PHILIPS 1PS79SB40

BAS40 series;
1PSxxSB4x series
General-purpose Schottky diodes
Rev. 07 — 12 May 2006
Product data sheet
1. Product profile
1.1 General description
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic
packages.
Table 1.
Product overview
Type number
Package
Configuration
Philips
JEITA
1PS70SB40
SOT323
SC-70
single diode
1PS76SB40
SOD323
SC-76
single diode
1PS79SB40
SOD523
SC-79
single diode
BAS40
SOT23
-
single diode
BAS40H
SOD123F
-
single diode
BAS40L
SOD882
-
single diode
BAS40W
SOT323
SC-70
single diode
1PS70SB44
SOT323
SC-70
dual series
BAS40-04
SOT23
-
dual series
BAS40-04W
SOT323
SC-70
dual series
1PS70SB45
SOT323
SC-70
dual common cathode
1PS75SB45
SOT416
SC-75
dual common cathode
BAS40-05
SOT23
-
dual common cathode
BAS40-05W
SOT323
SC-70
dual common cathode
1PS70SB46
SOT323
SC-70
dual common anode
BAS40-06
SOT23
-
dual common anode
BAS40-06W
SOT323
SC-70
dual common anode
BAS40-07
SOT143B
-
dual isolated
BAS40-07V
SOT666
-
dual isolated
BAS40-05V
SOT666
-
quadruple common cathode/
common cathode
1PS88SB48
SOT363
SC-88
quadruple common cathode/
common cathode
BAS40XY
SOT363
SC-88
quadruple; 2 series
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
1.2 Features
n High switching speed
n High breakdown voltage
n Low leakage current
n Low capacitance
1.3 Applications
n Ultra high-speed switching
n Voltage clamping
1.4 Quick reference data
Table 2.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
-
120
mA
-
-
380
mV
-
-
40
V
Per diode
forward current
IF
VF
forward voltage
VR
reverse voltage
[1]
[1]
IF = 1 mA
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
2. Pinning information
Table 3.
Pin
Pinning
Description
Simplified outline
Symbol
BAS40H; 1PS76SB40; 1PS79SB40
1
cathode
2
anode
[1]
1
1
2
2
sym001
001aab540
BAS40L
1
cathode
2
anode
[1]
1
1
2
2
sym001
Transparent
top view
BAS40; BAS40W; 1PS70SB40
1
anode
2
not connected
3
cathode
3
3
1
2
n.c.
006aaa436
1
2
006aaa144
BAS40_1PSXXSB4X_SER_7
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
2 of 21
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
Table 3.
Pinning …continued
Pin
Description
Simplified outline
Symbol
BAS40-04; BAS40-04W; 1PS70SB44
1
anode (diode 1)
2
cathode (diode 2)
3
cathode (diode 1),
anode (diode 2)
3
3
1
2
006aaa437
1
2
006aaa144
BAS40-05; BAS40-05W; 1PS70SB45; 1PS75SB45
1
anode (diode 1)
2
anode (diode 2)
3
cathode (diode 1),
cathode (diode 2)
3
3
1
2
006aaa438
1
2
006aaa144
BAS40-06; BAS40-06W; 1PS70SB46
1
cathode (diode 1)
2
cathode (diode 2)
3
anode (diode 1),
anode (diode 2)
3
3
1
2
006aaa439
1
2
006aaa144
BAS40-07
1
cathode (diode 1)
2
cathode (diode 2)
3
anode (diode 2)
4
anode (diode 1)
4
1
3
4
2
1
3
2
006aaa434
BAS40-07V
1
anode (diode 1)
2
not connected
3
cathode (diode 2)
4
anode (diode 2)
5
not connected
6
cathode (diode 1)
BAS40_1PSXXSB4X_SER_7
Product data sheet
6
5
4
1
2
3
6
5
4
1
2
3
006aaa440
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
3 of 21
Philips Semiconductors
BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes
Table 3.
Pin
Pinning …continued
Description
Simplified outline
Symbol
BAS40-05V; 1PS88SB48
1
anode (diode 1)
2
anode (diode 2)
3
cathode (diode 3),
cathode (diode 4)
4
anode (diode 3)
5
anode (diode 4)
6
6
5
1
2
4
6
5
1
2
4
3
001aab555
3
006aaa446
cathode (diode 1),
cathode (diode 2)
BAS40XY
1
anode (diode 1)
2
cathode (diode 2)
3
anode (diode 3),
cathode (diode 4)
4
anode (diode 4)
5
cathode (diode 3)
6
cathode (diode 1),
anode (diode 2)
[1]
5
4
1
2
3
6
5
4
1
2
3
006aaa256
The marking bar indicates the cathode.
