ROHM BR34L02FV-W_09

Double-cell Memory for Plug & Play
DDR1/DDR2
(For memory module) SPD Memory
BR34L02FV-W
No.09002EAT04
●Description
BR34L02FV-W is 256×8 bit Electrically Erasable PROM (Based on Serial Presence Detect)
●Features
1) 256×8 bit architecture serial EEPROM
2) Wide operating voltage range: 1.7V-5.5V
3) Two-wire serial interface
4) High reliability connection using Au pads and Au wires
5) Self-Timed Erase and Write Cycle
6) Page Write Function (16byte)
7) Write Protect Mode
Write Protect 1 (Onetime Rom)
: 00h-7Fh
Write Protect 2 (Hardwire WP PIN) : 00h-FFh
8) Low Power consumption
Write
( at 5V ) :1.2mA (typ.)
Read
( at 5V ) :0.2mA(typ.)
Standby ( at 5V ) :0.1µA(typ.)
9) DATA security
Write protect feature (WP pin)
Inhibit to WRITE at low VCC
10) Compact package: SSOP-B8
11) High reliability fine pattern CMOS technology
12) Rewriting possible up to 1,000,000 times
13) Data retention: 40 years
14) Noise reduction Filtered inputs in SCL / SDA
15) Initial data FFh at all addresses
●Absolute Maximum Ratings (Ta=25℃)
Parameter
Symbol
Supply Voltage
VCC
Power Dissipation
Pd
Storage Temperature
Tstg
Operating Temperature
Topr
Terminal Voltage
-
Rating
-0.3~+6.5
300*
-65~+125
-40~+85
-0.3~VCC+0.3
Unit
V
mW
℃
℃
V
Rating
1.7~5.5
0~VCC
Unit
V
V
* Reduce by 3.0 mW/C over 25C
●Recommended operating conditions
Parameter
Symbol
Supply Voltage
VCC
Input Voltage
VIN
●Memory cell characteristics(Ta=25℃, VCC=1.7V~5.5V)
Specification
Parameter
Min.
Typ.
Max.
Unit
Write / Erase Cycle
*1
1,000,000
-
-
Cycles
Data Retention
*1
40
-
-
Years
*1:Not 100% TESTED
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1/17
2009.04 - Rev.A
Technical Note
BR34L02FV-W
●Electrical characteristics - DC(Unless otherwise specified Ta=-40℃~+85℃, VCC=1.7V~5.5V)
Specification
Parameter
Symbol
Unit
Min.
Typ.
Max.
Test Condition
"H" Input Voltage 1
VIH1
0.7 VCC
-
-
V
2.5V≦VCC≦5.5V
"L" Input Voltage 1
VIL1
-
-
0.3 VCC
V
2.5V≦VCC≦5.5V
"H" Input Voltage 2
VIH2
0.8 VCC
-
-
V
1.7V≦VCC<2.5V
"L" Input Voltage 2
VIL2
-
-
0.2 VCC
V
1.7V≦VCC<2.5V
"L" Output Voltage 1
VOL1
-
-
0.4
V
IOL=3.0mA,2.5V≦VCC≦5.5V(SDA)
"L" Output Voltage 2
VOL2
-
-
0.2
V
IOL=0.7mA,1.7V≦VCC<2.5V(SDA)
Input Leakage Current 1
ILI1
-1
-
1
µA
VIN=0V~VCC(A0,A1,A2,SCL)
Input Leakage Current 2
ILI2
-1
-
15
µA
VIN=0V~VCC(WP)
Output Leakage Current
ILO
-1
-
1
µA
VOUT=0V~VCC (SDA)
ICC1
-
-
2.0
mA
ICC2
-
-
0.5
mA
ISB
-
-
2.0
µA
Operating Current
Standby Current
VCC=5.5V,fSCL=400kHz,tWR=5ms
Byte Write
Page Write
Write Protect
VCC =5.5V,fSCL=400kHz
Random Read
Current Read
Sequential Read
VCC =5.5V,SDA,SCL= VCC
A0,A1,A2=GND,WP=GND
○Note: This IC is not designed to be radiation-resistant.
●Electrical characteristics - AC(Unless otherwise specified Ta=-40℃~+85℃, VCC =1.7V~5.5V)
FAST-MODE
STANDARD-MODE
2.5V≦VCC≦5.5V
1.7V≦VCC≦5.5V
Parameter
Symbol
Min.
Typ.
Max.
Min.
Typ.
Max.
