INTEGRATED CIRCUITS DATA SHEET TDA2545A Quasi-split-sound circuit Product specification File under Integrated Circuits, IC02 February 1985 Philips Semiconductors Product specification Quasi-split-sound circuit TDA2545A GENERAL DESCRIPTION The TDA2545A is a monolithic integrated circuit for quasi-split-sound processing in television receivers. Features • 3-stage gain controlled i.f. amplifier • A.G.C. circuit • Reference amplifier and limiter amplifier for vision carrier (V.C.) processing • Linear multiplier for quadrature demodulation QUICK REFERENCE DATA Supply voltage (pin 11) VP = V11-13 typ. 12 V Supply current (pin 11) IP = I11 typ. 45 mA Minimum i.f. vision carrier input voltage (r.m.s. value) VVC1-16(rms) typ. 150 µV Output voltage; 5,5 MHz (r.m.s. value) V12-13(rms) typ. 100 mV Output voltage; 5,742 MHz (r.m.s. value) V12-13(rms) typ. 45 mV I.F. control range ∆Gv typ. 64 dB S + W/W typ. 58 dB S + W/W typ. 56 dB Signal-to-weighted-noise (rel. to 1 kHz; 30 kHz deviation) at 5,5 MHz at 5,742 MHz for 2T/20T pulses with white bars PACKAGE OUTLINES 16-lead DIL; plastic (SOT38); SOT38-1; 1996 November 19. February 1985 2 Philips Semiconductors Product specification Quasi-split-sound circuit TDA2545A (1) I.F. signal: vision carrier (V.C.) and sound carrier (S.C.). Fig.1 Block diagram. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pin 11) VP = V11-13 max. 13,2 V Storage temperature range Tstg −25 to + 150 °C Operating ambient temperature range Tamb 0 to + 70 °C February 1985 3 Philips Semiconductors Product specification Quasi-split-sound circuit TDA2545A CHARACTERISTICS VP = V11-13 = 12 V; Tamb = 25 °C; measured at fVC = 38,9 MHz, fSC1 = 33,4 MHz, fSC2 = 33,158 MHz: Vision carrier (V.C.) modulated with different video signals (see below); modulation depth 100% (proportional to 10% residual carrier). Vision carrier amplitude (r.m.s. value) is VVC = 10 mV. Vision-to-sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation ∆f = ± 30 kHz. For measuring circuit see Fig.2; unless otherwise specified. PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply (pin 11) Supply voltage VP = V11-13 10,8 12 13,2 V Supply current IP = I11 33 45 55 mA VVC1-16(rms) − 150 200 µV VVC1-16(rms) 100 250 − mV I.F. gain control range ∆Gv 60 64 − dB Control voltage range (see Fig.3) V3-13 4 − Vp V Input resistance R1-16 − 2,5 − kΩ Input capacitance C1-16 − 1,5 − pF V12-13(rms) 60 100 140 mV Output voltage; 5,742 MHz (r.m.s. value) V12-13(rms) 27 45 63 mV D.C. output voltage V12-13 − 5,9 − V Allowable d.c. load resistance at the output R12-13 7 − − kΩ Allowable output current −I12 − − 1 mA at 5,5 MHz S+W/W 53 58 − dB at 5,742 MHz S+W/W 51 56 − dB at 5,5 MHz S+W/W 50 53 − dB at 5,742 MHz S+W/W 50 53 − dB at 5,5 MHz S+W/W 60 65 − dB at 5,742 MHz S+W/W 58 63 − dB I.F. amplifier Input voltage for start of gain control (intercarrier signals −3 dB) Input voltage for end of gain control (intercarrier signals + 1 dB) Intercarrier generation Output voltage; 5,5 MHz (r.m.s. value) Intercarrier signal-to-noise (see note 1) (measured behind the FM demodulators) weighted according to CCIR 468-2, quasi-peak a. 2T/20T pulses with white bars (see also Fig.4) b. 6 kHz sinewave c. black level (sync pulses only) Note 1. Incidental phase on the vision carrier, caused by TV transmitter, has to be less than 0,5 degrees for black to white transient (equivalent to S+W/W = 56 dB for 6 kHz sinewave). February 1985 4 Philips Semiconductors Product specification Quasi-split-sound circuit TDA2545A Fig.2 Measuring circuit for TDA2545A. Fig.3 Control voltage at pin 3 as a function of the input voltage VVC1-16(rms). February 1985 5 Philips Semiconductors Product specification Quasi-split-sound circuit TDA2545A Fig.4 Signal-to-weighted-noise ratio depending on video modulation. February 1985 6 Philips Semiconductors Product specification Quasi-split-sound circuit TDA2545A PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 ME seating plane D A2 A A1 L c e Z b1 w M (e 1) b MH 9 16 pin 1 index E 1 8 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.7 1.40 1.14 0.53 0.38 0.32 0.23 21.8 21.4 6.48 6.20 2.54 7.62 3.9 3.4 8.25 7.80 9.5 8.3 0.254 2.2 inches 0.19 0.020 0.15 0.055 0.045 0.021 0.015 0.013 0.009 0.86 0.84 0.26 0.24 0.10 0.30 0.15 0.13 0.32 0.31 0.37 0.33 0.01 0.087 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT38-1 050G09 MO-001AE February 1985 EIAJ EUROPEAN PROJECTION ISSUE DATE 92-10-02 95-01-19 7 Philips Semiconductors Product specification Quasi-split-sound circuit TDA2545A SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. February 1985 8