PHILIPS PCF50603HN

INTEGRATED CIRCUITS
DATA SHEET
PCF50603
Controller for power supply
and battery management
Preliminary specification
2003 Oct 31
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
CONTENTS
1
FEATURES
1.1
1.2
1.3
1.4
System control
Supply voltage generation
Battery management
Subscriber identity module card interface
2
APPLICATIONS
3
GENERAL DESCRIPTION
4
QUICK REFERENCE DATA
5
ORDERING INFORMATION
6
BLOCK DIAGRAM
7
PINNING
8
FUNCTIONAL DESCRIPTION
8.1
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
8.2
8.3
8.4
8.5
8.5.1
8.5.2
On/off control
Operating states
Reset generation
Watchdog timer
Automatic restart after battery removal
Debounce filters
Serial interface (I2C-bus)
Interrupt controller (INT)
Power supply modules
Main battery charger (MBC)
Supported charger plugs
External components
2003 Oct 31
8.6
8.7
8.8
8.9
8.10
8.11
8.12
8.13
Backup battery charger (BBC)
SIM card interface (SIMI)
Battery voltage monitor (BVM)
Temperature high sensor (TS)
Real time clock (RTC)
Pulse-width modulator (PWM1 and PWM2)
LED modulator (LED1 and LED2)
General purpose outputs (GPO)
9
LIMITING VALUES
10
CHARACTERISTICS
11
APPLICATION INFORMATION
12
PACKAGE OUTLINE
13
SOLDERING
13.1
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
13.2
13.3
13.4
13.5
2
14
DATA SHEET STATUS
15
DEFINITIONS
16
DISCLAIMERS
17
PURCHASE OF PHILIPS I2C COMPONENTS
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
1
1.1
PCF50603
FEATURES
System control
• Serial 400 kHz I2C-bus interface to transfer the control
data between the PCF50603 and the host controller
• On/Off Control (OOC) module to control the power
ramp-up and ramp-down sequences for the handset.
Furthermore it determines the supported system
operating states: NOPOWER, SAVE, STANDBY and
ACTIVE to realize minimum power consumption in all
states.
1.2
Supply voltage generation
• The power supplies have three programmable activity
modes (OFF, ECO and ON). In the ACTIVE state, the
operation modes can be selected by the two external
pins PWREN1 and PWREN2.
• Internal Current Controlled Oscillator (CCO) generates
the internal high clock frequency. The generated
frequency is typically 3.6 MHz.
• One Charge Pump (CP) with programmable output
voltage for the supply of white or blue LEDs
• An accurate 32.768 kHz oscillator. This oscillator can be
used to supply the 32 kHz clock domains in the system,
to improve the accuracy of the internal clock and to
reduce the power consumption of the PCF50603.
• Two 100 mA LDO voltage regulators (RF1REG and
RF2REG) with fixed output voltage (mask
programmable) for RF supplies. RF1REG and RF2REG
are optimized for low noise, high power supply rejection
and excellent load regulation.
• Interrupt controller (INT) that generates the interrupt
request for the host controller. All interrupt sources can
be masked.
• Two 150 mA LDO voltage regulators (D1REG and
D2REG) optimized for small external capacitors.
D1REG provides a programmable output voltage,
D2REG provides a fixed output voltage (mask
programmable).
• The Real Time Clock (RTC) module uses the 32 kHz
clock to provide time reference and alarm functions with
wake up control for the handset
• One 150 mA LDO voltage regulator (IOREG) dedicated
for the supply of the I/O pads. IOREG has a fixed output
voltage (mask programmable) and is optimized for a
small external capacitor.
• One accessory recognition pin with debounce filters and
capability to start up the system (REC1_N)
• One accessory detection comparator input pin with
programmable threshold levels that issues an interrupt
when an accessory is connected (REC2_N)
• One 100 mA LDO voltage regulator (LPREG) with fixed
output voltage (mask programmable). In low power
operation (ECO) mode LPREG can be used to
permanently supply parts in the system in all activity
states.
• Two Pulse-Width Modulators (PWM1 and PWM2) which
generate an output voltage with programmable duty
cycle and frequency
• Two LED modulators (LED1 and LED2) capable of
generating eight different blinking patterns with eight
different repetition periods
• One 100 mA LDO voltage regulator (D3REG) with
programmable output voltage. D3REG is optimized for a
small external capacitor.
• Three General Purpose Outputs (GPO) programmable
via the serial interface. The GPOs are open-drain
NMOST outputs, capable of handling the full battery
voltage range and high sink currents. The GPOs can be
programmed to be continuously active LOW or 3-state,
in addition the GPO outputs can be controlled by the
LED or PWM modulators.
• One 250 mA LDO voltage regulator (HCREG) with
programmable output voltage. The high current HCREG
is optimized for applications like hands-free audio.
• D1REG, D2REG, D3REG, IOREG and LPREG support
ECO mode. In this mode the output current is limited to
1 mA and the internal power consumption is reduced
significantly.
• Watchdog timer that can be activated by software.
• The Temperature high Sensor (TS) provides thermal
protection for the whole chip
• Enhanced ESD protection on all pins that connect to the
main battery pack
• Microphone bias voltage generator with low noise and
high power supply rejection (MBGEN).
