INTEGRATED CIRCUITS DATA SHEET TDA6107JF Triple video output amplifier Product specification 2002 Oct 18 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF FEATURES GENERAL DESCRIPTION • Typical bandwidth of 5.5 MHz for an output signal of 60 V (p-p) The TDA6107JF includes three video output amplifiers and is intended to drive the three cathodes of a colour CRT directly. The device is contained in a plastic DIL-bent-SIL 9-pin medium power (DBS9MPF) package, and uses high-voltage DMOS technology. • High slew rate of 900 V/µs • No external components required • Very simple application To obtain maximum performance, the amplifier should be used with black-current control. • Single supply voltage of 200 V • Internal reference voltage of 2.5 V • Fixed gain of 50 • Black-Current Stabilization (BCS) circuit with voltage window from 1.8 to 6 V and current window from −100 µA to 10 mA • Thermal protection • Internal protection against positive flashover discharges appearing on the CRT. ORDERING INFORMATION TYPE NUMBER TDA6107JF 2002 Oct 18 PACKAGE NAME DBS9MPF DESCRIPTION plastic DIL-bent-SIL medium power package with fin; 9 leads 2 VERSION SOT111-1 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF BLOCK DIAGRAM VDD handbook, full pagewidth 6 MIRROR 5 MIRROR 1 TDA6107JF CASCODE 1 3× MIRROR 4 CURRENT SOURCE 9, 8, 7 1× Voc(3), Voc(2), Voc(1) 1× Rf THERMAL PROTECTION CIRCUIT Vi(1), Vi(2), Vi(3) VIP REFERENCE 1, 2, 3 DIFFERENTIAL STAGE 5 MIRROR 3 Ri Ra 3× CASCODE 2 MIRROR 2 4 MBL525 Fig.1 Block diagram (one amplifier shown). PINNING SYMBOL PIN DESCRIPTION Vi(1) 1 inverting input 1 Vi(2) 2 inverting input 2 Vi(3) 3 inverting input 3 GND 4 ground (fin) Iom 5 black-current measurement output VDD 6 supply voltage Voc(3) 7 cathode output 3 Voc(2) 8 cathode output 2 Voc(1) 9 cathode output 1 handbook, halfpage Vi(1) 1 Vi(2) 2 Vi(3) 3 GND 4 Iom 5 TDA6107JF VDD 6 Voc(3) 7 Voc(2) 8 Voc(1) 9 MBL524 Fig.2 Pin configuration. 2002 Oct 18 3 Io(m) Philips Semiconductors Product specification Triple video output amplifier TDA6107JF LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages measured with respect to pin 4 (ground); currents as specified in Fig.1; unless otherwise specified. SYMBOL PARAMETER MIN. MAX. UNIT VDD supply voltage 0 250 V Vi input voltage at pins 1 to 3 0 12 V Vo(m) measurement output voltage 0 6 V Voc cathode output voltage 0 VDD V Iocsm(L) LOW non-repetitive peak cathode output current at a flashover discharge of 100 µC 0 3 A Iocsm(H) HIGH non-repetitive peak cathode output current at a flashover discharge of 100 nC 0 6 A Tstg storage temperature −55 +150 °C Tj junction temperature −20 +150 °C Ves electrostatic handling voltage Human Body Model (HBM) − 3000 V Machine Model (MM) − 300 V HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices (see “Handling MOS Devices” ). QUALITY SPECIFICATION Quality specification “SNW-FQ-611 part D” is applicable and can be found in the “Quality reference Handbook”. The handbook can be ordered using the code 9397 750 00192. 2002 Oct 18 4 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS Rth(j-a) thermal resistance from junction to ambient Rth(j-fin) thermal resistance from junction to fin Rth(h-a) thermal resistance from heatsink to ambient VALUE note 1 UNIT 56 K/W 11 K/W 18 K/W Note 1. An external heatsink is necessary. Thermal protection The internal thermal protection circuit gives a decrease of the slew rate at high temperatures: 10% decrease at 130 °C and 30% decrease at 145 °C (typical values on the spot of the thermal protection circuit). MBH989 8 handbook, halfpage Ptot (W) (1) 6 4 (2) handbook, halfpage outputs 2 5 K/W thermal protection circuit 0 −40 6 K/W 0 40 80 120 160 Tamb (°C) fin MGK279 (1) Infinite heatsink. (2) No heatsink. Fig.3 Power derating curves. 2002 Oct 18 Fig.4 Equivalent thermal resistance network. 