INTEGRATED CIRCUITS DATA SHEET TDA3866 Quasi-split sound processor for all standards Preliminary specification File under Integrated Circuits, IC02 January 1992 Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards TDA3866 FEATURES GENERAL DESCRIPTION • Quasi-split sound processor for all standards e. g. B/G (FM sound) and L (AM sound) Separate symmetrical IF inputs for FM or AM sound. Gain controlled wideband IF amplifier, input select switch. AGC generation due to peak sync for FM or mean signal level for AM. Reference amplifier for the regeneration of the vision carrier. Optimized limiting amplifier for AM suppression in the regenerated vision carrier signal and 90° phase shifter. • AF2 signal automatically muted (at B/G) by the input signal level • AM signal processing for L standard and switching over the audio signal • Stereo-matrix correction • Layout-compatible with TDA3858 (32 pins) and TDA3857 (20 pins) Intercarrier mixer for FM sound, output with low-pass filter. Separate signal processing for 5.5 and 5.74 MHz intercarriers. • AM output level typically 500 mV at m = 0.54 (+2.5 dB in comparison to TDA3856) Wide supply voltage range, only 300 mW power dissipation at 5 V. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. VP supply voltage (pin 21) 4.5 5 8.8 UNIT V IP supply current − 60 72 mA Vi IF IF input sensitivity (−3 dB) − 70 100 µV Vo audio output signal for FM standard B/G (RMS value) − 1 − V audio output signal for AM standard L (RMS value) − 0.5 − V for FM − 0.5 − % for AM − 1 − % for FM − 68 − dB for AM − 56 − dB THD S/N (W) total harmonic distortion weighted signal-to-noise ratio ORDERING AND PACKAGE INFORMATION PACKAGE EXTENDED TYPE NUMBER TDA3866 PINS 24 PIN POSITION shrink DIL plastic Note 1. SOT234-1; 1997 January 8. January 1992 MATERIAL 2 CODE SOT234(1) Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards Fig.1 Block diagram (B/G and L). January 1992 3 TDA3866 Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards PINNING SYMBOL PIN CONFIGURATION PIN DESCRIPTION AMIF1 1 AM IF difference input 1 for L standard (32.4 MHz) AMIF2 2 AM IF difference input 2 for L standard CAGC 3 charge capacitor for AGC (FM and AM) CAM 4 charge capacitor for AM AGC MODE 5 3-state input for standard select FM2R1 6 reference circuit for FM2 (5.74 MHz) FM2R2 7 reference circuit for FM2 (5,74 MHz) AF2 8 AF2 output (AF out of 5.74 MHz) AF1 9 AF1 output (AF out of 5.5 MHz or AM) FM1R1 10 reference circuit for FM1 (5.5 MHz) FM1R2 11 reference circuit for FM1 (5.5 MHz) VC-R1 12 reference circuit for the vision carrier (38.9 MHz) VC-R2 13 reference circuit for the vision carrier (38.9 MHz) CAFAM 14 DC-decoupling capacitor for AM demodulator (AF-AM) FM1I 15 intercarrier input for FM1 (5.5 MHz) CAF1 16 DC-decoupling capacitor for FM1 demodulator (AF1) ICO 17 intercarrier output signal (5.5/5.74 MHz) CAF2 18 DC-decoupling capacitor for FM2 demodulator (AF2) FM2I 19 intercarrier input for FM2 (5.74 MHz) GND 20 ground (0 V) VP 21 +5 ... +8 V supply voltage Cref 22 charge capacitor for reference voltage FMIF1 23 IF difference input 1 for B/G standard (38.9 MHz) FMIF2 24 IF difference input 2 for B/G standard (38.9 MHz) January 1992 TDA3866 4 Fig.2 Pin configuration. Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards FUNCTIONAL DESCRIPTION The quasi-split sound processor is for all standards. Dependent on the voltage on pin 5 either FM mode (B/G) or AM mode (L) is selected. B/G standard (FM mode): Pins 23 and 24 are active, AGC detector uses peak sync level. Sound carrier SC1 (5.5 MHz) provides AF1, sound carrier SC2 (5.74 MHz) provides AF2. With no sound carrier SC2 on pin 19, AF2 output is muted (in mid-position of the standard select switch FM mode without muting of AF2 is selected). The mute circuit prevents false signal recognition in the stereo decoder at high IF signal levels when no second sound carrier exists (mono) and an AF signal is present in the identification signal frequency range. With 1 mV on pin 19, under measurement conditions, AF2 is switched on (see limiting amplifier). Weak input signals at pins 23 and 24 generate noise on pin 19, which is present in the intercarrier signal and passes through the 5.74 MHz filter. Noise on pin 19 inhibits muting. No misinterpretation due to white noise occurs in the stereo decoder; when non-correlated noise masks the identification signal frequencies, which may be present in sustained January 1992 tone signals. The stereo decoder remains switched to mono. The series capacitor Cs in 38.9 MHz resonant circuit provides a notch at the sound carrier frequency in order to provide more attenuation for the sound carrier in the vision carrier reference channel. The ratio of parallel/series capacitor depends on the ratio of VC/SC frequency and has to be adapted to other TV transmission standards if necessary, according to the formula CS = CP (fVC/fSC)2 − CP. The result is an improved “intercarrier buzz” (up to 10 dB improvement in sound channel 2 with 250 kHz video modulation for B/G stereo) or suppression of 350 kHz video modulated beat frequency in the digitally-modulated NICAM subcarrier. The picture carrier for quadrature demodulation in the intercarrier mixer is not exactly 90 degrees due to the shift variation in the integrated phase shift network. The tuning of the LC reference circuit to provide optimal video suppression at the intercarrier output is not the same as that to provide optimal intercarrier buzz suppression. In order to optimize the AF signal performance, a fine tuning for the optimal S/N at the sound channel 2 (from 5.74 MHz) may be performed with a 250 kHz square wave video modulation. 5 TDA3866 Measurements at the demodulators: For all signal-to-noise measurements the generator must meet the following specifications; phase modulation errors < 0.5 degree for B/W-jumps intercarrier signal-to-noise ratio as measured with “TV-demodulator AMF2” (weighted S/N) must be > 60 dB at 6 kHz sine wave modulation of the B/W-signal. Signal-to-noise ratios are measured with ∆f = ±50 kHz deviation and fmod = 1 kHz; with a deviation of ±27 kHz the S/N ratio is deteriorated by 5.3 dB. L standard (AM mode): Pins 1 and 2 are active, AGC detector uses mean signal level. The audio signal from the AM demodulator is output on AF1, with AF2 output muted. Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards TDA3866 LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VP supply voltages (pin 21) − 8.8 V Vn input and output voltage (pins 1, 2, 5, 8, 9, 15, 17, 19, 23 and 24) 0 VP V Ptot total power dissipation 0 635 mW Tstg storage temperature range −25 150 °C Tamb operating ambient temperature range 0 70 °C VESD electrostatic handling(1) ±500 − V pins 1, 2, 23 and 24 +400 − V pins 1, 2, 23 and 24 −500 − V all pins except 1, 2, 23 and 24 Note 1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor. January 1992 6 Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards TDA3866 CHARACTERISTICS VP = 5 V and Tamb = 25 °C, measurements taken in Fig.3 with fVC = 38.9 MHz, fSC1 = 33.4 MHz and fSC2 = 33.158 MHz. Vision carrier (VC) modulated with different video signals, modulation depth 100 % (proportional to 10 % residual carrier). Vision carrier amplitude (RMS value) Vi VC = 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation ∆f = 50 kHz unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP supply voltage range (pin 21) 4.5 5 8.8 V IP supply current (pin 21) 48 60 72 mA