BAS40_1PSXXSB4X_SER_7
Product data sheet
6
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
4 of 21
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
1PS70SB40
SC-70
plastic surface-mounted package; 3 leads
SOT323
1PS76SB40
SC-76
plastic surface-mounted package; 2 leads
SOD323
1PS79SB40
SC-79
plastic surface-mounted package; 2 leads
SOD523
BAS40
-
plastic surface-mounted package; 3 leads
SOT23
BAS40H
-
plastic surface-mounted package; 2 leads
SOD123F
BAS40L
-
leadless ultra small plastic package; 2 terminals;
body 1.0 × 0.6 × 0.5 mm
SOD882
BAS40W
SC-70
plastic surface-mounted package; 3 leads
SOT323
1PS70SB44
SC-70
plastic surface-mounted package; 3 leads
SOT323
BAS40-04
-
plastic surface-mounted package; 3 leads
SOT23
BAS40-04W
SC-70
plastic surface-mounted package; 3 leads
SOT323
1PS70SB45
SC-70
plastic surface-mounted package; 3 leads
SOT323
1PS75SB45
SC-75
plastic surface-mounted package; 3 leads
SOT416
BAS40-05
-
plastic surface-mounted package; 3 leads
SOT23
BAS40-05W
SC-70
plastic surface-mounted package; 3 leads
SOT323
1PS70SB46
SC-70
plastic surface-mounted package; 3 leads
SOT323
BAS40-06
-
plastic surface-mounted package; 3 leads
SOT23
BAS40-06W
SC-70
plastic surface-mounted package; 3 leads
SOT323
BAS40-07
-
plastic surface-mounted package; 4 leads
SOT143B
BAS40-07V
-
plastic surface-mounted package; 6 leads
SOT666
BAS40-05V
-
plastic surface-mounted package; 6 leads
SOT666
1PS88SB48
SC-88
plastic surface-mounted package; 6 leads
SOT363
BAS40XY
SC-88
plastic surface-mounted package; 6 leads
SOT363
BAS40_1PSXXSB4X_SER_7
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
5 of 21
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
4. Marking
Table 5.
Marking codes
Type number
Marking code[1]
Type number
Marking code[1]
1PS70SB40
6*3
1PS75SB45
45
1PS76SB40
S4
BAS40-05
45*
1PS79SB40
T
BAS40-05W
65*
BAS40
43*
1PS70SB46
6*6
BAS40H
AJ
BAS40-06
46*
BAS40L
S6
BAS40-06W
66*
BAS40W
63*
BAS40-07
47*
1PS70SB44
6*4
BAS40-07V
67
BAS40-04
44*
BAS40-05V
65
BAS40-04W
64*
1PS88SB48
8*5
1PS70SB45
6*5
BAS40XY
40*
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per diode
VR
reverse voltage
-
40
V
IF
forward current
-
120
mA
IFRM
repetitive peak forward
current
tp ≤ 1 s; δ ≤ 0.5
-
120
mA
IFSM
non-repetitive peak forward
current
tp ≤ 10 ms
-
200
mA
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Tj = 25 °C prior to surge.
BAS40_1PSXXSB4X_SER_7
Product data sheet
[1]
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
6 of 21
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
6. Thermal characteristics
Table 7.
Symbol
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
Unit
thermal resistance from
junction to ambient
in free air
SOT23
-
-
500
K/W
SOT143B
-
-
500
K/W
SOT363 (1PS88SB48)
-
-
416
K/W
Per device
Rth(j-a)
[1]
SOT416
-
-
833
K/W
SOT666 (BAS40-05V)
[2]
-
-
225
K/W
SOT666 (BAS40-07V)
[2]
-
-
416
K/W
SOD123F
[2]
-
-
330
K/W
-
-
450
K/W
SOD523
[2]
-
-
450
K/W
SOD882
[2]
-
-
500
K/W
-
-
625
K/W
-
-
260
K/W
SOD323
SOT323
Rth(j-sp)
thermal resistance from
junction to solder point
[3]
SOT363 (BAS40XY)
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Reflow soldering is the only recommended soldering method.
