INTEGRATED CIRCUITS DATA SHEET TDA3867T Quasi-split sound processor with two FM demodulators Preliminary specification File under Integrated Circuits, IC02 January 1992 Philips Semiconductors Preliminary specification Quasi-split sound processor with two FM demodulators TDA3867T FEATURES • Quasi-split sound processor for all FM standards e.g. B/G • Reduction of spurious video signals by tracking function and AFC for the vision carrier reference circuit; (indispensable for NICAM) • AF2 signal automatically muted (at B/G) by the input signal level GENERAL DESCRIPTION Symmetrical IF input and gain controlled wideband IF amplifier. AGC generation due to peak sync Reference amplifier for the regeneration of the vision carrier. Optimized limiting amplifier for AM suppression in the regenerated vision carrier signal and 90° phase shifter. Intercarrier mixer for FM sound, output with low-pass filter. Separate signal processing for 5.5 and 5.74 MHz intercarriers. Wide supply voltage range, only 300 mW power dissipation at 5 V. QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VP supply voltage (pin 24) 4.5 5 8.8 V IP supply current (pin 24) − 60 72 mA Vi IF IF input sensitivity (−3 dB) − 70 100 µV Vo audio output signal (RMS value) − 1 − V THD total harmonic distortion − 0.5 − % S/N (W) weighted signal-to-noise ratio for FM − 68 − dB for FM with 6 kHz sinus vision modulation − 56 − dB ORDERING AND PACKAGE INFORMATION PACKAGE EXTENDED TYPE NUMBER TDA3867T PINS 28 PIN POSITION mini-pack plastic Note 1. SOT136-1; 1997 January 8. January 1992 MATERIAL 2 CODE SOT136A (1) Philips Semiconductors Preliminary specification Quasi-split sound processor with two FM demodulators Fig.1 Block diagram. January 1992 3 TDA3867T Philips Semiconductors Preliminary specification Quasi-split sound processor with two FM demodulators PINNING TDA3867T PIN CONFIGURATION SYMBOL PIN DESCRIPTION n.c. 1 not connected n.c. 2 not connected CAGC 3 charge capacitor for AGC n.c. 4 not connected n.c. 5 not connected MATR 6 input for stereo matrix correction FM2R1 7 reference circuit for FM2 (5.74 MHz) FM2R2 8 reference circuit for FM2 (5,74 MHz) AF2 9 AF2 output (AF out of 5.74 MHz) AF1 10 AF1 output (AF out of 5.5 MHz) FM1R1 11 reference circuit for FM1 (5.5 MHz) FM1R2 12 reference circuit for FM1 (5.5 MHz) n.c. 13 not connected VC-R1 14 reference circuit for the vision carrier (38.9 MHz) VC-R2 15 reference circuit for the vision carrier (38.9 MHz) TRACK 16 DC output level for tracking n.c. 17 not connected FM1I 18 intercarrier input for FM1 (5.5 MHz) CAF1 19 DC-decoupling capacitor for FM1 demodulator (AF1) ICO 20 intercarrier output signal (5.5/5.74 MHz) CAF2 21 DC-decoupling capacitor for FM2 demodulator (AF2) FM2I 22 intercarrier input for FM2 (5.74 MHz) GND 23 ground (0 V) VP 24 +5 to +8 V supply voltage n.c. 25 not connected n.c. 26 not connected FMIF1 27 IF difference input 1 (B/G standard, 38.9 MHz) FMIF2 28 IF difference input 2 (B/G standard, 38.9 MHz) January 1992 4 Fig.2 Pin configuration. Philips Semiconductors Preliminary specification Quasi-split sound processor with two FM demodulators FUNCTIONAL DESCRIPTION The quasi-split sound processor is suitable for all FM standards (e. g. B/G). The AGC detector uses peak sync level. Sound carrier SC1 (5.5 MHz) provides AF1, sound carrier SC2 (5.74 MHz) provides AF2. With no sound carrier SC2 on pin 22, AF2 output is muted. The mute circuit prevents false signal recognition in the stereo decoder at high IF signal levels when no second sound carrier exists (mono) and an AF signal is present in the identification signal frequency range. With 