74HC3GU04 Inverter Rev. 04. — 11 January 2010 Product data sheet 1. General description The 74HC3GU04 is a high-speed Si-gate CMOS device. This device provides three inverter gates with unbuffered outputs. The 74HC3GU04 has CMOS input switching levels and supply voltage range 2 V to 6 V. 2. Features Wide supply voltage range from 2.0 V to 6.0 V Symmetrical output impedance High noise immunity Low-power dissipation Balanced propagation delays Multiple package options ESD protection: HBM JESD22-A114F exceeds 2 000 V MM JESD22-A115-A exceeds 200 V Specified from −40 °C to +85 °C and −40 °C to +125 °C 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC3GU04DP −40 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 74HC3GU04DC −40 °C to +125 °C VSSOP8 plastic very thin shrink small outline package; 8 leads; SOT765-1 body width 2.3 mm 74HC3GU04GD −40 °C to +125 °C XSON8U plastic extremely thin small outline package; no leads; SOT996-2 8 terminals; UTLP based; body 3 × 2 × 0.5 mm 4. Marking Table 2. Marking Type number Marking code 74HC3GU04DP HU4 74HC3GU04DC HU4 74HC3GU04GD HU4 74HC3GU04 NXP Semiconductors Inverter 5. Functional diagram 1 1A 1Y 1 1 7 3 1 5 6 1 2 7 3 2A 2Y 5 6 3A 3Y 2 mna720 Fig 1. mna721 Logic symbol Fig 2. IEC logic symbol 6. Pinning information 6.1 Pinning 74HC3GU04 1A 1 8 VCC 3Y 2 7 1Y 2A 3 6 3A GND 4 5 2Y 74HC3GU04 1A 1 8 VCC 3Y 2 7 1Y 2A 3 6 3A GND 4 5 2Y 001aak023 Transparent top view 001aak022 Fig 3. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) Fig 4. Pin configuration SOT996-2 (XSON8U) 6.2 Pin description Table 3. Pin description Symbol Pin Description 1A, 2A, 3A 1, 3, 6 data input 1Y, 2Y, 3Y 7, 5, 2 data output GND 4 ground (0 V) VCC 8 supply voltage 74HC3GU04_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 11 January 2010 2 of 16 74HC3GU04 NXP Semiconductors Inverter 7. Functional description Table 4. Function table [1] Input Output nA nY L H H L [1] H = HIGH voltage level; L = LOW voltage level. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage Conditions Min Max Unit −0.5 +7.0 V IIK input clamping current VI < −0.5 V or VI > VCC + 0.5 V [1] - ±20 mA IOK output clamping current VO < −0.5 V or VO > VCC + 0.5 V [1] - ±20 mA IO output current VO = −0.5 V to (VCC + 0.5 V) [1] - ±25 mA quiescent supply current [1] - 50 mA IGND ground current [1] −50 - mA Tstg storage temperature −65 +150 °C Ptot total power dissipation - 300 mW ICC [1] [2] Tamb = −40 °C to +125 °C [2] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For TSSOP8 package: above 55 °C the value of Ptot derates linearly with 2.5 mW/K. For VSSOP8 package: above 110 °C the value of Ptot derates linearly with 8 mW/K. For XSON8U package: above 118 °C the value of Ptot derates linearly with 7.8 mW/K. 