Clock Frequency
fSCL
400
100
Data Clock High Period
tHIGH
0.6
4.0
Data Clock Low Period
tLOW
1.2
4.7
SDA and SCL Rise Time *1
tR
0.3
1.0
SDA and SCL Fall Time *1
tF
0.3
0.3
Start Condition Hold Time
tHD:STA
0.6
4.0
Start Condition Setup Time
tSU:STA
0.6
4.7
Input Data Hold Time
tHD:DAT
0
0
Input Data Setup Time
tSU:DAT
50
50
Output Data Delay Time
tPD
0.1
0.9
0.2
3.5
Output Data Hold Time
tDH
0.1
0.2
Stop Condition Setup Time
tSU:STO
0.6
4.7
Bus Free Time
tBUF
1.2
4.7
Write Cycle Time
tWR
5
5
Noise Spike Width (SDA and SCL)
tI
0.1
0.1
WP Hold Time
tHD:WP
0
0
WP Setup Time
tSU:WP
0.1
0.1
WP High Period
tHIGH:WP
1.0
1.0
-
Unit
kHz
µs
µs
µs
µs
µs
µs
ns
ns
µs
µs
µs
µs
ms
µs
ns
µs
µs
*1:Not 100% TESTED
■Fast / Standard Modes
Fast mode and Standard mode differ only in operation frequency. Operations performed at 100kHz are considered in
"Standard-mode", while those conducted at 400kHz are in "Fast-mode".
Please note that these clock frequencies are maximum values. At lower power supply voltage it is difficult to operate at high speeds.
The EEPROM can operate at 400kHz, between 2.5V and 5.5V, and at 100kHz from 1.7V-5.5V.
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2/17
2009.04 - Rev.A
Technical Note
BR34L02FV-W
●Synchronous Data Timing
tR
tF
tHIGH
SCL
SCL
tSU:DAT tLOW
tHD:STA
tHD:DAT
tSU:STA
SDA
(IN)
tBUF
tPD
tHD:STA
tSU:STO
SDA
tDH
SDA
(OUT)
START BIT
STOP BIT
Fig.1-(b) Start/Stop Bit Timing
Fig.1-(a) Synchronous Data Timing
○SDA data is latched into the chip at the rising edge ○
of SCL clock.
○Output data toggles at the falling edge of SCL clock.
SCL
SCL
DATA(1)
SDA
SDA
D0
D1
D0
DATA(n)
ACK
ACK
tWR
ACK
tWR
WRITE DATA(n)
STOP CONDITION
Stop Condition
WP
START CONDITION
tSU:WP
tHD:WP
Fig.1-(d) WP Timing Of The Write Operation
Fig.1-(c) Write Cycle Timing
SCL
DATA(n)
DATA(1)
SDA
D1
D0
ACK
ACK
tHIGH:WP
tWR
WP
Fig.1-(e) WP Timing Of The Write Cancel Operation
○For WRITE operation, WP must be "Low" from the rising edge of the
clock (which takes in D0 of first byte) until the end of tWR. (See
Fig.1-(d) ) During this period, WRITE operation can be canceled by
setting WP "High".(See Fig.1-(e))
○When WP is set to "High" during tWR, WRITE operation is
immediately ceased, making the data unreliable. It must then be
re-written.
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3/17
2009.04 - Rev.A
Technical Note
BR34L02FV-W
●Block diagram
A0
1
2 Kbit EEPROM ARRAY
ADDRESS
2
DECODER
8bit
SLAVE , WORD
DATA
ADDRESS REGISTER
REGISTER
START
A2
3
VCC
7
WP
6
SCL
5
SDA
8bit
8bit
A1
8
STOP
CONTOROL LOGIC
ACK
GND
4
HIGH VOLTAGE GEN.
VCC LEVEL DETECT
Fig.2 Block Diagram
●Pinout diagram and description
Pin Name
Input/Output
7 WP
VCC
GND
A0,A1,A2
SCL
IN
IN
A2 3
6 SCL
SDA
IN / OUT
GND 4
5 SDA
WP
IN
A0 1
8 VCC
A1 2
Functions
Power Supply
Ground 0V
Slave Address Set.
Serial Clock Input
BR34L02FV-W
Slave and Word Address,
Serial Data Input, Serial Data Output
*1
Write Protect Input
*2
*1 Open drain output requires a pull-up resistor.
*2 WP Pin has a Pull-Down resistor. Please leave unconnected or
connect to GND when not in use.
Fig.3 Pin Configuration
6
5
5
4
4
SPEC
3
0.8
Ta=85℃
Ta=-40℃
Ta=25℃
3
2
Ta=85℃
Ta=-40℃
Ta=25℃
2
1
VOL1[V]
6
VIL1,2[V]
VIH1,2[V]
●Electrical characteristics curves
The following characteristic data are typ. value.
SPEC
Ta=85℃
0.4
Ta=25℃
0.2
1
1
0.6
SPEC
Ta=-40℃
0
0
0
1
2
3
4
5
0
0
6
1
2
3
4
5
6
0
1
2
V CC [V]
VCC[V]
Fig.4 "H" Input Voltage VIH1,2
(A0,A1,A2,SCL,SDA,WP)
5
6
16
1.2
SPEC
SPEC
1
0.8
4
Fig.6 "L" Output Voltage
VOL1-IOL1 (VCC=2.5V)
Fig.5 "L" Input Voltage VIL1,2
(A0,A1,A2,SCL,SDA,WP)
1
3
IOL1[mA]
12
Ta=85℃
Ta=25℃
0.4
ILI2[μA]
ILI1[μA]
VOL2[V]
0.8
0.6
0.6
8
Ta=85℃
Ta=25℃
Ta=-40℃
0.4
SPEC
0.2
0.2
Ta=-40℃
4
Ta=85℃
Ta=25℃
Ta=-40℃
0
0
0
0
1
2
3
4
5
6
IOL2[mA]
Fig.7 "L" Output Voltage
VOL2-IOL2 (VCC=1.7V)
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© 2009 ROHM Co., Ltd. All rights reserved.
