INTEGRATED CIRCUITS DATA SHEET PCF50603 Controller for power supply and battery management Preliminary specification 2003 Oct 31 Philips Semiconductors Preliminary specification Controller for power supply and battery management PCF50603 CONTENTS 1 FEATURES 1.1 1.2 1.3 1.4 System control Supply voltage generation Battery management Subscriber identity module card interface 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 QUICK REFERENCE DATA 5 ORDERING INFORMATION 6 BLOCK DIAGRAM 7 PINNING 8 FUNCTIONAL DESCRIPTION 8.1 8.1.1 8.1.2 8.1.3 8.1.4 8.1.5 8.2 8.3 8.4 8.5 8.5.1 8.5.2 On/off control Operating states Reset generation Watchdog timer Automatic restart after battery removal Debounce filters Serial interface (I2C-bus) Interrupt controller (INT) Power supply modules Main battery charger (MBC) Supported charger plugs External components 2003 Oct 31 8.6 8.7 8.8 8.9 8.10 8.11 8.12 8.13 Backup battery charger (BBC) SIM card interface (SIMI) Battery voltage monitor (BVM) Temperature high sensor (TS) Real time clock (RTC) Pulse-width modulator (PWM1 and PWM2) LED modulator (LED1 and LED2) General purpose outputs (GPO) 9 LIMITING VALUES 10 CHARACTERISTICS 11 APPLICATION INFORMATION 12 PACKAGE OUTLINE 13 SOLDERING 13.1 Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods 13.2 13.3 13.4 13.5 2 14 DATA SHEET STATUS 15 DEFINITIONS 16 DISCLAIMERS 17 PURCHASE OF PHILIPS I2C COMPONENTS Philips Semiconductors Preliminary specification Controller for power supply and battery management 1 1.1 PCF50603 FEATURES System control • Serial 400 kHz I2C-bus interface to transfer the control data between the PCF50603 and the host controller • On/Off Control (OOC) module to control the power ramp-up and ramp-down sequences for the handset. Furthermore it determines the supported system operating states: NOPOWER, SAVE, STANDBY and ACTIVE to realize minimum power consumption in all states. 1.2 Supply voltage generation • The power supplies have three programmable activity modes (OFF, ECO and ON). In the ACTIVE state, the operation modes can be selected by the two external pins PWREN1 and PWREN2. • Internal Current Controlled Oscillator (CCO) generates the internal high clock frequency. The generated frequency is typically 3.6 MHz. • One Charge Pump (CP) with programmable output voltage for the supply of white or blue LEDs • An accurate 32.768 kHz oscillator. This oscillator can be used to supply the 32 kHz clock domains in the system, to improve the accuracy of the internal clock and to reduce the power consumption of the PCF50603. • Two 100 mA LDO voltage regulators (RF1REG and RF2REG) with fixed output voltage (mask programmable) for RF supplies. RF1REG and RF2REG are optimized for low noise, high power supply rejection and excellent load regulation. • Interrupt controller (INT) that generates the interrupt request for the host controller. All interrupt sources can be masked. • Two 150 mA LDO voltage regulators (D1REG and D2REG) optimized for small external capacitors. D1REG provides a programmable output voltage, D2REG provides a fixed output voltage (mask programmable). • The Real Time Clock (RTC) module uses the 32 kHz clock to provide time reference and alarm functions with wake up control for the handset • One 150 mA LDO voltage regulator (IOREG) dedicated for the supply of the I/O pads. IOREG has a fixed output voltage (mask programmable) and is optimized for a small external capacitor. • One accessory recognition pin with debounce filters and capability to start up the system (REC1_N) • One accessory detection comparator input pin with programmable threshold levels that issues an interrupt when an accessory is connected (REC2_N) • One 100 mA LDO voltage regulator (LPREG) with fixed output voltage (mask programmable). In low power operation (ECO) mode LPREG can be used to permanently supply parts in the system in all activity states. • Two Pulse-Width Modulators (PWM1 and PWM2) which generate an output voltage with programmable duty cycle and frequency • Two LED modulators (LED1 and LED2) capable of generating eight different blinking patterns with eight different repetition periods • One 100 mA LDO voltage regulator (D3REG) with programmable output voltage. D3REG is optimized for a small external capacitor. • Three General Purpose Outputs (GPO) programmable via the serial interface. The GPOs are open-drain NMOST outputs, capable of handling the full battery voltage range and high sink currents. The GPOs can be programmed to be continuously active LOW or 3-state, in addition the GPO outputs can be controlled by the LED or PWM modulators. • One 250 mA LDO voltage regulator (HCREG) with programmable output voltage. The high current HCREG is optimized for applications like hands-free audio. • D1REG, D2REG, D3REG, IOREG and LPREG support ECO mode. In this mode the output current is limited to 1 mA and the internal power consumption is reduced significantly. • Watchdog timer that can be activated by software. • The Temperature high Sensor (TS) provides thermal protection for the whole chip • Enhanced ESD protection on all pins that connect to the main battery pack • Microphone bias voltage generator with low noise and high power supply rejection (MBGEN). 