PHILIPS PMEG1030EH

PMEG1030EH; PMEG1030EJ
10 V, 3 A ultra low VF MEGA Schottky barrier rectifiers
Rev. 03 — 2 June 2005
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an
integrated guard ring for stress protection encapsulated in small SMD plastic packages.
Table 1:
Product overview
Type number
Package
Configuration
Philips
JEITA
PMEG1030EH
SOD123F
-
single isolated diodes
PMEG1030EJ
SOD323F
SC-90
single isolated diodes
1.2 Features
■
■
■
■
Forward current: 3 A
Reverse voltage: 10 V
Ultra low forward voltage
Small and flat lead SMD package
1.3 Applications
■
■
■
■
■
Low voltage rectification
High efficiency DC-to-DC conversion
Switched-mode power supply
Inverse polarity protection
Low power consumption applications
1.4 Quick reference data
Table 2:
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IF
forward current
Tsp ≤ 55 °C
-
-
3
A
VR
reverse voltage
-
-
10
V
-
390
530
mV
VF
[1]
forward voltage
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
IF = 3 A
[1]
PMEG1030EH; PMEG1030EJ
Philips Semiconductors
10 V, 3 A ultra low VF MEGA Schottky barrier rectifiers
2. Pinning information
Table 3:
Pinning
Pin
Description
1
cathode
2
anode
Simplified outline
Symbol
[1]
1
1
2
2
sym001
001aab540
[1]
The marking bar indicates the cathode.
3. Ordering information
Table 4:
Ordering information
Type number
Package
Name
Description
Version
PMEG1030EH
-
plastic surface mounted package; 2 leads
SOD123F
PMEG1030EJ
SC-90
plastic surface mounted package; 2 leads
SOD323F
4. Marking
Table 5:
Marking codes
Type number
Marking code
PMEG1030EH
AC
PMEG1030EJ
E7
9397 750 15078
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 2 June 2005
2 of 9
PMEG1030EH; PMEG1030EJ
Philips Semiconductors
10 V, 3 A ultra low VF MEGA Schottky barrier rectifiers
5. Limiting values
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
VR
reverse voltage
Conditions
Min
Max
Unit
-
10
V
IF
forward current
Tsp ≤ 55 °C
-
3
A
IFRM
repetitive peak forward
current
tp ≤ 1 ms; δ ≤ 0.25
-
5.5
A
IFSM
non-repetitive peak forward
current
t = 8 ms; square
wave
[1]
-
9
A
Ptot
total power dissipation
Tamb ≤ 25 °C
[1]
-
375
mW
[2]
-
830
mW
[1]
-
360
mW
[2]
-
830
mW
PMEG1030EH
PMEG1030EJ
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
Table 7:
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[1] [2]
-
-
330
K/W
[2] [3]
-
-
150
K/W
[1] [2]
-
-
350
K/W
[2] [3]
-
-
150
K/W
PMEG1030EH
-
-
60
K/W
PMEG1030EJ
-
-
55
K/W
PMEG1030EH
PMEG1030EJ
Rth(j-sp)
thermal resistance from
junction to solder point
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating will be available on request.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
9397 750 15078
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 2 June 2005
3 of 9
PMEG1030EH; PMEG1030EJ
Philips Semiconductors
10 V, 3 A ultra low VF MEGA Schottky barrier rectifiers
7. Characteristics
Table 8:
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Min
reverse current
IR
diode capacitance
Cd
Typ
Max
Unit
[1]
forward voltage
VF
[1]
Conditions
IF = 0.01 A
-
100
130
mV
IF = 0.1 A
-
170
200
mV
IF = 1 A
-
280
350
mV
IF = 3 A
-
390
530
mV
VR = 5 V
-
0.55
2
mA
VR = 8 V
-
0.8
2.5
mA
VR = 10 V
-
1
3
mA
VR = 1 V; f = 1 MHz
-
70
85
pF
Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
006aaa290
104
006aaa291
106
IR
(µA)
105
IF
(mA)
103
(1)
(2)
(1)
102
(2)
(3)
104
(4)
103
(3)
10
102
1
10
(4)
10−1
1
0
0.1
0.2
0.3
0.4
0.5
VF (V)
0
2
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(3) Tamb = 25 °C
(4) Tamb = −40 °C
(4) Tamb = −40 °C
8
10
Fig 2. Reverse current as a function of reverse
voltage; typical values
9397 750 15078
Product data sheet
6
VR (V)
