacitor from the PVDD pin to PGND (pin 2) must be place next to the IC. 1 PVDD 3 NC No Connect. SW Switch Node (Output): Internal connection for the high-side MOSFET source and low-side MOSFET drain. Due to the high speed switching on this pin, the SW pin should be routed away from sensitive nodes. PGND Power Ground. PGND is the ground path for the MIC26903 buck converter power stage. The PGND pins connect to the low-side N-Channel internal MOSFET gate drive supply ground, the sources of the MOSFETs, the negative terminals of input capacitors, and the negative terminals of output capacitors. The loop for the power ground should be as small as possible and separate from the Signal ground (SGND) loop. PVIN High-Side N-internal MOSFET Drain Connection (Input): The PVIN operating voltage range is from 4.5V to 28V. Input capacitors between the PVIN pins and the power ground (PGND) are required and keep the connection short. 20 BST Boost (Output): Bootstrapped voltage to the high-side N-channel MOSFET driver. A Schottky diode is connected between the PVDD pin and the BST pin. A boost capacitor of 0.1μF is connected between the BST pin and the SW pin. Adding a small resistor at the BST pin can slow down the turnon time of high-side N-Channel MOSFETs. 22 CS Current Sense (Input): The CS pin senses current by monitoring the voltage across the low-side MOSFET during the OFF-time. The current sensing is necessary for short circuit protection. In order to sense the current accurately, connect the low-side MOSFET drain to SW using a Kelvin connection. The CS pin is also the high-side MOSFET’s output driver return. 4, 9, 10, 11, 12 2, 5, 6, 7, 8, 21 13,14,15, 16,17,18,19 July 2011 2 M9999-071311-A Micrel, Inc. MIC261201 Pin Description (Continued) Pin Number Pin Name Pin Function 23 SGND Signal ground. SGND must be connected directly to the ground planes. Do not route the SGND pin to the PGND Pad on the top layer, see PCB layout guidelines for details. 24 FB Feedback (Input): Input to the transconductance amplifier of the control loop. The FB pin is regulated to 0.8V. A resistor divider connecting the feedback to the output is used to adjust the desired output voltage. 25 PG Power Good (Output): Open Drain Output. The PG pin is externally tied with a resistor to VDD. A high output is asserted when VOUT > 92% of nominal. 26 EN Enable (input): A logic level control of the output. The EN pin is CMOS-compatible. Logic high = enable, logic low = shutdown. In the off state, supply current of the device is greatly reduced (typically 5µA). The EN pin should not be left open. 27 VIN Power Supply Voltage (Input): Requires bypass capacitor to SGND. VDD 5V Internal Linear Regulator (Output): VDD supply is the power MOSFET gate drive supply voltage and the supply bus for the IC. VDD is created by internal LDO from VIN. When VIN < +5.5V, VDD should be tied to PVIN pins. A 1.0µF ceramic capacitor from the VDD pin to PGND pins must be place next to the IC. 28 July 2011 3 M9999-071311-A Micrel, Inc. MIC261201 Absolute Maximum Ratings(1, 2) Operating Ratings(3) PVIN to PGND................................................ –0.3V to +29V VIN to PGND ....................................................–0.3V to PVIN PVDD, VDD to PGND .......................................... -0.3V to +6V VSW, VCS to PGND .............................. –0.3V to (PVIN +0.3V) VBST to VSW ........................................................ –0.3V to 6V VBST to PGND .................................................. –0.3V to 35V VFB, VPG to PGND............................... –0.3V to (VDD + 0.3V) VEN to PGND ........................................ –0.3V to (VIN +0.3V) PGND to SGND ........................................... –0.3V to +0.3V Junction Temperature .............................................. +150°C Storage Temperature (TS).........................–65°C to +150°C Lead Temperature (soldering, 10sec)........................ 260°C Supply Voltage (PVIN, VIN)................................. 4.5V to 28V PVDD, VDD Supply Voltage (PVDD, VDD)......... 4.5V to 5.5V Enable Input (VEN) .................................................. 0V to VIN Junction Temperature (TJ) ........................ –40°C to +125°C Maximum Power Dissipation......................................Note 4 Package Thermal Resistance(4) 5mm x 6mm MLF®(θJA) .....................................28°C/W Electrical Characteristics(5) PVIN = VIN = VEN = 12V, VBST – VSW = 5V; TA = 25°C, unless noted. Bold values indicate –40°C ≤ TJ ≤ +125°C. Parameter Condition Min. Typ. Max. Units Power Supply Input Input Voltage Range (VIN, PVIN) 28 V 730 1500 µA 5 10 µA 4.5 Quiescent Supply Current VFB = 1.5V (non-switching) Shutdown Supply Current VEN = 0V VDD Supply Voltage VDD Output Voltage VIN = 7V to 28V, IDD = 40mA 4.8 5 5.4 V VDD UVLO Threshold VDD Rising 3.7 4.2 4.5 V VDD UVLO Hysteresis 400 Dropout Voltage (VIN – VDD) IDD = 25mA 380 mV 600 mV 5.5 V DC/DC Controller Output-Voltage Adjust Range (VOUT) 0.8 Reference 0°C ≤ TJ ≤ 85°C (±1.5%) 0.792 0.8 0.808 –40°C ≤ TJ ≤ 125°C (±2.0%) 0.788 0.8 0.812 V Load Regulation IOUT = 0A to 12A (Continuous Mode) 0.25 % Line Regulation VIN = 4.5V to 28V 0.25 % FB Bias Current VFB = 0.8V 50 nA Enable Control EN Logic Level High V 1.8 EN Logic Level Low EN Bias