2003 Oct 31
3
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
1.3
PCF50603
Battery management
1.4
• Operates from a three cell NiCd/NiMH or a one cell
Li-ion battery pack
Subscriber identity module card interface
• Two different modes that can be selected with the
Subscriber Identity Module card Interface (SIMI):
• Battery Voltage Monitor (BVM) to detect a too low main
battery voltage with programmable threshold levels.
A low battery condition is reported via the interrupt
mechanism.
– Transparent interface including an arbiter and signal
level translators
– Subscriber Identity Module (SIM) card interface with
integrated sequencer, arbiter and signal level
translators. The sequencer supports and controls
card activation and de-activation, warm reset and
controlled clock stop for power-down modes.
• Charger control. There is an option between two
different charger control functions, depending on the
configuration:
• Dedicated SIM supply (SIMREG). Supports
3.0 V and 1.8 V cards, including a power saving ECO
mode for the power-down mode of the SIM card.
– Configuration Constant Current Constant Voltage
(CCCV). Linear charger control supporting Li-ion as
well as NiCd/NiMH battery types for a wide range of
battery capacities.
• Enhanced ESD protection on all pins that connect to the
SIM card contact pins.
– Configuration BATMAX comparator that compares
the battery voltage against a programmable
threshold voltage. This function can be activated by
software and is used to detect the end-of-charge.
2
APPLICATIONS
• Mobile phones.
• Supports the use of a backup battery that powers at
empty main battery situations. The backup battery is
used to supply the RTC, the internal state and the
LPVDD supply in it’s ECO mode. Goldcaps, Li and Li-ion
cells are supported.
3
GENERAL DESCRIPTION
The PCF50603 is a highly integrated solution for power
supply generation, battery management including
charging and a SIM card interface including supply
generation. The device is controlled by a host controller via
a 400 kHz I2C-bus serial interface.
• Includes a Backup Battery Charger (BBC).
A rechargeable backup battery or backup capacitor can
be charged from the main battery. For charging, a
programmable constant voltage mode is supported.
4 QUICK REFERENCE DATA
VSS = REFGND = GND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
SYMBOL
PARAMETER
VBAT
main battery input voltage
VSAVE
backup battery input voltage
VCHG
charger input voltage
VCHGMIN
minimum charger voltage
enabling MBC module
fCLKCCO
high clock frequency
CONDITIONS
TYP.
MAX.
UNIT
0
−
5.7
V
0
−
5.7
V
DC
0
−
15.0
V
rectified sine wave;
100 Hz to 120 Hz; note 1
0
−
20.0
V
−
2.7
−
V
3.42
3.6
3.78
MHz
32 kHz clock available
Note
1. Not allowed in CCCV configuration.
2003 Oct 31
MIN.
4
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
5
PCF50603
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
PCF50603HN
2003 Oct 31
DESCRIPTION
HVQFN48 plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 6 × 6 × 0.85 mm
5
VERSION
SOT778-1
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5
1
INT
CONTROLLER
OOC
TS
10
32kHz
OSCILLATOR
SDA
REFC
MICBIAS
REC2_N
6
GPO1
GPO2
GPO3
SIMCKHC
SIMIOHC
SIMRSHC_N
SIMCKCD
SIMIOCD
SIMRSCD_N
SIMEN
28
12
13
BBC
control data
I2C-BUS
INTERFACE
OSCO
status data
ON-CHIP
REFERENCE
BATMAX
COMPARATOR
AND
MBC
reference voltage
bias currents
AUDIO
DETECTION
33
34
31
BVM
CHGDRV
CHGCUR/
BATMAX
VBAT
48
47
INTERNAL
SUPPLY
MODULE
PWM1 AND PWM2
GPO
46
LED1 AND LED2
30
32
29
internal supply
8
36
9
37
CP
7
43
38
SIMI
35
42
VSAVE
VCHG
VINT
CPVBAT
SCP
SCN
CPVDD
44
45
41
SIMREG
D3REG
39
14
SIMD3VBAT
IOVDD
D3VDD
15
16
IOD2VBAT
LPREG
D1REG
21
D2VDD
20
LPD1VBAT
D1VDD
Fig.1 Block diagram.
RF2REG
RF1REG
19
22
23
HCREG
24
18
17
LPVDD
RF12VBAT
HCVBAT
RF1VDD
RF2VDD
HCVDD
MDB679
PCF50603
40
D2REG
IOREG
Preliminary specification
SIMVCC
3
OSCI
CLOCK
GENERATOR
UNIT
RTC AND
ALARM
2
25
operation modes
temp_ok
system clocks
SCL
26
Philips Semiconductors
6
IRQ_N
REC1_N
Controller for power supply
and battery management
4
PCF50603
PWREN2
BLOCK DIAGRAM
11
PWREN1
6
27
CLK32K
dbook, full pagewidth
2003 Oct 31
ONKEY_N RSTHC_N
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
7
PCF50603
PINNING
SYMBOL
PIN
DESCRIPTION(1)
SUPPLY
VSS and
REFGND
−
n.a.