2003 Oct 31 3 Philips Semiconductors Preliminary specification Controller for power supply and battery management 1.3 PCF50603 Battery management 1.4 • Operates from a three cell NiCd/NiMH or a one cell Li-ion battery pack Subscriber identity module card interface • Two different modes that can be selected with the Subscriber Identity Module card Interface (SIMI): • Battery Voltage Monitor (BVM) to detect a too low main battery voltage with programmable threshold levels. A low battery condition is reported via the interrupt mechanism. – Transparent interface including an arbiter and signal level translators – Subscriber Identity Module (SIM) card interface with integrated sequencer, arbiter and signal level translators. The sequencer supports and controls card activation and de-activation, warm reset and controlled clock stop for power-down modes. • Charger control. There is an option between two different charger control functions, depending on the configuration: • Dedicated SIM supply (SIMREG). Supports 3.0 V and 1.8 V cards, including a power saving ECO mode for the power-down mode of the SIM card. – Configuration Constant Current Constant Voltage (CCCV). Linear charger control supporting Li-ion as well as NiCd/NiMH battery types for a wide range of battery capacities. • Enhanced ESD protection on all pins that connect to the SIM card contact pins. – Configuration BATMAX comparator that compares the battery voltage against a programmable threshold voltage. This function can be activated by software and is used to detect the end-of-charge. 2 APPLICATIONS • Mobile phones. • Supports the use of a backup battery that powers at empty main battery situations. The backup battery is used to supply the RTC, the internal state and the LPVDD supply in it’s ECO mode. Goldcaps, Li and Li-ion cells are supported. 3 GENERAL DESCRIPTION The PCF50603 is a highly integrated solution for power supply generation, battery management including charging and a SIM card interface including supply generation. The device is controlled by a host controller via a 400 kHz I2C-bus serial interface. • Includes a Backup Battery Charger (BBC). A rechargeable backup battery or backup capacitor can be charged from the main battery. For charging, a programmable constant voltage mode is supported. 4 QUICK REFERENCE DATA VSS = REFGND = GND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. SYMBOL PARAMETER VBAT main battery input voltage VSAVE backup battery input voltage VCHG charger input voltage VCHGMIN minimum charger voltage enabling MBC module fCLKCCO high clock frequency CONDITIONS TYP. MAX. UNIT 0 − 5.7 V 0 − 5.7 V DC 0 − 15.0 V rectified sine wave; 100 Hz to 120 Hz; note 1 0 − 20.0 V − 2.7 − V 3.42 3.6 3.78 MHz 32 kHz clock available Note 1. Not allowed in CCCV configuration. 2003 Oct 31 MIN. 4 Philips Semiconductors Preliminary specification Controller for power supply and battery management 5 PCF50603 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME PCF50603HN 2003 Oct 31 DESCRIPTION HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 × 6 × 0.85 mm 5 VERSION SOT778-1 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 5 1 INT CONTROLLER OOC TS 10 32kHz OSCILLATOR SDA REFC MICBIAS REC2_N 6 GPO1 GPO2 GPO3 SIMCKHC SIMIOHC SIMRSHC_N SIMCKCD SIMIOCD SIMRSCD_N SIMEN 28 12 13 BBC control data I2C-BUS INTERFACE OSCO status data ON-CHIP REFERENCE BATMAX COMPARATOR AND MBC reference voltage bias currents AUDIO DETECTION 33 34 31 BVM CHGDRV CHGCUR/ BATMAX VBAT 48 47 INTERNAL SUPPLY MODULE PWM1 AND PWM2 GPO 46 LED1 AND LED2 30 32 29 internal supply 8 36 9 37 CP 7 43 38 SIMI 35 42 VSAVE VCHG VINT CPVBAT SCP SCN CPVDD 44 45 41 SIMREG D3REG 39 14 SIMD3VBAT IOVDD D3VDD 15 16 IOD2VBAT LPREG D1REG 21 D2VDD 20 LPD1VBAT D1VDD Fig.1 Block diagram. RF2REG RF1REG 19 22 23 HCREG 24 18 17 LPVDD RF12VBAT HCVBAT RF1VDD RF2VDD HCVDD MDB679 PCF50603 40 D2REG IOREG Preliminary specification SIMVCC 3 OSCI CLOCK GENERATOR UNIT RTC AND ALARM 2 25 operation modes temp_ok system clocks SCL 26 Philips Semiconductors 6 IRQ_N REC1_N Controller for power supply and battery management 4 PCF50603 PWREN2 BLOCK DIAGRAM 11 PWREN1 6 27 CLK32K dbook, full pagewidth 2003 Oct 31 ONKEY_N RSTHC_N Philips Semiconductors Preliminary specification Controller for power supply and battery management 7 PCF50603 PINNING SYMBOL PIN DESCRIPTION(1) SUPPLY VSS and REFGND − n.a. ground and VSS pads of all modules are connected to the ground plane of the package REC1_N 1 VINT accessory recognition input with debounce filter (active LOW); input with internal pull-up resistor to VINT SCL 2 IOVDD I2C-bus clock input SDA 3 IOVDD I2C-bus data input and output CLK32K 4 IOVDD 32.768 kHz digital clock output; in ACTIVE state and IOVDD is on PWREN2 5 IOVDD control signal input; selects in combination with PWREN1 the ON, OFF or ECO mode of the linear regulators PWREN1 6 IOVDD control signal input; selects in combination with PWREN2 the ON, OFF or ECO mode of the linear regulators SIMRSHC_N 7 IOVDD SIM reset input from host controller (active LOW) SIMCKHC 8 IOVDD SIM clock input from host controller SIMIOHC 9 IOVDD SIM I/O data to or from the host controller with an internal pull-up resistor to IOVDD IRQ_N 10 IOVDD interrupt request output to host controller (active LOW); open-drain output with an internal pull-up resistor to IOVDD RSTHC_N 11 IOVDD reset output to host controller (active LOW) MICBIAS 12 n.a. microphone bias output voltage REC2_N 13 MICBIAS accessory recognition input with debounce filter and programmable threshold (active LOW) IOVDD 14 n.a. IOREG output voltage IOD2VBAT 15 n.a. IOREG and D2REG input voltage D2VDD 16 n.a. D2REG output voltage HCVDD 17 n.a. HCREG output voltage HCVBAT 18 n.a. HCREG input voltage LPVDD 19 n.a. LPREG output voltage LPD1VBAT 20 n.a. LPREG and D1REG input voltage D1VDD 21 n.a. D1REG output voltage RF1VDD 22 n.a. RF1REG output voltage RF12VBAT 23 n.a. RF1REG and RF2REG input voltage RF2VDD 24 n.a. RF2REG output voltage OSCO 25 VINT 32.768 kHz oscillator output OSCI 26 VINT 32.768 kHz oscillator input ONKEY_N 27 VINT On-key (active LOW); input with internal pull-up resistor to VINT REFC 28 n.a. reference voltage bypass capacitor connection VINT 29 n.a. internal supply voltage output VSAVE 30 n.a. backup battery supply voltage VBAT 31 n.a. main battery supply voltage VCHG 32 n.a. charger voltage 2003 Oct 31 7 Philips Semiconductors Preliminary specification Controller for power supply and battery management SYMBOL PCF50603 DESCRIPTION(1) PIN SUPPLY CHGDRV 33 n.a. drive of external charger circuitry (configuration CCCV) CHGCUR/ BATMAX 34 n.a. configuration CCCV: charger current feedback CPVDD 35 n.a. charge pump output voltage CPVBAT 36 n.a. charge pump input voltage SCP 37 n.a. switching capacitor positive side SCN 38 n.a. switching capacitor negative side D3VDD 39 n.a. D3REG output voltage SIMD3VBAT 40 n.a. SIMREG and D3REG input voltage SIMVCC 41 n.a. SIMREG output voltage SIMIOCD 42 SIMVCC SIM I/O data to/from the SIM card; internal pull-up resistor to SIMVCC configuration BATMAX: open-drain output of BATMAX comparator SIMCKCD 43 SIMVCC SIM clock output to the SIM card SIMRSCD_N 44 SIMVCC SIM reset output to the SIM card (active LOW) SIMEN 45 IOVDD enable SIMI and SIMREG GPO3 46 n.a. general purpose open-drain output 3 GPO2 47 n.a. general purpose open-drain output 2 GPO1 48 n.a. general purpose open-drain output 1 Note 1. One ESD diode reverse biased to VSS except pin VCHG who has one clamp in series with a 500 Ω resistor connected between pad and VSS. 2003 Oct 31 8 Philips Semiconductors Preliminary specification Controller for power supply and battery management 24 RF2VDD 23 RF12VBAT 22 RF1VDD 21 D1VDD 20 LPD1VBAT 19 LPVDD 18 HCVBAT 17 HCVDD 16 D2VDD 15 IOD2VBAT 14 IOVDD 13 REC2_N handbook, full pagewidth PCF50603 25 OSCO MICBIAS 12 26 OSCI RSTHC_N 11 IRQ_N 10 27 ONKEY_N SIMIOHC 9 28 REFC SIMCKHC 8 29 VINT SIMRSHC_N 7 PWREN1 6 PWREN2 5 CLK32K 4 32 VCHG 33 CHGDRV SDA 3 34 CHGCUR/BATMAX SCL 2 35 CPVDD REC1_N 1 36 CPVBAT 30 VSAVE 31 VBAT Bottom view. All GND and VSS pads are connected to the ground plane. Fig.2 Pin configuration. 2003 Oct 31 9 SCP 37 SCN 38 D3VDD 39 SIMD3VBAT 40 SIMVCC 41 SIMIOCD 42 SIMCKCD 43 SIMRSCD_N 44 SIMEN 45 GPO3 46 GPO1 48 GPO2 47 PCF50603HN MDB680 Philips Semiconductors Preliminary specification Controller for power supply and battery management 8 PCF50603 FUNCTIONAL DESCRIPTION 8.1 On/off control 8.1.1 OPERATING STATES The PCF50603 has four operating states (see Fig.3): • NOPOWER • SAVE • STANDBY • ACTIVE. handbook, full pagewidth NOPOWER VBAT < VVERY_LOW_BAT AND VSAVE < VVERY_LOW_BACK AND VCHG < VVERY_LOW_BAT SAVE VBAT < VVERY_LOW_BAT AND VSAVE > VVERY_LOW_BACK OR VCHG > VVERY_LOW_BAT STANDBY VBAT > VVERY_LOW_BAT ACTIVE VBAT > VLOW_BAT MDB681 Fig.3 State diagram. 8.1.2 RESET GENERATION The RSTHC_N is kept LOW for minimum 10 ms after entering the ACTIVE state. If the IOREG supply is switched off, RSTHC_N becomes LOW again (see Fig.4). The OOC generates an internal and an external reset each time the system goes from STANDBY to ACTIVE state. All registers for the regulators and converters are reset to their default values. 2003 Oct 31 A special condition occurs when the main battery voltage drops below the VVERY_LOW_BAT limit of typically 2.7 V; the RSTHC_N is asserted in order to shut down the host controller immediately (see Fig.5). 