Current VEN = 12V 0.6 V 6 30 µA 600 750 kHz Oscillator Switching Frequency (6) Maximum Duty Cycle (7) VFB = 0V 450 VFB = 1.0V Minimum Duty Cycle Minimum Off-Time July 2011 4 82 % 0 % 300 ns M9999-071311-A Micrel, Inc. MIC261201 Electrical Characteristics(5) (Continued) PVIN = VIN = VEN = 12V, VBST – VSW = 5V; TA = 25°C, unless noted. Bold values indicate –40°C ≤ TJ ≤ +125°C. Parameter Condition Min. Typ. Max. Units Soft-Start Soft-Start time 5 ms Short-Circuit Protection Current-Limit Threshold VFB = 0.8V, TJ = 25°C 18.75 26 33 A Current-Limit Threshold VFB = 0.8V, TJ = 125°C 17.36 26 33 A Short-Circuit Current VFB = 0V 6 A Top-MOSFET RDS (ON) ISW = 3A 13 mΩ Bottom-MOSFET RDS (ON) ISW = 3A 5.3 SW Leakage Current VEN = 0V 60 µA VIN Leakage Current VEN = 0V 25 µA 95 %VOUT Internal FETs mΩ Power Good (PG) PG Threshold Voltage Sweep VFB from Low to High PG Hysteresis Sweep VFB from High to Low 5.5 %VOUT PG Delay Time Sweep VFB from Low to High 100 µs PG Low Voltage Sweep VFB < 0.9 × VNOM, IPG = 1mA 70 TJ Rising 160 °C 15 °C 85 92 200 mV Thermal Protection Over-Temperature Shutdown Over-Temperature Shutdown Hysteresis Notes: 1. Exceeding the absolute maximum rating may damage the device. 2. Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5kΩ in series with 100pF. 3. The device is not guaranteed to function outside operating range. 4. PD(MAX) = (TJ(MAX) – TA)/ θJA, where θJA depends upon the printed circuit layout. A 5 square inch 4 layer, 0.62”, FR-4 PCB with 2oz finish copper weight per layer is used for the θJA. 5. Specification for packaged product only. 6. Measured in test mode. 7. The maximum duty-cycle is limited by the fixed mandatory off-time tOFF of typically 300ns. July 2011 5 M9999-071311-A Micrel, Inc. MIC261201 Typical Characteristics 10 20 15 VOUT = 1.8V IOUT = 0A SWITCHING 5 0 VEN = 0V REN = Open 30 15 10 16 22 28 10 22 28 4 0.804 0.800 VOUT = 1.8V 0.792 VOUT = 1.8V -0.5% 10 16 22 550 500 July 2011 22 28 PG Threshold/VREF Ratio vs. Input Voltage 100% VEN = VIN 12 8 4 0 28 16 INPUT VOLTAGE (V) VPG THRESHOLD/VREF (%) EN INPUT CURRENT (µA) IOUT = 0A INPUT VOLTAGE (V) 10 Enable Input Current vs. Input Voltage 600 22 VOUT = 1.8V INPUT VOLTAGE (V) VOUT = 1.8V 16 10 4 28 16 10 15 0 4 INPUT VOLTAGE (V) 4 20 5 -1.0% 650 28 25 IOUT = 0A to 12A 0.0% Switching Frequency vs. Input Voltage 22 30 0.5% 28 700 16 Current Limit vs. Input Voltage IOUT = 0A 22 10 INPUT VOLTAGE (V) CURRENT LIMIT (A) TOTAL REGULATION (%) FEEDBACK VOLTAGE (V) 16 1.0% 16 IDD = 10mA Total Regulation vs. Input Voltage 0.808 10 VFB = 0.9V INPUT VOLTAGE (V) Feedback Voltage vs. Input Voltage 4 4 0 4 INPUT VOLTAGE (V) 0.796 6 2 0 4 FREQUENCY (kHz) 8 45 VDD VOLTAGE (V) 25 10 VDD Output Voltage vs. Input Voltage 60 SHUTDOWN CURRENT (µA) 30 SUPPLY CURRENT (mA) VIN Shutdown Current vs. Input Voltage VIN Operating Supply Current vs. Input Voltage 95% 90% 85% VREF = 0.7V 80% 4 10 16 22 INPUT VOLTAGE (V) 6 28 4 10 16 22 28 INPUT VOLTAGE (V) M9999-071311-A Micrel, Inc. MIC261201 Typical Characteristics (Continued) VIN Operating Supply Current vs. Temperature 10 40 VDD UVLO Threshold vs. Temperature 5 Rising 30 20 VIN = 12V VOUT = 1.8V IOUT = 0A SWITCHING 10 8 VDD THRESHOLD (V) SUPPLY CURRENT (uA) SUPPLY CURRENT (mA) VIN Shutdown Current vs. Temperature 6 4 VIN = 12V Falling 3 2 1 IOUT = 0A 2 4 Hyst VEN = 0V 0 -25 0 25 50 75 100 0 0 125 -50 -25 0 TEMPERATURE (°C) 100 -50 125 -25 0 V IN = 12V IOUT = 0A 0.800 0.796 25 50 75 100 125 TEMPERATURE (°C) Line Regulation vs. Temperature 0.4% LOAD REGULATION (%) FEEBACK VOLTAGE (V) 75 Load Regulation vs. Temperature V OUT = 1.8V 0.804 50 TEMPERATURE (°C) Feedback Voltage vs. Temperature 0.808 25 0.2% LINE REGULATION (%) -50 0.2% 0.0% VIN = 12V -0.2% VOUT = 1.8V 0.1% 0.0% V IN = 4.5V to 28V V OUT = 1.8V -0.1% IOUT =0A to 12A 0.792 -50 -25 0 25 50 75 100 -0.2% -0.4% 125 -50 -25 0 TEMPERATURE (°C) 25 50 75 100 -50 125 Switching Frequency vs. Temperature 25 50 75 100 125 100 125 Current Limit vs. Temperature 30 VIN = 12V CURRENT LIMIT (A) 25 VOUT = 1.8V 5 IOUT = 0A VDD (V) FREQUENCY (kHz) 0 TEMPERATURE (°C) VDD vs. Temperature 6 700 650 -25 TEMPERATURE (°C) 600 550 4 VIN = 12V 3 VOUT = 1.8V 20 15 10 VIN = 12V VOUT = 1.8V 5 IOUT =0A 500 0 2 -50 -25 0 25 50 75 TEMPERATURE (°C) July 2011 100 125 -50 -25 0 25 50 75 TEMPERATURE (°C) 7 100 125 -50 -25 0 25 50 75 TEMPERATURE (°C) M9999-071311-A Micrel, Inc. MIC261201 Typical Characteristics (Continued) Feedback Voltage vs. Output Current Efficiency vs. Output Current 0.808 24VIN 70 VOUT = 1.8V 50 0 2 4 6 8 0.796 VIN = 12V VOUT = 1.8V 2 700 FREQUENCY (kHz) LINE REGULATION (%) 0.0% -0.5% -1.0% 3.3V 2.5V 1.8V 1.5V 1.2V 1.0V 0.9V 0.8V 85 80 75 70 65 VIN = 5V 55 50 6 9 12 OUTPUT CURRENT (A) July 2011 2 15 4 6 8 10 12 OUTPUT CURRENT (A) Output Voltage (VIN = 5V) vs. Output Current VIN = 5V 550 VFB < 0.8V 4.6 4.2 3.8 TA 25ºC 85ºC 125ºC 3.4 3.0 0 POWER DISSIPATION (W) EFFICIENCY (%) 90 3 0 12 2 4 6 8 10 0 12 3 4.0 IC Power Dissipation (VIN = 5V) vs. Output Current 3.5 VIN = 5V VOUT = 0.8,V, 1.0V, 1.2V, 1.5V, 1.8V,2.5V, 3.3V 9 12 15 Die Temperature* (VIN = 5V) vs. Output Current 100 3.0 2.5 2.0 3.3V 1.5 6 OUTPUT CURRENT (A) OUTPUT CURRENT (A) 95 0 10 500 12 10 Efficiency (VIN = 5V) vs. Output Current 60 8 600 OUTPUT CURRENT (A) 100 6 VOUT = 1.8V 650 8 4 VIN = 12V 0.5% 6 1.791 5.0 