NEC ELECTRONICS INC. MAY 1999 TRQ-99-05-323 QUARTERLY MICROPROCESSOR/MICROCOMPUTER RELIABILITY REPORT This report contains reliability data on microprocessor and microcomputer devices fabricated at NEC Roseville and assembled at NEC Roseville or NEC Singapore. (Signatures on file) Prepared by D. Yee RQC Dept. Roseville Mfg. Approved by M. Mahal RQC Dept. Roseville Mfg. Please refer all inquiries to: NEC Electronics Inc. Attn: Reliability and Quality Assurance Department 7501 Foothills Boulevard Roseville, CA 95747 Tel. (916) 786-3900 The information in this document is subject to change without notice. No part of this document May be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which May appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied, or otherwise, is granted under any patents, copyrights, or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making a continuous effort to enhance the reliability, of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, firecontainment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard," "Special," and "Specific." The Specific quality grade applies only to devices developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment, and industrial robots. Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment, and medical equipment (not specifically designed for life support). Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, and life-support systems or medical equipment for life support, etc. The quality grade of NEC devices is Standard unless otherwise specified in NEC's data sheets or data books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. NEC Electronics Inc. is dedicated to the QCD principle of providing the highest Quality product at the lowest possible Cost with on-time Delivery to our customers. NEC Electronics Inc. Roseville Manufacturing Table of Contents Page Failure Rate Prediction..................................................................................................... 3 Table 1. Reliability Tests ................................................................................................. 4 Table 2. Reliability Test Results ...................................................................................... 5 Table 3. HTB Life Test Summary and Failure Rate Predictions ..................................... 6 Table 4. Other Life Test Summaries (HTSL, HHSL, T/H) ............................................. 8 Table 5. Environmental and Mechanical Test Summaries (TS, T/C, PCT) .................... 9 Table 6. Failure Summaries ............................................................................................. 10 Table 7. CMOS-4 Process Family, Quarterly Reliability Data (Jan-Mar 99) ................. 11 Table 8. CMOS-5 Process Family, Quarterly Reliability Data (Jan-Mar 99) ................. 11 2 NEC Electronics Inc. Roseville Manufacturing Failure Rate Prediction This report contains reliability test results of all microprocessor devices assembled in NEC Roseville that were subjected to routine Monitor Reliability Testing (MRT). It also contains failure rate predictions for these devices, calculated using the Arrhenius method shown below. L= Where: L X2 This report will be updated in September 1998. When predicting the failure rate at a certain temperature from accelerated life test data, various values of activation energy, corresponding to failure mechanisms, should be considered. This procedure is done whenever exact causes of failures are known by performing failure analysis. In some cases, however, an average activation energy is assumed in order to accomplish a quick first-order approximation. NEC assumes an