ground and VSS pads of all modules are connected to the ground plane of the
package
REC1_N
1
VINT
accessory recognition input with debounce filter (active LOW); input with internal
pull-up resistor to VINT
SCL
2
IOVDD
I2C-bus clock input
SDA
3
IOVDD
I2C-bus data input and output
CLK32K
4
IOVDD
32.768 kHz digital clock output; in ACTIVE state and IOVDD is on
PWREN2
5
IOVDD
control signal input; selects in combination with PWREN1 the ON, OFF or ECO
mode of the linear regulators
PWREN1
6
IOVDD
control signal input; selects in combination with PWREN2 the ON, OFF or ECO
mode of the linear regulators
SIMRSHC_N
7
IOVDD
SIM reset input from host controller (active LOW)
SIMCKHC
8
IOVDD
SIM clock input from host controller
SIMIOHC
9
IOVDD
SIM I/O data to or from the host controller with an internal pull-up resistor to
IOVDD
IRQ_N
10
IOVDD
interrupt request output to host controller (active LOW); open-drain output with an
internal pull-up resistor to IOVDD
RSTHC_N
11
IOVDD
reset output to host controller (active LOW)
MICBIAS
12
n.a.
microphone bias output voltage
REC2_N
13
MICBIAS
accessory recognition input with debounce filter and programmable threshold
(active LOW)
IOVDD
14
n.a.
IOREG output voltage
IOD2VBAT
15
n.a.
IOREG and D2REG input voltage
D2VDD
16
n.a.
D2REG output voltage
HCVDD
17
n.a.
HCREG output voltage
HCVBAT
18
n.a.
HCREG input voltage
LPVDD
19
n.a.
LPREG output voltage
LPD1VBAT
20
n.a.
LPREG and D1REG input voltage
D1VDD
21
n.a.
D1REG output voltage
RF1VDD
22
n.a.
RF1REG output voltage
RF12VBAT
23
n.a.
RF1REG and RF2REG input voltage
RF2VDD
24
n.a.
RF2REG output voltage
OSCO
25
VINT
32.768 kHz oscillator output
OSCI
26
VINT
32.768 kHz oscillator input
ONKEY_N
27
VINT
On-key (active LOW); input with internal pull-up resistor to VINT
REFC
28
n.a.
reference voltage bypass capacitor connection
VINT
29
n.a.
internal supply voltage output
VSAVE
30
n.a.
backup battery supply voltage
VBAT
31
n.a.
main battery supply voltage
VCHG
32
n.a.
charger voltage
2003 Oct 31
7
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
SYMBOL
PCF50603
DESCRIPTION(1)
PIN
SUPPLY
CHGDRV
33
n.a.
drive of external charger circuitry (configuration CCCV)
CHGCUR/
BATMAX
34
n.a.
configuration CCCV: charger current feedback
CPVDD
35
n.a.
charge pump output voltage
CPVBAT
36
n.a.
charge pump input voltage
SCP
37
n.a.
switching capacitor positive side
SCN
38
n.a.
switching capacitor negative side
D3VDD
39
n.a.
D3REG output voltage
SIMD3VBAT
40
n.a.
SIMREG and D3REG input voltage
SIMVCC
41
n.a.
SIMREG output voltage
SIMIOCD
42
SIMVCC
SIM I/O data to/from the SIM card; internal pull-up resistor to SIMVCC
configuration BATMAX: open-drain output of BATMAX comparator
SIMCKCD
43
SIMVCC
SIM clock output to the SIM card
SIMRSCD_N
44
SIMVCC
SIM reset output to the SIM card (active LOW)
SIMEN
45
IOVDD
enable SIMI and SIMREG
GPO3
46
n.a.
general purpose open-drain output 3
GPO2
47
n.a.
general purpose open-drain output 2
GPO1
48
n.a.
general purpose open-drain output 1
Note
1. One ESD diode reverse biased to VSS except pin VCHG who has one clamp in series with a 500 Ω resistor connected
between pad and VSS.
2003 Oct 31
8
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
24 RF2VDD
23 RF12VBAT
22 RF1VDD
21 D1VDD
20 LPD1VBAT
19 LPVDD
18 HCVBAT
17 HCVDD
16 D2VDD
15 IOD2VBAT
14 IOVDD
13 REC2_N
handbook, full pagewidth
PCF50603
25 OSCO
MICBIAS 12
26 OSCI
RSTHC_N 11
IRQ_N 10
27 ONKEY_N
SIMIOHC
9
28 REFC
SIMCKHC
8
29 VINT
SIMRSHC_N
7
PWREN1
6
PWREN2
5
CLK32K
4
32 VCHG
33 CHGDRV
SDA
3
34 CHGCUR/BATMAX
SCL
2
35 CPVDD
REC1_N
1
36 CPVBAT
30 VSAVE
31 VBAT
Bottom view.
All GND and VSS pads are connected to the ground plane.
Fig.2 Pin configuration.