IF source control (pin 5) V5 input voltage in order to obtain standards B/G (FM) with automatic muting B/G (FM) without muting L (AM sound) I5 input current pin 5 connected 2.8 − VP V pin 5 open-circuit − 2.8 − V pin 5 connected 1.3 − 2.3 V 22 kΩ to GND (alternative measure) − 1.8 − V pin 5 connected 0 − 0.8 V V5 = VP − − 100 µA V5 = 0 − − −300 µA − − 100 Ω IF input not activated (pins 1-2 or 23-24) RI input resistance VDC DC input voltage (pins 1, 2, 23 and 24) internally set LOW − − 0.1 V α1,2-23,24 crosstalk attenuation of IF input switch note 1 50 56 − dB 1.75 2.2 2.65 kΩ IF amplifier (pins 1-2 or 23-24) RI input resistance CI input capacitance 1.0 1.5 2.2 pF VI DC potential, voltage (pins 1, 2, 23, 24) − 1.75 − V Vi IF maximum input signal (RMS value) Vo = +1 dB 70 100 − mV input signal sensitivity B/G standard (RMS value, pins 23-24) −3 dB intercarrier signal reduction on pin 17 − 70 100 µV input signal sensitivity L standard (RMS value, pins 1-2) −3 dB intercarrier signal reduction on pin 9 − 70 100 µV 60 63 − dB ∆Gv IF gain control range B IF bandwidth −3 dB 50 70 − MHz V3 voltage range for gain control (pin 3) Gmin − Gmax 1.7 − 2.6 V January 1992 7 Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards SYMBOL PARAMETER TDA3866 CONDITIONS MIN. TYP. MAX. UNIT Resonance amplifier (pins 12-13) fo = 38.9 MHz − 270 − mV − 4 − kΩ − 0.247 − µH 68 − pF 40 − Vo vision carrier amplitude (peak-to-peak value) R12-13 operating resistance L inductance Fig.3 and 5 C capacitance CS = 27 pF − QL Q-factor of resonant circuit Qo = 90 − V12, 13 DC voltage (pins 12 and 13) − VP−1 − V output signal for 5.5 MHz (RMS value) 71 95 125 mV output signal for 5.74 MHz (RMS value) 32 43 56 mV −1 dB − 8.5 − MHz −3 dB − 10 − MHz Intercarrier mixer output (pin 17) Vo B IF bandwidth VVID/V17 residual video AM on intercarrier note 2 − 3 10 % VVC residual vision carrier (RMS value) 1st/2nd harmonic; (38.9/77.8 MHz) − 0.5 1 mV R17 output resistance (emitter follower) 1 mA emitter current − 30 − Ω Io allowable AC output current (pin 17) − − ±0.7 mA I17 allowable DC output current − − −2 mA V17 DC voltage − 1.75 − V − 300 450 µV Limiting amplifiers (pins 15 and 19) Vi minimum input signal (RMS value) −3 dB AF signal maximum input signal (RMS value) 200 − − mV R15, 19 input resistance − 560 − Ω V15, 19 DC voltage − 0 − V Vi level detector threshold for no muting (RMS value, pin 19) − 1 − mV ∆Vi hysteresis of level detector − 5 − dB January 1992 only 5.74 MHz channel 8 Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards SYMBOL PARAMETER TDA3866 CONDITIONS MIN. TYP. MAX. UNIT FM1 and FM2 demodulators Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with Vi IF (rms) = 10 mV (fmod = 1 kHz, deviation ∆f = ± 50 kHz) at pins 15 and 19 without ceramic filters, RS = 50 Ω. De-emphasis 50 µs and V5 = VP (B/G standard). QL-factor = 11 for resonant circuits at pins 6-7 and 10-11. VIC intercarrier signals (RMS values, pins 6-7 and 10-11) − 100 − mV VDC DC voltage (pins 6-7 and 10-11) − 1.8 − V Vo AF output signals (RMS values, pins 8 and 9) 0.75 0.95 1.20 V ∆Vo difference of AF signals between channels (pins 8 and 9) − − 1 dB R8, 9 output resistance − 100 − Ω − 2.1 − V − − ±1.5 mA − − −2 mA V8, 9 DC voltage I8, 9 allowed AC current of emitter output (peak value) I8, 9 maximum allowed DC output current THD total harmonic distortion − 0.5 1.0 % Vo AF output signal (RMS value) THD = 1.5 % 1.25 − − V αAM AM suppression 1 kHz, m = 0.3 48 54 − dB note 3 S/N(W) weighted signal-to-noise ratio CCIR 468-3 64 68 − dB B AF bandwidth −3 dB 0.02 − 100 kHz αCR crosstalk attenuation (pins 9-8) 60 70 − dB V16, 18 DC voltage (pins 16 and 18) − 1.7 − V 400 500 600 mV − 100 − Ω − − ±1.5 mA − − −2 mA AM mode, input signal