average activation energy of 0.7 eV for CMOS-4 and lesser technologies and 0.45 eV for CMOS-5 and greater technologies for such approximations. These average values have been assessed from extensive reliability test results and yield a conservative failure rate. T ≡ Failure rate in %/1000 hours ≡ The tabular value of chi-squared distribution at a given confidence level and calculated degrees of freedom (2f + 2, where f = number of failures) ≡ T Number of equivalent device hours = (Number of devices) x (number of test hours) x (acceleration factor) Example A sample of 960 pieces was subjected to 1000 hours at 125°C burn-in. One reject was observed. Given that the acceleration factor was calculated to be 34.6 using equation (1), what is the failure rate, normalized to 55°C, using a confidence level of 60%? Express the failure rate in FIT. Solution For n = 2f + 2 = 2(1) + 2 = 4, X2 = 4.046. (1) Then L = Where: A ≡ Acceleration factor EA ≡ Activation energy T J1 T J2 ≡ Junction temperature (in K) at TA1 = 55°C ≡ Junction temperature (in K) at TA2 = 125°C k ≡ Boltzmann's constant = 8.62 x 10−5 eV/K (2) Another method of expressing failures is as FIT (failures in time). One FIT is equal to one failure in 109 hours. Since L is already expressed as %/1000 hours (10−5 failure/hr), an easy conversion from %/1000 hours to FIT would be to multiply the value of L by 104. Since life testing at NEC is performed under high-temperature ambient conditions, the Arrhenius relationship is used to normalize failure rate predictions at a system operation temperature of 55°C. The Arrhenius model includes the effects of temperature and activation energy of the failure mechanisms. This model assumes that the degradation of a performance parameter is linear with time. The temperature dependence is taken to be an exponential function that defines the probability of occurrence. The Arrhenius equation is: −E (T −T ) A= exp A J1 J2 k(T )(T ) J1 J2 X2 105 2T = = Because temperature dependence on power dissipation of a particular device type cannot be ignored, junction temperatures (TJ1 and TJ2) are used instead of ambient temperatures (TA1 and TA2) . Also, thermal resistance of a particular device cannot be ignored. These two factors cannot be accounted for unless junction temperatures are used. We calculate junction temperatures using the following formula: = TJ = TA + (Thermal Resistance) x (Power Dissipation at TA) From the high-temperature operating life test results, the failure rates can be predicted at a 60% confidence level using the following equation: 3 X2 105 2T (%/1000H) X2 105 2 (s.s.)(test hrs)(acc. factor) (4.046) 105 2(960)(1000)(34.6) 0.0061 %/1000H Therefore, FIT = (0.0061)(104) = 61 NEC Electronics Inc. Roseville Manufacturing Table 1. Reliability Tests The major reliability tests performed by NEC consist of high-temperature bias (HTB), 85°C/85% relative humidity (T/H), high-temperature storage life (HTSL), and high-humidity storage life (HHSL) tests. Additionally, various environmental and mechanical tests are performed. This table shows the conditions of the various life tests, environmental tests, and mechanical tests. Test Item High-temperature bias life Symbol HTB MIL-STD 883C Method 1005 Condition TA = 125°C, Remarks Note 1 High-temperature storage life Temperature and humidity life HTSL 1008 VCC = 5.5 V. TA = 150°C. Note 1 High-humidity storage life HHSL Pressure cooker PCT T/H TA = 85°C, RH = 85%. VDD = 5.5 V, alternate pin bias. TA = 85°C, RH = 85%. TA = 125°C, Temperature cycle T/C 1010 Lead fatigue LI 2004 Solderability SD 2003 Soldering heat Temperature cycle Thermal shock Notes: TS RH = 100% P = 2.3 atm. −65° to 150°C, 1 hour/ cycle. 