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage VI input voltage VO output voltage Tamb ambient temperature Δt/ΔV input transition rise and fall rate Conditions Typ Max Unit 2.0 5.0 6.0 V 0 - VCC V 0 - VCC V −40 +25 +125 °C VCC = 2.0 V - - 625 ns/V VCC = 4.5 V - 1.67 139 ns/V VCC = 6.0 V - - 83 ns/V 74HC3GU04_4 Product data sheet Min © NXP B.V. 2010. All rights reserved. Rev. 04 — 11 January 2010 3 of 16 74HC3GU04 NXP Semiconductors Inverter 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol VIH Parameter HIGH-level input voltage VIL LOW-level input voltage VOH VOL −40 °C to +85 °C Conditions HIGH-level output voltage −40 °C to +125 °C Unit Min Typ[1] Max Min Max VCC = 2.0 V 1.7 1.1 - 1.7 - V VCC = 4.5 V 3.6 2.4 - 3.6 - V VCC = 6.0 V 4.8 3.1 - 4.8 - V VCC = 2.0 V - 0.9 0.3 - 0.3 V VCC = 4.5 V - 2.1 0.9 - 0.9 V VCC = 6.0 V - 2.9 1.2 - 1.2 V IO = −20 μA; VCC = 2.0 V 1.9 2.0 - 1.9 - V IO = −20 μA; VCC = 4.5 V 4.4 4.5 - 4.4 - V IO = −20 μA; VCC = 6.0 V 5.9 6.0 - 5.9 - V IO = −4.0 mA; VCC = 4.5 V 4.13 4.32 - 3.7 - V IO = −5.2 mA; VCC = 6.0 V 5.63 5.81 - 5.2 - V IO = 20 μA; VCC = 2.0 V - 0 0.1 - 0.1 V IO = 20 μA; VCC = 4.5 V - 0 0.1 - 0.1 V IO = 20 μA; VCC = 6.0 V - 0 0.1 - 0.1 V IO = 4.0 mA; VCC = 4.5 V - 0.15 0.33 - 0.4 V IO = 5.2 mA; VCC = 6.0 V - 0.16 0.33 - 0.4 V VI = VIH or VIL LOW-level output voltage VI = VIH or VIL II input leakage current VI = VCC or GND; VCC = 6.0 V - - ±1.0 - ±1.0 μA ICC supply current per input pin; VI = VCC or GND; IO = 0 A; VCC = 6.0 V - - 10 - 20 μA CI input capacitance - 3.0 - - - pF [1] All typical values are measured at Tamb = 25 °C. 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6. Symbol Parameter tpd −40 °C to +85 °C Conditions Min Typ[1] Max Min Max VCC = 2.0 V - 13 75 - 90 ns VCC = 4.5 V - 6 15 - 18 ns VCC = 6.0 V - 5 13 - 15 ns propagation delay nA to nY; see Figure 5 [2] 74HC3GU04_4 Product data sheet −40 °C to +125 °C Unit © NXP B.V. 2010. All rights reserved. Rev. 04 — 11 January 2010 4 of 16 74HC3GU04 NXP Semiconductors Inverter Table 8. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6. Symbol Parameter tt transition time −40 °C to +85 °C Conditions Min Max Min Max VCC = 2.0 V - 18 95 - 125 ns VCC = 4.5 V - 6 19 - 25 ns - 5 16 - 20 ns - 5 - - - pF [3] nY; see Figure 5 VCC = 6.0 V CPD [4] power dissipation VI = GND to VCC capacitance [1] All typical values are measured at Tamb = 25 °C. [2] tpd is the same as tPLH and tPHL. [3] tt is the same as tTLH and tTHL. [4] −40 °C to +125 °C Unit Typ[1] CPD is used to determine the dynamic power dissipation (PD in μW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of outputs. 12. Waveforms VI VM nA input VM GND t PHL t PLH VOH 90 % VM nY output VM 10 % VOL t THL t TLH mna722 Measurement points are given in Table 9. Fig 5. Table 9. Propagation delay data input (nA) to data output (nY) and transition time output (nY) Measurement points Type 74HC3GU04 Input Output VM VM 0.5 × VCC 0.5 × VCC 74HC3GU04_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 11 January 2010 5 of 16 74HC3GU04 NXP Semiconductors Inverter VI tW 90 % negative pulse VM 0V VI tf tr tr tf 90 % positive pulse 0V VM 10 % VM VM 10 % tW VCC G VI VCC VO RL S1 open DUT RT CL 001aad983 Test data is given in Table 10. Definitions for test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator. CL = Load capacitance including jig and probe capacitance. RL = Load resistance. S1 = Test selection switch. Fig 6. Table 10. Test circuit for measuring switching times Test data Type 74HC3GU04 Input Load VI tr, tf CL RL tPHL, tPLH GND to VCC ≤ 6 ns 50 pF 1 kΩ open 74HC3GU04_4 Product data sheet S1 position © NXP B.V. 2010. All