0
1
2
3
4
5
6
V CC [V]
Fig.8 Input Leakage Current
ILI1 (A0,A1,A2,SCL,SDA)
4/17
0
1
2
3
4
5
6
V CC [V]
Fig.9 Input Leakage Current
ILI2 (WP)
2009.04 - Rev.A
Technical Note
BR34L02FV-W
2.5
0.6
SPEC
SPEC
Ta=25℃
Ta=85℃
Ta=-40℃
0.5
0.5
0.5
fSCL=400kHz
0.4 DATA=AAh
0.4
ICC2[mA]
1
ICC2[mA]
ICC1[mA]
fSCL=400kHz(VCC≧2.5V)
fSCL=100kHz(1.7V≦Vcc<2.5V)
DATA=AA
1.5
0.6
SPEC
2
0.3
Ta=25℃
Ta=85℃
fSCL=100kHz
DATA=AAh
0.3
Ta=85℃
0.2
Ta=25℃
0.2
Ta=-40℃
0.1
0.1
Ta=-40℃
0
0
0
1
2
3
4
5
0
0
6
1
2
VCC[V]
3
4
Fig.10 Write Operating Current
ICC1 (fSCL=100kHz,400kHz)
0
10000
2
1
SPEC1
1
2
SPEC2
4
5
1
2
3
4
5
6
0
3
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
2
SPEC1
Ta=85℃
Ta=25℃
Ta=-40℃
1
Ta=-40℃
Ta=25℃
Ta=85℃
SPEC1
1
3
4
5
1
2
Fig.16 Data Clock Low Period
tLow
3
4
5
6
Ta=-40℃
Ta=25℃
Ta=85℃
SPEC1
0
1
2
3
4
5
6
VCC[V]
Fig.17 Start Condition Hold Time
tHD:STA
50
Fig.18 Start Condition Setup Time
tSU:STA
50
200
SPEC1,2
SPEC1,2
Ta=85℃
Ta=25℃
Ta=-40℃
-50
-100
0
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
-50
Ta=85℃
-100
-150
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
tSU:DAT(HIGH)[ns]
tHD:DAT(LOW)[μs]
0
Ta=-40℃
Ta=25℃
-200
-200
3
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
2
VCC[V]
VCC[V]
2
6
0
0
6
3
1
0
0
1
5
SPEC2
4
tSU:STA[μs]
tHD:STA[μs]
2
0
4
5
4
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
-150
3
SPEC2
4
2
2
Fig.15 Data Clock High Period
tHigh
5
1
Ta=-40℃
Ta=85℃
V CC [V]
Fig.14 Clock Frequency
fSCL
SPEC2
0
1
V CC [V]
5
3
Ta=25℃
SPEC1
1
0
0
6
Fig.13 Standby Current
ISB
tHD:DAT(HIGH)[μs]
2
SPEC1:FAST-MODE
SPEC2:STANDARD-MOD
Ta=25℃
3
Vcc[V]
VCC[V]
6
SPEC1:FASTE
SPEC1:FAST-MODE
SPEC2:STANDD-MODE
SPEC2:STANDARD-MO
3
1
0
5
SPEC2
100
0
4
4
10
Ta=-40℃
3
5
Ta=85℃
Ta=25℃
Ta=-40℃
tHIGH[μs]
fSCL[kHz]
1.5
Ta=85℃
2
Fig.12 Read Operating Current
ICC2 (fSCL=100kHz)
1000
0.5
1
V CC [V]
SPEC
ISB[μA]
6
Fig.11 Read Operating Current
ICC2 (fSCL=400kHz)
2.5
tLOW[μs]
5
V CC [V]
4
5
6
0
1
2
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4
5
6
VCC[V]
VCC[V]
Fig.19 Input Data Hold Time
tHD:DAT(High)
3
Fig.20 Input Data Hold Time
tHD:DAT(LOW)
5/17
100
SPEC1,2
Ta=85℃
Ta=25℃
Ta=-40℃
0
-100
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
-200
0
1
2
3
4
5
6
Vcc[V]
VCC[V]
Fig.21 Input Data Setup Time
tSU:DAT(High)
2009.04 - Rev.A
Technical Note
BR34L02FV-W
4
4
Ta=85℃
0
SPEC2
3
SPEC1,2
3
SPEC1:FAST-MODE
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
SPEC2:STANDARD-MODE
2
SPEC1
-100
SPEC1
-200
0
1
Ta=85℃
Ta=25℃
Ta=-40℃
SPEC2
1
Ta=-40℃
Ta=25℃
2
3
4
5
tDH[μs]
100
tPD[μs]
tSU:DAT(Low)[ns]
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
tDH[μs]
200
1
2
3
4
5
SPEC1
6
0
V CC [V]
VCC[V]
Fig.22 Input Data Setup Time
tSU:DAT(Low)
Fig.23 Output Data Delay Time
tPD
3
SPEC1
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
2
1
2
3
4
5
1
2
3
4
5
6
0
0.6
Ta=85℃
0.2
0.3
Ta=-40℃
0.2
Ta=25℃
1
2
3
4
5
0
6
1
2
VCC[V]
3
4
5
SPEC1,2
0
6
0
1
2
3
Fig.30 Noise Spike Width
tI(SDA H)
Ta=85℃
1
SPEC1,2
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
-0.2
Ta=25℃
Ta=85℃
tHIGH:WP[μs]
tSU:WP[μs]
0.3
0.8
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
0.6
0.4
-0.4
-0.6
0
2
3
4
5
6
0
0
1
2
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3
4
5
6
0
1
2
3
4
5
6
VCC[V]
VCC[V]
Fig.32 WP Setup Time
tSU:WP
Fig.33 WP High Period
tHigh:WP
VCC[V]
Fig.31 Noise Spike Width
tI(SDA L)
Ta=-40℃
Ta=25℃
Ta=85℃
0.2
Ta=-40℃
SPEC1,2
1
6
SPEC1,2
Ta=-40℃
0
5
1.2
0
0.4
0.1
4
VCC[V]
0.2
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