10 Philips Semiconductors Preliminary specification Controller for power supply and battery management PCF50603 handbook, full pagewidth system state STANDBY ACTIVE STANDBY treset = 10 ms RSTHC_N xxVDD 32 kHz oscillator CLK32K MDB682 Before the supplies are turned on, the internal 32 kHz clock is already stable. After power up of the IOVDD supply the external clock on pin CLK32K becomes available. Fig.4 Reset generation timing diagram (STANDBY - ACTIVE - STANDBY transition). handbook, full pagewidth system state STANDBY ACTIVE STANDBY treset = 10 ms RSTHC_N SIM emergency deactivation SIM activation xxVDD 32 kHz oscillator CLK32K MDB683 Before the supplies are turned on, the internal 32 kHz clock is already stable. After power up of the IOVDD supply the external clock on pin CLK32K becomes available. Fig.5 Reset generation timing diagram (STANDBY - ACTIVE - STANDBY transition). 2003 Oct 31 11 Philips Semiconductors Preliminary specification Controller for power supply and battery management 8.1.3 PCF50603 phone due to mechanical bounce on the battery. The automatic restart is enabled or disabled by control bit BATRM_EN in the OOCC register. By default this automatic restart feature is disabled. WATCHDOG TIMER The OOC contains a WatchDog Timer (WDT). By default it is not activated. It can be activated by setting bit WDT_RST in the OOCC register to logic 1. Once this bit has been set, the watchdog is enabled, and needs to be cleared once every eight seconds. If the watchdog is not reset in time, the PCF50603 automatically goes to the STANDBY state when the watchdog timer expires. Status bit WDTEXP is set when the watchdog timer expires. After each ACTIVE to STANDBY transition the WDT is disabled and needs to be activated again by software when entering the ACTIVE state. 8.1.4 Status bit BATRMSTAT in the OOCS2 register indicates whether the PMU returned to ACTIVE state due to a restart after battery removal. The status bit remains active until the PMU returns to STANDBY or SAVE state. Figure 6 shows the timing for an automatic restart due to battery removal. This feature is only triggered by battery removal (VBAT < 2.7 V). All other shut-down conditions like, low battery, high temperature, programming GO_STDBY do not trigger this function. AUTOMATIC RESTART AFTER BATTERY REMOVAL The PMU allows for an automatic restart from SAVE to ACTIVE state when the main battery is removed for a period less than two seconds (tBATRMLIM). This feature is especially convenient to avoid accidental switch-off of the system handbook, full pagewidth state ACTIVE This feature is only applicable upon the condition that a BBC (VSAVE > VVERY_LOW_BACK) is available in the system. SAVE ACTIVE <tBATRMLIM VLOW_BAT VBAT VSAVE VVERY_LOW_BAT VLOW_BACK CLK32K RSTHC_N xxVDD BATRMSTAT (internal status bit) treset Fig.6 Automatic restart after battery removal. 2003 Oct 31 12 MCE539 Philips Semiconductors Preliminary specification Controller for power supply and battery management 8.1.5 PCF50603 DEBOUNCE FILTERS Fig.7 is applicable for all debounce filters in the PCF50603. handbook, full pagewidth un-debounced tdebounce tdebounce debounced interrupts falling edge rising edge MDB684 The debounced signal keeps the old value until the new value has been stable for at least the applicable debounce time. Any spike (>30 ms) in the original signal will reset the debounce timer again. This filter suppresses all signal changes that are shorter than the debounce time. Fig.7 Definition of debounce filter. 8.2 The interrupt module is powered in all states (except NOPOWER) and retains the register values. Events that occur in the STANDBY state, are captured and can be read out by the system controller once the system is in the ACTIVE state. Serial interface (I2C-bus) The I2C-bus is the serial interface of the PCF50603. A detailed description of the I2C-bus specification, including applications, is given in the brochure: The I2C-bus and how to use it, order no. 9398 393 40011 or I2C-bus Peripherals Data Handbook IC12. 8.3 The IRQ_N signal is asserted in the ACTIVE state whenever one or more PCF50603 interrupts are active. Interrupt controller (INT) Each interrupt register (8-bits) is cleared when it is read (R&C) through the I2C-bus interface. New interrupts that occur during a R&C action are captured in an intermediate register (see Figs.8 and 9). The PCF50603 uses the interrupt controller to indicate to the system controller if the status of the PCF50603 change and that an action of the system controller is required. Interrupts can be generated by several modules of the PCF50603. The interrupt generator handles all interrupts with the same priority. Priority setting shall be done by the system controller software. All interrupts related to shut-down conditions (LOWBAT, ONKEY1S and HIGHTMP) are automatically cleared on a transition from ACTIVE to STANDBY state. All