PHILIPS SA57022-50D

INTEGRATED CIRCUITS
SA57022-XX
500 mA LDO with ON/OFF control and
Vref bypass
Product data
Supersedes data of 2001 Oct 03
2003 Oct 13
Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
GENERAL DESCRIPTION
The SA57022-XX has an extremely precise fixed output with a
typical accuracy of ±2%. It is designed to provide very low dropout
and ultra low noise with an optional Bypass pin, and fast transient
response. Supply current is reduced to zero (typical).
The SA57022-XX incorporates both over-temperature and
over-current protection. The SA57022-XX is stable with an output
capacitor of only 1.0 µF and has a maximum output current of
500 mA. It is available in the 7-pin small outline package (SOP002).
FEATURES
APPLICATIONS
• Very low dropout voltage: 300 mV typ. (Iout = 500 mA)
• High precision output voltage: ±2%
• Output current capacity: 500 mA
• Low noise: 75 µVrms typ. @ 20 Hz to 80 KHz, for Cn = 470 pF.
• Extremely good line regulation: 10 mV typical
• Extremely good load regulation: 20 mV typical
• Low temperature drift co-efficient to Vout: ±100 ppm/°C
• Internal current limit and thermal shut-down circuits
• Input voltage range: –0.3 V to 12 V
• Wide preset output voltage range: 1.8 V to 5 V
• Wide operating temperature range: –40 °C to +85 °C
• Battery-operated systems
• Portable computers
• Cameras, VCRs and camcorders
• PCMCIA cards, modems, pagers
• Cellular/GSM/PHS phones
• Linear post-regulator for SMPS
• Instrumentation
SIMPLIFIED SYSTEM DIAGRAM
VIN
7
1
VOUT
CURRENT
LIMIT
DRIVER
5
R
REFERENCE
BIAS
ON/OFF
THERMAL
SHUTDOWN
R
GND 3
4
BYPASS
SL01527
Figure 1. Simplified system diagram.
2003 Oct 13
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Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
SA57022-XXD
DESCRIPTION
VERSION
TEMPERATURE
RANGE
small outline 7-pin surface mount (see dimensional drawing)
SOP002
–40 to +85 °C
NOTE:
The device has six voltage output options, indicated by the XX on
the order code.
XX
VOLTAGE (Typical)
18
1.8 V
25
2.5 V
Part number marking
Each package is marked with a four letter code. The first three
letters designate the product. The fourth letter, represented by ‘x’, is
a date tracking code.
Part number
Marking
SA57022-18
ALMx
SA57022-25
ALNx
SA57022-28
ALPx
SA57022-30
ALRx
28
2.8 V
30
3.0 V
33
3.3 V
SA57022-33
ALSx
50
5.0 V
SA57022-50
ALTx
PIN CONFIGURATION
VOUT
PIN DESCRIPTION
1
NC
2
GND
3
BYPASS
4
7
SA57022-XX
VIN
6
GND
PIN
SYMBOL
1
VOUT
2
NC
Regulated output voltage.
No connection.
3
GND
4
BYPASS
Reference bypass input. Connecting a
470 pF capacitor further reduces output
noise.
5
ON/OFF
Output voltage On/Off control pin.
6
GND
7
VIN
ON/OFF
5
DESCRIPTION
Ground.
SL01525
Figure 2. Pin configuration.
Substrate ground pin. This pin must be
connected to ground.
Power supply input.
MAXIMUM RATINGS
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
–0.3
+12
V
VOUT(typ) + 0.5
VOUT(typ) + 10
V
VIN
Supply voltage
VIN(OPR)
Operating voltage
IOUT
Output current
0
500
mA
Toper
Operating temperature
–40
+85
°C
Tstg
Storage temperature
–40
+150
°C
PD
Power dissipation (Note 1)
–
400
mW
PD
Power dissipation (Note 2)
–
950
mW
NOTES:
1. Unattached.
2. Mounted on double-sided glass epoxy PCB, with copper ground plane 192 × 142 × 1.2 mm.
2003 Oct 13
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Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
ELECTRICAL CHARACTERISTICS
Tamb = 25 °C; VON/OFF = 1.6 V, unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
IOUT = 0 mA
–
1.9
5
mA
ICC
No-load input current
ICC(OFF)
Input current (off)
VON/OFF = 0 V
–
0
1
µA
VOUT
Output voltage (as % of Vnom)
IOUT = 250 mA
98%
–
102%
V
SA57022-18
1.764
1.8
1.836
V
SA57022-25
2.450
2.5
2.550
V
SA57022-28
2.744
2.8
2.856
V
SA57022-30
2.940
3.0
3.060
V
SA57022-33
3.234
3.3
3.060
V
SA57022-50
4.900
5.0
5.100
V
VIN = VOUT – 0.2 V; IOUT = 250 mA
–
0.3
0.5
V
VIO
Dropout voltage (Note 2)
∆V1
Line regulation
VIN = VOUT +1.5 V to VIN = VOUT +2.5 V;
IOUT = 250 mA
–
10
20
mV
∆V2
Load regulation
IOUT = 0 to 250 mA
–
20
120
mV
∆VOUT/∆T
VOUT Temperature coefficient
(Note 1)
Tj = –30 to +85 °C
–
100
–
ppm/°C
RR
Ripple rejection (Note 1)
f = 120 Hz; Vripple = 1 V; IOUT = 250 mA
50
64
–
dB
Vn
Output noise voltage (Note 1)
fBW = 20 to 80 kHz; Cn = 470 pF
–
75
–
µVrms
ION/OFF
ON/OFF pin input current
VON/OFF = VIN
10
20
30
µA
VON/OFF(H)
ON/OFF HIGH threshold voltage
1.6
–
VIN+0.3
V
VON/OFF(L)
ON/OFF LOW threshold voltage
-0.3
–
0.4
V
NOTES:
1. The parameter is guaranteed by design.
2. This parameter is not guaranteed if VOUT is less than 2 V.
2003 Oct 13
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Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
APPLICATION INFORMATION
VOLTAGE
INPUT
CIN = 1 µF
CERAMIC
7
VIN
TO LOAD
6
5
SUB
ON/OFF
VOUT
NC
GND
BYPASS
1
2
3
4
COUT = 2.2 µF
CERAMIC
Cn = 470 pF
CERAMIC
SL01526
Figure 3. Typical application circuit.