Ta=25℃
Ta=85℃
0.2
Fig.29 Noise Spike Width
tI(SCL L)
0.6
0.2
Ta=-40℃
Ta=25℃
0.3
V CC [V]
Fig.28 Noise Spike Width
tI(SCL H)
0.5
0.4
0.1
SPEC1,2
0
0
6
Ta=85℃
0.1
0
5
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
0.5
0.4
SPEC1,2
0.1
4
0.6
tI(SDA H)[μs]
tI(SCL L)[μs]
Ta=25℃
3
Fig.27 Write Cycle Time
tWR
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
0.5
Ta=-40℃
0.4
0.3
2
VCC[V]
0.6
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
0.5
1
Fig.26 Bus Free Time
tBUF
Fig.25 Stop Condition Setup Time
tSU:STO
tI(SCL H)[μs]
Ta=85℃
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
VCC[V]
VCC[V]
tI(SDA L)[μs]
3
0
0
6
Ta=25℃
1
0
0
0
Ta=85℃
Ta=25℃
Ta=-40℃
SPEC1
1
Ta=85℃
Ta=25℃
Ta=-40℃
6
Ta=-40℃
2
1
5
5
tWR[ms]
tBUF[μs]
tSU:STO[μs]
2
4
SPEC1,2
SPEC2
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
3
6
4
3
2
Fig.24 Output Data Hold Time
tDH
4
4
1
VCC[V]
5
SPEC2
Ta=85℃
Ta=25℃
Ta=-40℃
SPEC2
0
0
5
2
1
0
6
SPEC1:FAST-MODE
SPEC2:STANDARD-MODE
6/17
2009.04 - Rev.A
Technical Note
BR34L02FV-W
●Data transfer on the I2C BUS
○Data transfer on the I2C BUS
The BUS is considered to be busy after the START condition and free a certain time after the STOP condition.
Every SDA byte must be 8-bits long and requires an ACKNOWLEDGE signal after each byte. The devices have Master
and Slave configurations. The Master device initiates and ends data transfer on the BUS and generates the clock signals
in order to permit transfer.
The EEPROM in a slave configuration is controlled by a unique address. Devices transmitting data are referred to as the
Transmitter. The devices receiving the data are called Receiver.
○START Condition (Recognition of the START bit)
・All commands are proceeded by the start condition, which is a High to Low transition of SDA when SCL is High.
・The device continuously monitors the SDA and SCL lines for the start condition and will not respond to any command
until this condition has been met. (See Fig.1-(b) START/STOP Bit Timing)
○STOP Condition (Recognition of STOP bit)
・All communications must be terminated by a stop condition, which is a Low to High transition of SDA when SCL is High.
(See Fig.1-(b) START/STOP Bit Timing)
○Acknowledge
・ Acknowledge is a software used to indicate successful data transfers. The Transmitter device will release the BUS after
transmitting eight bits. When inputting the slave address during write or read operation, the Transmitter is the µ-COM.
When outputting the data during read operation, the Transmitter is the EEPROM.
・During the ninth clock cycle the Receiver will pull the SDA line Low to verify that the eight bits of data have been
received. (When inputting the slave address during write or read operation, EEPROM is the receiver. When outputting
the data during read operation the receiver is the µ-COM.)
・The device will respond with an Acknowledge after recognition of a START condition and its slave address (8bit).
・In WRITE mode, the device will respond with an Acknowledge after the receipt of each subsequent 8-bit word (word
address and write data).
・In READ mode, the device will transmit eight bits of data, release the SDA line, and monitor the line for an Acknowledge.
・If an Acknowledge is detected and no STOP condition is generated by the Master, the device will continue to transmit
the data. If an Acknowledge is not detected, the device will terminate further data transmissions and await a STOP
condition before returning to standby mode.