1 mV on pin 22, under measurement conditions, AF2 is switched on (see limiting amplifier). Weak input signals at pins 27 and 28 generate noise on pin 22, which is present in the intercarrier signal and passes through the 5.74 MHz filter. Noise on pin 22 inhibits muting. No misinterpretation due to white noise occurs in the stereo decoder; when non-correlated noise masks the identification signal frequencies, which may be present in sustained tone signals. The stereo decoder remains switched to mono. January 1992 The series capacitor Cs in the 38.9 MHz resonant circuit provides a notch at the sound carrier frequency in order to provide more attenuation for the sound carrier in the vision carrier reference channel. The ratio of parallel/series capacitor depends on the ratio of VC/SC frequency and has to be adapted to other TV transmission standards if necessary, according to TDA3867T Measurements at the demodulators: For all signal-to-noise measurements the generator must meet the following specifications; phase modulation errors < 0.5 degree for B/W-jumps intercarrier signal-to-noise ratio as measured with “TV demodulator AMF2” (weighted S/N) must be > 60 dB at 6 kHz sine wave modulation of the B/W-signal. 2 C S = C P ( f VC ⁄ f SC ) - C P . The result is an improved “intercarrier buzz” (up to 10 dB improvement in sound channel 2 with 250 kHz video modulation for B/G stereo) or suppression of 350 kHz video modulated beat frequency in the digitally-modulated NICAM subcarrier. The picture carrier for quadrature demodulation in the intercarrier mixer is not exactly 90 degrees due to the shift variation in the integrated phase shift network. The tuning of the LC reference circuit to provide optimal video suppression at the intercarrier output is not the same as that to provide optimal intercarrier buzz suppression. In order to optimize the AF signal performance, a fine tuning for the optimal S/N at the sound channel 2 (from 5.74 MHz) may be performed with a 250 kHz square wave video modulation. 5 Signal-to-noise ratios are measured with ∆f = ± 50 kHz deviation and fm = 1 kHz; with a deviation of ±27 kHz the S/N ratio is deteriorated by 5.3 dB. Philips Semiconductors Preliminary specification Quasi-split sound processor with two FM demodulators TDA3867T LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VP supply voltages (pin 24) − 8.8 V Vn input and output voltage (pins 9, 10, 18, 20, 22, 27 and 28) 0 VP V Ptot total power dissipation 0 635 mW Tstg storage temperature range −25 150 °C Tamb operating ambient temperature range 0 70 °C VESD electrostatic handling(1) all pins except 27 and 28 ±500 − V pins 27 and 28 +400 − V −500 − V Note 1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor. January 1992 6 Philips Semiconductors Preliminary specification Quasi-split sound processor with two FM demodulators TDA3867T CHARACTERISTICS VP1 = 5 V and Tamb = 25 °C, measurements taken in Fig.3 with fVC = 38.9 MHz, fSC1 = 33.4 MHz and fSC2 = 33.158 MHz. Vision carrier (VC) modulated with different video signals, modulation depth 100 % (proportional to 10 % residual carrier). Vision carrier amplitude (RMS value) Vi VC = 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation ∆f = ±50 kHz and deviation ∆f = ±50 kHz unless otherwise specified. SYMBOL PARAMETER VP supply voltage.range (pin 24) IP supply current (pin 24) CONDITIONS VP = 5 V MIN. TYP. MAX. UNIT 4.5 5 8.8 V 48 60 72 mA IF amplifier (pins 27-28) RI input resistance 1.75 2.2 2.65 kΩ CI input capacitance 1.0 1.5 2.2 pF VI DC potential, voltage (pins 27 and 28) − 1.75 − V Vi IF maximum input signal (RMS value) Vo = +1 dB 70 100 − mV input signal sensitivity (RMS value) −3 dB intercarrier signal reduction on pin 20 − 70 100 µV ∆Gv IF gain control range 60 63 − dB B IF bandwidth −3 dB 50 70 − MHz V3 voltage range for gain control (pin 3) Gmin − Gmax 1.7 − 2.6 V fo = 38.9 MHz − 270 − mV − 4 − kΩ Resonance amplifier (pins 14-15) Vo vision carrier amplitude (peak-to-peak value) R14-15 operating resistance L inductance Fig.3 and 4 − 0.247 − µH C capacitance CS = 27 pF − 68 − pF QL Q-factor of resonant circuit Qo = 90 − 40 − V14, 15 DC voltage (pins 14 and 15) − VP−1 − V 71 95 125 mV Intercarrier mixer output (pin 20) Vo output signal for 5.5 MHz (RMS value) output signal for 5.74 MHz (RMS value) B IF bandwidth 32 43 56 mV −1 dB − 8.5 − MHz −3 dB − 10 − MHz VVID/V20 residual video AM on intercarrier note 1 − 3 10 % VVC residual vision carrier (RMS value) 1st/2nd harmonic; (38.9/77.8 MHz) − 0.5 1 mV R20 output resistance (emitter follower) 1 mA emitter current − 30 − Ω Io allowable AC output current (pin 20) − − ±0.7 mA I20 allowable DC output current − − −2 mA V20 DC voltage − 1.75 − V January 1992 7 Philips Semiconductors Preliminary specification Quasi-split sound processor with two FM demodulators SYMBOL PARAMETER CONDITIONS MIN. TDA3867T TYP. MAX. UNIT Limiting amplifiers (pins 18 and 22) − 300 450 µV maximum input signal (RMS value) 200 − − mV R18, 22 input resistance − 560 − Ω V18, 22 DC voltage − 0 − V Vi level detector threshold for no muting (RMS value, pin 22) − 1 − mV ∆Vi hysteresis of level detector − 5 − dB VP1−3.3 − VP1−1 V black picture − 9 − white test picture − 4 − 50 % grey picture − 6 − black picture − −8 − mV/kHz white test picture − −3 − mV/kHz 50 % grey picture − −5.5 − mV/kHz Vi minimum input signal (RMS value) −3 dB AF signal only 5.74 MHz channel Tracking automatic frequency control (AFC) of the vision carrier reference circuit. Vo tracking output voltage range (pin 16) FTR tracking reducing factor for S note 5 AFC steepness (open loop) for FM1 and FM2 demodulators Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with Vi IF (rms) = 10 mV (fmod = 1 kHz, deviation ∆f = ± 50 kHz) on pins 18 and 22 without ceramic filters, RS = 50 Ω. De-emphasis of 50 µs and V5 = VP (B/G standard). QL−factor = 11 for resonant circuits at pins 7-8 and 11-12. VIC intercarrier signals (RMS values, pins 7-8 and 11-12) − 100 − mV VDC DC voltage (pins 7, 8, 11 and 12) − 1.8 − V Vo AF output signals (RMS values, pins 9 and 10) 0.75 0.95 1.20 V ∆Vo difference of AF signals between channels (pins 9 and 10) − − 1 dB R9, 10 output resistance − 100 − Ω V9, 10 DC voltage − 2.1 − V I9, 10 allowed AC current of emitter output (peak value) − − ±1.5 mA maximum allowed DC output current − − −2 mA THD total harmonic distortion − 0.5 1.0 % Vo AF output signal (RMS value) THD = 1.5 % 1.25 − − V αAM AM suppression 1 kHz, m = 0.3 48 54 − dB S/N(W) weighted signal-to-noise ratio CCIR 468-3 64 68 − dB B AF bandwidth −3 dB 0.02 − 100 kHz αCR crosstalk attenuation (pins 9-10) 60 70 − dB V6 adjusting voltage for AF2 signal (pin 6) 0 − 5 V January 1992 pin 6 open-circuit; note 2 note 3 note 4 8 Philips Semiconductors Preliminary specification Quasi-split sound processor with two FM demodulators SYMBOL ∆GAF2 V19, 21 PARAMETER CONDITIONS MIN. TDA3867T TYP. MAX. UNIT minimum gain range due to V6 due to V6 −1.5 − 1.0 dB typical gain range due to V6 −2.5 − 1.5 dB − 1.7 − V 5.74 MHz on pin 22 70 − − dB − 5 25 mV DC voltage (pins 19 and 21) Audio frequency performance in B/G standard unless otherwise specified. Measurements on AF outputs (pins 9 and 10) Vo AF signal attenuation