2003 Oct 31
9
SCP 37
SCN 38
D3VDD 39
SIMD3VBAT 40
SIMVCC 41
SIMIOCD 42
SIMCKCD 43
SIMRSCD_N 44
SIMEN 45
GPO3 46
GPO1 48
GPO2 47
PCF50603HN
MDB680
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
8
PCF50603
FUNCTIONAL DESCRIPTION
8.1
On/off control
8.1.1
OPERATING STATES
The PCF50603 has four operating states (see Fig.3):
• NOPOWER
• SAVE
• STANDBY
• ACTIVE.
handbook, full pagewidth
NOPOWER
VBAT < VVERY_LOW_BAT
AND
VSAVE < VVERY_LOW_BACK
AND
VCHG < VVERY_LOW_BAT
SAVE
VBAT < VVERY_LOW_BAT
AND
VSAVE > VVERY_LOW_BACK
OR
VCHG > VVERY_LOW_BAT
STANDBY
VBAT > VVERY_LOW_BAT
ACTIVE
VBAT > VLOW_BAT
MDB681
Fig.3 State diagram.
8.1.2
RESET GENERATION
The RSTHC_N is kept LOW for minimum 10 ms after
entering the ACTIVE state. If the IOREG supply is
switched off, RSTHC_N becomes LOW again (see Fig.4).
The OOC generates an internal and an external reset each
time the system goes from STANDBY to ACTIVE state. All
registers for the regulators and converters are reset to their
default values.
2003 Oct 31
A special condition occurs when the main battery voltage
drops below the VVERY_LOW_BAT limit of typically 2.7 V; the
RSTHC_N is asserted in order to shut down the host
controller immediately (see Fig.5).
10
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
handbook, full pagewidth
system
state
STANDBY
ACTIVE
STANDBY
treset = 10 ms
RSTHC_N
xxVDD
32 kHz
oscillator
CLK32K
MDB682
Before the supplies are turned on, the internal 32 kHz clock is already stable. After
power up of the IOVDD supply the external clock on pin CLK32K becomes available.
Fig.4 Reset generation timing diagram (STANDBY - ACTIVE - STANDBY transition).
handbook, full pagewidth
system
state
STANDBY
ACTIVE
STANDBY
treset = 10 ms
RSTHC_N
SIM emergency deactivation
SIM activation
xxVDD
32 kHz
oscillator
CLK32K
MDB683
Before the supplies are turned on, the internal 32 kHz clock is already stable. After
power up of the IOVDD supply the external clock on pin CLK32K becomes available.
Fig.5 Reset generation timing diagram (STANDBY - ACTIVE - STANDBY transition).
2003 Oct 31
11
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
8.1.3
PCF50603
phone due to mechanical bounce on the battery. The
automatic restart is enabled or disabled by control
bit BATRM_EN in the OOCC register. By default this
automatic restart feature is disabled.
WATCHDOG TIMER
The OOC contains a WatchDog Timer (WDT). By default
it is not activated. It can be activated by setting
bit WDT_RST in the OOCC register to logic 1. Once this
bit has been set, the watchdog is enabled, and needs to be
cleared once every eight seconds. If the watchdog is not
reset in time, the PCF50603 automatically goes to the
STANDBY state when the watchdog timer expires. Status
bit WDTEXP is set when the watchdog timer expires. After
each ACTIVE to STANDBY transition the WDT is disabled
and needs to be activated again by software when
entering the ACTIVE state.
8.1.4
Status bit BATRMSTAT in the OOCS2 register indicates
whether the PMU returned to ACTIVE state due to a restart
after battery removal. The status bit remains active until
the PMU returns to STANDBY or SAVE state.
Figure 6 shows the timing for an automatic restart due to
battery removal.
This feature is only triggered by battery removal
(VBAT < 2.7 V). All other shut-down conditions like, low
battery, high temperature, programming GO_STDBY do
not trigger this function.
AUTOMATIC RESTART AFTER BATTERY REMOVAL
The PMU allows for an automatic restart from SAVE to
ACTIVE state when the main battery is removed for a
period less than two seconds (tBATRMLIM). This feature is
especially convenient to avoid accidental switch-off of the
system
handbook, full pagewidth
state
ACTIVE
This feature is only applicable upon the condition that a
BBC (VSAVE > VVERY_LOW_BACK) is available in the system.
SAVE
ACTIVE
<tBATRMLIM
VLOW_BAT
VBAT
VSAVE
VVERY_LOW_BAT
VLOW_BACK
CLK32K
RSTHC_N
xxVDD
BATRMSTAT
(internal status bit)
treset
Fig.6 Automatic restart after battery removal.
2003 Oct 31
12
MCE539
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
8.1.5
PCF50603
DEBOUNCE FILTERS
Fig.7 is applicable for all debounce filters in the PCF50603.
handbook, full pagewidth
un-debounced
tdebounce
tdebounce
debounced
interrupts
falling edge
rising edge
MDB684
The debounced signal keeps the old value until the new value has been stable for at least the applicable debounce time. Any spike (>30 ms) in the
original signal will reset the debounce timer again. This filter suppresses all signal changes that are shorter than the debounce time.
Fig.7 Definition of debounce filter.
8.2
The interrupt module is powered in all states (except
NOPOWER) and retains the register values. Events that
occur in the STANDBY state, are captured and can be
read out by the system controller once the system is in the
ACTIVE state.
Serial interface (I2C-bus)
The I2C-bus is the serial interface of the PCF50603.
A detailed description of the I2C-bus specification,
including applications, is given in the brochure: The
I2C-bus and how to use it, order no. 9398 393 40011 or
I2C-bus Peripherals Data Handbook IC12.