at pins 1-2 SC = 32.4 MHz; fmod = 1 kHz, m = 0.54; Vi AM = 10 mV rms Vo AF output signal on pin 9 (RMS value) R9 output resistance (pin 9) Io maximum AC output current (peak value) I9 maximum DC output current V9 DC voltage − 2.1 − V THD total harmonic distortion Fig.4 − 1 2 % S/N(W) weighted signal-to-noise ratio CCIR 468-3 50 56 − dB B AF bandwidth −3 dB 0.02 − 100 kHz V14 DC voltage (pin 14) − 2 − V January 1992 note 3 9 Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards SYMBOL PARAMETER TDA3866 CONDITIONS MIN. TYP. MAX. UNIT Audio frequency performance for FM operation in B/G standard (V5 = VP) unless otherwise specified. Measurements on AF outputs (pins 8 and 9) Vo signals attenuation of AF signal switches mute: AF2 on pin 8 V5 = 0 70 − − dB AM mode: not required signal AF1 on pin 9 (from FM) 5.5 MHz on pin 18; V5 = 0; Vi = 10 mV 70 − − dB FM mode: not required signal AF1 on pin 9 (from AM) signal for L standard (pins 1-2); V5 = VP 70 − − dB dV8, 9 DC level deviation (pins 8 and 9) when switching to FM or AM sound or Mute − 5 25 mV S/N(W) weighted signal-to-noise ratio on output pin 9 CCIR 468-3 de-emphasis 50 µs black picture fi = 5.5 MHz 59 63 − dB 2T/20T pulses with white bar fi = 5.5 MHz 57 61 − dB 6 kHz sine wave, B/W-modulated fi = 5.5 MHz 52 56 − dB 250 kHz square wave B/W-modulated fi = 5.5 MHz 50 56 − dB black picture fi = 5.742 MHz 57 61 − dB 2T/20T pulses with white bar fi = 5.742 MHz 55 59 − dB 6 kHz sine wave, B/W-modulated fi = 5.742 MHz 50 54 − dB 250 kHz square wave B/W-modulated fi = 5.742 MHz 50 56 − dB all standards; fR = 70 Hz VR = 200 mV (p-p) 30 40 − dB on output pin 8 RR ripple rejection Notes to the characteristics 1. Crosstalk attenuation of IF input switch, measured at R12-13 = 470 Ω (instead of LC circuit); input signal Vi (rms) = 20 mV (pins 23-24). AGC voltage V3 set to a value to achieve Vo (rms) = 20 mV (pins 12-13). After switching (V5 = 0 V) measure attenuation. IF coupling with OFWG3203 and OFWL9350 (Siemens). 2. Spurious intercarrier AM: m = (A-B)/A (wherein A = signal at sync; B = signal with 100% picture modulation.) 3. For larger current: RL > 2.2 kΩ (pin 8 or 9 to GND) in order to increase the bias current of the output emitter follower. January 1992 10 Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards TDA3866 Fig.3 Test and application circuit for standards B/G and L (for application SAW-filters must be used). January 1992 11 Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards TDA3866 Fig.4 Total harmonic distortion (THD) as a function of audio frequency at AM standard (V5 = 0). (1) simple resonance circuit (without CS) (2) resonance circuit with CS = 27 pF CS = CP (fVC/fSC)2 − CP CS = 27 pF (Fig.3) Fig.5 Frequency response of the 38.9 MHz reference circuit. January 1992 12 Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards APPLICATION INFORMATION Fig.6 Internal circuits; (continued in Fig.7). January 1992 13 TDA3866 Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards Fig.7 Internal circuits; (continued from Fig.6) January 1992 14 TDA3866 Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards TDA3866 PACKAGE OUTLINE SDIP24: plastic shrink dual in-line package; 24 leads (400 mil) SOT234-1 ME seating plane D A2 A A1 L c e Z b1 (e 1) w M MH b 13 24 pin 1 index E 1 12 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.8 1.3 0.8 0.53 0.40 0.32 0.23 22.3 21.4 9.1 8.7 1.778 10.16 3.2 2.8 10.7 10.2 12.2 10.5 0.18 1.6 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-04 SOT234-1 January 1992 EUROPEAN PROJECTION 15 Philips Semiconductors Preliminary specification Quasi-split sound processor for all standards TDA3866 with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. January 1992 16