○Device Addressing
・Following a START condition, the Master outputs the Slave address to be accessed. The most significant four bits
of the slave address are the “device type indentifier.” For this EEPROM it is “1010.” (For WP register access this code
is "0110".)
・The next three bits identify the specified device on the BUS (device address). The device address is defined by the state
of the A0,A1 and A2 input pins. This IC works only when the device address input from the SDA pin corresponds to the
status of the A0,A1 and A2 input pins. Using this address scheme allows up to eight devices to be connected to the
BUS. The last bit of the stream (R/W…READ/WRITE) determines the operation to be performed.
R/W=0
R/W=1
Device Type
WRITE (including word address input of Random Read)
READ
Device Address
Read Write
Mode
R/W
R/W
Access Area
1010
A2
A1
A0
Access to Memory
0110
A2
A1
A0
Access to Write Protect Register
○Write Protect command
The Write Protect command cancels any write commands that access addresses 00~7Fh.
The Write Protect Register can be written to once (One time Rom).
Once this command is excuted, the data is protected forever.
○Write Protect Pin (WP)
When the WP pin set to Vcc (H level), write protect is set for 256 words (all addresses). WP pin set to GND (L level)
enables writing of 256 words (all addresses).
If permanent protection is implemented by the Write Protect command, writing is prohibited in the the lower half area
(addresses 00~7Fh) regardless of the WP pin status.
The WP pin has a pulldown resistor. Please leave unconnected or connect to GND when not in use.
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7/17
2009.04 - Rev.A
Technical Note
BR34L02FV-W
●Command
○Write Cycle
During WRITE CYCLE operation data is written in the EEPROM. The Byte Write Cycle is used to write only one byte. In
the case of writing continuous data consisting of more than one byte, Page Write is used. The maximum bytes that can
be written at one time is 16 bytes.
S
T
A
R
T
SDA
LINE
W
R
I
T
E
SLAVE
ADDRESS
WORD
ADDRESS
WA
7
1 0 1 0 A2 A1 A0
S
T
O
P
DATA
WA
0
D7
D0
A
C
K
R A
/ C
W K
A
C
K
Fig.34 Byte Write Cycle Timing
S
T
A
R
T
SDA
L IN E
S LA V E
ADDRESS
W
R
I
T
E
W ORD
A D D R E S S (n )
WA
7
1 0 1 0 A 2A 1A 0
R A
/ C
W K
D A TA (n)
WA
0
D7
A
C
K
S
T
O
P
D A TA (n + 1 5)
D0
D0
A
C
K
A
C
K
Fig.35 Page Write Cycle Timing
・With this command the data is programmed into the indicated word address.
・When the Master generates a STOP condition, the device begins the internal write cycle to the nonvolatile memory array.
This device is capable of sixteen-byte Page Write operations.
Once programming is started no commands are accepted for tWR (5ms max.).
If the Master transmits more than sixteen words prior to generating the STOP condition, the address counter will “roll
over” and the previously transmitted data will be overwritten.
When two or more byte of data are input, the four low order address bits are internally incremented by one after the
receipt of each word, while the four higher order bits of the address (WA7~WA4) remain constant.
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8/17
2009.04 - Rev.A
Technical Note
BR34L02FV-W
○Read Cycle
During Read Cycle operation data is read from the EEPROM. The Read Cycle is composed of Random Read Cycle and
Current Read Cycle. The Random Read Cycle reads the data in the indicated address.
The Current Read Cycle reads the data in the internally indicated address and verifies the data immediately after the
Write Operation. The Sequential Read operation can be performed with both Current Read and Random Read. With the
Sequential Read Cycle it is possible to continuously read the next data.
It is necessary to input
“High” at last ACK timing.
S
T
A
R
T
SDA
L IN E
W
R
I
T
E
SLAVE
ADDRESS
W ORD
A D D R E S S (n )
WA
7
1 0 1 0 A 2 A 1A 0
S
T
A
R
T
WA
0
R A
/ C
W K
SLAVE
ADDRESS
R
E
A
D
S
T
O
P
D A TA (n)
1 0 1 0 A 2 A 1A 0
D7
D0
A
C
K
R A
/ C
W K
A
C
K
Fig.36 Random Read Cycle Timing
S
T
A
R
T
SDA
LINE
R
E
A
D
SLAVE
ADDRESS
S
T
O
P
DATA
1 0 1 0 A2 A1 A0
D7
It is necessary to input
“High” at last ACK timing.
D0
A
C
K
R A
/ C
W K
Fig.37 Current Read Cycle Timing
・Random Read operation allows the Master to access any memory location indicated by word address.
・In cases where the previous operation is Random or Current Read (which includes Sequential Read), the internal
address counter is increased by one from the last accessed address (n). Thus Current Read outputs the data of the
next word address (n+1).
・If an Acknowledge is detected and no STOP condition is generated by the Master (µ-COM), the device will continue to
transmit data. (It can transmit all data (2kbit 256word))
・If an Acknowledge is not detected, the device will terminate further data transmissions and await a STOP condition
before returning to standby mode.
