TFA9843BJ 2-channel audio amplifier (SE: 1 W to 20 W) Rev. 01 — 4 May 2004 Preliminary data sheet 1. General description The TFA9843BJ contains two identical audio power amplifiers. The TFA9843BJ can be used as two Single-Ended (SE) channels with a fixed gain of 26 dB. The TFA9843BJ comes in a 9-pin DIL-bent-SIL (DBS9P) power package. The TFA9843BJ is pin compatible with the TFA9841J, TFA9842J, TFA9842BJ and the TFA9843J. The TFA9843BJ contains a unique protection circuit that is solely based on multiple temperature measurements inside the chip. This gives maximum output power for all supply voltages and load conditions with no unnecessary audio holes. Almost any supply voltage and load impedance combination can be made as long as thermal boundary conditions (number of channels used, external heatsink and ambient temperature) allow it. 2. Features ■ ■ ■ ■ ■ ■ ■ ■ ■ 1 W to 20 W operation possibility Soft clipping Standby and mute mode No on or off switching plops Low standby current High supply voltage ripple rejection Outputs short-circuit protected to ground, supply and across the load Thermally protected Pin compatible with the TFA9841J, TFA9842J, TFA9842BJ and the TFA9843J. 3. Applications ■ ■ ■ ■ ■ Televisions Monitors PC speakers Boom boxes Mini and micro audio receivers. TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) 4. Quick reference data Table 1: Quick reference data Symbol Parameter VCC supply voltage Conditions Min Typ Max Unit operating 9 18 26 V no signal - - 28 V Iq quiescent supply current VCC = 18 V; RL = ∞ Ω - 60 100 mA Istb standby supply current - - 10 µA Po output power 7 8.5 - W THD = 10 %; RL = 4 Ω VCC = 18 V - 14 - W THD total harmonic distortion Po = 1 W VCC = 22 V - 0.1 0.5 % Gv voltage gain 25 26 27 dB SVRR supply voltage ripple rejection - 60 - dB fripple = 1 kHz 5. Ordering information Table 2: Ordering information Type number TFA9843BJ Package Name Description Version DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523 -1 9397 750 12846 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 2 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) 6. Block diagram VCC 9 IN1 4 8 OUT1 60 kΩ IN2 1 2 OUT2 60 kΩ CIV 3 VREF SHORT-CIRCUIT AND TEMPERATURE PROTECTION VCC MODE 7 STANDBY MUTE ON 0.5VCC 6 SVR TFA9843BJ 5 001aaa414 GND Fig 1. Block diagram. 7. Pinning information 7.1 Pinning IN2 1 OUT2 2 CIV 3 IN1 4 GND 5 SVR 6 MODE 7 OUT1 8 VCC 9 TFA9843BJ 001aaa415 Fig 2. Pin configuration. 9397 750 12846 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 3 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) 7.2 Pin description Table 3: Pin description Symbol Pin Description IN2 1 input 2 OUT2 2 loudspeaker terminal 2 CIV 3 common input voltage decoupling IN1 4 input 1 GND 5 ground SVR 6 half supply voltage decoupling (ripple rejection) MODE 7 mode selection input (standby, mute and operating) OUT1 8 loudspeaker terminal 1 VCC 9 supply voltage 8. Functional description 8.1 Input configuration The input cut-off frequency is: 1 f i ( cut – off ) = ----------------------------2π ( R i × C i ) (1) Application: Ri = 60 kΩ and Ci = 220 nF: 1 f i ( cut – off ) = ---------------------------------------------------------------- = 12 Hz 3 –9 2π ( 60 × 10 × 220 × 10 ) (2) As shown in Equation 2 large capacitor values for the inputs are not necessary; so the switch-on delay during charging of the input capacitors can be minimized. This results in a good low frequency response and good switch-on behavior. 8.2 Power amplifier The power amplifier is a Single-Ended (SE) amplifier with an all-NPN output stage, capable of delivering a peak output current of 4 A. 8.2.1 Output power measurement The output power as a function of the supply voltage is measured on the output pins at THD = 10 %; see Figure 8. The maximum output power is limited by the supply voltage of 26 V and the maximum available output current is 4 A (repetitive peak current). A minimum load of 3 Ω is required for VCC > 22 V; see Figure 5. The output power is measured with one channel driven. 