VOUT = 1.8V 4 1.796 Switching Frequency vs. Output Current VIN = 4.5V to 28V 2 1.800 OUTPUT CURRENT (A) Line Regulation vs. Output Current 0 1.805 1.782 0 OUTPUT CURRENT (A) 1.0% VIN = 12V VOUT = 1.8V 1.810 1.787 0.792 12 10 0.800 OUTPUT VOLTAGE (V) 60 1.814 0.804 DIE TEMPERATURE (°C) 80 1.819 OUTPUT VOLTAGR (V) 12VIN 90 EFFICIENCY (%) FEEDBACK VOLTAGE (V) 100 Output Voltage vs. Output Current 0.8V 1.0 80 60 40 VIN = 5V VOUT = 1.8V 20 0.5 0 0.0 0 3 6 9 OUTPUT CURRENT (A) 8 12 0 2 4 6 8 10 12 OUTPUT CURRENT (A) M9999-071311-A Micrel, Inc. MIC261201 Typical Characteristics (Continued) Efficiency (VIN = 12V) vs. Output Current 4.5 95 4.0 VIN = 12V VOUT = 0.8,V, 1.0V, 1.2V, 1.5V, 1.8V,2.5V, 3.3V, 5.0V 80 75 70 65 60 VIN = 12V 50 0 3 6 9 3.0 2.5 2.0 5.0V 1.5 0.8V 1.0 3 3.3V 2.5V 1.8V 1.5V 80 75 1.2V 1.0V 0.9V 0.8V 70 65 60 VIN = 24V 50 9 12 5.0V 0.8V 2 16 OUTPUT CURRENT (A) OUTPUT CURRENT (A) 18 8 6 V IN = 5V VOUT = 0.8, 1.2, 1.5V 2 0 0 25 50 75 100 AMBIENT TEMPERATURE (°C) July 2011 60 VIN = 24V 40 VOUT = 1.8V 3 6 9 0 12 2 125 4 6 8 10 12 100 125 OUTPUT CURRENT (A) Thermal Derating* vs. Ambient Temperature 18 16 1.8V 14 12 3.3V 10 8 6 VIN = 5V 4 VOUT = 1.8, 2.5, 3.3V 2 -25 80 0 16 1.5V 12 100 Thermal Derating* vs. Ambient Temperature 12 10 20 1 0 0.8V 8 120 OUTPUT CURRENT (A) 14 6 140 4 3 4 Die Temperature* (VIN = 24V) vs. Output Current 5 18 -50 2 OUTPUT CURRENT (A) VOUT = 0.8,V, 1.0V, 1.2V, 1.5V, 1.8V,2.5V, 3.3V, 5.0V 6 Thermal Derating* vs. Ambient Temperature 4 0 12 0 15 OUTPUT CURRENT (A) 10 9 VIN = 24V POWER DISSIPATION (W) EFFICIENCY (%) 85 6 6 IC Power Dissipation (VIN = 24V) vs. Output Current 7 5.0V 3 VIN = 12V VOUT = 1.8V 20 OUTPUT CURRENT (A) 90 0 40 0 0 Efficiency (VIN = 24V) vs. Output Current 55 60 0.5 OUTPUT CURRENT (A) 95 80 0.0 15 12 3.5 DIE TEMPERATURE (°C) 55 100 OUTPUT CURRENT (A) EFFICIENCY (%) 85 POWER DISSIPATION (W) 5.0V 3.3V 2.5V 1.8V 1.5V 1.2V 1.0V 0.9V 0.8V 90 Die Temperature* (VIN = 12V) vs. Output Current DIE TEMPERATURE (°C) 100 IC Power Dissipation (VIN = 12V) vs. Output Current 0.8V 14 12 1.8V 10 8 6 V IN = 12V 4 VOUT = 0.8, 1.2, 1.8V 2 0 0 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE (°C) 9 125 -50 -25 0 25 50 75 AMBIENT TEMPERATURE (°C) M9999-071311-A Micrel, Inc. MIC261201 Typical Characteristics (Continued) Thermal Derating* vs. Ambient Temperature Thermal Derating* vs. Ambient Temperature 18 18 16 2.5V 14 OUTPUT CURRENT (A) OUTPUT CURRENT (A) 16 12 5V 10 8 6 V IN = 12V 4 VOUT = 2.5, 3.3, 5V 2 0 -50 -25 0 25 50 75 100 AMBIENT TEMPERATURE (°C) 125 14 12 0.8V 10 8 2.5V 6 4 VIN = 24V 2 VOUT = 0.8, 1.2, 2.5V 0 -50 -25 0 25 50 75 100 125 AMBIENT TEMPERATURE (°C) Die Temperature* : The temperature measurement was taken at the hottest point on the MIC261201 case mounted on a 5 square inch 4 layer, 0.62”, FR-4 PCB with 2oz finish copper weight per layer, see Thermal Measurement section. Actual results will depend upon the size of the PCB, ambient temperature and proximity to other heat emitting components. July 2011 10 M9999-071311-A Micrel, Inc. MIC261201 Functional Characteristics July 2011 11 M9999-071311-A Micrel, Inc. MIC261201 Functional Characteristics (Continued) July 2011 12 M9999-071311-A Micrel, Inc. MIC261201 Functional Characteristics (Continued) July 2011 13 M9999-071311-A Micrel, Inc. MIC261201 Functional Diagram Figure 1. MIC261201 Block Diagram July 2011 14 M9999-071311-A Micrel, Inc. MIC261201 The maximum duty cycle is obtained from the 300ns tOFF(min): Functional Description The MIC261201 is an adaptive ON-time synchronous step-down DC/DC regulator with an internal 5V linear regulator and a Power Good (PG) output. It is designed to operate over a wide input voltage range from 4.5V to 28V and provides a regulated output voltage at up to 7A of output current. An adaptive ON-time control scheme is employed to obtain a constant switching frequency and to simplify the control compensation. Over-current protection is implemented without the use of an external sense resistor. The device includes an internal soft-start function which reduces the power supply input surge current at start-up by controlling the output voltage rise time. Dmax = Continuous Mode In continuous mode, the output voltage is sensed by the MIC261201 feedback (FB) pin via the voltage divider R1 and R2, and compared to a 0.8V reference voltage VREF at the error comparator through a low gain transconductance (gm) amplifier. If the feedback voltage decreases and the output of the gm amplifier is below 0.8V, then the error comparator will trigger the control logic and generate an ON-time period. The ON-time period length is predetermined by the “FIXED tON ESTIMATION” circuitry: VOUT VIN × 600kHz Eq. 1 where VOUT is the output voltage and VIN is the power stage input voltage. At the end of the ON-time period, the internal high-side driver turns off the high-side MOSFET and the low-side driver turns on the low-side MOSFET. The OFF-time period length depends upon the feedback voltage in most cases. When the feedback voltage decreases and the output of the gm amplifier is below 0.8V, the ON-time period is triggered and the OFF-time period ends. If the OFF-time period determined by the feedback voltage is less than the minimum OFF-time tOFF(min), which is about 300ns, the MIC261201 control logic will