PHILIPS BGA6489

DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D109
BGA6489
MMIC wideband medium power
amplifier
Product specification
2003 Sep 18
Philips Semiconductors
Product specification
MMIC wideband medium power amplifier
FEATURES
BGA6489
PINNING
• Broadband 50 Ω gain block
PIN
DESCRIPTION
• 20 dBm output power
1
RF out/bias
• SOT89 package
2
GND
• Single supply voltage needed.
3
RF in
APPLICATIONS
• Broadband medium power gain blocks
• Small signal high linearity amplifiers
handbook, halfpage
• Variable gain and high output power in combination with
the BGA2031
3
1
2
• Cellular, PCS and CDPD
• IF/RF buffer amplifier
1
2
Bottom view
• Wireless data SONET
3
MGX418
• Oscillator amplifier, final PA
Marking code: 4A.
• Drivers for CATV amplifier.
Fig.1 Simplified outline (SOT89) and symbol.
DESCRIPTION
Silicon Monolithic Microwave Integrated Circuit (MMIC)
wideband medium power amplifier with internal matching
circuit in a 4-pin SOT89 plastic low thermal resistance
SMD package.
The BGA6x89 series of medium power gain blocks are
resistive feedback Darlington configured amplifiers.
Resistive feedback provides large bandwidth with high
accuracy.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
TYP.
UNIT
VS
DC supply voltage
IS = 74 mA
5.1
V
IS
DC supply current
VS = 8 V; R1 = 39 Ω; Tj = 25 °C
78
mA
|s21|2
insertion power gain
f = 1.95 GHz
16
dB
NF
noise figure
f = 1.95 GHz
3.3
dB
PL 1 dB
load power at 1 dB compression
f = 850 MHz
20
dBm
f = 1.95 GHz
17
dBm
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
2003 Sep 18
2
Philips Semiconductors
Product specification
MMIC wideband medium power amplifier
BGA6489
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134)
SYMBOL
PARAMETER
VS
DC supply voltage
IS
DC supply current
CONDITIONS
MIN.
RF input AC coupled
Ts ≤ 70 °C; note 1
MAX.
UNIT
−
6
V
−
150
mA
Ptot
total power dissipation
−
800
mW
Tstg
storage temperature
−65
+150
°C
Tj
operating junction temperature
−
150
°C
PD
maximum drive power
−
15
dBm
Note
1. Ts is the temperature at the soldering point of pin 2.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-s
PARAMETER
CONDITIONS
thermal resistance from junction to solder point Ts ≤ 70 °C; note 1
VALUE
UNIT
100
K/W
Note
1. Ts is the temperature at the soldering point of pin 2.
STATIC CHARACTERISTICS
Tj = 25 °C; VS = 8 V; R1 = 39 Ω; unless otherwise specified.
SYMBOL
IS
2003 Sep 18
PARAMETER
CONDITIONS
supply current
3
MIN.
TYP.
MAX.
UNIT
70
78
86
mA
Philips Semiconductors
Product specification
MMIC wideband medium power amplifier
BGA6489
CHARACTERISTICS
VS = 8 V; IS = 74 mA; Tamb = 25 °C; IP3(out) tone spacing = 1 MHz; PL = 0 dBm per tone (see Fig.2); R1 = 39 Ω;
ZL = ZS = 50 Ω; unless otherwise specified.
SYMBOL
|s21|2
RL IN
RL OUT
NF
PARAMETER
insertion power gain
return losses input
return losses output
noise figure
CONDITIONS
TYP.
UNIT
f = 850 MHz
20
dB
f = 1.95 GHz
16
dB
f = 2.5 GHz
15
dB
f = 850 MHz
14
dB
f = 1.95 GHz
16
dB
f = 2.5 GHz
19
dB
f = 850 MHz
16
dB
f = 1.95 GHz
12
dB
f = 2.5 GHz
10
dB
f = 850 MHz
3.1
dB
f = 1.95 GHz
3.3
dB
f = 2.5 GHz
3.4
dB
K
stability factor
f = 850 MHz
1.2
−
f = 2.5 GHz
1.3
−
PL 1 dB
load power
at 1 dB gain compression; f = 850 MHz
20
dBm
at 1 dB gain compression; f = 1.95 GHz
17
dBm
f = 850 MHz
13
dBm
f = 2.5 GHz
12
dBm
f = 850 MHz
33
dBm
f = 2.5 GHz
27
dBm
IP3(in)
IP3(out)
2003 Sep 18
input intercept point
output intercept point
4
Philips Semiconductors
Product specification
MMIC wideband medium power amplifier
BGA6489
APPLICATION INFORMATION
Figure 2 shows a typical application circuit for the BGA6489 MMIC. The device is internally matched to 50 Ω, and
therefore does not require any external matching. The value of the input and output DC blocking capacitors C1 and C2
depends on the operating frequency; see the tables below. Capacitors C1 and C2 are used in conjunction with L1 and
C3 to fine tune the input and output impedance. For optimum supply decoupling, a 1 µF capacitor (C5) can be added.