Input capacitor
Thermal shutdown
An input capacitor of 1.0 µF (min) should be connected from VIN to
GND if there is more than 10 inches of wire between the regulator
and the AC filter capacitor, or if a battery is operated as the power
source. The capacitor should be less than 1 cm from the input pin.
Integrated thermal protection circuitry shuts the regulator off when
die temperature exceeds 150 °C. The regulator remains off until the
die temperature drops to approximately 140 °C.
Power dissipation
Aluminum electrolytic or tantalum capacitor types can be used.
(Because many aluminum electrolytic capacitors freeze at
approximately –30 °C, solid tantalums are recommended for
applications operating below –25 °C.) When operating from sources
other than batteries, supply-noise rejection and transient response
can be improved by increasing the value of the input and output
capacitors and employing passive filtering techniques.
The amount of power the regulator dissipates is primarily a function
of input and output voltage, and output current. The following
equation is used to calculate worst case actual power dissipation:
P D [ ǒV IN(max) * V OUT(min)Ǔ
Eqn. (1)
Where:
PD = worst case actual power dissipation
VIN(max) = maximum voltage on VIN
VOUT(min) = minimum regulator output voltage
ILOAD(max) = maximum output (load) current
Output capacitor
Phase compensation is used to ensure stable operation even if load
current varies. For this reason, an output capacitor with good
frequency characteristics is needed. Set it as close to the circuit as
possible, with wires as short as possible. A 1.0 µF capacitor from
VOUT to ground is recommended. The output capacitor should have
an ESR (effective series resistance) of 5.0 Ω or less, and a resonant
frequency above 1.0 MHz.
The maximum allowable power dissipation, as shown in Equation (2),
is a function of the maximum ambient temperature (Tamb(max)), the
maximum allowable die temperature (125 °C), and the thermal
resistance from junction-to-air (Rth(j–a)).
Optional BYPASS capacitor
P D(max) +
A 470 pF capacitor connected from the BYPASS input to ground
reduces noise present on the internal reference, which in turn
significantly reduces output noise. This capacitor must have low
leakage, because the pin is high impedance. If output noise is not a
concern, this pin may be left unconnected. Larger capacitor values
may be used, but results in a longer time period to rated output
voltage when power is initially applied.
T j(max) * T amb(max)
R th(j*a)
Eqn. (2)
The SUB (heat sink) pin must be connected to ground with a wide
trace.
PCB layout hints
The component placement around the LDO should be done carefully
to achieve good dynamic line and load response. The input and
noise capacitor should be kept close to the LDO. The rise in junction
temperature depends on how efficiently the heat is carried away
from the junction to ambient. The junction to lead thermal
impedance is a characteristic of the package and fixed. The thermal
impedance between lead to ambient can be reduced by increasing
the copper area on PCB. Increase the input, output and ground
trace area to reduce the junction-to-ambient impedance.
ON/OFF
The regulator is fully enabled when a logic HIGH is applied to this
input. The regulator enters shutdown when a logic LOW is appplied
to this input. During shutdown, regulator output voltage falls to
zero,and supply current is reduced to 1.0 µA max, and VOUT falls to
zero. For use as an always-on regulator, connect ON/OFF pin to the
supply voltage, as shown in Figure 3.
Optional BYPASS diode
If the voltage on the output pin rises above the input voltage, as
might happen in some applications, the overcurrrent will flow via
internal parasitic diodes from output to input. To prevent this,
connect a bypass diode between the output and input pins.
2003 Oct 13
I LOAD(max)
5
Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
PACKING METHOD
The SA57003 is packed in reels, as shown in Figure 4.
GUARD
BAND
TAPE
REEL
ASSEMBLY
TAPE DETAIL
COVER TAPE
CARRIER TAPE
BARCODE
LABEL
BOX
SL01305
Figure 4. Tape and reel packing method
2003 Oct 13
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Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
Plastic small outline package; 7 leads; body width 4.4 mm
2003 Oct 13
7
SA57022-XX
SOP002
Philips Semiconductors
Product data
500 mA LDO with ON/OFF control and Vref bypass
SA57022-XX
REVISION HISTORY
Rev
Date
Description
_2
20031013
Product data (9397 750 12112). ECN 853-2293 30328 of 09 September 2003.
Modifications:
• Change package name from SOP-7B to SOP002 in Ordering information and Package outline sections.
_1
20011003
Product data (9397 750 08967). ECN 853-2293 27197 of 03 October 2001.
Data sheet status
Level
Data sheet status [1]
Product
status [2] [3]
Definitions
I
Objective data
Development
This data sheet contains data from the objective specification for product development.
Philips Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL
http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given
in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no
representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be
expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree
to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes in the products—including circuits, standard cells, and/or software—described
or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated
via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys
no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent,
copyright, or mask work right infringement, unless otherwise specified.
 Koninklijke Philips Electronics N.V. 2003
All rights reserved. Printed in U.S.A.
Contact information
For additional information please visit
http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
Date of release: 10-03
For sales offices addresses send e-mail to:
[email protected]
Document order number:
2003 Oct 13
8
9397 750 12112