apply the tOFF(min) instead. tOFF(min) is required to maintain enough energy in the boost capacitor (CBST) to drive the high-side MOSFET. July 2011 tS = 1- 300ns tS Eq. 2 where tS = 1/600kHz = 1.66μs. It is not recommended to use MIC261201 with a OFFtime close to tOFF(min) during steady-state operation. Also, as VOUT increases, the internal ripple injection will increase and reduce the line regulation performance. Therefore, the maximum output voltage of the MIC261201 should be limited to 5.5V and the maximum external ripple injection should be limited to 200mV. Please refer to “Setting Output Voltage” subsection in Application Information for more details. The actual ON-time and resulting switching frequency will vary with the part-to-part variation in the rise and fall times of the internal MOSFETs, the output load current, and variations in the VDD voltage. Also, the minimum tON results in a lower switching frequency in high VIN to VOUT applications, such as 24V to 1.0V. The minimum tON measured on the MIC261201 evaluation board is about 100ns. During load transients, the switching frequency is changed due to the varying OFF-time. To illustrate the control loop operation, we will analyze both the steady-state and load transient scenarios. Figure 2 shows the MIC261201 control loop timing during steady-state operation. During steady-state, the gm amplifier senses the feedback voltage ripple, which is proportional to the output voltage ripple and the inductor current ripple, to trigger the ON-time period. The ONtime is predetermined by the tON estimator. The termination of the OFF-time is controlled by the feedback voltage. At the valley of the feedback voltage ripple, which occurs when VFB falls below VREF, the OFF period ends and the next ON-time period is triggered through the control logic circuitry. Theory of Operation The MIC261201 operates in a continuous mode as shown in Figure 1. t ON(estimated) = t S - t OFF(min) 15 M9999-071311-A Micrel, Inc. MIC261201 Unlike true current-mode control, the MIC261201 uses the output voltage ripple to trigger an ON-time period. The output voltage ripple is proportional to the inductor current ripple if the ESR of the output capacitor is large enough. The MIC261201 control loop has the advantage of eliminating the need for slope compensation. In order to meet the stability requirements, the MIC261201 feedback voltage ripple should be in phase with the inductor current ripple and large enough to be sensed by the gm amplifier and the error comparator. The recommended feedback voltage ripple is 20mV~100mV. If a low-ESR output capacitor is selected, then the feedback voltage ripple may be too small to be sensed by the gm amplifier and the error comparator. Also, the output voltage ripple and the feedback voltage ripple are not necessarily in phase with the inductor current ripple if the ESR of the output capacitor is very low. In these cases, ripple injection is required to ensure proper operation. Please refer to “Ripple Injection” subsection in Application Information for more details about the ripple injection technique. Figure 2. MIC261201 Control Loop Timing Figure 3 shows the operation of the MIC261201 during a load transient. The output voltage drops due to the sudden load increase, which causes the VFB to be less than VREF. This will cause the error comparator to trigger an ON-time period. At the end of the ON-time period, a minimum OFF-time tOFF(min) is generated to charge CBST since the feedback voltage is still below VREF. Then, the next ON-time period is triggered due to the low feedback voltage. Therefore, the switching frequency changes during the load transient, but returns to the nominal fixed frequency once the output has stabilized at the new load current level. With the varying duty cycle and switching frequency, the output recovery time is fast and the output voltage deviation is small in MIC261201 converter. VDD Regulator The MIC261201 provides a 5V regulated output for input voltage VIN ranging from 5.5V to 28V. When VIN < 5.5V, VDD should be tied to PVIN pins to bypass the internal linear regulator. Soft-Start Soft-start reduces the power supply input surge current at startup by controlling the output voltage rise time. The input surge appears while the output capacitor is charged up. A slower output rise time will draw a lower input surge current. The MIC261201 implements an internal digital soft-start by making the 0.8V reference voltage VREF ramp from 0 to 100% in about 5ms with 9.7mV steps. Therefore, the output voltage is controlled to increase slowly by a staircase VFB ramp. Once the soft-start cycle ends, the related circuitry is disabled to reduce current consumption. VDD must be powered up at the same time or after VIN to make the soft-start function correctly. Current Limit The MIC261201 uses the RDS(ON) of the internal low-side power MOSFET to sense over-current conditions. This method will avoid adding cost, board space and power losses taken by a discrete current sense resistor. The low-side MOSFET is used because it displays much lower parasitic oscillations during switching than the high-side MOSFET. Figure 3. MIC261201 Load Transient Response July 2011 16 M9999-071311-A Micrel, Inc. MIC261201 In each switching cycle of the MIC261201 