PHILIPS 74LVCH322245AEC

INTEGRATED CIRCUITS
DATA SHEET
74LVC322245A; 74LVCH322245A
32-bit bus transceiver with direction
pin; 30 Ω series termination
resistors; 5 V tolerant; 3-state
Product specification
File under Integrated Circuits, IC24
1999 Sep 01
Philips Semiconductors
Product specification
32-bit bus transceiver with direction pin; 30 Ω
series termination resistors; 5 V tolerant; 3-state
74LVC322245A;
74LVCH322245A
FEATURES
DESCRIPTION
• 5 V tolerant inputs/outputs for interfacing with 5 V logic
The 74LVC(H)322245A is a high-performance, low-power,
low-voltage, Si-gate CMOS device, superior to most
advanced CMOS compatible TTL families. Inputs can be
driven from either 3.3 or 5 V devices. In 3-state operation,
outputs can handle 5 V. These features allow the use of
these devices in a mixed 3.3 and 5 V environment.
• Wide supply voltage range of 1.2 to 3.6 V
• Complies with JEDEC standard no. 8-1A
• CMOS low power consumption
• MULTIBYTE flow-trough standard pin-out architecture
• Low inductance multiple power and ground pins for
minimum noise and ground bounce
The 74LVC(H)322245A is a 32-bit transceiver featuring
non-inverting 3-state bus compatible outputs in both send
and receive directions. The 74LVC(H)322245A features
two output enable (nOE) inputs for easy cascading and
two send or receive (nDIR) inputs for direction control.
nOE controls the outputs so that the buses are effectively
isolated. The 74LVC(H)322245A is designed with 30 Ω
series termination resistors in both HIGH and LOW output
stages to reduce line noise.
• Direct interface with TTL levels
• Bus hold on data inputs (74LVCH322245A only)
• Integrated 30 Ω termination resistors
• Typical output ground bounce voltage:
VOLP <0.8 V at VCC = 3.3 V; Tamb = 25 °C
• Typical output VOH undershoot voltage:
VOHV >2 V at VCC = 3.3 V; Tamb = 25 °C
To ensure the high-impedance state during power-up or
power-down, input nOE should be tied to VCC through a
pull-up resistor; the minimum value of the resistor is
determined by the current-sinking capability of the driver.
• Power-off disabled outputs, permitting live insertion
• Plastic fine-pitch ball grid array package.
The 74LVCH322245A bus hold data inputs eliminates the
need for external pull-up resistors to hold unused or
floating data inputs at a valid logic level (see Fig.2).
QUICK REFERENCE DATA
Ground = 0 V; Tamb = 25 °C; tr = tf ≤ 2.5 ns.
SYMBOL
PARAMETER
tPHL/tPLH
propagation delay
nAn to nBn; nBn to nAn
CI
CONDITIONS
CL = 50 pF; VCC = 3.3 V
TYPICAL
UNIT
3.3
ns
input capacitance
5.0
pF
CI/O
input/output capacitance
10
pF
CPD
power dissipation capacitance per
buffer
28
pF
VI = GND to VCC; note 1
Note
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
Σ(CL × VCC2 × fo) = sum of the outputs.
1999 Sep 01
2
Philips Semiconductors
Product specification
32-bit bus transceiver with direction pin; 30 Ω
series termination resistors; 5 V tolerant; 3-state
74LVC322245A;
74LVCH322245A
FUNCTION TABLE
See note 1.