9397 750 12846 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 4 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) 8.2.2 Headroom Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom, compared to the average power output, for transferring the loudest parts without distortion. At VCC = 18 V, Po = 5 W and RL = 4 Ω at THD = 0.2 % (see Figure 6), the Average Listening Level (ALL) music power without any distortion yields: 3 5 × 10 P o ( ALL ) = ----------------- = 315 mW 15.85 (3) The power dissipation can be derived from Figure 9 for 0 dB respectively 12 dB headroom (see Table 4). Table 4: Power rating as function of headroom Headroom Power output (THD = 0.2 %) Power dissipation; both channels driven 0 dB Po = 5 W PD = 8.4 W 12 dB Po(ALL) = 315 mW PD = 4.2 W For the average listening level a power dissipation of 4.2 W can be used for a heatsink calculation. 8.3 Mode selection The TFA9843BJ has three functional modes, which can be selected by applying the proper DC voltage to pin MODE (see Table 5 and Figure 3). Table 5: Mode selection VMODE Amplifiers 1 and 2 0 V to 0.8 V standby 4.5 V to (VCC − 3.5 V) mute (VCC − 2.0 V) to VCC on Standby — In this mode the current consumption is very low and the outputs are floating. The device is in standby mode when VMODE < 0.8 V, or when pin MODE is grounded. Mute — In this mode the amplifier is DC-biased but not operational (no audio output). This allows the input coupling capacitors to be charged to avoid pop-noise. The device is in mute mode when 4.5 V < VMODE < (VCC − 3.5 V). On — In this mode the amplifier is operating normally. The operating mode is activated at VMODE > (VCC − 2.0 V). standby 0.8 all mute 4.5 1/2 on VCC − 3.5 VCC − 2.0 VCC VMODE (V) 001aaa416 Fig 3. Mode selection. 9397 750 12846 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 5 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) 8.4 Supply voltage ripple rejection The Supply Voltage Ripple Rejection (SVRR) is measured with an electrolytic capacitor of 150 µF on pin SVR using a bandwidth of 20 Hz to 22 kHz. Figure 11 illustrates the SVRR as function of the frequency. A larger capacitor value on pin SVR improves the ripple rejection behavior at the lower frequencies. 8.5 Built-in protection circuits The TFA9843BJ contains two types of temperature sensors; one measures local temperatures of the power stages and one measures the global chip temperature. At a local temperature of the power stage of approximately 185 °C or a global temperature of approximately 150 °C this detection circuit switches off the power stages for 2 ms. High impedance of the outputs is the result. After this time period the power stages switch on automatically and the detection will take place again; still a too high temperature switches off the power stages immediately. This protects the TFA9843BJ against shorts to ground, to the supply voltage, across the load and also to high chip temperatures. The protection will only be activated when necessary, so even during a short-circuit condition, a certain amount of (pulsed) current will still be flowing through the short, just as much as the power stage can handle without exceeding the critical temperature level. 