converter, the inductor current is sensed by monitoring the low-side MOSFET in the OFF period. If the peak inductor current is greater than 26A, then the MIC261201 turns off the high-side MOSFET and a soft-start sequence is triggered. This mode of operation is called “hiccup mode” and its purpose is to protect the downstream load in case of a hard short. The load current-limit threshold has a fold back characteristic related to the feedback voltage as shown in Figure 4. A small resistor RG, which is in series with CBST, can be used to slow down the turn-on time of the high-side Nchannel MOSFET. The drive voltage is derived from the VDD supply voltage. The nominal low-side gate drive voltage is VDD and the nominal high-side gate drive voltage is approximately VDD – VDIODE, where VDIODE is the voltage drop across D1. An approximate 30ns delay between the high-side and low-side driver transitions is used to prevent current from simultaneously flowing unimpeded through both MOSFETs. Current Limit Threshold vs. Feedback Voltage CURRENT LIMIT THRESHOLD (A) 30 25 20 15 10 5 0 0.0 0.2 0.4 0.6 0.8 1.0 FEEDBACK VOLTAGE (V) Figure 4. MIC261201 Current-Limit Foldback Characteristic Power-Good (PG) The Power Good (PG) pin is an open drain output which indicates logic high when the output is nominally 92% of its steady state voltage. A pull-up resistor of more than 10kΩ should be connected from PG to VDD. MOSFET Gate Drive The Block Diagram (Figure 1) shows a bootstrap circuit, consisting of D1 (a Schottky diode is recommended) and CBST. This circuit supplies energy to the high-side drive circuit. Capacitor CBST is charged, while the low-side MOSFET is on, and the voltage on the SW pin is approximately 0V. When the high-side MOSFET driver is turned on, energy from CBST is used to turn the MOSFET on. As the high-side MOSFET turns on, the voltage on the SW pin increases to approximately VIN. Diode D1 is reverse biased and CBST floats high while continuing to keep the high-side MOSFET on. The bias current of the high-side driver is less than 10mA so a 0.1μF to 1μF is sufficient to hold the gate voltage with minimal droop for the power stroke (high-side switching) cycle, i.e. ΔBST = 10mA x 1.67μs/0.1μF = 167mV. When the low-side MOSFET is turned back on, CBST is recharged through D1. July 2011 17 M9999-071311-A Micrel, Inc. MIC261201 Maximizing efficiency requires the proper selection of core material and minimizing the winding resistance. The high frequency operation of the MIC261201 requires the use of ferrite materials for all but the most cost sensitive applications. Lower cost iron powder cores may be used but the increase in core loss will reduce the efficiency of the power supply. This is especially noticeable at low output power. The winding resistance decreases efficiency at the higher output current levels. The winding resistance must be minimized although this usually comes at the expense of a larger inductor. The power dissipated in the inductor is equal to the sum of the core and copper losses. At higher output loads, the core losses are usually insignificant and can be ignored. At lower output currents, the core losses can be a significant contributor. Core loss information is usually available from the magnetics vendor. Copper loss in the inductor is calculated by Equation 7: Application Information Inductor Selection Values for inductance, peak, and RMS currents are required to select the output inductor. The input and output voltages and the inductance value determine the peak-to-peak inductor ripple current. Generally, higher inductance values are used with higher input voltages. Larger peak-to-peak ripple currents will increase the power dissipation in the inductor and MOSFETs. Larger output ripple currents will also require more output capacitance to smooth out the larger ripple current. Smaller peak-to-peak ripple currents require a larger inductance value and therefore a larger and more expensive inductor. A good compromise between size, loss and cost is to set the inductor ripple current to be equal to 20% of the maximum output current. The inductance value is calculated by Equation 3: L= PINDUCTOR(Cu) = IL(RMS)2 × RWINDING VOUT × (VIN(max) − VOUT ) VIN(max) × fsw × 20% × IOUT(max) Eq. 3 The resistance of the copper wire, RWINDING, increases with the temperature. The value of the winding resistance used should be at the operating temperature. where: fSW = switching frequency, 600kHz 20% = ratio of AC ripple current to DC output current VIN(max) = maximum power stage input voltage PWINDING(Ht) = RWINDING(20°C) × (1 + 0.0042 × (TH – T20°C)) Eq. 8 where: TH = temperature of wire under full load T20°C = ambient temperature RWINDING(20°C) = room temperature winding resistance (usually specified by the manufacturer) The peak-to-peak inductor current ripple is: ΔIL(pp) = VOUT × (VIN(max) − VOUT ) VIN(max) × fsw × L Eq. 4 Output Capacitor Selection The type of the output capacitor is usually determined by its equivalent series resistance (ESR). Voltage and RMS current capability are two other important factors for selecting the output capacitor. Recommended capacitor types are ceramic, low-ESR aluminum electrolytic, OSCON and POSCAP. The output capacitor’s ESR is usually the main cause of the output ripple. The output capacitor ESR also affects the control loop from a stability point of view. The peak inductor current is equal to the average output current plus one half of the peak-to-peak inductor current ripple. IL(pk) =IOUT(max) + 0.5 × ΔIL(pp) Eq. 5 The RMS inductor current is used to calculate the I2R losses in the inductor. 