(1) Tamb = 125 °C
Fig 1. Forward current as a function of forward
voltage; typical values
4
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 2 June 2005
4 of 9
PMEG1030EH; PMEG1030EJ
Philips Semiconductors
10 V, 3 A ultra low VF MEGA Schottky barrier rectifiers
006aaa292
130
Cd
(pF)
110
90
70
50
30
0
2
4
6
8
10
VR (V)
Tamb = 25 °C; f = 1 MHz
Fig 3. Diode capacitance as a function of reverse voltage; typical values
8. Package outline
1.7
1.5
1.2
1.0
1.35
1.15
1
0.80
0.65
0.5
0.3
1
0.55
0.35
3.6
3.4
2.7
2.3
2.7
2.5
1.8
1.6
2
2
0.70
0.55
0.40
0.25
0.25
0.10
Dimensions in mm
04-11-29
Fig 4. Package outline SOD123F
0.25
0.10
Dimensions in mm
04-09-13
Fig 5. Package outline SOD323F (SC-90)
9. Packing information
Table 9:
Packing methods
The -xxx numbers are the last three digits of the 12NC ordering code. [1]
Type number
Package
Description
Packing quantity
3000
10000
PMEG1030EH
SOD123F
4 mm pitch, 8 mm tape and reel
-115
-135
PMEG1030EJ
SOD323F
4 mm pitch, 8 mm tape and reel
-115
-135
[1]
For further information and the availability of packing methods, see Section 16.
9397 750 15078
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 2 June 2005
5 of 9
PMEG1030EH; PMEG1030EJ
Philips Semiconductors
10 V, 3 A ultra low VF MEGA Schottky barrier rectifiers
10. Soldering
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 6. Reflow soldering footprint SOD123F
3.05
2.80
2.10
1.60
solder lands
solder resist
1.65
0.95
0.50
0.60
occupied area
solder paste
0.50
(2×)
msa433
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7. Reflow soldering footprint SOD323F (SC-90)
9397 750 15078
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 2 June 2005
6 of 9
Philips Semiconductors
PMEG1030EH; PMEG1030EJ
10 V, 3 A ultra low VF MEGA Schottky barrier rectifiers
11. Revision history
Table 10:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
PMEG1030EH_EJ_3
20050602
Product data sheet
-
9397 750 15078
PMEG1030EH_EJ_2
Modifications:
•
Table 6 “Limiting values” IFSM value changed to 9 A
PMEG1030EH_EJ_2
20050405
Product data sheet
-
9397 750 14884
PMEG1030EJ_1
PMEG1030EJ_1
20050124
Product data sheet
-
9397 750 13916
-
9397 750 15078
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 2 June 2005
7 of 9
PMEG1030EH; PMEG1030EJ
Philips Semiconductors
10 V, 3 A ultra low VF MEGA Schottky barrier rectifiers
12. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
13. Definitions
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
15. Trademarks
14. Disclaimers
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
16. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
9397 750 15078
Product data sheet
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Rev. 03 — 2 June 2005
8 of 9
Philips Semiconductors
PMEG1030EH; PMEG1030EJ
10 V, 3 A ultra low VF MEGA Schottky barrier rectifiers
17. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . .
General description. . . . . . . . . . . . . . . . . . . . . .
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick reference data. . . . . . . . . . . . . . . . . . . . .
Pinning information . . . . . . . . . . . . . . . . . . . . . .
Ordering information . . . . . . . . . . . . . . . . . . . . .
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal characteristics. . . . . . . . . . . . . . . . . . .
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . . .
Packing information. . . . . . . . . . . . . . . . . . . . . .
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . . .
1
1
1
1
1
2
2
2
3
3
4
5
5
6
7
8
8
8
8
8
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 2 June 2005
Document number: 9397 750 15078
Published in The Netherlands