9. Limiting values Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC supply voltage operating −0.3 +26 V no signal −0.3 +28 V VI input voltage −0.3 VCC + 0.3 V IORM repetitive peak output current - 4 A Tstg storage temperature non-operating −55 +150 °C Tamb ambient temperature operating −40 +85 °C Ptot total power dissipation - 35 W VCC(sc) supply voltage to guarantee short-circuit protection - 24 V 10. Thermal characteristics Table 7: Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air 40 K/W Rth(j-c) thermal resistance from junction to case both channels driven 2.0 K/W 9397 750 12846 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 6 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) 11. Static characteristics Table 8: Static characteristics VCC = 18 V; Tamb = 25 °C; RL = 4 Ω; VMODE = VCC; Vi = 0 V; measured in test circuit Figure 12; unless otherwise specified. Symbol Parameter Conditions supply voltage operating [1] Iq quiescent supply current RL = ∞ Ω [2] Istb standby supply current VMODE = 0 V VO DC output voltage VMODE mode selection input voltage VCC IMODE input current on pin MODE Min Typ Max Unit 9 18 26 V - 60 100 mA - - 10 µA - 9 - V on mode VCC − 2.0 - VCC V mute mode 4.5 - VCC − 3.5 V standby mode 0 - 0.8 V 0 < VMODE < (VCC − 3.5) - - 20 µA [3] [1] A minimum load of 3 Ω is allowed at VCC > 22 V. [2] With a load connected at the outputs the quiescent supply current will increase. [3] The DC output voltage with respect to ground is approximately 0.5VCC. 12. Dynamic characteristics Table 9: Dynamic characteristics VCC = 18 V; Tamb = 25 °C; RL = 4 Ω; f = 1 kHz; VMODE = VCC; measured in test circuit Figure 12; unless otherwise specified. Symbol Parameter Po output power THD total harmonic distortion Conditions Min Typ Max Unit THD = 10 % 7 8.5 - W THD = 0.5 % - 6.5 - W VCC = 22 V; THD = 10 % - 14 - W Po = 1 W - 0.1 0.5 % Gv voltage gain 25 26 27 dB Zi input impedance 40 60 - kΩ Vn(o) noise output voltage [1] - 150 - µV supply voltage ripple rejection fripple = 1 kHz [2] - 60 - dB fripple = 100 Hz to 20 kHz [2] - 60 - dB [3] - - 150 µV 50 60 - dB - - 1 dB SVRR Vo(mute) output voltage in mute mode αcs channel separation |Gv| channel unbalance Rsource = 0 Ω [1] The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance Rsource = 0 Ω at the input. [2] SVRR is measured at the output, with a source impedance Rsource = 0 Ω at the input and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine-wave with a frequency fripple and an amplitude of 300 mV (RMS), which is applied to the positive supply rail. [3] Output voltage in mute mode (VMODE = 7 V) and an input voltage of 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz, so including noise. 9397 750 12846 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 7 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) 001aaa417 107 Vo (µV) 106 001aaa418 60 Po (W) 105 40 104 20 102 4Ω RL = 1 Ω 10 1 3Ω 2Ω 103 8Ω 0 4 8 12 16 VMODE (V) 0 20 8 12 16 24 20 28 VCC (V) Vi = 100 mV; VCC = 18 V. THD = 10 %. Fig 4. AC output voltage as function of mode selection voltage. Fig 5. Output power (one channel) as function of supply voltage for various loads. 001aaa419 102 001aaa420 10 THD+N (%) THD+N (%) 10 1 1 10−1 10−1 10−2 10−1 1 10 Po (W) 102 VCC = 18 V; f = 1 kHz; RL = 4 Ω. Fig 6. Total harmonic distortion-plus-noise as function of output power. 10−2 10 103 104 f (Hz) 105 VCC = 18 V; Po = 1 W; RL = 4 Ω. Fig 7. Total harmonic distortion-plus-noise as function of frequency. 9397 750 12846 Preliminary data sheet 102 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 8 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) 001aaa421 50 Po (W) 001aaa422 10 PD (W) 40 8 30 6 20 4 10 2 0 8 12 16 20 24 28 VCC (V) THD = 10 %; RL = 4 Ω; f = 1 kHz. 0 0 8 4 12 16 20 Po (W) VCC = 18 V; RL = 4 Ω. Fig 8. Output power as function of supply voltage. 001aaa423 0 Fig 9. Total (worst-case, both channels driven) power dissipation as function of channel output power per channel. 001aaa424 0 αcs (dB) SVRR (dB) −20 −20 −40 −40 −60 −60 −80 −100 10 102 103 104 105 −80 10 VCC = 18 V; RL = 4 Ω. 103 104 105 VCC = 18 V; Rsource = 0 Ω; Vripple = 300 mV (RMS); a bandpass filter of 20 Hz to 22 kHz has been applied; inputs short-circuited. Fig 10. Channel separation as function of frequency (no bandpass filter applied). Fig 11. Supply voltage ripple rejection as function of frequency. 