125g (DIP) 250g (QFP), three bends, 90°, without breaking. TA = 230°C, 5 sec, rosinbased flux. 260°C, 10 sec, rosin based flux. 215°C VPS 235°C, IR reflow 10 cycles, −65° to 150°C. 15 cycles, 0° to 100°C. Note 3 1010 1011 Notes 1, 2 Notes 1, 2 Notes 1, 2 Note 1 Note 4 Note 5 DIP PLCC QFP Note 1 1. Electrical test per data sheet is performed. Devices that exceed the data sheet limits are considered rejects. 2. Pretreatment as specified. 3. MIL-STD 750A, method 2031. 4. Broken lead is considered a reject. 5. Less than 95% coverage is considered a reject. 4 NEC Electronics Inc. Roseville Manufacturing Table 2. Reliability Test Results The reliability test results given in this report are representative of the following products fabricated in Roseville and assembled in Roseville or Singapore. Fabricated in Roseville D7720A NMOS-4 D78H11 CMOS-4 CX2 CMOS-5 CX3: D17003AH D6701 D70108 D77C20A D77C25 D7502A D7503A D75004 D75108A D75304 D75306 D75308 D75312 D75316 D75328 D17010 D70208 D70216 D70322 D70325 D70335 D78C10 D78C11A D78C14 D78213 D78234 D78238 D78322 D937LH Assembled in Roseville 28-pin DIP D7720AC D77C20AC D77C25C 40-pin DIP D70108C D70116C 68-pin PLCC D70208L D70216L 84-pin PLC D70320L D70325L D70335L 64-pin QFP D7502AGF D7503AGF D75304GF 80-pin QFP D75306GF D75308GF D75312GF D75316GF Assembled in Singapore 80-pin QFP 75216AGF 75308GF 78C10AGF 64-pin LQFP 78352BG 5 NEC Electronics Inc. Roseville Manufacturing Table 3. HTB Life Test Summary and Failure Rate Predictions This table summarizes the reliability test results of processes extensively used by most NEC microprocessor products. The failure rate predictions are based on both 125°C and 150°C high-temperature bias life test results. Failure rate predictions are shown for the current period of available data and for past periods of cumulative data. µPD7720AC (28-pin DIP) Process Type Jan 88–Dec 98 (cumulative) Process Period NMOS-4 Jan 88– Mar 99 Total (cumulative) µPD77C20AC Jul 90– Mar 99 (28-pin DIP) (cumulative) µPD77C25C Jul 90– Mar 99 (28-pin DIP) (cumulative) µPD70108C Jan 90– Mar 99 (40-pin DIP) (cumulative) µPD7503A Jan 97– Mar 99 (64-pin QFP) (cumulative) µPD75304 Apr 92– Mar 99 (80-pin QFP) (cumulative) µPD75306 Apr 92– Mar 99 (80-pin QFP) (cumulative) µPD75308 Jan 90– Mar 99 (80-pin QFP) (cumulative) µPD75312 Jul 94– Mar 99 (80-pin QFP) (cumulative) µPD75316 Jul 94– Mar 99 (80-pin QFP) (cumulative) µPD17010 Oct 94– Mar 99 (80-pin QFP) (cumulative) µPD78C10 Jan 92– Mar 99 (80-pin QFP) (cumulative) Singapore Assembly µPD75216 Jan 92– Mar 99 (80-pin QFP) (cumulative) Singapore Assembly µPD75308 Jan 92– Mar 99 (80-pin QFP) (cumulative) Singapore Assembly CMOS-4 Jan 89– Mar 99 Total (cumulative) µPD70208 Jan 92– Mar 99 (68-pin PLCC) (cumulative) ∝PD70216 Apr 93– Mar 99 (68-pin PLCC) (cumulative) µPD70320 Jul 91– Mar 99 (84-pin PLCC) (cumulative) µPD70325 Jan 92– Mar 99 (84-pin PLCC) (cumulative) (125°C) 448 520,000 0 17.9 9.3 x 106 Ambient Temp. Accum,. Device Hours 520,000 No. of Failures 0 Accel. Factor (Note 1) 17.9 Equiv. Device Hours (125°C) Number of Devices 448 9.3 x 106 (125°C) 432 432,000 0 32.6 1.41 x 107 (125°C) 96 96,000 0 32.6 3.13 x 106 (125°C) 24 24,000 0 32.6 7.82 x 105 (125°C) 168 168,000 0 32.6 5.48 x 106 (125°C) 384 384,000 0 32.6 1.25 x 107 (125°C) 120 120,000 0 32.6 2.35 x 106 (125°C) 360 360,000 0 32.6 8.61 x 106 (125°C) 312 311,168 1 32.6 9.39 x 106 (125°C) 552 552,000 0 32.6 1.80 x 107 (125°C) 72 72,000 0 32.6 2.35 x 106 (125°C) 24 24,000 0 32.6 7.82 x 105 (125°C) 144 144,000 0 32.6 4.69 x 106 (125°C) 120 120,000 0 32.6 3.91 x 106 (125°C) 2808 2,812,168 1 32.6 9.17 x107 (125°C) 748 736,000 0 11.3 805. x 106 (125°C) 936 936,000 