5 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF CHARACTERISTICS Operating range: Tj = −20 to +150 °C; VDD = 180 to 210 V. Test conditions: Tamb = 25 °C; VDD = 200 V; Vo(c1) = Vo(c2) = Vo(c3) = 1⁄2VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W (measured in test circuit of Fig.8); unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Iq quiescent supply current 5.6 6.6 7.6 mA Vref(int) internal reference voltage (input stage) − 2.5 − V Ri input resistance − 3.6 − kΩ G gain of amplifier 47.5 51.0 55.0 ∆G gain difference −2.5 0 +2.5 VO(oc) nominal output voltage at pins 7, 8 and 9 (DC value) Ii = 0 µA 116 129 142 V ∆VO(oc)(offset) differential nominal output offset voltage between pins 7 and 8, 8 and 9 and 9 and 7 (DC value) Ii = 0 µA − 0 5 V ∆Vo(c)(T) output voltage temperature drift at pins 7, 8 and 9 − 10 − mV/K − 0 − mV/K −50 − +50 µA −100 µA < Io(c) < 100 µA; 1.5 V < Vi < 5.5 V; 1.8 V < Vo(m) < 6 V −0.9 −1.0 −1.1 −100 µA ≤ Io(c) < 10 mA; 1.5 V < Vi < 5.5 V; 1.8 V < Vo(m) < 4 V −0.9 −1.0 −1.1 ∆Vo(c)(T)(offset) differential output offset voltage temperature drift between pins 7 and 8, 8 and 9 and 7 and 9 Io(m)(offset) offset current of measurement Io(c) = 0 µA; output (for three channels) 1.5 V < Vi < 5.5 V; 1.8 V < Vo(m) < 6 V ∆Io(m)/∆Io(c) linearity of current transfer (for three channels) Io(c)(max) maximum peak output current 50 V < Vo(c) < VDD − 50 V (pins 7, 8 and 9) − 20 − mA Vo(c)(min) minimum output voltage (pins 7, 8 and 9) Vi = 7.0 V; at Io(c) = 0 mA; note 1 − − 10 V Vo(c)(max) maximum output voltage (pins 7, 8 and 9) Vi = 1.0 V; at Io(c) = 0 mA; note 1 VDD − 15 − − V BS small signal bandwidth (pins 7, 8 and 9) Vo(c) = 60 V (p-p) − 5.5 − MHz BL large signal bandwidth (pins 7, 8 and 9) Vo(c) = 100 V (p-p) − 4.5 − MHz tPco cathode output propagation time 50% input to 50% output (pins 7, 8 and 9) Vo(c) = 100 V (p-p) square wave; f <1 MHz; tr = tf = 40 ns (pins 1, 2 and 3); see Figs 6 and 7 − 60 − ns 2002 Oct 18 6 Philips Semiconductors Product specification Triple video output amplifier SYMBOL PARAMETER TDA6107JF CONDITIONS MIN. TYP. MAX. UNIT ∆tPco difference in cathode output propagation time 50% input to 50% output (pins 7 and 8, 7 and 9 and 8 and 9) Vo(c) = 100 V (p-p) square wave; f < 1 MHz; tr = tf = 40 ns (pins 1, 2 and 3) −10 0 +10 ns to(r) cathode output rise time 10% output to 90% output (pins 7, 8 and 9) Vo(c) = 50 to 150 V square wave; f < 1 MHz; tf = 40 ns (pins 1, 2 and 3); see Fig.6 67 91 113 ns to(f) cathode output fall time 90% output to 10% output (pins 7, 8 and 9) Vo(c) = 150 to 50 V square wave; f < 1 MHz; tr = 40 ns (pins 1, 2 and 3); see Fig.7 67 91 113 ns tst settling time 50% input to 99% < output < 101% (pins 7, 8 and 9) Vo(c) = 100 V (p-p) square wave; f < 1 MHz; tr = tf = 40 ns (pins 1, 2 and 3); see Figs 6 and 7 − − 350 ns SR slew rate between 50 V to (VDD − 50 V) (pins 7, 8 and 9) Vi = 4 V (p-p) square wave; f < 1 MHz; tr = tf = 40 ns (pins 1, 2 and 3) − 900 − V/µs Ov cathode output voltage overshoot (pins 7, 8 and 9) Vo(c) = 100 V (p-p) square wave; f < 1 MHz; tr = tf = 40 ns (pins 1, 2 and 3); see Figs 6 and 7 − 2 − % PSRR power supply rejection ratio f < 50 kHz; note 2 − 55 − dB αct(DC) DC crosstalk between channels − −50 − dB Notes 1. See also Fig.5 for the typical DC-to-DC transfer of VI to VO(oc). 2. The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage. 2002 Oct 18 7 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF MBH988 200 handbook, halfpage Vo(c) (V) 160 129 120 80 40 0 0 2 2.5 4 Vi (V) 6 Fig.5 Typical DC-to-DC transfer of VI to VOC. 2002 Oct 18 8 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF 4.04 Vi (V) 3.08 t 2.12 tst Ov (in %) 151 150 140 149 Vo(c) (V) 100 60 50 t to(r) MGK280 tPco Fig.6 Output voltage (pins 7, 8 and 9) rising edge as a function of the AC input signal. 2002 Oct 18 9 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF 4.04 Vi (V) 3.08 t 2.12 tst 150 140 Vo(c) (V) 100 Ov (in %) 51 60 50 49 t to(f) MGK281 tPco Fig.7 Output voltage (pins 7, 8 and 9) falling edge as a function of the AC input signal. 2002 Oct 18 10 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF Cathode output Dissipation The cathode output is protected against peak current (caused by positive voltage peaks during high-resistance flash) of 3 A maximum with a charge content of 100 µC (1). Regarding dissipation, distinction must first be made between static dissipation (independent of frequency) and dynamic dissipation (proportional to frequency). The cathode is also protected against peak currents (caused by positive voltage peaks during low-resistance flash) of 6 A maximum with a charge content of 100 nC (1). The static dissipation of the TDA6107JF is due to voltage supply currents and load currents in the feedback network and CRT. The DC voltage of VDD (pin 6) must be within the operating range of 180 to 210 V during the peak currents. The static dissipation Pstat equals: Flashover protection Where: P stat = V DD × I DD + 3 × V OC × I OC VDD = supply voltage The TDA6107JF incorporates