9397 750 12846 Preliminary data sheet 102 f (Hz) f (Hz) © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 9 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) 13. Application information 13.1 Application diagram VCC VCC 1000 µF 100 nF 9 220 nF IN1 4 Vi 8 OUT1 470 µF 60 kΩ 220 nF − IN2 1 Vi + RL 4Ω 2 OUT2 470 µF 60 kΩ CIV 3 VREF + − SHORT-CIRCUIT AND TEMPERATURE PROTECTION RL 4Ω VCC MODE 7 VCC 10 kΩ 50 kΩ 100 kΩ 7.5 V microcontroller 22 µF 270 Ω BC547 BC547 2.2 µF STANDBY MUTE ON 0.5VCC SVR 6 TFA9843BJ 47 µF 5 1.5 kΩ 001aaa425 GND Fig 12. Application diagram. Remark: Switching inductive loads, the output voltage can rise beyond the maximum supply voltage of 28 V. At high supply voltage it is recommended to use (Schottky) diodes to the supply voltage and ground. 13.2 Printed-circuit board 13.2.1 Layout and grounding To obtain a high-level system performance, certain grounding techniques are essential. The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large (output) signal currents from interfering with the small AC input signals. The small-signal ground tracks should be physically located as far as possible from the power ground tracks. Supply and output tracks should be as wide as possible for delivering maximum output power. 9397 750 12846 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 10 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) AUDIO POWER CS NIJMEGEN PF / 3002 .naJ 72 TVA 1000 µF 1 BTL1/2 100 nF −SE1+ 1000 µF 1000 µF 220 nF SVR 150 µF SVR −SE2+ 220 nF CIV MODE 22 µF SGND +VP 10 kΩ 10 kΩ CIV IN2+ IN1+ SB ON MUTE 001aaa426 Fig 13. Printed-circuit board layout (single-sided); components view. 13.2.2 Power supply decoupling Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor location should be as close as possible to the device and grounded to the power ground. Proper power supply decoupling also prevents oscillations. For suppressing higher frequency transients (spikes) on the supply line a capacitor with low ESR, typical 100 nF, has to be placed as close as possible to the device. For suppressing lower frequency noise and ripple signals, a large electrolytic capacitor, e.g. 1000 µF or greater, must be placed close to the device. The bypass capacitor on pin SVR reduces the noise and ripple on the mid rail voltage. For good THD and noise performance a low ESR capacitor is recommended. 13.3 Thermal behavior and heatsink calculation The measured maximum thermal resistance of the IC package, Rth(j-c), is 2.0 K/W. A calculation for the heatsink can be made, with the following parameters: Tamb(max) = 60 °C (example) VCC = 18 V and RL = 4 Ω Tj(max) = 150 °C (specification) 9397 750 12846 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 11 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) Rth(tot) is the total thermal resistance between the junction and the ambient including the heatsink. This can be calculated using the maximum temperature increase divided by the power dissipation: Rth(tot) = (Tj(max) − Tamb(max))/PD. At VCC = 18 V and RL = 4 Ω (2 × SE) the measured worst-case sine-wave dissipation is 8.4 W; see Figure 9. For Tj(max) = 150 °C the temperature raise, caused by the power dissipation, is: 150 − 60 = 90 °C: P × Rth(tot) = 90 °C Rth(tot) = 90/8.4 = 10.7 K/W Rth(h-a) = Rth(tot) − Rth(j-c) = 10.7 − 2.0 = 8.7 K/W. This calculation is for an application at worst-case (stereo) sine-wave output signals. In practice music signals will be applied, which decreases the maximum power dissipation to approximately half of the sine-wave power dissipation (see Section 8.2.2). This allows for the use of a smaller heatsink: P × Rth(tot) = 90 °C Rth(tot) = 90/4.2 = 21.4 K/W Rth(h-a) = Rth(tot) − Rth(j-c) = 21.4 − 2.0 = 19.4 K/W. 001aaa427 150 RL = 2 Ω Tj (°C) 4Ω 6Ω 100 8Ω 16 Ω 50 0 8 12 16 20 24 28 VCC (V) 2 × SE loads; Tamb = 25 °C; external heatsink of 10 K/W; music signals. Fig 14. Junction temperature as function of supply voltage for various loads. 