[3]
Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IF = 1 mA
-
-
380
mV
IF = 10 mA
-
-
500
mV
Per diode
VF
IR
Cd
[1]
[1]
forward voltage
reverse current
diode capacitance
IF = 40 mA
-
-
1
V
VR = 30 V
-
-
1
µA
VR = 40 V
-
-
10
µA
VR = 0 V; f = 1 MHz
-
-
5
pF
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
BAS40_1PSXXSB4X_SER_7
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
7 of 21
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
mlc361
102
mlc362
103
IR
(µA)
IF
(mA)
(1)
102
10
10
(1)
(2)
(3)
(4)
(2)
1
1
10−1
10−1
(3)
10−2
0
0.2
0.4
0.6
0.8
VF (V)
1
10−2
0
10
(1) Tamb = 125 °C
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(3) Tamb = 25 °C
20
30
VR (V)
40
(4) Tamb = −40 °C
Fig 1. Forward current as a function of forward
voltage; typical values
mlc364
103
Fig 2. Reverse current as a function of reverse
voltage; typical values
mlc363
5
Cd
(pF)
rdif
(Ω)
4
102
3
2
10
1
1
10−1
1
10
IF (mA)
102
0
0
20
30
VR (V)
40
Tamb = 25 °C; f = 1 MHz
f = 10 kHz
Fig 3. Differential resistance as a function of forward
current; typical values
Fig 4. Diode capacitance as a function of reverse
voltage; typical values
BAS40_1PSXXSB4X_SER_7
Product data sheet
10
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
8 of 21
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
8. Package outline
1.35
1.15
1.1
0.8
0.65
0.58
0.45
0.15
1
2.7
2.3
0.85
0.75
1
1.8
1.6
1.65 1.25
1.55 1.15
2
2
0.40
0.25
0.25
0.10
0.34
0.26
Dimensions in mm
03-12-17
Fig 5. Package outline SOD323 (SC-76)
3.0
2.8
0.17
0.11
Dimensions in mm
02-12-13
Fig 6. Package outline SOD523 (SC-79)
1.7
1.5
1.1
0.9
1.2
1.0
1
3
0.55
0.35
0.45
0.15
2.5 1.4
2.1 1.2
3.6
3.4
1
2.7
2.5
2
0.48
0.38
1.9
2
0.15
0.09
Dimensions in mm
04-11-04
Fig 7. Package outline SOT23 (TO-236AB)
0.70
0.55
Dimensions in mm
04-11-29
Fig 8. Package outline SOD123F
2.2
1.8
0.50
0.46
0.62
0.55
0.25
0.10
1.1
0.8
0.45
0.15
3
2
0.30
0.22
0.65
0.30
0.22
1.02
0.95
2.2 1.35
2.0 1.15
1
0.55
0.47
1
0.4
0.3
cathode marking on top side
Dimensions in mm
Fig 9. Package outline SOD882
0.25
0.10
1.3
03-04-17
Dimensions in mm
04-11-04
Fig 10. Package outline SOT323 (SC-70)
BAS40_1PSXXSB4X_SER_7
Product data sheet
2
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
9 of 21
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
3.0
2.8
2.2
1.8
1.1
0.9
1.9
6
4
2.5
2.1
1.1
0.8
5
4
2
3
0.45
0.15
3
0.45
0.15
1.4
1.2
1
2.2 1.35
2.0 1.15
pin 1
index
2
0.88
0.78
1
0.48
0.38
0.15
0.09
0.25
0.10
0.3
0.2
0.65
1.3
1.7
Dimensions in mm
04-11-16
Fig 11. Package outline SOT143B
Dimensions in mm
04-11-08
Fig 12. Package outline SOT363 (SC-88)
1.7
1.5
0.95
0.60
1.8
1.4
3
6
0.45
0.15
0.6
0.5
5
4
0.3
0.1
1.75 0.9
1.45 0.7
1.7
1.5
1.3
1.1
pin 1 index
1
2
1
0.30
0.15
0.25
0.10
Fig 13. Package outline SOT416 (SC-75)
0.18
0.08
1
04-11-04
Dimensions in mm
04-11-08
Fig 14. Package outline SOT666
BAS40_1PSXXSB4X_SER_7
Product data sheet
3
0.27
0.17
0.5
1
Dimensions in mm
2
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
10 of 21
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package
Description
Packing quantity
3000 4000 8000 10000
1PS70SB40
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
1PS76SB40
SOD323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
1PS79SB40
SOD523
2 mm pitch, 8 mm tape and reel
-
-
-315
-
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS40
SOT23
4 mm pitch, 8 mm tape and reel
-215
-
-
-235
BAS40H
SOD123F 4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS40L
SOD882
2 mm pitch, 8 mm tape and reel
-
-
-
-315
BAS40W
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
1PS70SB44
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS40-04
SOT23
4 mm pitch, 8 mm tape and reel
-215
-
-
-235
BAS40-04W
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
1PS70SB45
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
1PS75SB45
SOT416
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS40-05
SOT23
4 mm pitch, 8 mm tape and reel
-215
-
-
-235
BAS40-05W
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
1PS70SB46
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS40-06