8.3
The IRQ_N signal is asserted in the ACTIVE state
whenever one or more PCF50603 interrupts are active.
Interrupt controller (INT)
Each interrupt register (8-bits) is cleared when it is read
(R&C) through the I2C-bus interface. New interrupts that
occur during a R&C action are captured in an intermediate
register (see Figs.8 and 9).
The PCF50603 uses the interrupt controller to indicate to
the system controller if the status of the PCF50603 change
and that an action of the system controller is required.
Interrupts can be generated by several modules of the
PCF50603. The interrupt generator handles all interrupts
with the same priority. Priority setting shall be done by the
system controller software.
All interrupts related to shut-down conditions (LOWBAT,
ONKEY1S and HIGHTMP) are automatically cleared on a
transition from ACTIVE to STANDBY state.
All interrupts can be masked: this effectively prevents that
IRQ_N is asserted for masked interrupts. Masking is
implemented with a mask bit in the mask registers for each
interrupt source. Nevertheless, the interrupt status
registers still provide the actual interrupt status of the
masked interrupts, which allows polling of the interrupt
status registers. Note that if the mask bit is cleared for an
active interrupt, the IRQ_N line goes LOW at the next
falling edge of the output pin CLK32K.
There are no timing requirements for interrupt service
response times. All events that require immediate actions
are performed by the PCF50603 without any action by the
system controller.
The function of the interrupt module is to capture, mask
and combine the interrupt signals from the modules that
can generate an interrupt. All interrupts are combined in
the interrupt signal IRQ_N. The IRQ_N signal is
implemented as an open-drain output with an internal
pull-up resistor.
2003 Oct 31
13
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
handbook, full pagewidth
(1)
IRQ_N
I2C-bus
read request &
address
read
INT1
read
INT2
read
INT3
MDB685
Read access can be done with or without incremental addressing.
(1) IRQ_N becomes inactive high as soon as the read sequence of the last INTx register containing an active interrupt starts.
Fig.8 Interrupt timing; no interrupt captured during read sequence.
minimal 1 CLK32
handbook, full pagewidth
(1)
IRQ_N
I2C-bus
read request &
address
read
INT1
read
INT2
read
INT3
MDB686
Read access can be done with or without incremental addressing.
(1) IRQ_N becomes inactive high as soon as the read sequence of the last INTx register containing an active interrupt starts.
Fig.9 Interrupt timing; interrupt captured during read sequence.
2003 Oct 31
14
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
8.4
PCF50603
Power supply modules
In total 11 power supply modules are available in the PCF50603; see Table 1:
• Three regulators for supplying the digital and analog circuitry (D1REG, D2REG and D3REG). These regulators support
the ECO mode
• One regulator for high current supply (HCREG)
• One regulator for the SIMI supply (SIMREG)
• One charge pump (CP)
• One regulator for supplying the I/O pads (IOREG). This regulator supports the ECO mode
• One regulator for low power supply (LPREG). This regulator supports the ECO mode, the LPREG is the only regulator
that can be enabled in SAVE and STANDBY state (ECO mode only)
• Two low-noise regulators for RF supply (RF1REG and RF2REG)
• One ultra low-noise regulator for supplying a microphone (MBGEN).
Table 1
Power supply modules; VSS = REFGND = GND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
SUPPLY
NAME
NOMINAL
CURRENT
(mA)
MINIMUM MAXIMUM VOLTAGE
VOLTAGE VOLTAGE
STEPS
(V)
(V)
(mV)
RESET
VOLTAGE
(V)
ECO
MODE
PSRR(1)
(dB)
SIZE EXTERNAL
CAPACITOR(2)
(nF)
Programmable power supplies
D1REG
150
1.20
3.20
100
note 3
yes
60
470
D3REG
100
1.20
3.20
100
note 3
yes
60
470
HCREG
250 (4)
2.60
3.20
200
note 3
no
60
4700
60
1000
SIMREG
CP
20
1.80
3.00
−
1.8
yes(5)
75(6)
3.50
5.00
500
note 3
no
−
220/4700(7)
Fixed power supplies, mask programmable
D2REG
150
1.20
3.20
100
note 3
yes
60
470
IOREG
150
1.20
3.20
100
note 3
yes
60
470
LPREG
100
1.20
3.20
100
note 3
yes
60
470
RF1REG (8)
100
2.60
3.00
100
note 3
no
70
4700
RF2REG (8)
100
2.60
3.00
100
note 3
no
70
4700
2.15
2.15
−
2.15
yes
110
4700
Fixed power supply
MBGEN
1.5
Notes
1. Typical value, 100 Hz < f < 1000 Hz.
2. Typical values assume X5R or X7R type of capacitor.
3. Mask programmable for reset settings of different types.
4. Under specific conditions a nominal current of 300 mA can be delivered.
5. When SIMI is in Power-down mode.
6. Maximum current depends on the selected output voltage. At 3.50 V, 4.00 V and 4.50 V the maximum output current
is 75 mA. At 5.00 V output voltage the maximum output current is 50 mA.