The external components should be placed as close as possible to the MMIC. When using via holes, use multiple via
holes per pin in order to limit ground path induction. Resistor R1 is a bias resistor providing DC current stability with
temperature.
R1(2)
handbook, full pagewidth
VS
C3
C4
C5(1)
L1
50 Ω
microstrip
C1
3
1
VD C2
50 Ω
microstrip
2
MGX419
(1) Optional capacitor for optimum supply decoupling.
(2) R1 values at operating supply voltage:
VS = 6 V; R1 = 15 Ω.
VS = 9 V; R1 = 51 Ω.
VS = 11.5 V; R1 = 82 Ω.
Fig.2 Typical application circuit.
Table 1
Component descriptions (see Fig.2)
VALUE AT OPERATING FREQUENCY
COMPONENT
DESCRIPTION
DIMENSIONS
500
MHz
800
MHz
1950
MHz
2400
MHz
3500
MHz
C1, C2
multilayer ceramic chip capacitor
0603
220 pF 100 pF 68 pF
56 pF
39 pF
C3
multilayer ceramic chip capacitor
0603
1 nF
1 nF
1 nF
C4
multilayer ceramic chip capacitor
0603
100 pF 68 pF
22 pF
22 pF
15 pF
C5 (optional)
electrolytic or tantalum capacitor
0603
1 µF
1 µF
1 µF
1 µF
1 µF
L1
SMD inductor
0603
68 nH
33 nH
22 nH
18 nH
15 nH
R1
SMD resistor 0.5 W; VS = 9 V
−
−
−
−
−
−
2003 Sep 18
5
1 nF
1 nF
Philips Semiconductors
Product specification
MMIC wideband medium power amplifier
BGA6489
90°
handbook, full pagewidth
1.0
+1
135°
+0.5
0.8
45°
+2
0.6
+0.2
0.4
+5
0.2
180°
0
0.2
0.5
200 MHz
2
5
10
0°
0
2.6 GHz
−5
−0.2
−2
−0.5
−135°
−45°
−1
1.0
−90°
MGX400
IS = 74 mA; VS = 8 V; PD = −30 dBm; ZO = 50 Ω.
Fig.3 Input reflection coefficient (s11); typical values.
90°
handbook, full pagewidth
1.0
+1
135°
+0.5
0.8
45°
+2
0.6
+0.2
0.4
+5
2.6 GHz
0.2
180°
0
0.2
0.5
1
2
5
10
0°
0
200 MHz
−5
−0.2
−135°
−2
−0.5
−45°
−1
−90°
1.0
MGX401
IS = 74 mA; VS = 8 V; PD = −30 dBm; ZO = 50 Ω.
Fig.4 Output reflection coefficient (s22); typical values.
2003 Sep 18
6
Philips Semiconductors
Product specification
MMIC wideband medium power amplifier
BGA6489
MGX402
0
MGX403
25
handbook, halfpage
|s |2
handbook, halfpage
|s |2
21
(dB)
12
(dB)
20
−10
15
−20
10
−30
5
−40
0
500
1000
1500
0
2000
2500
f (MHz)
0
IS = 74 mA; VS = 8 V; PD = −30 dBm; ZO = 50 Ω.
1500
2000
2500
f (MHz)
Insertion gain (|s21|2) as a function of
frequency; typical values.
Fig.6
MGX404
25
1000
IS = 74 mA; VS = 8 V; PD = −30 dBm; ZO = 50 Ω.
Isolation (|s12|2) as a function of frequency;
typical values.
Fig.5
500
MGX405
40
handbook, halfpage
handbook, halfpage
PL1dB
IP3(out)
(dBm)
(dBm)
20
30
15
20
10
10
5
0
0
0
500
1000
1500
2000
2500
f (MHz)
0
500
1000
1500
IS = 74 mA; VS = 8 V; ZO = 50 Ω.
IS = 74 mA; VS = 8 V; PL = 0 dBm; ZO = 50 Ω.
Fig.7
Fig.8
Load power as a function of frequency;
typical values.
2003 Sep 18
7
2000
2500
f (MHz)
Output intercept as a function of frequency;
typical values.
Philips Semiconductors
Product specification
MMIC wideband medium power amplifier
BGA6489
MGX406
5
MGX407
5
handbook, halfpage
handbook, halfpage
NF
(dB)
K
4
4
3
3
2
2
1
1
0
0
500
1000
1500
0
2000
2500
f (MHz)
0
500
1000
1500
2000
2500
f (MHz)
IS = 74 mA; VS = 8 V; ZO = 50 Ω.