protection diodes against CRT flashover discharges that clamp the cathodes output voltage up to a maximum of VDD + Vdiode. IDD = supply current VOC = DC value of cathode voltage To limit the diode current an external 1.5 kΩ carbon high-voltage resistor in series with the cathode output and a 2 kV spark gap are needed (for this resistor value, the CRT has to be connected to the main PCB (1). The dynamic dissipation Pdyn equals: VDD must be decoupled to GND: Where: IOC = DC value of cathode current. P dyn = 3 × V DD × ( C L + C int ) × f i × V oc(p-p) × δ 1. With a capacitor >20 nF with good HF behaviour (e.g. foil); this capacitor must be placed as close as possible to pins 6 and 4, but definitely within 5 mm. CL = load capacitance 2. With a capacitor >3.3 µF on the picture tube base print, depending on the CRT size. fi = input frequency Cint = internal load capacitance (≈4 pF) Voc(p-p) = output voltage (peak-to-peak value) δ = non-blanking duty cycle. Switch-off behaviour The IC must be mounted on the picture tube base print to minimize the load capacitance CL. The switch-off behaviour of the TDA6107JF is controllable. This is because the output pins of the TDA6107JF are still under control of the input pins for low power supply voltages (approximately 30 V and higher). Bandwidth The addition of the flash resistor produces a decreased bandwidth and increases the rise and fall times; see “Application Note AN96072”. (1)External protection against higher currents is described in “Application Note AN96072”. 2002 Oct 18 11 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF TEST AND APPLICATION INFORMATION VDD handbook, full pagewidth C1 Vi(1) J1 22 µF 6 Rf 1 Ri Vof C2 1 Ra C7 20 nF Voc(1) 9 C10 6.8 pF Iom 22 nF C8 10 µF R1 2 MΩ C9 3.2 pF C3 Vi(2) J2 22 µF Rf 2 Ri Vof C4 2 Ra Voc(2) C11 136 pF R2 100 kΩ C13 6.8 pF R3 2 MΩ C14 136 pF R4 100 kΩ C16 6.8 pF R5 2 MΩ C17 136 pF R6 100 kΩ 8 Iom 22 nF probe 1 C12 3.2 pF C5 Vi(3) 22 µF J3 Rf 3 Ri Vof C6 3 Ra Voc(3) 7 Iom 22 nF probe 2 C15 3.2 pF VIP REFERENCE probe 3 5 TDA6107JF Vo(m) 4 4V MBL526 Current sources J1, J2 and J3 are to be tuned so that Vo(c) of pins 9, 8 and 7 is set to 100 V. Fig.8 Test circuit. 2002 Oct 18 12 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF INTERNAL CIRCUITRY handbook, full pagewidth GND VDD 4 6 to cascode stage to black current measurement circuit TDA6107JF 1, 2, 3 (1) esd from input circuit esd flash 7, 8, 9 esd to black current measurement circuit from control circuit 5 esd 6.8 V from input circuit Vbias from black current measurement circuit esd esd from control circuit to black current measurement circuit to black current measurement circuit MBL527 (1) All pins have an energy protection for positive or negative overstress situations. Fig.9 Internal pin configuration. 2002 Oct 18 13 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF PACKAGE OUTLINE DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads SOT111-1 D D1 A2 q P P1 Q A3 q2 q1 A seating plane A4 E pin 1 index c L 1 9 e2 b e Z b2 0 θ w M b1 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A mm 18.5 17.8 A2 A3 max. 3.7 8.7 8.0 A4 b b1 b2 c D (1) D1 E (1) e e2 15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 2.54 15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20 L P P1 3.9 3.4 2.75 2.50 3.4 3.2 Q q 1.75 15.1 1.55 14.9 q1 q2 w Z (1) max. θ 4.4 4.2 5.9 5.7 0.25 1.0 65o 55o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-03-11 SOT111-1 2002 Oct 18 EUROPEAN PROJECTION 14 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction to soldering through-hole mount packages The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by solder wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joints for more than 5 seconds. Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING DBS, DIP, HDIP, SDIP, SIL WAVE suitable(1) suitable Note 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 2002 Oct 18 15 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2002 Oct 18 16 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF NOTES 2002 Oct 18 17 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF NOTES 2002 Oct 18 18 Philips Semiconductors Product specification Triple video output amplifier TDA6107JF NOTES 2002 Oct 18 19 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA74 © Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 753504/02/pp20 Date of release: 2002 Oct 18 Document order number: 9397 750 10545