7. The CP module requires both a switching capacitor as well as an output capacitor.
8. Optimized for low noise (30 µV RMS value, 400 Hz < f < 80 kHz).
2003 Oct 31
15
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
8.5
PCF50603
Main battery charger (MBC)
The fast charge current is determined by the value of the
external sense resistor. The charge current in the pre and
trickle charge phase is programmable as a ratio of the fast
charge current.
The main battery charger (MBC) module provides a
complete constant-current/constant-voltage linear charger
controller for lithium-ion (Li-ion) batteries (in CCCV
configuration) or a programmable battery threshold level
detector for end-of-charge indication (configuration
BATMAX). Nickel-cadmium (NiCd) and Nickel metal
hydride (NiMH) batteries can also be charged with
constant current.
In BATMAX configuration an end-of-charge indication is
available on the BATMAX pin.
8.5.1
The PCF50603 charger circuitry supports the following
type of charger plugs (see Fig.10):
Only an external power PNP transistor is required to
control the charge current. The CC and CCCV control
circuitry is fully integrated in the PCF50603 charging
module.
• Regulated charger plugs with output voltage at least
0.5 V above the battery voltage with a maximum of 10 V
and with current limitation up to 3C of the used battery
(CCCV and BATMAX configuration)
In CCCV configuration the charging process for
Li-ion/Li-pol batteries is performed under control of the
host controller. The communication between the
PCF50603 charger module and the host controller is
interrupt based, which simplifies the control of the
PCF50603.
handbook, full pagewidth
VCHG
SUPPORTED CHARGER PLUGS
• Non regulated charger plugs with peak output voltages
up to 20 V with a duration of less than 14 ms and with
current limitation up to 3C of the used battery (BATMAX
configuration only).
VCHG
< 14 ms
< 14 ms
15 V
10 V
10 V
2.7 V
2.7 V
ICHG
t
MDB687
Regulated charger plug.
Non regulated charger plug.
Fig.10 Characteristics of the supported charger plugs.
2003 Oct 31
16
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
8.5.2
PCF50603
EXTERNAL COMPONENTS
A small discrete circuit must be used to control the charge current (see Fig.11).
handbook, halfpage
VCHG
CHGDRV
BC869(1)
CHGCUR
0.15 Ω
VBAT
Rsense
MDB688
(1) The charge switch requires a current gain in the range of 50 to 400 for stable loop operation.
Fig.11 Charge current external circuitry.
8.6
• In transparent mode the SIMEN input allows the host
controller to have direct control over the SIM card
supply. In sequencer mode the SIMEN input indicates
the presence of a SIM card.
Backup battery charger (BBC)
The BBC is implemented as a voltage limited current
source with a selectable output resistor. It offers the
following features:
• Enhanced ESD protection on all SIM contact pins
• Selectable output resistor to reduce the current at higher
voltages
• The SIMI and SIMREG can be enabled in the ACTIVE
state. In all other states the SIMI and SIMREG are
disabled.
• Four programmable charge currents
• Two programmable maximum limiting voltages
• The BBC can be enabled in the ACTIVE state; in all
other states the BBC is disabled.
8.7
8.8
The BVM monitors the main battery voltage. It offers the
following features:
SIM card interface (SIMI)
• Programmable low battery threshold (VLOW_BAT)
The SIMI provides the facilities to communicate with SIM.
It offers the following features:
• Hysteresis and selectable debounce filter built in to
prevent fast cycling
• Support for transparent mode. The host controller
controls the communication with the SIM card, including
the activation and deactivation sequences.
• The BVM is enabled in all activity states.
The BVM observes permanently the main battery voltage
and generates a LOWBAT interrupt if the battery voltage
drops below the programmed threshold voltage VLOW_BAT
(see Fig.12). When a LOWBAT interrupt is generated in
ACTIVE state, the host controller should initiate a
transition to STANDBY state. In case the host controller
does not initiate a transition to the STANDBY state within
eight seconds after the interrupt occurred, the OOC forces
the PCF50603 to the STANDBY state in order to prevent a
too deep discharge of the battery.
• Support for sequencer mode. The internal sequencer of
the PCF50603 performs the activation and deactivation
sequences.
• Includes a dedicated linear regulator for the SIM card
supply (SIMREG) supporting both 1.8 V and 3.0 V cards
• Provides level-shifters for the SIM interfacing signals.
The level-shifters translate the host controller signal
levels (IOVDD) to SIM card signal levels (SIMVCC) and
vice versa.
2003 Oct 31
Battery voltage monitor (BVM)
17
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
V
handbook, full pagewidth
VBAT
Vhys
VLOW_BAT
tdebounce
LOWBAT
interrupt
t
MDB689
Fig.12 BVM and LOWBAT behaviour.
8.9
Temperature high sensor (TS)
A HIGHTMP interrupt is generated when the temperature
threshold is passed for more than 62 ms (debouncing
time). When a HIGHTMP interrupt is generated the host
controller should initiate a transition to STANDBY state.
In case the host controller does not initiate a transition to
the STANDBY state within 1 second after the interrupt
occurred, the OOC forces the PCF50603 to the STANDBY
state in order to prevent damage to the circuit.
The TS monitors the junction temperature of the
PCF50603. It offers the following features:
• Fixed temperature threshold
• Hysteresis and debounce filter built in to prevent fast
cycling
• The TS is enabled in ACTIVE state, in all other states
the TS is disabled.