rights reserved. Rev. 04 — 11 January 2010 6 of 16 74HC3GU04 NXP Semiconductors Inverter 12.1 Additional characteristics Rbias = 560 kΩ VCC 0.47 μF input output 100 μF VI (f = 1 kHz) A IO GND mna050 ΔI o g fs = -------ΔV i VO is constant. Fig 7. Test set-up for measuring forward transconductance mnb124 30 gfs (mA/V) 20 10 0 0 2 4 6 VCC (V) 8 Tamb = 25 °C. Fig 8. Typical forward transconductance as a function of supply voltage 74HC3GU04_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 11 January 2010 7 of 16 74HC3GU04 NXP Semiconductors Inverter 13. Typical transfer characteristics mnb121 150 ICC (μA) 120 1.6 90 1.2 60 0.8 30 0.4 0.4 0.8 1.2 1.6 VO (V) 8 4 6 3 4 2 2 1 0 0 0 0 0 2 2 1 3 4 5 VI (V) VI (V) VCC = 2.0 V; IO = 0 A. Fig 9. 5 I CC (mA) VO (V) 0 mnb122 10 2 VCC = 4.5 V; IO = 0 A. Typical transfer characteristics VCC = 2.0 V Fig 10. Typical transfer characteristics VCC = 4.5 V mnb123 20 6 I CC (mA) VO (V) 16 12 3 8 4 0 0 0 2 4 VI (V) 6 VCC = 6.0 V; IO = 0 A. Fig 11. Typical transfer characteristics VCC = 6.0 V 14. Application information Some applications for the 74HC3GU04 are: • Linear amplifier (see Figure 12) • Crystal oscillator (see Figure 14). 74HC3GU04_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 11 January 2010 8 of 16 74HC3GU04 NXP Semiconductors Inverter Remark: All values given are typical values unless otherwise specified. R2 VCC 1 μF R1 U04 ZL mna052 ZL > 10 kΩ. R1 ≥ 3 kΩ. R2 ≤ 1 MΩ. Open loop amplification: AOL = 20 (typical). A OL Voltage amplification: A V = – ----------------------------------------- . R1 1 + ------- ( 1 + AOL ) R2 Vo(p-p) = VCC − 1.5 V centered at 0.5 × VCC. Unity gain bandwidth product is 5 MHz (typical). Input capacitance see Figure 13. Fig 12. Linear amplifier application mna054 80 input capacitance (pF) (1) 60 (2) 40 (3) 20 0 0 2 4 6 VI (V) 8 (1) VCC = 2.0 V. (2) VCC = 4.5 V. (3) VCC = 6.0 V. Fig 13. Typical input capacitance as a function of the input voltage 74HC3GU04_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 11 January 2010 9 of 16 74HC3GU04 NXP Semiconductors Inverter R1 R2 U04 C1 C2 out mna053 Test data is given in Table 11 and Table 12. C1 = 47 pF (typical). C2 = 22 pF (typical). R1 = 1 MΩ to 10 MΩ (typical). R2 optimum value depends on the frequency and required stability against changes in VCC or average minimum ICC (ICC = 2 mA at VCC = 3.0 V and f = 1 MHz) Fig 14. Crystal oscillator application Table 11. External components for resonator (f < 1 MHz) Frequency R1 R2 C1 C2 10 kHz to 15.9 kHz 2.2 MΩ 220 kΩ 56 pF 20 pF 16 kHz to 24.9 kHz 2.2 MΩ 220 kΩ 56 pF 10 pF 25 kHz to 54.9 kHz 2.2 MΩ 100 kΩ 56 pF 10 pF 55 kHz to 129.9 kHz 2.2 MΩ 100 kΩ 47 pF 5 pF 130 kHz to 199.9 kHz 2.2 MΩ 47 kΩ 47 pF 5 pF 200 kHz to 349.9 kHz 2.2 MΩ 47 kΩ 47 pF 5 pF 350 kHz to 600 kHz 2.2 MΩ 47 kΩ 47 pF 5 pF Table 12. Optimum value for R2 Frequency R2 Optimum 3 kHz 2.0 kΩ minimum required ICC 8.0 kΩ minimum influence due to change in VCC 1.0 kΩ minimum required ICC 4.7 kΩ minimum influence by VCC 0.5 kΩ minimum required ICC 2.0 kΩ minimum influence by VCC 0.5 kΩ minimum required ICC 2.0 kΩ minimum influence by VCC 6 kHz 10 kHz 14 kHz > 14 kHz replace R2 by C3 = 35 pF (typical) 74HC3GU04_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 11 January 2010 10 of 16 74HC3GU04 NXP Semiconductors Inverter 15. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm D E A SOT505-2 X c HE y v M A Z 5 8 A A2 (A3) A1 pin 1 index θ Lp L 1 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.00 0.95 0.75 0.25 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.5 0.47 0.33 0.2 0.13 0.1 0.70 0.35 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 --- Fig 15. Package outline SOT505-2 (TSSOP8) 74HC3GU04_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 11 January 2010 11 of 16 74HC3GU04 NXP Semiconductors Inverter VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm D E SOT765-1 A X c y HE v M A Z 5 8 Q A A2 A1 pin 1 index (A3) θ Lp 1 4 e L detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(2) e HE L Lp Q v w y Z(1) θ mm 1 0.15 0.00 0.85 0.60 0.12 0.27 0.17 0.23 0.08 2.1 1.9 2.4 2.2 0.5 3.2 3.0 0.4 0.40 0.15 0.21 0.19 0.2 0.13 0.1 0.4 0.1 8° 0° Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-06-07 MO-187 Fig 16. Package outline SOT765-1 (VSSOP8) 74HC3GU04_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 11 January 2010 12 of 16 74HC3GU04 NXP Semiconductors Inverter XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm B D SOT996-2 A A E A1 detail X terminal 1 index area e1 v w b e L1 1 4 8 5 C C A B C M M y y1 C L2 L X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D E e e1 L L1 L2 v w y y1 mm 0.5 0.05 0.00 0.35 0.15 2.1 1.9 3.1 2.9 0.5 1.5 0.5 0.3 0.15 0.05 0.6 0.4 0.1 0.05 0.05 0.1 REFERENCES OUTLINE VERSION IEC SOT996-2 --- JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-12-18 07-12-21 Fig 17. Package outline SOT996-2 (XSON8U) 74HC3GU04_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 11 January 2010 13 of 16 74HC3GU04 NXP Semiconductors Inverter 16. Abbreviations Table 13. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 17. Revision history Table 14. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC3GU04_4 20100111 Product data sheet - 74HC3GU04_3 Modifications: • Marking code for 74HC3GU04DP package changed from HU04 to HU4 74HC3GU04_3 20090511 Product data sheet - 74HC3GU04_2 74HC3GU04_2 20031126 Product specification - 74HC3GU04_1 74HC3GU04_1 20030818 Product specification - - 74HC3GU04_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 11 January 2010 14 of 16 74HC3GU04 NXP Semiconductors Inverter 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 18.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74HC3GU04_4 Product data sheet © NXP B.V. 2010. All rights reserved. Rev. 04 — 11 January 2010 15 of 16 74HC3GU04 NXP Semiconductors Inverter 20. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 12.1 13 14 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 3 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 Dynamic characteristics . . . . . . . . . . . . . . . . . . 4 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Additional characteristics . . . . . . . . . . . . . . . . . 7 Typical transfer characteristics . . . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . . 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 11 January 2010 Document identifier: 74HC3GU04_4