interrupts can be masked: this effectively prevents that IRQ_N is asserted for masked interrupts. Masking is implemented with a mask bit in the mask registers for each interrupt source. Nevertheless, the interrupt status registers still provide the actual interrupt status of the masked interrupts, which allows polling of the interrupt status registers. Note that if the mask bit is cleared for an active interrupt, the IRQ_N line goes LOW at the next falling edge of the output pin CLK32K. There are no timing requirements for interrupt service response times. All events that require immediate actions are performed by the PCF50603 without any action by the system controller. The function of the interrupt module is to capture, mask and combine the interrupt signals from the modules that can generate an interrupt. All interrupts are combined in the interrupt signal IRQ_N. The IRQ_N signal is implemented as an open-drain output with an internal pull-up resistor. 2003 Oct 31 13 Philips Semiconductors Preliminary specification Controller for power supply and battery management PCF50603 handbook, full pagewidth (1) IRQ_N I2C-bus read request & address read INT1 read INT2 read INT3 MDB685 Read access can be done with or without incremental addressing. (1) IRQ_N becomes inactive high as soon as the read sequence of the last INTx register containing an active interrupt starts. Fig.8 Interrupt timing; no interrupt captured during read sequence. minimal 1 CLK32 handbook, full pagewidth (1) IRQ_N I2C-bus read request & address read INT1 read INT2 read INT3 MDB686 Read access can be done with or without incremental addressing. (1) IRQ_N becomes inactive high as soon as the read sequence of the last INTx register containing an active interrupt starts. Fig.9 Interrupt timing; interrupt captured during read sequence. 2003 Oct 31 14 Philips Semiconductors Preliminary specification Controller for power supply and battery management 8.4 PCF50603 Power supply modules In total 11 power supply modules are available in the PCF50603; see Table 1: • Three regulators for supplying the digital and analog circuitry (D1REG, D2REG and D3REG). These regulators support the ECO mode • One regulator for high current supply (HCREG) • One regulator for the SIMI supply (SIMREG) • One charge pump (CP) • One regulator for supplying the I/O pads (IOREG). This regulator supports the ECO mode • One regulator for low power supply (LPREG). This regulator supports the ECO mode, the LPREG is the only regulator that can be enabled in SAVE and STANDBY state (ECO mode only) • Two low-noise regulators for RF supply (RF1REG and RF2REG) • One ultra low-noise regulator for supplying a microphone (MBGEN). Table 1 Power supply modules; VSS = REFGND = GND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. SUPPLY NAME NOMINAL CURRENT (mA) MINIMUM MAXIMUM VOLTAGE VOLTAGE VOLTAGE STEPS (V) (V) (mV) RESET VOLTAGE (V) ECO MODE PSRR(1) (dB) SIZE EXTERNAL CAPACITOR(2) (nF) Programmable power supplies D1REG 150 1.20 3.20 100 note 3 yes 60 470 D3REG 100 1.20 3.20 100 note 3 yes 60 470 HCREG 250 (4) 2.60 3.20 200 note 3 no 60 4700 60 1000 SIMREG CP 20 1.80 3.00 − 1.8 yes(5) 75(6) 3.50 5.00 500 note 3 no − 220/4700(7) Fixed power supplies, mask programmable D2REG 150 1.20 3.20 100 note 3 yes 60 470 IOREG 150 1.20 3.20 100 note 3 yes 60 470 LPREG 100 1.20 3.20 100 note 3 yes 60 470 RF1REG (8) 100 2.60 3.00 100 note 3 no 70 4700 RF2REG (8) 100 2.60 3.00 100 note 3 no 70 4700 2.15 2.15 − 2.15 yes 110 4700 Fixed power supply MBGEN 1.5 Notes 1. Typical value, 100 Hz < f < 1000 Hz. 2. Typical values assume X5R or X7R type of capacitor. 3. Mask programmable for reset settings of different types. 4. Under specific conditions a nominal current of 300 mA can be delivered. 5. When SIMI is in Power-down mode. 6. Maximum current depends on the selected output voltage. At 3.50 V, 4.00 V and 4.50 V the maximum output current is 75 mA. At 5.00 V output voltage the maximum output current is 50 mA. 7. The CP module requires both a switching capacitor as well as an output capacitor. 8. Optimized for low noise (30 µV RMS value, 400 Hz < f < 80 kHz). 2003 Oct 31 15 Philips Semiconductors Preliminary specification Controller for power supply and battery management 8.5 PCF50603 Main battery charger (MBC) The fast charge current is determined by the value of the external sense resistor. The charge current in the pre and trickle charge phase is programmable as a ratio of the fast charge current. The main battery charger (MBC) module provides a complete constant-current/constant-voltage linear charger controller for lithium-ion (Li-ion) batteries (in CCCV configuration) or a programmable battery threshold level detector for end-of-charge indication (configuration BATMAX). Nickel-cadmium (NiCd) and Nickel metal hydride (NiMH) batteries can also be charged with constant current. In BATMAX