The hysteresis and debounce time have been built in to
prevent fast cycling of the HIGHTMP signal.
The behaviour of the TS is shown in Figure 13.
The TS can not be disabled via the I2C-bus.
handbook, full pagewidth
Tj
150 °C
Thys
130 °C
tdebounce
tdebounce
HIGHTMP
interrupt
t
MDB690
Fig.13 TS behaviour.
2003 Oct 31
18
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
8.10
PCF50603
Real time clock (RTC)
8.12
The RTC module provides the time information to the
handset based on a 1 Hz clock frequency. Basically it is a
32-bit counter counting elapsed seconds.
The PCF50603 contains two LED modulators (LED1 and
LED2), which can be selected as input for any of the GPO
outputs. The LED modulator of the PCF50603 is used for
the control of the indicator LEDs. They offer the following
features:
• The RTC module contains one alarm function that
generates an interrupt if the actual RTC time equals the
content of the alarm register. The alarm registers are
preset to all 1 s which effectively disables the alarm;
effectively no alarm interrupt will be generated as long
as the RTC counter does not overflow. It is
recommended to mask the ALARM interrupt before a
new value is written to the alarm registers, in order to
prevent interrupts during the write actions (a new setting
may require up to 4 register writes).
• The LED driver can select eight different repetition
periods
• Capable of generating eight different blinking patterns.
The selected pattern is generated once per repetition
period
• The LED can be used as a status indicator during the
ACTIVE state or when a charger is connected.
• The RTC module is able to generate an interrupt each
second (SECOND interrupt) as well as each minute
(MINUTE interrupt). When the RTC starts up the first
time (after transition from NOPOWER state) the minute
interrupt is aligned with each 60 seconds crossing. If the
synchronization with the 60 second crossing is required
after reprogramming the RTC time registers it is up to
the software to program the RTC time registers with a
modulo 60 value.
8.11
8.13
General purpose outputs (GPO)
The PCF50603 contains three high current (100 mA)
open-drain GPOs. They offer the following features:
• Each GPO can be configured as a constant LOW level,
a high impedance, a LED modulator output, a PWM
output or as the complementary PWM output PWM
• The GPOs can sink 100 mA from any supply or battery
voltage.
Pulse-width modulator (PWM1 and PWM2)
The two PWMs (PWM1 and PWM2) offer the following
features:
• Programmable frequency and duty cycle
• Any of the GPOs can be connected to either the PWMs
or the inverse of the PWMs
• The PWMs can be independently enabled in ACTIVE
state. In all other states the PWMs are disabled.
2003 Oct 31
LED modulator (LED1 and LED2)
19
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
9 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VBAT
main battery voltage
−0.5
+6.5
V
VSAVE
backup battery input voltage
−0.5
+6.5
V
VCHG
charger input voltage
−0.5
+20
V
VI
input voltage on any pin with
respect to REFGND
−0.5
+6.5
V
II
input current at any input
−10
+10
mA
IO
output current at any output
−10
+10
mA
Ptot
total power dissipation
−
2000
mW
Tamb
operating ambient
temperature
−40
+85
°C
Tstg
storage temperature
−55
+150
°C
Vesd
electrostatic discharge
voltage
−
±6000
V
HBM; note 1
pins SIMEN, IOD2VBAT, SIMD3VBAT,
SIMRSCD_N, SIMCKCD, SIMIOCD,
VBAT, VSAVE, CPVBAT, LPD1VBAT,
REC1_N, SIMVCC, RF12VBAT,
HCVBAT, REC2_N
pin VCHG
−
±4000
V
other pins
−
±2000
V
−
±200
V
MM; note 2
Notes
1. Human Body Model: equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor.
2. Machine Model: equivalent to discharging a 200 pF capacitor via a 0 Ω resistor.
10 CHARACTERISTICS
VSS = REFGND = GND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VBAT
main battery input voltage
0
−
5.7
V
VSAVE
backup battery input voltage
0
−
5.7
V
VCHG
charger input voltage
DC
0
−
15.0
V
rectified sine wave;
100 Hz to 120 Hz; note 1
0
−
20.0
V
−
2.7
−
V
3.42
3.6
3.78
MHz
VCHGMIN
minimum charger voltage
enabling MBC module
fCLKCCO
high clock frequency
32 kHz clock available
D1 regulator
VO
output voltage
1.20
−
3.20
V
IO
output current
−
−
150
mA
2003 Oct 31
20
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
SYMBOL
PCF50603
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
D3 regulator
VO
output voltage
1.20
−
3.20
V
IO
output current
−
−
100
mA
2.60
−
3.20
V
−
−
250
mA
HC regulator
VO
output voltage
IO
output current
note 1
SIM regulator
VO
output voltage
1.80
−
3.00
V
IO
output current
−
−
20
mA
3.50
−
5.00
V
−
−
75
mA
CP regulator
VO
output voltage
IO
output current
note 2
D2 regulator
VO
output voltage
1.20
−
3.20
V
IO
output current
−
−
150
mA
IO regulator
VO
output voltage
1.20
−
3.20
V
IO
output current
−
−
150
mA
LP regulator
VO
output voltage
1.20
−
3.20
V
IO
output current
−
−
100
mA
RF1 regulator
VO
output voltage
2.60
−
3.00
V
IO
output current
−
−
100
mA
RF2 regulator
VO
output voltage
2.60
−
3.00
V
IO
output current
−
−
100
mA
MBGEN regulator
VO
output voltage
2.15
−
2.15
V
IO
output current
−
−
1.5
mA
Notes
1. Under specific conditions a nominal current of 300 mA can be delivered.
2. Maximum current depends on the selected output voltage. At 3.50 V, 4.00 V and 4.50 V the maximum output current
is 75 mA. At 5.00 V output voltage the maximum output current is 50 mA.