2 IL(RMS) = IOUT(max) + July 2011 ΔIL(PP) 12 Eq. 7 2 Eq. 6 18 M9999-071311-A Micrel, Inc. MIC261201 The maximum value of ESR is calculated: ESR COUT ≤ ΔVOUT(pp) Input Capacitor Selection The input capacitor for the power stage input VIN should be selected for ripple current rating and voltage rating. Tantalum input capacitors may fail when subjected to high inrush currents, caused by turning the input supply on. A tantalum input capacitor’s voltage rating should be at least two times the maximum input voltage to maximize reliability. Aluminum electrolytic, OS-CON, and multilayer polymer film capacitors can handle the higher inrush currents without voltage de-rating. The input voltage ripple will primarily depend on the input capacitor’s ESR. The peak input current is equal to the peak inductor current, so: Eq. 9 ΔIL(PP) where: ΔVOUT(pp) = peak-to-peak output voltage ripple ΔIL(PP) = peak-to-peak inductor current ripple The total output ripple is a combination of the ESR and output capacitance. The total ripple is calculated in Equation 10: 2 ΔVOUT(pp) ΔVIN = IL(pk) × ESRCIN ΔIL(PP) ⎛ ⎞ 2 ⎟ + ΔIL(PP) × ESR C = ⎜⎜ OUT ⎟ ⎝ C OUT × f SW × 8 ⎠ Eq. 10 ( ) The input capacitor must be rated for the input current ripple. The RMS value of input capacitor current is determined at the maximum output current. Assuming the peak-to-peak inductor current ripple is low: where: D = duty cycle COUT = output capacitance value fSW = switching frequency ICIN(RMS) ≈ IOUT(max) × D × (1 − D) ΔIL(PP) Eq. 14 The power dissipated in the input capacitor is: As described in the “Theory of Operation” subsection in the Functional Description section, the MIC261201 requires at least 20mV peak-to-peak ripple at the FB pin to make the gm amplifier and the error comparator behave properly. Also, the output voltage ripple should be in phase with the inductor current. Therefore, the output voltage ripple caused by the output capacitors value should be much smaller than the ripple caused by the output capacitor ESR. If low-ESR capacitors, such as ceramic capacitors, are selected as the output capacitors, a ripple injection method should be applied to provide the enough feedback voltage ripple. Please refer to the “Ripple Injection” subsection for more details. The voltage rating of the capacitor should be twice the output voltage for a tantalum and 20% greater for aluminum electrolytic or OS-CON. The output capacitor RMS current is calculated in Equation 11: ICOUT (RMS) = Eq. 13 PDISS(CIN) = ICIN(RMS)2 × ESRCIN Eq. 15 Ripple Injection The VFB ripple required for proper operation of the MIC261201 gm amplifier and error comparator is 20mV to 100mV. However, the output voltage ripple is generally designed as 1% to 2% of the output voltage. For a low output voltage, such as a 1V, the output voltage ripple is only 10mV to 20mV, and the feedback voltage ripple is less than 20mV. If the feedback voltage ripple is so small that the gm amplifier and error comparator can’t sense it, then the MIC261201 will lose control and the output voltage is not regulated. In order to have some amount of VFB ripple, a ripple injection method is applied for low output voltage ripple applications. Eq. 11 12 The power dissipated in the output capacitor is: 2 PDISS(COUT ) = ICOUT (RMS) × ESR COUT July 2011 Eq. 12 19 M9999-071311-A Micrel, Inc. MIC261201 The applications are divided into three situations according to the amount of the feedback voltage ripple: 1. Enough ripple at the feedback voltage due to the large ESR of the output capacitors. MIC261201 As shown in Figure 5a, the converter is stable without any ripple injection. The feedback voltage ripple is: ΔVFB(pp) = R2 × ESR COUT × ΔIL (pp) R1 + R2 Figure 5c. Invisible Ripple at FB Eq. 16 In this situation, the output voltage ripple is less than 20mV. Therefore, additional ripple is injected into the FB pin from the switching node SW via a resistor Rinj and a capacitor Cinj, as shown in Figure 5c. The injected ripple is: where ΔIL(pp) is the peak-to-peak value of the inductor current ripple. 2. Inadequate ripple at the feedback voltage due to the small ESR of the output capacitors. The output voltage ripple is fed into the FB pin through a feedforward capacitor Cff in this situation, as shown in Figure 5b. The typical Cff value is between 1nF and 100nF. With the feedforward capacitor, the feedback voltage ripple is very close to the output voltage ripple: ΔVFB(pp) ≈ ESR × ΔIL (pp) ΔVFB(pp) = VIN × K div × D × (1 - D) × K div = Eq. 17 R1//R2 R inj + R1//R2 1 fSW × τ Eq. 18 Eq. 19 where: VIN = Power stage input voltage D = duty cycle fSW = switching frequency τ = (R1//R2//Rinj) × Cff 3. Virtually no ripple at the FB pin voltage due to the very-low ESR of the output capacitors. In Equations 20 and 21, it is assumed that the time constant associated with Cff must be much greater than the switching period: MIC261201 1 T = << 1 fSW × τ τ Figure 5a. Enough Ripple at FB Eq. 20 If the voltage divider resistors