configuration an end-of-charge indication is available on the BATMAX pin. 8.5.1 The PCF50603 charger circuitry supports the following type of charger plugs (see Fig.10): Only an external power PNP transistor is required to control the charge current. The CC and CCCV control circuitry is fully integrated in the PCF50603 charging module. • Regulated charger plugs with output voltage at least 0.5 V above the battery voltage with a maximum of 10 V and with current limitation up to 3C of the used battery (CCCV and BATMAX configuration) In CCCV configuration the charging process for Li-ion/Li-pol batteries is performed under control of the host controller. The communication between the PCF50603 charger module and the host controller is interrupt based, which simplifies the control of the PCF50603. handbook, full pagewidth VCHG SUPPORTED CHARGER PLUGS • Non regulated charger plugs with peak output voltages up to 20 V with a duration of less than 14 ms and with current limitation up to 3C of the used battery (BATMAX configuration only). VCHG < 14 ms < 14 ms 15 V 10 V 10 V 2.7 V 2.7 V ICHG t MDB687 Regulated charger plug. Non regulated charger plug. Fig.10 Characteristics of the supported charger plugs. 2003 Oct 31 16 Philips Semiconductors Preliminary specification Controller for power supply and battery management 8.5.2 PCF50603 EXTERNAL COMPONENTS A small discrete circuit must be used to control the charge current (see Fig.11). handbook, halfpage VCHG CHGDRV BC869(1) CHGCUR 0.15 Ω VBAT Rsense MDB688 (1) The charge switch requires a current gain in the range of 50 to 400 for stable loop operation. Fig.11 Charge current external circuitry. 8.6 • In transparent mode the SIMEN input allows the host controller to have direct control over the SIM card supply. In sequencer mode the SIMEN input indicates the presence of a SIM card. Backup battery charger (BBC) The BBC is implemented as a voltage limited current source with a selectable output resistor. It offers the following features: • Enhanced ESD protection on all SIM contact pins • Selectable output resistor to reduce the current at higher voltages • The SIMI and SIMREG can be enabled in the ACTIVE state. In all other states the SIMI and SIMREG are disabled. • Four programmable charge currents • Two programmable maximum limiting voltages • The BBC can be enabled in the ACTIVE state; in all other states the BBC is disabled. 8.7 8.8 The BVM monitors the main battery voltage. It offers the following features: SIM card interface (SIMI) • Programmable low battery threshold (VLOW_BAT) The SIMI provides the facilities to communicate with SIM. It offers the following features: • Hysteresis and selectable debounce filter built in to prevent fast cycling • Support for transparent mode. The host controller controls the communication with the SIM card, including the activation and deactivation sequences. • The BVM is enabled in all activity states. The BVM observes permanently the main battery voltage and generates a LOWBAT interrupt if the battery voltage drops below the programmed threshold voltage VLOW_BAT (see Fig.12). When a LOWBAT interrupt is generated in ACTIVE state, the host controller should initiate a transition to STANDBY state. In case the host controller does not initiate a transition to the STANDBY state within eight seconds after the interrupt occurred, the OOC forces the PCF50603 to the STANDBY state in order to prevent a too deep discharge of the battery. • Support for sequencer mode. The internal sequencer of the PCF50603 performs the activation and deactivation sequences. • Includes a dedicated linear regulator for the SIM card supply (SIMREG) supporting both 1.8 V and 3.0 V cards • Provides level-shifters for the SIM interfacing signals. The level-shifters translate the host controller signal levels (IOVDD) to SIM card signal levels (SIMVCC) and vice versa. 2003 Oct 31 Battery voltage monitor (BVM) 17 Philips Semiconductors Preliminary specification Controller for power supply and battery management PCF50603 V handbook, full pagewidth VBAT Vhys VLOW_BAT tdebounce LOWBAT interrupt t MDB689 Fig.12 BVM and LOWBAT behaviour. 8.9 Temperature high sensor (TS) A HIGHTMP interrupt is generated when the temperature threshold is passed for more than 62 ms (debouncing time). When a HIGHTMP interrupt is generated the host controller should initiate a transition to STANDBY state. In case the host controller does not initiate a transition to the STANDBY state within 1 second after the interrupt occurred, the OOC forces the PCF50603 to the STANDBY state in order to prevent damage to the circuit. The TS monitors the junction temperature of the PCF50603. It offers the following features: • Fixed temperature threshold • Hysteresis and debounce filter built in to prevent fast cycling • The TS is enabled in ACTIVE state, in all other states the TS is disabled. The hysteresis and debounce time have been built in to prevent fast cycling of the HIGHTMP signal. The behaviour of the TS is shown in Figure 13. The TS can not be disabled via the I2C-bus. handbook, full pagewidth Tj 150 °C Thys 130 °C tdebounce tdebounce HIGHTMP interrupt t MDB690 Fig.13 TS behaviour. 