INPUT
OUTPUT
nOE
nDIR
nAn
nBn
L
L
A=B
inputs
L
H
inputs
B=A
H
X
Z
Z
Note
1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
ORDERING INFORMATION
PACKAGES
TYPE NUMBER
74LVC322245AEC
TEMPERATURE RANGE
PINS
PACKAGE
MATERIAL
CODE
−40 to +85 °C
96
LFBGA96
plastic
SOT536-1
96
LFBGA96
plastic
SOT536-1
74LVCH322245AEC
PINNING
SYMBOL
DESCRIPTION
nDIR
direction control
nOE
output enable input (active LOW)
nAn
data inputs/outputs
nBn
data inputs/outputs
GND
ground (0 V)
VCC
DC supply voltage
1999 Sep 01
3
Philips Semiconductors
Product specification
32-bit bus transceiver with direction pin; 30 Ω
series termination resistors; 5 V tolerant; 3-state
74LVC322245A;
74LVCH322245A
MNA475
handbook, full pagewidth
6
1A1
1A3
1A5
1A7
2A1
2A3
2A5
2A6
3A1
3A3
3A5
3A7
4A1
4A3
4A5
4A6
5
1A0
1A2
1A4
1A6
2A0
2A2
2A4
2A7
3A0
3A2
3A4
3A6
4A0
4A2
4A4
4A7
4
1OE GND VCC GND GND VCC GND 2OE 3OE GND VCC GND GND VCC GND 4OE
3
1DIR GND VCC GND GND VCC GND 2DIR 3DIR GND VCC GND GND VCC GND 4DIR
2
1B0
1B2
1B4
1B6
2B0
2B2
2B7
3B0
3B2
3B4
3B6
4B0
4B2
4B4
4B7
1
1B1
1B3
1B5
1B7
2B1
2B3 2B51 2B6
3B1
3B3
3B5
3B7
4B1
4B3
4B5
4B6
A
B
C
D
E
J
K
L
M
N
P
R
T
2B4
F
G
H
Fig.1 Pin configuration.
handbook, halfpage
VCC
data
input
to internal circuit
MNA473
Fig.2 Bus hold circuit.
1999 Sep 01
4
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H3
1OE
A5
E5
A6
E6
1B1
B5
F5
1B2
B6
F6
5
1A4
1B4
C6
1A7
H5
1B7
D1
2A7
M6
2B7
4B6
T5
3B7
M1
R2
R1
4A6
M2
3A7
H2
4B5
T6
3B6
H1
4B4
4A5
L1
3A6
P1
4A4
L2
R6
3B5
M5
2B6
D2
3B4
3A5
G1
2A6
4B3
R5
P2
4A3
K1
3A4
G2
L6
2B5
H6
1B6
D6
2B4
2A5
C1
1A6
3B3
L5
4B2
P6
N1
4A2
K2
3A3
F1
2A4
C2
G6
1B5
D5
2B3
G5
1A5
K6
4B1
P5
3B2
N2
4A1
J1
3A2
F2
2A3
B1
3B1
K5
2B2
4B0
N6
T4
4A0
J2
3A1
E1
2A2
B2
1A3
1B3
C5
2B1
A1
1A2
J6
4OE
N5
3B0
4DIR
J4
3A0
E2
2A1
T3
3OE
J5
2B0
3DIR
H4
2A0
A2
1A1
J3
2OE
A4
1A0
1B0
2DIR
Philips Semiconductors
1DIR
32-bit bus transceiver with direction pin; 30 Ω
series termination resistors; 5 V tolerant; 3-state
andbook, full pagewidth
1999 Sep 01
A3
T1
4A7
4B7
T2
MNA476
Product specification
74LVC322245A;
74LVCH322245A
Fig.3 Logic symbol.
Philips Semiconductors
Product specification
32-bit bus transceiver with direction pin; 30 Ω
series termination resistors; 5 V tolerant; 3-state
74LVC322245A;
74LVCH322245A
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
CONDITIONS
UNIT
MIN.
VCC
DC supply voltage
VI
DC input voltage
VO
DC output voltage
for max. speed performance
or low-voltage applications
2.7
MAX.
3.6
V
1.2
3.6
V
0
5.5
V
output HIGH or LOW state
0
VCC
V
3-state
0
5.5
V
Tamb
operating ambient temperature
see DC and AC characteristics
per device
−40
+85
°C
tr,tf (∆t/∆f)
input rise and fall times
VCC = 1.2 to 2.7 V
0
20
ns/V
VCC = 2.7 to 3.6 V
0
10
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
CONDITIONS
MIN.
−0.5
MAX.
+6.5
UNIT
VCC
DC supply voltage
VI
DC input voltage
note 1
−0.5
+6.5
V
IIK
DC input diode current
VI < 0
−
−50
mA
IOK
DC output diode current
VO > VCC or VO < 0; note 1
−
±50
mA
VO
DC output voltage
output HIGH or LOW state; note 1 −0.5
IO
DC output source or sink current
ICC, IGND
DC VCC or GND current
Tstg
storage temperature
PD
power dissipation per package
VCC + 0.5 V
output 3-state; note 1
−0.5
+6.5
V
VO = 0 to VCC
−
±50
mA
−
±100
mA
−65
+150
°C
−
1000
mW
temperature range:
−40 to +85 °C; note 2
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. Above 70 °C the value of PD derates linearly with 1.8 mW/K.