・If an Acknowledge is detected with the "Low" level (not "High" level), the command will become Sequential Read, and
the next data will be transmitted. Therefore, the Read command is not terminated. In order to terminate Read input
Acknowledge with "High" always, then input a STOP condition.
S
T
A
R
T
SDA
L IN E
R
E
A
D
SLAVE
ADDRESS
1 0 1 0 A 2A 1A 0
D A T A (n )
D7
R A
/ C
W K
S
T
O
P
D A T A (n + x)
D0
D7
A
C
K
A
C
K
It is necessary to
input “High” at
last ACK timing.
D0
A
C
K
Fig.38 Sequential Read Cycle Timing (With Current Read)
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9/17
2009.04 - Rev.A
Technical Note
BR34L02FV-W
●Software Reset
Execute software reset in the event that the device is in an unexpected state after power up and/or the command input
needs to be reset. Below are three types(Fig.39 –(a), (b), (c)) of software reset:
・During dummy clock, release the SDA BUS (tied to VCC by a pull-up resistor) .
・During this time the device may pull the SDA line Low for Acknowledge or the outputting of read data.
・If the Master sets the SDA line to High, it will conflict with the device output Low, which can cause current overload and
result in instantaneous power down, which may damage the device.
DUMMY CLOCK×14
SCL
1
2
13
START×2
COMMAND
14
SDA
COMMAND
Fig.39-(a) DUMMY CLOCK×14 + START+START
START
1
SCL
START
DUMMY CLOCK×9
2
8
9
COMMAND
SDA
COMMAND
Fig.39-(b) START + DUMMY CLOCK×9 + START
START×9
SCL
1
3
2
7
8
9
COMMAND
SDA
COMMAND
Fig.39-(c) START×9
* COMMAND starts with start condition.
●Acknowledge polling
Since the IC ignores all input commands during the internal write cycle, no ACK signal will be returned.
When the Master sends the next command after the Write command, if the device returns an ACK signal it means that the
program is completed. No ACK signal indicates that the device is still busy.
Using Acknowledge polling decreases the waiting time by tWR=5ms.
When operating Write or Current Read after Write, first transmit the Slave address (R/W is"High" or "Low"). After the device
returns the ACK signal continue word address input or data output.
During the internal write cycle,
no ACK will be returned.
THE FIRST WRITE COMMAND
(ACK=High)
S
T
A
R
T
WRITE COMMAND
S
T
A
R
T
S
T
O
P
SLAVE
ADDRESS
A
C
K
H
S
T
A
R
T
SLAVE
ADDRESS
A
C
K
H
・・・
tWR
THE SECOND WRITE COMMAND
・・・
S
T
A
R
T
SLAVE
ADDRESS
A
C
K
H
S
T
A
R
T
SLAVE
ADDRESS
tWR
A
C
K
L
WORD
ADDRESS
A
C
K
L
DATA
A
C
K
L
S
T
O
P
After the internal write cycle
is completed, ACK will be returned
(ACK=Low). Then input next
Word Address and data.
Fig.40 Successive Write Operation By Acknowledge Polling
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10/17
2009.04 - Rev.A
Technical Note
BR34L02FV-W
●WP effective timing
WP is normally fixed at "H" or "L". However, in case WP needs to be controlled in order to cancel the Write command, pay
attention to “WP effective timing” as follows:
The Write command is canceled by setting WP to "H" within the WP cancellation effective period.
The period from the START condition to the rising edge of the clock (which takes in the data DO - the first byte of the Page Write
data) is the ‘invalid cancellation period’. WP input is considered inconsequential during this period. The setup time for the rising
edge of the SCL, which takes in DO, must be more than 100ns.
The period from the rising edge of SCL (which takes in the data D0) to the end of internal write cycle (tWR) is the ‘effective
cancellation period’. When WP is set to "H" during tWR, Write operation is stopped, making it necessary to rewrite the data.
It is not necessary to wait for tWR (5ms max.) after stopping the Write command by WP because the device is in standby mode.
・The
rising edge of the clock
which take in D0
SCL
SDA
D1
D0
・The rising edge
・of SDA
SCL
SDA
ACK
D0
AN
AN ENLARGEMENT
SDA
S
A
T SLAVE C WORD
A
K
R ADDRESS L ADDRESS
T
WP
ACK
ENLARGEMENT
A
A
C
C
D7
D6
D2
D5
D1
D0
D3
D4
K
K
L
L
DATA
A
C
K
L
S
T
O
P
tWR
WP cancellation
WP cancellation
Stop of the write
invalid period
effective period
operation
Data is not
No
data
will
be
guaranteed
Fig.41 WP effective timing
●Command cancellation from the START and STOP conditions
Command input is canceled by successive inputs of START and STOP conditions. (Refer to Fig.42)
However, during ACK or data output, the device may set the SDA line to Low, making operation of the START and STOP
conditions impossible, and thus preventing reset. In this case execute reset by software. (Refer to Fig.39)
The internal address counter will not be determined when operating the Cancel command by the START and STOP
conditions during Random, Sequential or Current Read. Operate a Random Read in this case.