mute: AF2 on pin 9 Vi = 400 µV; dV9 DC level deviation after mute switching S/N(W) weighted signal-to-noise ratio CCIR 468-3 on output pin 10 de-emphasis 50 µs black picture fi = 5.5 MHz 59 63 − dB 2T/20T pulses with white bar fi = 5.5 MHz 57 61 − dB 6 kHz sine wave, B/W-modulated fi = 5.5 MHz 52 56 − dB 250 kHz square wave B/W-modulated fi = 5.5 MHz 50 56 − dB on output pin 9 RR black picture fi = 5.742 MHz 57 61 − dB 2T/20T pulses with white bar fi = 5.742 MHz 55 59 − dB 6 kHz sine wave, B/W-modulated fi = 5.742 MHz 50 54 − dB 250 kHz square wave B/W-modulated fi = 5.742 MHz 50 56 − dB 30 40 − dB ripple rejection all standards; fR = 70 Hz VR = 200 mV (p-p) Notes to the characteristics 1. Spurious intercarrier AM: m = (A−B)/A (wherein A = signal at sync; B = signal with 100 % picture modulation.) 2. AF2 signal can be adjusted by V6 3. For larger current: RL > 2.2 kΩ (pin 9 or 10 to GND) in order to increase the bias current of the output emitter follower. 4. If not used, pin 6 should not be connected. 5. Automatic frequency control (AFC) of the vision carrier reference circuit (pins 14 and 15) for reducing spurious video signals in the stereo/dual sound modes. The factor of reducing FTR at a deviation ∆fVC specifies the ratio of spurious signals with/without tracking function. January 1992 9 Philips Semiconductors Preliminary specification Quasi-split sound processor with two FM demodulators TDA3867T (1) CP = 47 pF with the optional use of tracking (because of Co of the varicaps). Fig.3 Test and application circuit (for application SAW-filters must be used). (1) simple resonance circuit (without Cs) (2) resonance circuit with Cs = 27 pF f VC 2 C S = C P -------- – C P f SC CS = 27 pF (Fig.3) Fig.4 Frequency response of the 38.9 MHz reference circuit. January 1992 10 Philips Semiconductors Preliminary specification Quasi-split sound processor with two FM demodulators Fig.5 Internal circuits. January 1992 11 TDA3867T Philips Semiconductors Preliminary specification Quasi-split sound processor with two FM demodulators TDA3867T PACKAGE OUTLINE SO28: plastic small outline package; 28 leads; body width 7.5 mm SOT136-1 D E A X c y HE v M A Z 15 28 Q A2 A (A 3) A1 pin 1 index θ Lp L 1 14 e bp 0 detail X w M 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y mm 2.65 0.30 0.10 2.45 2.25 0.25 0.49 0.36 0.32 0.23 18.1 17.7 7.6 7.4 1.27 10.65 10.00 1.4 1.1 0.4 1.1 1.0 0.25 0.25 0.1 0.9 0.4 0.012 0.096 0.004 0.089 0.01 0.019 0.013 0.014 0.009 0.71 0.69 0.30 0.29 0.050 0.419 0.043 0.055 0.394 0.016 0.043 0.039 0.01 0.01 0.004 0.035 0.016 inches 0.10 Z (1) θ Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT136-1 075E06 MS-013AE January 1992 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-01-24 97-05-22 12 o 8 0o Philips Semiconductors Preliminary specification Quasi-split sound processor with two FM demodulators TDA3867T SOLDERING Wave soldering Introduction Wave soldering techniques can be used for all SO packages if the following conditions are observed: There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. • The longitudinal axis of the package footprint must be parallel to the solder flow. • The package footprint must incorporate solder thieves at the downstream end. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Reflow soldering Reflow soldering techniques are suitable for all SO packages. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. January 1992 13 Philips Semiconductors Preliminary specification Quasi-split sound processor with two FM demodulators TDA3867T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. January 1992 14