R1 and R2 are in the kΩ range, a Cff of 1nF to 100nF can easily satisfy the large time constant requirements. Also, a 100nF injection capacitor Cinj is used in order to be considered as short for a wide range of the frequencies. MIC261201 Figure 5b. Inadequate Ripple at FB July 2011 20 M9999-071311-A Micrel, Inc. MIC261201 The process of sizing the ripple injection resistor and capacitors is: Step 1. Select Cff to feed all output ripples into the feedback pin and make sure the large time constant assumption is satisfied. Typical choice of Cff is 1nF to 100nF if R1 and R2 are in kΩ range. Step 2. Select Rinj according to the expected feedback voltage ripple using Equation 22: K div = ΔVFB(pp) VIN × fSW × τ D × (1 − D) Figure 6. Voltage-Divider Configuration Eq. 21 In addition to the external ripple injection added at the FB pin, internal ripple injection is added at the inverting input of the comparator inside the MIC261201, as shown in Figure 8. The inverting input voltage VINJ is clamped to 1.2V. As VOUT is increased, the swing of VINJ will be clamped. The clamped VINJ reduces the line regulation because it is reflected as a DC error on the FB terminal. Therefore, the maximum output voltage of the MIC261201 should be limited to 5.5V to avoid this problem. Then the value of Rinj is obtained as: R inj = (R1//R2) × ( 1 K div − 1) Eq. 22 Step 3. Select Cinj as 100nF, which could be considered as short for a wide range of the frequencies. Setting Output Voltage The MIC26603 requires two resistors to set the output voltage as shown in Figure 7. The output voltage is determined by Equation 23: VOUT = VFB × (1 + R1 ) R2 Eq. 23 where VFB = 0.8V. A typical value of R1 can be between 3kΩ and 10kΩ. If R1 is too large, it may allow noise to be introduced into the voltage feedback loop. If R1 is too small, it will decrease the efficiency of the power supply, especially at light loads. Once R1 is selected, R2 can be calculated using: R2 = July 2011 VFB × R1 VOUT − VFB Figure 7. Internal Ripple Injection Eq. 24 21 M9999-071311-A Micrel, Inc. MIC261201 Thermal Measurements Measuring the IC’s case temperature is recommended to insure it is within its operating limits. Although this might seem like a very elementary task, it is easy to get erroneous results. The most common mistake is to use the standard thermal couple that comes with a thermal meter. This thermal couple wire gauge is large, typically 22 gauge, and behaves like a heatsink, resulting in a lower case measurement. Two methods of temperature measurement are using a smaller thermal couple wire or an infrared thermometer. If a thermal couple wire is used, it must be constructed of 36 gauge wire or higher then (smaller wire size) to minimize the wire heat-sinking effect. In addition, the thermal couple tip must be covered in either thermal grease or thermal glue to make sure that the thermal couple junction is making good contact with the case of the IC. Omega brand thermal couple (5SC-TT-K-36-36) is adequate for most applications. Wherever possible, an infrared thermometer is recommended. The measurement spot size of most infrared thermometers is too large for an accurate reading on a small form factor ICs. However, a IR thermometer from Optris has a 1mm spot size, which makes it a good choice for measuring the hottest point on the case. An optional stand makes it easy to hold the beam on the IC for long periods of time. July 2011 22 M9999-071311-A Micrel, Inc. MIC261201 Inductor PCB Layout Guidelines Warning!!! To minimize EMI and output noise, follow these layout recommendations. PCB Layout is critical to achieve reliable, stable and efficient performance. A ground plane is required to control EMI and minimize the inductance in power, signal and return paths. The following guidelines should be followed to insure proper operation of the MIC261201 regulator. IC • A 2.2µF ceramic capacitor, which is connected to the PVDD pin, must be located right at the IC. The PVDD pin is very noise sensitive and placement of the capacitor is very critical. Use wide traces to connect to the PVDD and PGND pins. • A 1.0uF ceramic capacitor must be placed right between VDD and the signal ground SGND. The SGND must be connected directly to the ground planes. Do not route the SGND pin to the PGND Pad on the top layer. • Place the IC close to the point-of-load (POL). • Use fat traces to route the input and output power lines. • Signal and power grounds should be kept separate and connected at only one location. Place the input capacitor next. • Place the input capacitors on the same side of the board and as close to the IC as possible. • Keep both the PVIN pin and PGND connections short. • Place several vias to the ground plane close to the input capacitor ground terminal. • Use either X7R or X5R dielectric input capacitors. Do not use Y5V or Z5U type capacitors. • Do not replace the ceramic input capacitor with any other type of capacitor. Any type of capacitor can be placed in parallel with the input capacitor. • If a Tantalum input capacitor is placed in parallel with the input capacitor, it must be recommended for switching regulator applications and the operating voltage must be derated by 50%. • In “Hot-Plug” applications, a Tantalum or Electrolytic bypass capacitor must be used