INTEGRATED CIRCUITS DATA SHEET TDA2653A Vertical deflection circuit Product specification File under Integrated Circuits, IC02 January 1991 Philips Semiconductors Product specification Vertical deflection circuit TDA2653A DESCRIPTION The TDA2653A is a monolithic integrated circuit for vertical deflection in large screen colour television receivers. The circuit incorporates the following functions: • Oscillator; switch capability for 50 Hz/60 Hz operation • Synchronization circuit • Blanking pulse generator with guard circuit • Sawtooth generator with buffer stage • Preamplifier with fed-out inputs • Output stage with thermal and short-circuit protection • Flyback generator • Voltage stabilizers QUICK REFERENCE DATA Supply voltage (pin 9) Supply current (pin 5 + pin 9) (1) (1) V9-8 = VS typ. 26 V I5 + I9 = IS typ. 325 mA I6(p-p) typ. 1,7 A Maximum output current (peak-to-peak value) I6(p-p) max. 2,6 A Picture frequency f Sync input pulse (peak-to-peak value) V2-8(p-p) ≥ 1V Thermal resistance from junction to mounting base Rth j-mb ≤ 5 K/W Output current (peak-to-peak value) Note 1. for 45 AX systems PACKAGE OUTLINE 13-lead SIL; plastic power (SOT141RGA); SOT141-6; 1996 November 19. January 1991 2 50 Hz/60 Hz Fig.1 Block diagram. (1) Condition for pin 12: LOW voltage level = 50 Hz; HIGH voltage level = 60 Hz. Philips Semiconductors January 1991 Product specification Vertical deflection circuit TDA2653A 3 Philips Semiconductors Product specification Vertical deflection circuit TDA2653A RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pin 9) V9−8 = VS max. 40 V Supply voltage output stage (pin 5) V5-8 max. 60 V Pin 3 V3−11 max. 7 V Pin 13 V13-8 max. 7 V Pins 4 and 10 V4; 10-8 max. 24 V Pin 6 v6-8 max. 60 V −V6−8 max. 0 V V7; 11−8 max. 40 V I1 max. 0 mA −I1 max. 1 mA Pin 2 ±I2 max. 10 mA Pin 3 I3 max. 0 mA −I3 max. 5 mA I7 max. 1,3 A −I7 max. 1,5 A I11 max. 50 mA −I11 max. 1 mA I12 max. 3 mA −I12 max. 0 mA Voltages Pins 7 and 11 Currents Pin 1 Pin 7 Pin 11 Pin 12 Pins 5, 6 and 8: internally limited by the short-circuit protection circuit. Total power dissipation: internally limited by the thermal protection circuit. Storage temperature range Tstg −25 to + 150 °C Operating ambient temperature range Tamb 0 °C to limiting value Fig.2 January 1991 4 Total power dissipation. Rth h-a includes Rth mb-h which is expected when heatsink compound is used. Rth j−mb ≤ 5 K/W. Philips Semiconductors Product specification Vertical deflection circuit TDA2653A CHARACTERISTICS Tamb = 25 °C unless otherwise specified. Supply voltage/output stage V9-8 = VS Supply voltage 9 to 30 V ≥ V5-8 − 2,2 V typ. V5-8 − 1,9 V typ. 1,3 V Output voltage at −I6 = 1,1 A V6-8 at I6 = 1,1 A V6-8 ≤ 1,6 V Flyback generator output voltage at −I7 = 1,1 A V7-8 typ. VS − 2,2 V Peak output current ±I6 ≤ 1,3 A Flyback generator peak current ±I7 ≤ 1,3 A −I4; 10 typ. 0,1 µA 1 to 12 V 28 % Feedback Input quiescent current Synchronization Sync input pulse V2-8 Tracking range typ. Oscillator/sawtooth generator Oscillator frequency control input voltage V1-8 6 to 9 V Sawtooth generator output voltage V3-8 0 to VS − 1 V V11-8 0 to VS − 2 V −I3 0 to 4 mA ≥ −2 µA ≤ +30 mA (∆f/f)/∆Tcase typ. 10-4 K-1 (∆f/f)/∆VS typ. 4 x 10-4 V-1 V2−8 typ. 18,5 V Output current −I2 ≤ 3 mA Output resistance R2−8 typ. 410 Ω Blanking pulse duration at 50 Hz sync tb typ. 1,4 ± 0,07 ms Saturation voltage; LOW voltage level V12−8 typ. 1 V Output leakage current I12 typ. 1 µA From junction to mounting base Rth j-mb ≤ 5 K/W Junction temperature; switching point thermal protection Tj typ. 150 ± 8 °C Sawtooth generator output current I11 Oscillator temperature dependency Tcase = 20 to 100 °C Oscillator voltage dependency VS = 10 to 30 V Blanking pulse generator Output voltage at VS = 24 V; I2 = 1 mA 50 Hz/60 Hz switch capability Thermal resistance/junction temperature January 1991 5 Philips Semiconductors Product specification Vertical deflection circuit TDA2653A PINNING 1. Oscillator adjustment 2. Synchronization input/blanking output 3. Sawtooth generator output 4. Preamplifier input 5. Positive supply of output stage 6. Output 7. Flyback generator output 8. Ground 9. Positive supply (VS) 10. Reference voltage 11. Sawtooth capacitor 12. 