0 11.3 1.06 x 107 (125°C) 508 508,000 0 11.3 3.30 x 106 (125°C) 644 644,000 1 11.3 5.65 x 106 6 Failure Rate, 55°°C and 60% Confidence Level (Note 2) 0.0098 %/1000 = 98.0 FIT 0.0022%/1000 = 22FIT NEC Electronics Inc. Roseville Manufacturing Table 3. HTB Life Test Summary and Failure Rate Predictions (continued) Process Type Process Period Ambient Temp. µPD70335 (84-pin PLCC) CMOS-5 Total µPD78352 (64-pin LQFP) CMOS-8 Total Jan 94- Mar 99 (cumulative) Apr 88– Mar 99 (cumulative) Oct 94– Mar 99 (cumulative) Oct 94– Mar 99 (cumulative) Notes: (125°C) Number of Devices 532 Accum,. Device Hours 532,000 (125°C) 3368 (125°C) (125°C) No. of Failures 0 Accel. Factor (Note 1) 11.3 6.01 x 106 3,356,000 1 11.3 3.79 x 107 192 192,000 0 _ _ 192 192,000 0 _ _ Equiv. Device Hours Failure Rate, 55°°C and 60% Confidence Level (Note 2) 0.0053%/1000H = 53FIT Note 3 1. The acceleration factor was calculated using the Arrhenius mathematical model. 2. FIT was derived from HTB data for all available time periods. 3. Some of the above FIT rates were not calculated. Due to small sample sizes in these cases, the FIT rates would not be meaningful. NEC expects a FIT rate of less than 100 for micro device types (target not to exceed 150). 7 NEC Electronics Inc. Roseville Manufacturing Table 4. Other Life Test Summaries (HTSL, HHSL, T/H) This table summarizes the reliability test results of the different process types during 150°C/175°C/200°C storage and 85°C/85% RH storage and bias tests. The data is summarized for the current period of available data and for past periods of cumulative data. Process Type µPD7720AC (28-pin DIP) NMOS-4 Total µPD77C20AC (28-pin DIP) µPD77C25C (28-pin DIP) µPD70108C (40-pin DIP) µPD70116C (40-pin QFP) µPD7503A (64-pin QFP) µPD75304 (80-pin QFP) µPD75306 (80-pin QFP) µPD75308 (80-pin QFP) µPD75312 (80-pin QFP) µPD75316 (80-pin QFP) µPD17010 (80-pin QFP) µPD78C10 (80-pin QFP) µPD75216 (80-pin QFP) µPD75308 (80-pin QFP) CMOS-4 Total µPD70208 (68-pin PLCC) µPD70216 (68-pin PLCC) µPD70320 (84-pin PLCC) µPD70325 (84-pin PLCC) µPD70335 (84-pin PLCC) CMOS-5 Total µPD78352 (64-pin LQFP) Process Period Jan 88– Mar 99 (cumulative) Jan 88– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jan 90– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jan 90– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jan 90– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jan 90– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jan 90– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jan 90– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Qty 380 HTSL Failures Hours 168 500 1000 0 0 0 Qty 0 HHSL Failures Hours 168 500 1000 - Qty 448 T/H Failures Hours 168 500 1000 0 0 0 380 0 0 0 0 - - - 448 0 0 0 360 0 0 0 0 - - - 432 0 0 0 80 0 0 0 0 - - - 96 0 0 0 20 0 0 0 0 - - - 24 0 0 0 100 0 0 0 0 - - - 120 0 0 0 180 0 0 0 0 - - - 216 0 0 0 324 0 0 0 0 - - - 380 0 0 2 80 0 0 0 0 - - - 96 0 0 0 300 0 0 0 0 - - - 384 0 0 0 260 0 0 0 1 - - - 312 0 0 1 500 0 0 1 0 - - - 520 0 1 0 40 0 0 0 0 - - - 72 0 0 0 0 - - - 0 - - - 204 0 0 0 0 - - - 0 - - - 260 0 0 0 0 - - - 0 - - - 220 0 0 0 2244 0 0 1 0 - - - 3336 0 1 4 604 0 0 0 0 - - - 620 0 0 0 804 0 0 0 0 - - - 912 0 0 0 476 0 0 0 0 - - - 528 0 0 0 584 0 0 0 0 - - - 692 0 0 0 516 0 0 0 0 - - - 528 0 0 0 2984 0 0 0 0 - - - 3280 0 0 0 0 - - - 0 - - - 192 0 0 0 8 NEC Electronics Inc. CMOS-8 Total Jan 90– Mar 99 (cumulative) Roseville Manufacturing 0 - - - 0 9 - - - 192 0 0 0 NEC Electronics Inc. Roseville Manufacturing Table 5. Environmental and Mechanical Test Summaries (TS, T/C, PCT) Process Type µPD7720AC (28-pin DIP) NMOS-4 Total µPD77C20AC (28-pin DIP) µPD77C25C (28-pin DIP) µPD70108C (40-pin