SCL
SDA
1
0
1
0
START
CONDITION
STOP
CONDITION
Fig.42 Command cancellation by the START and STOP conditions during input of the Slave Address
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11/17
2009.04 - Rev.A
Technical Note
BR34L02FV-W
●I/O Circuit
○SDA Pin Pull-up Resistor
A pull-up resistor is required because SDA is an NMOS open drain. Determine the resistor value of (RPU) by considering
the VIL and IL, and VOL-IOL characteristics. If a large RPU is chosen, the clock frequency needs to be slow. A smaller
RPU will result in a larger operating current.
○Maximum RPU
The maximum of RPU can be determined by the following factors.
①The SDA rise time determined by RPU and the capacitance of the BUS line(CBUS) must be less than tR.
In addition, all other timings must be kept within the AC specifications.
②When the SDA BUS is High, the voltage A at the SDA BUS is determined from the total input leakage(IL) of all devices
connected to the BUS. RPU must be higher than the input High level of the microcontroller and the device, including a
noise margin 0.2VCC.
Microcontroller
VCC-ILRPU-0.2 VCC ≧ VIH
∴
R PU
≦
BR34L02FV-W
0.8VCC -VIH
IL
RPU
SDA PIN
A
Examples: When VCC =3V, IL=10µA, VIH=0.7 VCC
IL
According to ②
RPU
IL
0.8×3-0.7×3
≦
10×10-6
THE CAPACITANCE
OF BUS LINE (CBUS)
≦ 300 [kΩ]
○Minimum RPU
Fig.43 I/O Circuit
The minimum value of RPU is determined by following factors.
①Meets the condition that VOLMAX=0.4V, IOLMAX=3mA when the output is Low.
VCC -VOL
≦ IOL
R PU
VCC -VOL
IOL
②VOLMAX=0.4V must be lower than the input Low level of the microcontroller and the EEPROM
including the recommended noise margin of 0.1VCC.
VOLMAX ≦ VIL-0.1 VCC
∴
RPU ≧
RPU ≧
3-0.4
3×10 -3
≧ 867 [Ω]
VOL=0.4[V]
VIL=0.3×3
=0.9[V]
so that condition ② is met
and
○SCL Pin Pull-up Resistor
When SCL is controlled by the CMOS output the pull-up resistor at SCL is not required.
However, should SCL be set to Hi-Z, connection of a pull-up resistor between SCL and VCC is recommended.
Several kΩ are recommended for the pull-up resistor in order to drive the output port of the microcontroller.
●A0, A1, A2, WP Pin connections
○Device Address Pin (A0, A1, A2) connections
The status of the device address pins is compared with the device address sent by the Master. One of the devices that is
connected to the identical BUS is selected. Pull up or down these pins or connect them to VCC or GND. Pins that are not
used as device address (N.C.Pins) may be High, Low, or Hi-Z.
○WP Pin connection
The WP input allows or prohibits write operations. When WP is High, only Read is available and Write to all address is
prohibited. Both Read and Write are available when WP is Low.
In the event that the device is used as a ROM, it is recommended that the WP input be pulled up or connected to VCC.
When both READ and WRITE are operated, the WP input must be pulled down or connected to GND or controlled.
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12/17
2009.04 - Rev.A
Technical Note
BR34L02FV-W
●Microcontroller connection
○Concerning Rs
2
The open drain interface is recommended for the SDA port in the I C BUS. However, if the Tri-state CMOS interface is
applied to SDA, insert a series resistor (Rs) between the SDA pin of the device and the pull up resistor RPU is
recommended, since it will serve to limit the current between the PMOS of the microcontroller, and the NMOS of the
EEPROM. Rs also protects the SDA pin from surges. Therefore, Rs is able to be used though open drain inout of the
SDA port.
ACK
RPU
SCL
RS
SDA
'H'OUTPUT OF
CONTROLLER
“L” OUTPUT OF EEPROM
CONTROLLER
The “H” output of controller and the “L” output of
EEPROM may cause current overload to SDA line.
EEPROM
Fig.44 I/O Circuit
○Rs Maximum
The maximum value of Rs is determined by following factors.
①SDA rise time determined by RPU and the capacitance value of the BUS line (CBUS) of SDA must be less than tR. In
addition, the other timings must be within the timing conditions of the AC.
A
is determined by RPU, and Rs must be lower than
②When the output from SDA is Low, the voltage of the BUS at ○
the input Low level of the microcontroller, including recommended noise margin (0.1VCC).
VCC
(VCC-VOL)×RS
R PU+R S
RPU A
RS
VOL
∴ RS ≦
IOL
BUS
CAPACITANCE
VIL
+ VOL+0.1VCC≦VIL
V IL -VOL -0.1VCC
1.1VCC-VIL
×
RPU
Examples : When VCC=3V V IL =0.3VCC V OL=0.4V R PU=20kΩ
EEPROM
CONTROLLER
According to ② RS ≦
0.3×3-0.4-0.1×3
1.1×3-0.3×3
×
20×103
≦ 1.67[kΩ]
Fig.46 I/O Circuit
○Rs Minimum
The minimum value of Rs is determined by the current overload during BUS conflict.