1999 Sep 01
V
6
Philips Semiconductors
Product specification
32-bit bus transceiver with direction pin; 30 Ω
series termination resistors; 5 V tolerant; 3-state
74LVC322245A;
74LVCH322245A
DC CHARACTERISTICS
Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).
TEST CONDITIONS
SYMBOL
−40 to +85
PARAMETER
OTHER
VIH
Tamb (°C)
HIGH-level input voltage
VCC (V)
−
−
−
−
−
−
GND
2.7 to 3.6 −
−
0.8
1.2
VOH
VOL
LOW-level input voltage
HIGH-level output voltage
LOW-level output voltage
TYP.(1) MAX.
MIN.
VCC
2.7 to 3.6 2.0
VIL
UNIT
1.2
V
V
VI = VIH or VIL
IO = −6 mA
2.7
VCC − 0.5 −
−
IO = −100 µA
3.0
VCC − 0.2 VCC
−
IO = −12 mA
3.0
VCC − 0.8 −
−
V
VI = VIH or VIL
IO = 6 mA
2.7
−
−
0.40
IO = 100 µA
3.0
−
−
0.20
IO = 12 mA
3.0
−
−
0.55
V
II
input leakage current
VI = 5.5 V or GND;
note 2
3.6
−
±0.1
±5
µA
IOZ
3-state output OFF-state current
VI = VIH or VIL;
VO = 5.5 V or GND
3.6
−
0.1
±5
µA
Ioff
power off leakage supply current
VI or VO = 5.5 V
0.0
−
0.1
±10
µA
ICC
quiescent supply current
VI = VCC or GND; IO = 0
3.6
−
0.1
40
µA
∆ICC
additional quiescent supply
current per data input pin
VI = VCC − 0.6 V; IO = 0
2.7 to 3.6 −
5
500
µA
IBHL
bus hold LOW sustaining current
VI = 0.8 V;
notes 3, 4 and 5
3.0
75
−
−
µA
IBHH
bus hold HIGH sustaining current VI = 2.0 V;
notes 3, 4 and 5
3.0
−75
−
−
µA
IBHLO
bus hold LOW overdrive current
notes 3, 4 and 6
3.6
450
−
−
µA
IBHHO
bus hold HIGH overdrive current
notes 3, 4 and 6
3.6
−450
−
−
µA
Notes
1. All typical values are at VCC = 3.3 V and Tamb = 25 °C.
2. For bus hold parts the bus hold circuit is switched off when VI exceeds VCC allowing 5.5 V on the input terminal.
3. Valid for data inputs of bus hold parts only (LVCH32xxx-A).
4. For data inputs only. Control inputs do not have a bus hold circuit.
5. The specified sustaining current at the data input holds the input below the specified VI level.
6. The specified overdrive current at the data input forces the data input to the opposite logic input level.
1999 Sep 01
7
Philips Semiconductors
Product specification
32-bit bus transceiver with direction pin; 30 Ω
series termination resistors; 5 V tolerant; 3-state
74LVC322245A;
74LVCH322245A
AC CHARACTERISTICS
GND = 0 V; tr = tf ≤ 2.5 ns; CL = 50 pF; RL = 500 Ω.
Tamb = −40 to +85 °C
TEST CONDITIONS
SYMBOL
PARAMETER
WAVEFORMS
tPHL/tPLH
tPZH/tPZL
tPHZ/tPLZ
propagation delay
nAn to nBn; nBn to nAn
see Figs 4 and 6
3-state output enable time
nOE to nAn; nOE to nBn
see Figs 5 and 6
3-state output disable time
nOE to nAn; nOE to nBn
see Figs 5 and 6
VCC (V)
MIN.
1.5
−
6.7
3.0 to 3.6
1.5
3.3
5.7
2.7
1.5
−
8.5
3.0 to 3.6
1.5
4.3
7.5
2.7
1.5
−
7.5
3.0 to 3.6
1.5
4.0
6.5
1. All typical values are measured at VCC = 3.3 V and Tamb = 25 °C.
AC WAVEFORMS
handbook, halfpage VI
VM
INPUT
GND
t PHL
t PLH
VOH
nBn, nAn
VM
OUTPUT
VOL
MNA477
VM = 1.5 V at VCC ≥ 2.7 V or
VM = 0.5 × VCC at VCC < 2.7 V.