50 Hz/ 60 Hz switching voltage 13. Oscillator capacitor January 1991 6 Philips Semiconductors Product specification Vertical deflection circuit TDA2653A APPLICATION INFORMATION The function is described against the corresponding pin number 1, 13. Oscillator The oscillator frequency is determined by a potentiometer at pin 1 and a capacitor at pin 13. 2. Sync input/blanking output Combination of sync input and blanking output. The oscillator has to be synchronized by a positive-going pulse between 1 and 12 V. The integrated frequency detector delivers a switching level at pin 12. The blanking pulse amplitude is 20 V with a load of 1 mA. 3. Sawtooth generator output The sawtooth signal is fed via a buffer stage to pin 3. It delivers the signal which is used for linearity control, and drive of the preamplifier. The sawtooth is applied via a shaping network to pin 11 (linearity) and via a resistor to pin 4 (preamplifier). 4. Preamplifier input The DC voltage is proportional to the output voltage (DC feedback). The AC voltage is proportional to the sum of the buffered sawtooth voltage at pin 3 and the voltage, with opposite polarity, at the feedback resistor (AC feedback). 5. Positive supply of output stage This supply is obtained from the flyback generator. An electrolytic capacitor between pins 7 and 5, and a diode between pins 5 and 9 have to be connected for proper operation of the flyback generator. 6. Output of class-B power stage The vertical deflection coil is connected to this pin, via a series connection of a coupling capacitor and a feedback resistor, to ground. 7. Flyback generator output An electrolytic capacitor has to be connected between pins 7 and 5 to complete the flyback generator. 8. Negative supply (ground) Negative supply of output stage and small signal part. 9. Positive supply The supply voltage at this pin is used to supply the flyback generator, voltage stabilizer, blanking pulse generator and buffer stage. 10. Reference voltage of preamplifier External adjustment and decoupling of reference voltage of the preamplifier. 11. Sawtooth capacitor This sawtooth capacitor has been split to realize linearity control. 12. 50 Hz/60 Hz switching level This pin delivers a LOW voltage level for 50 Hz and a HIGH voltage level for 60 Hz. The amplitudes of the sawtooth signals can be made equal for 50 Hz and 60 Hz with these levels. January 1991 7 Philips Semiconductors Product specification Vertical deflection circuit TDA2653A (1) Condition for pin 12: LOW voltage level = 50 Hz; HIGH voltage level = 60 Hz. Fig.3 Typical vertical deflection circuit for 45AX system (26 V). January 1991 8 Philips Semiconductors Product specification Vertical deflection circuit TDA2653A (1) Condition for pin 12: LOW voltage level = 50 Hz; HIGH voltage level = 60 Hz. Fig.4 Typical vertical deflection circuit for 45 AX system (VS1 = 26 V, VS2 = 12 V) in quasi-bridge connection. January 1991 9 Philips Semiconductors Product specification Vertical deflection circuit TDA2653A PACKAGE OUTLINE DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L3 L Q c 1 13 e1 Z e bp e2 m w M 0 5 v M 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A2 bp c D (1) d Dh E (1) e e1 e2 Eh j L L3 m Q v w x Z (1) mm 17.0 15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 12.2 11.8 3.4 1.7 5.08 6 3.4 3.1 12.4 11.0 2.4 1.6 4.3 2.1 1.8 0.8 0.25 0.03 2.00 1.45 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-03-11 SOT141-6 January 1991 EUROPEAN PROJECTION 10 Philips Semiconductors Product specification Vertical deflection circuit TDA2653A SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. January 1991 11