to limit the overvoltage spike seen on the input supply with power is suddenly applied. July 2011 Keep the inductor connection to the switch node (SW) short. • Do not route any digital lines underneath or close to the inductor. • Keep the switch node (SW) away from the feedback (FB) pin. • The CS pin should be connected directly to the SW pin to accurate sense the voltage across the lowside MOSFET. • To minimize noise, place a ground plane underneath the inductor. • The inductor can be placed on the opposite side of the PCB with respect to the IC. It does not matter whether the IC or inductor is on the top or bottom as long as there is enough air flow to keep the power components within their temperature limits. The input and output capacitors must be placed on the same side of the board as the IC. Output Capacitor Input Capacitor • • • Use a wide trace to connect the output capacitor ground terminal to the input capacitor ground terminal. • Phase margin will change as the output capacitor value and ESR changes. Contact the factory if the output capacitor is different from what is shown in the BOM. • The feedback trace should be separate from the power trace and connected as close as possible to the output capacitor. Sensing a long high current load trace can degrade the DC load regulation. Optional RC Snubber • 23 Place the RC snubber on either side of the board and as close to the SW pin as possible. M9999-071311-A Micrel, Inc. MIC261201 Evaluation Board Schematic Figure 8. Schematic of MIC261201 Evaluation Board (J11, R13, R15 are for testing purposes) July 2011 24 M9999-071311-A Micrel, Inc. MIC261201 Bill of Materials Item Part Number C1 Open 12105C475KAZ2A C2, C3 GRM32ER71H475KA88L C3225X7R1H475K C15 C6, C7, C10 C8 C9 C12 GRM32ER60J107ME20L C11, C16 R1 R2 R3 R4 R5 4.7µF Ceramic Capacitor, X7R, Size 1210, 50V 2 100µF Ceramic Capacitor, X5R, Size 1210, 6.3V 3 0.1µF Ceramic Capacitor, X7R, Size 0603, 50V 3 1.0µF Ceramic Capacitor, X7R, Size 0603, 10V 1 2.2µF Ceramic Capacitor, X7R, Size 0603, 10V 1 4.7nF Ceramic Capacitor, X7R, Size 0603, 50V 1 220µF Aluminum Capacitor, 35V 1 40V, 350mA, Schottky Diode, SOD323 1 Cooper Bussmann(8) 1.0µH Inductor, 21A Saturation Current 1 (3) TDK AVX(1) Murata(2) (3) 06035C104KAT2A AVX(1) GRM188R71H104KA93D Murata(2) (3) C1608X7R1H104K TDK 0603ZC105KAT2A AVX(1) GRM188R71A105KA61D Murata(2) (3) C1608X7R1A105K TDK 0603ZD225KAT2A AVX(1) GRM188R61A225KE34D Murata(2) (3) C1608X5R1A225K TDK 06035C472KAZ2A AVX(1) GRM188R71H472K Murata(2) B41851F7227M (3) TDK EPCOS(4) Open SD103AWS-7 SD103AWS L1 Murata(2) TDK SD103AWS D1 Qty. AVX(1) C3225X5R0J107M C1608X7R1H472K C14 Description Open 12106D107MAT2A C4, C5, C13 Manufacturer HCF1305-1R0-R CRCW06032R21FKEA CRCW06032R00FKEA CRCW060319K6FKEA CRCW06032K49FKEA CRCW060320K0FKEA MCC(5) Diodes Inc(6) (7) Vishay (7) 2.21Ω Resistor, Size 0603, 1% 1 (7) 2.00Ω Resistor, Size 0603, 1% 1 (7) 19.6kΩ Resistor, Size 0603, 1% 1 (7) 2.49kΩ Resistor, Size 0603, 1% 1 (7) 20.0kΩ Resistor, Size 0603, 1% 1 (7) Vishay Dale Vishay Dale Vishay Dale Vishay Dale Vishay Dale R6, R14, R17 CRCW060310K0FKEA Vishay Dale 10.0kΩ Resistor, Size 0603, 1% 3 R7 CRCW06034K99FKEA Vishay Dale(7) 4.99kΩ Resistor, Size 0603, 1% 1 CRCW06032K87FKEA (7) 2.87kΩ Resistor, Size 0603, 1% 1 (7) 2.00kΩ Resistor, Size 0603, 1% 1 (7) 1.18kΩ Resistor, Size 0603, 1% 1 (7) 806Ω Resistor, Size 0603, 1% 1 (7) 475Ω Resistor, Size 0603, 1% 1 R8 R9 R10 R11 R12 July 2011 CRCW06032K006FKEA CRCW06031K18FKEA CRCW0603806RFKEA CRCW0603475RFKEA Vishay Dale Vishay Dale Vishay Dale Vishay Dale Vishay Dale 25 M9999-071311-A Micrel, Inc. MIC261201 Bill of Materials (Continued) Item R13 Part Number CRCW06030000FKEA Manufacturer Description Qty. (7) 0Ω Resistor, Size 0603, 5% 1 (7) Vishay Dale R15 CRCW060349R9FKEA Vishay Dale 49.9Ω Resistor, Size 0603, 1% 1 R16, R18 CRCW06031R21FKEA Vishay Dale(7) 1.21Ω Resistor, Size 0603, 1% 2 R20 Open U1 MIC261201YJL Micrel. Inc.(9) 28V, 12A Hyper Speed Control™ Synchronous DC/DC Buck Regulator 1 Notes: 1. AVX: www.avx.com. 2. Murata: www.murata.com. 3. TDK: www.tdk.com. 4. EPCOS: www.epcos.com. 5. SANYO: www.sanyo.com. 6. Diode Inc.: www.diodes.com. 7. Vishay: www.vishay.com. 8. Cooper Bussmann: www.cooperbussmann.com. 9. Micrel, Inc.: www.micrel.com. July 2011 26 M9999-071311-A Micrel, Inc. MIC261201 PCB Layout Recommendations Figure 9. MIC261201 Evaluation Board Top Layer Figure 10. MIC261201 Evaluation Board Mid-Layer 1 (Ground Plane) July 2011 27 M9999-071311-A Micrel, Inc. MIC261201 PCB Layout Recommendations (Continued) Figure 11. MIC261201 Evaluation Board Mid-Layer 2 Figure 12. MIC261201 Evaluation Board Bottom Layer July 2011 28 M9999-071311-A Micrel, Inc. MIC261201 Recommended Land and Solder Stencil Pattern July 2011 29 M9999-071311-A Micrel, Inc. MIC261201 Package Information 28-Pin 5mm × 6mm MLF® (YJL) MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This information is not intended as a warranty and Micrel does not assume responsibility for its use. Micrel reserves the right to change circuitry, specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Micrel’s terms and conditions of sale for such products, Micrel assumes no liability whatsoever, and Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2011 Micrel, Incorporated. July 2011 30 M9999-071311-A