SOT23
4 mm pitch, 8 mm tape and reel
-215
-
-
-235
BAS40-06W
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS40-07
SOT143B 4 mm pitch, 8 mm tape and reel
-215
-
-
-235
BAS40-07V
SOT666
2 mm pitch, 8 mm tape and reel
-
-
-315
-
4 mm pitch, 8 mm tape and reel
-
-115
-
-
BAS40-05V
SOT666
2 mm pitch, 8 mm tape and reel
-
-
-315
-
4 mm pitch, 8 mm tape and reel
1PS88SB48
BAS40XY
SOT363
SOT363
-
-115
-
-
4 mm pitch, 8 mm tape and reel; T1
[2]
-115
-
-
-135
4 mm pitch, 8 mm tape and reel; T2
[3]
-125
-
-
-165
4 mm pitch, 8 mm tape and reel; T1
[2]
-115
-
-
-135
4 mm pitch, 8 mm tape and reel; T2
[3]
-125
-
-
-165
[1]
For further information and the availability of packing methods, see Section 13.
[2]
T1: normal taping
[3]
T2: reverse taping
BAS40_1PSXXSB4X_SER_7
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
11 of 21
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
10. Soldering
3.05
2.80
2.10
1.60
solder lands
solder resist
1.65
0.95
0.50
0.60
occupied area
solder paste
0.50
(2×)
msa433
Dimensions in mm
Fig 15. Reflow soldering footprint SOD323 (SC-76)
5.00
4.40
1.40
solder lands
solder resist
2.75 1.20
occupied area
MSA415
preferred transport direction during soldering
Dimensions in mm
Fig 16. Wave soldering footprint SOD323 (SC-76)
2.15
solder paste
0.50 0.60
1.20
solder lands
0.30
0.40
solder resist
occupied area
1.80
1.90
MGS343
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 17. Reflow soldering footprint SOD523 (SC-79)
BAS40_1PSXXSB4X_SER_7
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
12 of 21
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
2.90
2.50
solder lands
solder resist
2
0.85
1
2.70
1.30
3.00
0.85
3
occupied area
solder paste
0.60
(3x)
0.50 (3x)
0.60 (3x)
1.00
3.30
MSA439
Dimensions in mm
Fig 18. Reflow soldering footprint SOT23 (TO-236AB)
3.40
1.20 (2x)
solder lands
solder resist
occupied area
2
1
4.60 4.00 1.20
3
preferred transport direction during soldering
2.80
4.50
MSA427
Dimensions in mm
Fig 19. Wave soldering footprint SOT23 (TO-236AB)
BAS40_1PSXXSB4X_SER_7
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
13 of 21
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20. Reflow soldering footprint SOD123F
1.30
R = 0.05 (8×)
0.30
R = 0.05 (8×)
solder lands
0.60 0.70 0.80
(2×) (2×) (2×)
0.90
solder resist
occupied area
solder paste
0.30
(2×)
0.40
(2×)
0.50
(2×)
MBL872
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 21. Reflow soldering footprint SOD882
BAS40_1PSXXSB4X_SER_7
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
14 of 21
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
2.65
0.75
1.325
1.30
solder lands
2
solder resist
0.50
(3x) 1.90
3
0.60
2.35 0.85 (3x)
occupied area
1
0.55
(3x)
2.40
solder paste
MSA429
Dimensions in mm
Fig 22. Reflow soldering footprint SOT323 (SC-70)
4.60
4.00
1.15
solder lands
solder resist
2
occupied area
3.65
3
2.10
2.70
1
0.90
(2x)
MSA419
preferred transport direction during soldering
Dimensions in mm
Fig 23. Wave soldering footprint SOT323 (SC-70)
BAS40_1PSXXSB4X_SER_7
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
15 of 21
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
3.25
0.60 (3x)
0.50 (3x)
solder lands
0.60
(4x)
solder resist
4
3
2.70
occupied area
1.30 3.00
1
2
solder paste
msa441
0.90
1.00
2.50
Dimensions in mm
Fig 24. Reflow soldering footprint SOT143B
4.45
1.20 (3x)
solder lands
4
solder resist
3
occupied area
1.15 4.00 4.60
1
2
preferred transport direction during soldering
1.00
MSA422
3.40
Dimensions in mm
Fig 25. Wave soldering footprint SOT143B
BAS40_1PSXXSB4X_SER_7
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
16 of 21
BAS40 series; 1PSxxSB4x series
Philips Semiconductors
General-purpose Schottky diodes
2.65
0.60
(2×)
0.40 0.90 2.10
(2×)
2.35
solder paste
0.50
(4×)
solder lands
solder resist
0.50
(4×)
occupied area
1.20
2.40
MSA432
Dimensions in mm
Fig 26. Reflow soldering footprint SOT363 (SC-88)
5.25
0.30 1.00 4.00
4.50
solder lands
solder resist
occupied area
1.15
3.75
transport direction during soldering
Dimensions in mm