2003 Oct 31 18 Philips Semiconductors Preliminary specification Controller for power supply and battery management 8.10 PCF50603 Real time clock (RTC) 8.12 The RTC module provides the time information to the handset based on a 1 Hz clock frequency. Basically it is a 32-bit counter counting elapsed seconds. The PCF50603 contains two LED modulators (LED1 and LED2), which can be selected as input for any of the GPO outputs. The LED modulator of the PCF50603 is used for the control of the indicator LEDs. They offer the following features: • The RTC module contains one alarm function that generates an interrupt if the actual RTC time equals the content of the alarm register. The alarm registers are preset to all 1 s which effectively disables the alarm; effectively no alarm interrupt will be generated as long as the RTC counter does not overflow. It is recommended to mask the ALARM interrupt before a new value is written to the alarm registers, in order to prevent interrupts during the write actions (a new setting may require up to 4 register writes). • The LED driver can select eight different repetition periods • Capable of generating eight different blinking patterns. The selected pattern is generated once per repetition period • The LED can be used as a status indicator during the ACTIVE state or when a charger is connected. • The RTC module is able to generate an interrupt each second (SECOND interrupt) as well as each minute (MINUTE interrupt). When the RTC starts up the first time (after transition from NOPOWER state) the minute interrupt is aligned with each 60 seconds crossing. If the synchronization with the 60 second crossing is required after reprogramming the RTC time registers it is up to the software to program the RTC time registers with a modulo 60 value. 8.11 8.13 General purpose outputs (GPO) The PCF50603 contains three high current (100 mA) open-drain GPOs. They offer the following features: • Each GPO can be configured as a constant LOW level, a high impedance, a LED modulator output, a PWM output or as the complementary PWM output PWM • The GPOs can sink 100 mA from any supply or battery voltage. Pulse-width modulator (PWM1 and PWM2) The two PWMs (PWM1 and PWM2) offer the following features: • Programmable frequency and duty cycle • Any of the GPOs can be connected to either the PWMs or the inverse of the PWMs • The PWMs can be independently enabled in ACTIVE state. In all other states the PWMs are disabled. 2003 Oct 31 LED modulator (LED1 and LED2) 19 Philips Semiconductors Preliminary specification Controller for power supply and battery management PCF50603 9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VBAT main battery voltage −0.5 +6.5 V VSAVE backup battery input voltage −0.5 +6.5 V VCHG charger input voltage −0.5 +20 V VI input voltage on any pin with respect to REFGND −0.5 +6.5 V II input current at any input −10 +10 mA IO output current at any output −10 +10 mA Ptot total power dissipation − 2000 mW Tamb operating ambient temperature −40 +85 °C Tstg storage temperature −55 +150 °C Vesd electrostatic discharge voltage − ±6000 V HBM; note 1 pins SIMEN, IOD2VBAT, SIMD3VBAT, SIMRSCD_N, SIMCKCD, SIMIOCD, VBAT, VSAVE, CPVBAT, LPD1VBAT, REC1_N, SIMVCC, RF12VBAT, HCVBAT, REC2_N pin VCHG − ±4000 V other pins − ±2000 V − ±200 V MM; note 2 Notes 1. Human Body Model: equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor. 2. Machine Model: equivalent to discharging a 200 pF capacitor via a 0 Ω resistor. 10 CHARACTERISTICS VSS = REFGND = GND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VBAT main battery input voltage 0 − 5.7 V VSAVE backup battery input voltage 0 − 5.7 V VCHG charger input voltage DC 0 − 15.0 V rectified sine wave; 100 Hz to 120 Hz; note 1 0 − 20.0 V − 2.7 − V 3.42 3.6 3.78 MHz VCHGMIN minimum charger voltage enabling MBC module fCLKCCO high clock frequency 32 kHz clock available D1 regulator VO output voltage 1.20 − 3.20 V IO output current − − 150 mA 2003 Oct 31 20 Philips Semiconductors Preliminary specification Controller for power supply and battery management SYMBOL PCF50603 PARAMETER CONDITIONS MIN. TYP. MAX. UNIT D3 regulator VO output voltage 1.20 − 3.20 V IO output current − − 100 mA 2.60 − 3.20 V − − 250 mA HC regulator VO output voltage IO output current note 1 SIM regulator VO output voltage 1.80 − 3.00 V IO output current − − 20 mA 3.50 − 5.00 V − − 75 mA CP regulator VO output voltage IO output current note 2 D2 regulator VO output voltage 1.20 − 3.20 V IO output current − − 150 mA IO regulator VO output voltage 1.20 − 3.20 V IO output current − − 150 mA LP regulator VO output voltage 1.20 − 3.20 V IO output current − − 100 mA RF1 regulator VO output voltage 2.60 − 3.00 V IO output current − − 100 mA RF2 regulator VO output voltage 2.60 − 3.00 V IO output current − − 100 mA MBGEN regulator VO output voltage 2.15 − 2.15 V IO output current − − 1.5 mA Notes 1. Under specific conditions a nominal current of 300 mA can be delivered. 