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.4 Input nAn, nBn to output nBn, nAn propagation delay times.
1999 Sep 01
8
UNIT
MAX.
2.7
Note
nAn, nBn
TYP.(1)
ns
ns
ns
Philips Semiconductors
Product specification
32-bit bus transceiver with direction pin; 30 Ω
series termination resistors; 5 V tolerant; 3-state
74LVC322245A;
74LVCH322245A
VI
handbook, full pagewidth
nOE INPUT
VM
GND
t PLZ
t PZL
VCC
OUTPUT
LOW-to-OFF
OFF-to-LOW
VM
VX
VOL
t PZH
t PHZ
VOH
VY
OUTPUT
HIGH-to-OFF
OFF-to-HIGH
GND
VM
outputs
enabled
outputs
enabled
outputs
disabled
MNA478
VM = 1.5 V at VCC ≥ 2.7 V or
VM = 0.5 × VCC at VCC < 2.7 V;
VX = VOL + 0.3 V at VCC ≥ 2.7 V or
VX = VOL + 0.1 V at VCC < 2.7 V;
VY = VOH − 0.3 V at VCC ≥ 2.7 V or
VY = VOH − 0.1 V at VCC < 2.7 V;
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.5 3-state enable and disable times.
S1
handbook, full pagewidth
VCC
PULSE
GENERATOR
VI
RL
500 Ω
VO
2 × VCC
open
GND
D.U.T.
CL
50 pF
RT
RL
500 Ω
MNA479
TEST
S1
VCC
Definitions for test circuit:
RL = load resistor.
CL = load capacitance including jig and probe capacitance.
RT = termination resistance should be equal to the output impedance
Zo of the pulse generator.
VI
tPLH/tPHL
open
tPLZ/tPZL
2 × VCC
< 2.7 V
tPHZ/tPZH
GND
2.7 to 3.6 V 2.7 V
VCC
Fig.6 Load circuitry for switching times.
1999 Sep 01
9
Philips Semiconductors
Product specification
32-bit bus transceiver with direction pin; 30 Ω
series termination resistors; 5 V tolerant; 3-state
74LVC322245A;
74LVCH322245A
PACKAGE OUTLINE
LFBGA96: plastic low profile fine-pitch ball grid array package; 96 balls; body 13.5 x 5.5 x 1.05 mm
SOT536-1
D
ball A1
index area
A2
A
E
A1
detail X
b
A
∅w M
ZD
e
y
v A
ZE
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
e
X
1 2 3 4 5 6
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
b
D
E
e
v
w
y
ZD
ZE
mm
1.5
0.41
0.31
1.2
0.9
0.51
0.41
5.6
5.4
13.6
13.4
0.8
0.2
0.15
0.1
0.93
0.58
0.93
0.58
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
5
10 mm
scale
EUROPEAN
PROJECTION
ISSUE DATE
98-11-25
99-06-03
SOT536-1
1999 Sep 01
0
10
Philips Semiconductors
Product specification
32-bit bus transceiver with direction pin; 30 Ω
series termination resistors; 5 V tolerant; 3-state
SOLDERING
74LVC322245A;
74LVCH322245A
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
Manual soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Sep 01
11
Philips Semiconductors
Product specification
32-bit bus transceiver with direction pin; 30 Ω
series termination resistors; 5 V tolerant; 3-state
74LVC322245A;
74LVCH322245A
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
REFLOW(1)
WAVE
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable(2)
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
suitable
not
recommended(3)(4)
suitable
not
recommended(5)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Sep 01
12
Philips Semiconductors
Product specification
32-bit bus transceiver with direction pin; 30 Ω
series termination resistors; 5 V tolerant; 3-state
NOTES
1999 Sep 01
13
74LVC322245A;
74LVCH322245A
Philips Semiconductors
Product specification
32-bit bus transceiver with direction pin; 30 Ω
series termination resistors; 5 V tolerant; 3-state
NOTES
1999 Sep 01
14
74LVC322245A;
74LVCH322245A
Philips Semiconductors
Product specification
32-bit bus transceiver with direction pin; 30 Ω
series termination resistors; 5 V tolerant; 3-state
NOTES
1999 Sep 01
15
74LVC322245A;
74LVCH322245A
Philips Semiconductors – a worldwide company
Argentina: see South America
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Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
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Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
SCA 67
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245004/01/pp16
Date of release: 1999
Sep 01
Document order number:
9397 750 06257