sot363
Fig 27. Wave soldering footprint SOT363 (SC-88)
BAS40_1PSXXSB4X_SER_7
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
17 of 21
Philips Semiconductors
BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes
2.20
0.60
1.10
0.70
solder lands
2
solder resist
3
2.00 0.85
1.50
1
0.50
(3x)
occupied area
solder paste
MSA438
0.60
(3x)
1.90
Dimensions in mm
Fig 28. Reflow soldering footprint SOT416
2.75
2.45
2.10
1.60
0.15
(4×)
0.40
(6×)
2.00 1.70 1.00
0.55
(2×)
0.30 (2×)
0.375
(4×)
1.20
2.20
2.50
solder lands
placement area
solder resist
occupied area
0.075
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Fig 29. Reflow soldering footprint SOT666
BAS40_1PSXXSB4X_SER_7
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
18 of 21
Philips Semiconductors
BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes
11. Revision history
Table 10.
Revision history
Document ID
Release date
BAS40_1PSXXSB4X_ 20060512
SER_7
Modifications:
•
•
•
•
•
Data sheet status
Change notice
Supersedes
Product data sheet
-
BAS40_1PSXXSB4X_
SER_6
Type number BAS40XY added
Table 9 “Packing methods”: added packing method 2 mm pitch for SOD523
Figure 27 “Wave soldering footprint SOT363 (SC-88)”: amended
Figure 29 “Reflow soldering footprint SOT666”: amended
Section 12 “Legal information”: updated
BAS40_1PSXXSB4X_ 20050809
SER_6
Product data sheet
-
1PS70SB40_3
1PS75SB45_2
1PS76SB40_3
1PS79SB40_2
1PS88SB48_3
BAS40H_1
BAS40L_1
BAS40-05V_1
BAS40-07V_1
BAS40W_3
BAS40_SERIES_5
1PS70SB40_3
19990426
Product specification
-
1PS70SB40_2
1PS75SB45_2
19990426
Product specification
-
1PS75SB45_1
1PS76SB40_3
20040126
Product specification
-
1PS76SB40_2
1PS79SB40_2
19990426
Product specification
-
1PS79SB40_1
1PS88SB48_3
20021107
Product specification
-
1PS88SB48_2
BAS40H_1
20050425
Product data sheet
-
-
BAS40L_1
20030520
Product specification
-
-
BAS40-05V_1
20021121
Product specification
-
-
BAS40-07V_1
20020327
Product specification
-
-
BAS40W_3
19990426
Product specification
-
BAS40W_2
BAS40_SERIES_5
20011010
Product specification
-
BAS40_4
BAS40_1PSXXSB4X_SER_7
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
19 of 21
Philips Semiconductors
BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.semiconductors.philips.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Philips Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Philips Semiconductors
sales office. In case of any inconsistency or conflict with the short data sheet,
the full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, Philips Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.
Right to make changes — Philips Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — Philips Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a Philips Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. Philips Semiconductors accepts no liability for inclusion and/or use
of Philips Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is for the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — Philips Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.semiconductors.philips.com/profile/terms, including those
pertaining to warranty, intellectual property rights infringement and limitation
of liability, unless explicitly otherwise agreed to in writing by Philips
Semiconductors. In case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
BAS40_1PSXXSB4X_SER_7
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 07 — 12 May 2006
20 of 21
Philips Semiconductors
BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data. . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 5
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal characteristics. . . . . . . . . . . . . . . . . . . 7
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Packing information. . . . . . . . . . . . . . . . . . . . . 11
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Contact information. . . . . . . . . . . . . . . . . . . . . 20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: [email protected]
Date of release: 12 May 2006
Document identifier: BAS40_1PSXXSB4X_SER_7