DIP) µPD70116C (40-pin DIP) µPD7503A (64-pin QFP) µPD75304 (80-pin QFP) µPD75306 (80-pin QFP) µPD75308 (80-pin QFP) µPD75312 (80-pin QFP) µPD75316 (80-pin QFP) µPD17010 (80-pin QFP) µPD78C10 (80-pin QFP) µPD75216 (80-pin QFP) µPD75308 (80-pin QFP) CMOS-4 Total µPD70208 (68-pin PLCC) µPD70216 (68-pin PLCC) µPD70320 (84-pin PLCC) µPD70325 (84-pin PLCC) µPD70335 (84-pin PLCC) CMOS-5 Total µPD78352 (64-pin LQFP) CMOS-8 Total Process Period Jan 88– Mar 99 (cumulative) Jan 88- Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jan 90– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jan 90– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jan 90– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jan 90– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jan 90– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jan 90– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jul 88– Mar 99 (cumulative) Jul 90– Mar 99 (cumulative) Jan 90– Mar 99 (cumulative) Qty 261 TS Failures 0 Qty 380 T/C Failures 100 Cycles 300 Cycles 0 0 Qty 380 PCT Failures 96 Hours 102 Hours 0 0 261 0 460 0 0 380 0 0 342 0 450 0 0 360 0 0 72 0 100 0 0 100 0 1 18 0 24 0 0 20 0 0 54 0 125 0 0 100 0 0 90 0 225 0 0 180 0 0 234 0 400 0 0 320 0 0 54 2 125 0 0 100 0 0 224 0 350 0 0 300 0 0 162 0 300 0 1 240 0 0 332 0 500 0 0 400 0 0 54 0 75 0 1 60 0 0 0 - 0 - - 180 0 0 0 - 0 - - 120 0 0 0 - 0 - - 100 0 0 1636 2 2674 0 2 2580 0 1 324 1 800 0 1 600 0 0 468 0 975 0 0 820 0 0 180 1 525 0 3 419 0 0 144 0 675 0 1 580 0 0 306 0 600 0 1 460 0 0 1422 2 3575 0 6 2879 0 0 0 0 60 0 0 180 0 0 0 0 60 0 0 180 0 0 10 NEC Electronics Inc. Roseville Manufacturing Table 6. Failure Summaries CMOS-4 Test Item T/C T/C PCT HTB T/H T/H T/H HTSL HHBT TS T/H HTSL Duration 300 cyc. 300 cyc. 192 hrs. 168 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 168 hrs. 1000 hrs Period Jul 94–Oct 94 Jan 95–Mar 95 Jan 92–Apr 92 Oct 95–Dec 95 Jan 96–Mar 96 Oct 95–Dec 95 Jan 92–Apr 92 Apr 96–Jun 96 Oct-Dec 96 Jul-Sep 97 Apr-Jun 98 Sep-Dec 98 Failure 1 PC DC Failure 1 PC DC Failure 1 PC DC Failure 1 PC FUN Failure 1 PC DC Failure 1 PC FUN Failure 1 PC FUN Failure 1 PC DC Failure 1 PC FUN Failure 2PC DC Failure 1 PC DC Failure 1 PC DC Failure Duration 1000 hrs. 300 cyc. 300 cyc. 15 cyc. 168 hrs. 300 cyc. 300 cyc. 300 cyc. Period Jul 92–Sep 92 Apr 92–Jun 92 Jul 95–Sep 95 Apr 96–Jun 96 Jan 97–Jun 97 Apr 97–Jun 97 Apr 97–Jun 97 Jul–Sep 97 Failure 1 PC DC Failure 1 PC DC Failure 1 PC FUN Failure 1 PC FUN Failure 1 PC DC Failure 1 PC DC Failure 1 PC DC Failure 1PC DC Failure CMOS-5 Test Item HTB T/C T/C T/S HTB T/C T/C T/C 11 NEC Electronics Inc. Roseville Manufacturing Table 7. CMOS-4 Process Family, Quarterly Reliability Data (Jan-Mar 99) Life Tests Device Type µPD7503A (80-pin QFP) Assembly Month Jan- Mar 99 Qty 24 HTB Failures Hours 168 500 1000 0 0 0 Qty 24 T/H Failures Hours 168 500 1000 0 0 0 Qty 20 HTSL Failures/ Hours 168 500 1000 0 0 1 Environmental Tests Device Type µPD75312 (80-pin QFP) Assembly Month Jan-Mar 99 T/C Failures Cycles 100 300 0 0 Qty 25 Qty 20 PCT Failures Hours 192 288 0 0 96 0 TS Failures - Qty 18 Table 8. CMOS-5 Process Family, Quarterly Reliability Data (Jan-Mar 99) Life Tests Device Type µPD70216 (68-pin PLCC) µPD70335 (84-pin PLCC) Assembly Month Jan– Mar 99 Jan– Mar 99 Qty HTB Failures Hours 168 500 1000 24 0 0 0 24 0 0 0 Qty T/H Failures Hours 168 500 1000 Qty HTSL Failures Hours 168 500 1000 24 0 0 0 20 0 0 0 24 0 0 0 20 0 0 0 Environmental Tests Device Type µPD70216 (68-pin PLCC) µPD70335 (84-pin PLCC) Assembly Month Jan– Mar 99 Jan– Mar 99 Qty 25 T/C Failures Cycles 100 300 0 0 Qty 20 96 0 25 0 20 0 0 12 PCT Failures Hours 192 288 0 0 0 0 Qty 18 18 TS Failures 0 0