14. Test information 14.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. 9397 750 12846 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 12 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) 15. Package outline DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 9 e1 Z e Q w M bp 0 5 scale DIMENSIONS (mm are the original dimensions) UNIT A2(2) bp mm c D(1) D1(2) Dh E(1) Eh 2.7 0.80 0.58 13.2 2.3 0.65 0.48 12.8 10 mm v M c e2 m e e1 e2 6.2 14.7 3.5 2.54 1.27 5.08 3.5 5.8 14.3 L k 3 2 L1 L2 L3 m 12.4 11.4 6.7 11.0 10.0 5.5 4.5 3.7 2.8 P Q q q1 q2 3.4 1.15 17.5 4.85 3.8 3.1 0.85 16.3 3.6 v w x 0.8 0.3 0.02 Z(1) 1.65 1.10 Notes 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2. Plastic surface within circle area D1 may protrude 0.04 mm maximum. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 00-07-03 03-03-12 SOT523-1 Fig 15. Package outline. 9397 750 12846 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 13 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) 16. Soldering 16.1 Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 16.2 Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 16.3 Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. 16.4 Package related soldering information Table 10: Suitability of through-hole mount IC packages for dipping and wave soldering methods Package Soldering method Dipping Wave DBS, DIP, HDIP, RDBS, SDIP, SIL suitable suitable [1] PMFP [2] − not suitable [1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [2] For PMFP packages hot bar soldering or manual soldering is suitable. 9397 750 12846 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 14 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) 17. Revision history Table 11: Revision history Document ID Release date Data sheet status Change notice Order number Supersedes TFA9843BJ_1 20040504 Preliminary data - 9397 750 12846 - 9397 750 12846 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 15 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) 18. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 19. Definitions 20. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 21. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] 9397 750 12846 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 16 of 17 TFA9843BJ Philips Semiconductors 2-channel audio amplifier (2 × SE) 22. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.2.1 8.2.2 8.3 8.4 8.5 9 10 11 12 13 13.1 13.2 13.2.1 13.2.2 13.3 14 14.1 15 16 16.1 16.2 16.3 16.4 17 18 19 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Input configuration . . . . . . . . . . . . . . . . . . . . . . 4 Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 4 Output power measurement . . . . . . . . . . . . . . . 4 Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5 Supply voltage ripple rejection . . . . . . . . . . . . . 6 Built-in protection circuits . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Application information. . . . . . . . . . . . . . . . . . 10 Application diagram . . . . . . . . . . . . . . . . . . . . 10 Printed-circuit board . . . . . . . . . . . . . . . . . . . . 10 Layout and grounding . . . . . . . . . . . . . . . . . . . 10 Power supply decoupling . . . . . . . . . . . . . . . . 11 Thermal behavior and heatsink calculation . . 11 Test information . . . . . . . . . . . . . . . . . . . . . . . . 12 Quality information . . . . . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Soldering by dipping or by solder wave . . . . . 14 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 14 Package related soldering information . . . . . . 14 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information . . . . . . . . . . . . . . . . . . . . 16 9397 750 12846 Preliminary data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 4 May 2004 17 of 17