2003 Oct 31
21
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
11 APPLICATION INFORMATION
handbook,
full pagewidth
MAIN
BATTERY
2.2 µF
2.2 µF
VBAT
31
RSENSE
29
CHGCUR
CHGDRV
VCHG
BATTERY +
CHARGER
CONSTANT
CURRENT −
(3)
RF1VDD
FLASH 1.8 V
battery
backup
VINT
AUXADCx
470 nF
34
28
REFC
100 nF
33
12
32
17
on key
ONKEY_N
RAM 1.8 V
RF12VBAT LPD1VBAT IOD2VBAT SIMD3VBAT CPVBAT HCVBAT
23
20
15
40
36
18
VSAVE
30
19
27
MICBIAS
4700
nF
HCVDD
(1)
MICP
4700
nF
LPVDD
(2)
MICN
470
nF
22
4700 nF
RF
UNIT
RF2VDD
headset
24
4700 nF
13
SCP
220 nF
SCN
CPVDD
1
37
21
REC2_N
REC1_N
D1VDD
VDDA
470 nF
38
35
4700 nF
from bottom
connector
14
VDDD
IOVDD
470 nF
PCF50603
16
D2VDD
PCF5213
470 nF
back light
EL lamp
GPO3
DC
DC
46
39
VDDE3
D3VDD
VDDA
470 nF
VDDC
or
GPO2
back light
GPO1
VDDE1
47
VDDE2
LOWVOLT_N
48
ONKEY
OSCI
26
1 kΩ
10 pF
32.768 kHz
10 MΩ
6
10 pF
OSCO
IOVDD
25
5
11
10 kΩ
10
SIMEN
card present
SIM
CARD
READER
4
45
3
SIMRSCD_N
SIMIOCD
SIMCKCD
SIMVCC
1000 nF
44
2
42
9
43
8
41
7
REFGND/VSS
(1) HCVDD is reserved for hands free audio supply.
(2) LPVDD not used in the system.
(3) Connect VCHG to ground if charger is used in BATMAX configuration.
Fig.14 Application diagram.
2003 Oct 31
22
1 kΩ
AUXON_N
PWREN1
GPON0
PWREN2
RFSIGx
RSTON
RSTHC_N
SIMERRN
IRQ_N
CLK32I
CLK32K
SDA
SDA
SCL
SCL
SIMIOHC
SIMIO
SIMCKHC
SIMRSHC_N
SIMCLK
revmod
GPOx
MDB691
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
12 PACKAGE OUTLINE
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 6 x 6 x 0.85 mm
A
B
D
SOT778-1
terminal 1
index area
A
E
A1
c
detail X
C
e1
1/2 e
e
24
L
y
y1 C
v M C A B
w M C
b
13
25
12
e
e2
Eh
1/2 e
1
36
terminal 1
index area
48
37
X
Dh
0
2.5
DIMENSIONS (mm are the original dimensions)
A(1)
UNIT max.
mm
1
5 mm
scale
A1
b
c
D (1)
Dh
E (1)
Eh
e
e1
e2
L
v
w
y
y1
0.05
0.00
0.25
0.15
0.2
6.1
5.9
4.25
3.95
6.1
5.9
4.25
3.95
0.4
4.4
4.4
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT778-1
---
---
---
2003 Oct 31
23
EUROPEAN
PROJECTION
ISSUE DATE
02-07-05
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
with a high component density, as solder bridging and
non-wetting can present major problems.
13 SOLDERING
13.1
Introduction to soldering surface mount
packages
To overcome these problems the double-wave soldering
method was specifically developed.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
13.2
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
Reflow soldering
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
• below 220 °C (SnPb process) or below 245 °C (Pb-free
process)
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
– for all BGA and SSOP-T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
13.4
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
• below 235 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
13.3
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
2003 Oct 31
Manual soldering
24
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
13.5
PCF50603
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA
not suitable
suitable(4)
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
not
PLCC(5), SO, SOJ
suitable
REFLOW(2)
suitable
suitable
suitable
not
recommended(5)(6)
suitable
SSOP, TSSOP, VSO, VSSOP
not
recommended(7)
suitable
PMFP(8)
not suitable
LQFP, QFP, TQFP
not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Hot bar or manual soldering is suitable for PMFP packages.
2003 Oct 31
25
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
14 DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
15 DEFINITIONS
16 DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Oct 31
26
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
17 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2003 Oct 31
27
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected]
SCA75
© Koninklijke Philips Electronics N.V. 2003
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R54/01/pp28
Date of release: 2003
Oct 31
Document order number:
9397 750 11771