Current overload may cause noises in the power line and instantaneous power down.
The following conditions must be met, where “I” is the maximum permissible current, which depends on the Vcc line
impedance as well as other factors. “I” current must be less than 10mA for EEPROM.
Vcc
≦
RS
RPU
"L" OUTPUT
RS
∴ RS ≧
I
Vcc
I
Examples: When VCC=3V, I=10mA
"H" OUTPUT
MAXIMUM
CURRENT
CONTROLLER
RS
≧
3
10×10-3
≧ 300[Ω]
EEPROM
Fig.47 I/O Circuit
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© 2009 ROHM Co., Ltd. All rights reserved.
13/17
2009.04 - Rev.A
Technical Note
BR34L02FV-W
●I2C BUS Input / Output equivalent circuits
○Input (A0,A2,SCL)
Fig.48 Input Pin Circuit
○Input / Output (SDA)
Fig.49 Input / Output Pin Circuit
○Input (A1)
Fig.50 Input Pin Circuit
○Input (WP)
Fig.51 Input Pin Circuit
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14/17
2009.04 - Rev.A
Technical Note
BR34L02FV-W
●Power Supply Notes
VCC increases through the low voltage region where the internal circuit of IC and the microcontroller are unstable. In order
to prevent malfunction, the IC has P.O.R and LVCC functionality. During power up, ensure that the following conditions are
met to guaranty P.O.R. and LVCC operability.
1. "SDA='H'" and "SCL='L' or 'H'".
2. Follow the recommended conditions of tR, tOFF, Vbot so that P.O.R. will be activated during power up.
tR
VCC
Recommended conditions of tR, tOFF, Vbot
tOFF
tR
tOFF
Vbot
Below 10ms
Above 10ms
Below 0.3V
Below 100ms
Above 10ms
Below 0.2V
Vbot
0
Fig.52 VCC rising wavefrom
3. Prevent SDA and SCL from being "Hi-Z".
In case that condition 1. and/or 2. cannot be met, take following actions.
A) If unable to keep Condition 1 (SDA is "Low" during power up)
→Make sure that SDA and SCL are "High" as in the figure below.
VCC
tLOW
SCL
SDA
After Vcc becomes stable
After Vcc becomes stable
tDH
tSU:DAT
Fig.53 SCL="H" and SDA="L"
tSU:DAT
Fig.54 SCL="L" and SDA="L"
B) If unable to keep Condition 2
→After the power stabilizes, execute software reset. (See page 9,10)
C) If unable to keep either Condition 1 or 2
→Follow Instruction A first, then B
●LVCC Circuit
The LVCC circuit prevents Write operation at low voltage and prevents inadvertent writing. A voltage below the LVCC voltage
(1.2V typ.) prohibits Write operation.
●VCC Noise
○Bypass Capacitor
Noise and surges on the power line may cause abnormal function. It is recommended that bypass capacitors (0.1µF) be
attached between VCC and GND externally.
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15/17
2009.04 - Rev.A
Technical Note
BR34L02FV-W
●Notes for Use
1) Descrived numeric values and data are design representative values, and the values are not guaranteed.
2)
We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics
further sufficiently. In the case of use by changing the fixed number of external parts, make your decision with
sufficient margin in consideration of static characteristics and transition characteristics and fluctuations of external
parts and our LSI.
3)
Absolute maximum ratings
If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded,
LSI may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case
of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it
that conditions exceeding the absolute maximum ratings should not be impressed to LSI.
4)
GND electric potential
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that
of GND terminal.
5)
Heat design
In consideration of permissible dissipation in actual use condition, carry out heat design with sufficient margin.
6)
Terminal to terminal short circuit and wrong packaging
When to package LSI on to a board, pay sufficient attention to LSI direction and displacement. Wrong packaging
may destruct LSI. And in the case of short circuit between LSI terminals and terminals and power source,
terminal and GND owing to foreign matter, LSI may be destructed.
7)
Use in a strong electromagnetic field may cause malfunction, therfore, evaluate design sufficiently
.
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16/17
2009.04 - Rev.A
Technical Note
BR34L02FV-W
●Ordering part number
B
R
3
ROHM type
4
L
BUS type
Priduct type
34:I2C
0
2
F
V
Capacity
Packagr
02= 2K
FV:SSOP-B8
-
W
E
2
W: Double Cell
Packaging and forming specification
E2: Embossed tape and reel
SSOP-B8
<Tape and Reel information>
3.0 ± 0.2
(MAX 3.35 include BURR)
0.3MIN
4.4±0.2
6.4±0.3
8 76 5
Tape
Embossed carrier tape
Quantity
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1.15±0.1
1 23 4
0.15 ± 0.1
0.1
S
0.1
+0.06
0.22 -0.04
(0.52)
0.08
M
0.65
1pin
(Unit : mm)
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© 2009 ROHM Co., Ltd. All rights reserved.
Reel
17/17
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.04 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
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