IS = 74 mA; VS = 8 V; Z0 = 50 Ω.
Fig.9
Fig.10 Stability factor as a function of frequency;
typical values.
Noise figure as a function of frequency;
typical values.
MGX408
100
handbook, halfpage
Is
(mA)
90
80
70
60
−40
−20
0
20
40
60
80
Tj (°C)
VS = 8 V; R1 = 39 Ω.
Fig.11 Supply current as a function of operating
junction temperature; typical values.
2003 Sep 18
8
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s12
s22
9
ANGLE
(deg)
MAGNITUDE
(ratio)
ANGLE
(deg)
MAGNITUDE
(ratio)
ANGLE
(deg)
MAGNITUDE
(ratio)
ANGLE
(deg)
K-FACTOR
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
2800
2900
3000
3100
0.06
0.09
0.11
0.12
0.14
0.16
0.17
0.18
0.19
0.20
0.21
0.21
0.22
0.22
0.22
0.22
0.21
0.21
0.20
0.19
0.18
0.17
0.16
0.14
0.13
0.13
0.12
0.11
0.11
0.12
28.11
27.41
21.64
15.28
8.01
0.34
−7.27
−14.78
−22.18
−29.33
−36.41
−42.47
−49.06
−55.46
−61.20
−67.02
−73.40
−78.99
−84.54
−91.32
−97.58
−103.60
−111.90
−120.80
−129.80
−143.80
−154.47
−164.40
178.65
160.01
12.79
12.59
12.31
11.97
11.57
11.18
10.75
10.24
9.80
9.40
8.96
8.53
8.16
7.85
7.51
7.16
6.90
6.69
6.42
6.16
5.99
5.83
5.58
5.39
5.30
5.18
5.08
4.71
4.66
4.45
164.42
156.85
149.28
141.88
134.79
127.97
121.56
115.06
109.18
103.40
98.12
92.76
87.50
82.76
78.52
74.16
69.37
65.14
61.15
56.80
52.55
49.08
45.43
40.67
36.66
33.88
30.28
22.43
18.90
18.63
0.06
0.06
0.06
0.06
0.06
0.06
0.05
0.05
0.05
0.05
0.05
0.05
0.06
0.06
0.06
0.06
0.06
0.06
0.06
0.07
0.07
0.07
0.07
0.08
0.08
0.08
0.08
0.09
0.09
0.10
−0.30
−0.39
−0.35
−0.32
0.04
0.63
1.57
1.85
3.16
4.29
5.64
7.03
7.74
9.08
10.76
11.89
12.34
13.16
14.33
14.84
15.05
15.72
15.96
15.27
14.68
15.64
15.56
11.60
11.05
10.63
0.12
0.13
0.14
0.14
0.15
0.16
0.16
0.17
0.17
0.17
0.17
0.17
0.17
0.17
0.16
0.16
0.16
0.16
0.16
0.17
0.17
0.19
0.20
0.22
0.24
0.28
0.31
0.28
0.31
0.33
−22.91
−35.38
−46.54
−57.20
−61.41
−76.76
−85.75
−94.28
−102.4
−110.3
−118.5
−126.7
−134.8
−143.5
−152.7
−161.8
−171.9
177.4
166.81
156.07
145.29
135.65
126.23
117.62
110.35
104.05
97.10
91.75
84.80
80.37
1.1
1.1
1.1
1.1
1.1
1.1
1.2
1.2
1.2
1.2
1.2
1.2
1.2
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
Product specification
MAGNITUDE
(ratio)
BGA6489
f (MHz)
Philips Semiconductors
s21
s11
MMIC wideband medium power amplifier
2003 Sep 18
Scattering parameters
VS = 8 V; IS = 74 mA; PD = −30 dBm; ZO = 50 Ω; Tamb = 25 °C
Philips Semiconductors
Product specification
MMIC wideband medium power amplifier
BGA6489
PACKAGE OUTLINE
Plastic surface mounted package; collector pad for good heat transfer; 3 leads
SOT89
B
D
A
b3
E
HE
L
1
2
3
c
b2
w M
b1
e1
e
0
2
4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b1
b2
b3
c
D
E
e
e1
HE
L
min.
w
mm
1.6
1.4
0.48
0.35
0.53
0.40
1.8
1.4
0.44
0.37
4.6
4.4
2.6
2.4
3.0
1.5
4.25
3.75
0.8
0.13
OUTLINE
VERSION
SOT89
2003 Sep 18
REFERENCES
IEC
JEDEC
EIAJ
TO-243
SC-62
10
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
99-09-13
Philips Semiconductors
Product specification
MMIC wideband medium power amplifier
BGA6489
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Sep 18
11
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected].
SCA75
© Koninklijke Philips Electronics N.V. 2003
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R77/01/pp12
Date of release: 2003
Sep 18
Document order number:
9397 750 11767