2. Maximum current depends on the selected output voltage. At 3.50 V, 4.00 V and 4.50 V the maximum output current is 75 mA. At 5.00 V output voltage the maximum output current is 50 mA. 2003 Oct 31 21 Philips Semiconductors Preliminary specification Controller for power supply and battery management PCF50603 11 APPLICATION INFORMATION handbook, full pagewidth MAIN BATTERY 2.2 µF 2.2 µF VBAT 31 RSENSE 29 CHGCUR CHGDRV VCHG BATTERY + CHARGER CONSTANT CURRENT − (3) RF1VDD FLASH 1.8 V battery backup VINT AUXADCx 470 nF 34 28 REFC 100 nF 33 12 32 17 on key ONKEY_N RAM 1.8 V RF12VBAT LPD1VBAT IOD2VBAT SIMD3VBAT CPVBAT HCVBAT 23 20 15 40 36 18 VSAVE 30 19 27 MICBIAS 4700 nF HCVDD (1) MICP 4700 nF LPVDD (2) MICN 470 nF 22 4700 nF RF UNIT RF2VDD headset 24 4700 nF 13 SCP 220 nF SCN CPVDD 1 37 21 REC2_N REC1_N D1VDD VDDA 470 nF 38 35 4700 nF from bottom connector 14 VDDD IOVDD 470 nF PCF50603 16 D2VDD PCF5213 470 nF back light EL lamp GPO3 DC DC 46 39 VDDE3 D3VDD VDDA 470 nF VDDC or GPO2 back light GPO1 VDDE1 47 VDDE2 LOWVOLT_N 48 ONKEY OSCI 26 1 kΩ 10 pF 32.768 kHz 10 MΩ 6 10 pF OSCO IOVDD 25 5 11 10 kΩ 10 SIMEN card present SIM CARD READER 4 45 3 SIMRSCD_N SIMIOCD SIMCKCD SIMVCC 1000 nF 44 2 42 9 43 8 41 7 REFGND/VSS (1) HCVDD is reserved for hands free audio supply. (2) LPVDD not used in the system. (3) Connect VCHG to ground if charger is used in BATMAX configuration. Fig.14 Application diagram. 2003 Oct 31 22 1 kΩ AUXON_N PWREN1 GPON0 PWREN2 RFSIGx RSTON RSTHC_N SIMERRN IRQ_N CLK32I CLK32K SDA SDA SCL SCL SIMIOHC SIMIO SIMCKHC SIMRSHC_N SIMCLK revmod GPOx MDB691 Philips Semiconductors Preliminary specification Controller for power supply and battery management PCF50603 12 PACKAGE OUTLINE HVQFN48: plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 6 x 6 x 0.85 mm A B D SOT778-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e 24 L y y1 C v M C A B w M C b 13 25 12 e e2 Eh 1/2 e 1 36 terminal 1 index area 48 37 X Dh 0 2.5 DIMENSIONS (mm are the original dimensions) A(1) UNIT max. mm 1 5 mm scale A1 b c D (1) Dh E (1) Eh e e1 e2 L v w y y1 0.05 0.00 0.25 0.15 0.2 6.1 5.9 4.25 3.95 6.1 5.9 4.25 3.95 0.4 4.4 4.4 0.5 0.3 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT778-1 --- --- --- 2003 Oct 31 23 EUROPEAN PROJECTION ISSUE DATE 02-07-05 Philips Semiconductors Preliminary specification Controller for power supply and battery management PCF50603 with a high component density, as solder bridging and non-wetting can present major problems. 13 SOLDERING 13.1 Introduction to soldering surface mount packages To overcome these problems the double-wave soldering method was specifically developed. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 13.2 • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; Reflow soldering – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. • below 220 °C (SnPb process) or below 245 °C (Pb-free process) A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. – for all BGA and SSOP-T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. 13.4 Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. • below 235 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 13.3 When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards 2003 Oct 31 Manual soldering 24 Philips Semiconductors Preliminary specification Controller for power supply and battery management 13.5 PCF50603 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA not suitable suitable(4) DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS not PLCC(5), SO, SOJ suitable REFLOW(2) suitable suitable suitable not recommended(5)(6) suitable SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable PMFP(8) not suitable LQFP, QFP, TQFP not suitable Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Hot bar or manual soldering is suitable for PMFP packages. 2003 Oct 31 25 Philips Semiconductors Preliminary specification Controller for power supply and battery management PCF50603 14 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 15 DEFINITIONS 16 DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Oct 31 26 Philips Semiconductors Preliminary specification Controller for power supply and battery management PCF50603 17 PURCHASE OF PHILIPS I2C COMPONENTS Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 2003 Oct 31 27 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA75 © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands R54/01/pp28 Date of release: 2003 Oct 31 Document order number: 9397 750 11771