INTEGRATED CIRCUITS DATA SHEET TDA8707 Triple RGB 6-bit video analog-to-digital interface Product specification Supersedes dat of March 1995 File under Integrated Circuits, IC02 1996 Feb 01 Philips Semiconductors Product specification Triple RGB 6-bit video analog-to-digital interface TDA8707 It converts the analog inputs into 6-bit binary coded digital words at a sampling rate of 35 MHz. All analog signal inputs are clamped. FEATURES • Triple analog-to-digital converter (ADC) • 6-bit resolution • Sampling rate up to 35 MHz Analog-to-digital converter • Power dissipation of 335 mW (typical) The TDA8707 implements 3 independent 6-bit analog-to-digital converters in CMOS process. These converters use a full-flash approach. • Internal clamping function • TTL compatible digital inputs • −40 to +85 °C operating temperature Clamping feature • CMOS digital outputs. An internal clamping circuit is provided in each of the 3 analog channels. The analog pins INR, ING and INB are switched, through series capacitors, to on-chip clamping levels during an active pulse on the clamp input CLP. Clamping level in the R, G and B channels is Code 0. APPLICATIONS • High-speed analog-to-digital conversion for video signals • VGA signal treatment. Input buffers DESCRIPTION Internal buffers are provided to drive the analog-to-digital converter inputs. Their ratio can be adjusted externally at 1.5 or 2.0 with select input SLT. The TDA8707 is a CMOS triple 6-bit video low-power analog-to-digital converter (ADC) for RGB signals. QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VDDA analog supply voltage 4.5 5.0 5.5 V VDDD digital supply voltage 4.5 5.0 5.5 V IDDA analog supply current − 60 80 mA IDDD digital supply current fclk = 35 MHz − 5 8 mA INL integral non-linearity fclk = 35 MHz; ramp input; Tamb = 25 °C − ±0.35 ±0.6 LSB DNL differential non-linearity fclk = 35 MHz; ramp input; Tamb = 25 °C − ±0.35 ±0.6 LSB EB effective bits note 1 − 5.3 − bits fclk maximum clock conversion rate 35 − − MHz Ptot total power dissipation − 335 485 mW fclk = 35 MHz; note 2 Notes 1. The number of effective bits is measured with a clock frequency of 35 MHz. This value is given for a 4.43 MHz frequency on the R, G and B channels. 2. The external resistor (value 15 kΩ) between VDDA and CLREF, fixing internal static currents, influences Ptot. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA8707H QFP44 1996 Feb 01 DESCRIPTION VERSION plastic quad flat package; 44 leads; lead length 1.3 mm; body 10 × 10 × 1.75 mm SOT307-2 2 Philips Semiconductors Product specification Triple RGB 6-bit video analog-to-digital interface TDA8707 BLOCK DIAGRAM CLREF handbook, full pagewidth VDDA1 VSSA1 INR CLP 24 33 CLK 23 10 35 34 BUFFER 38, 40-44 6-BIT ADC CLAMPING CIRCUIT R0 to R5 6 V DDA2 V SSA2 ING 30 32 31 BUFFER 6-BIT ADC CLAMPING CIRCUIT 3-8 G0 to G5 6 V DDA3 V SSA3 INB 27 TDA8707 29 28 BUFFER 14-16, 18-20 6-BIT ADC CLAMPING CIRCUIT B0 to B5 6 CREFH CREFL 22 26 21 25 36 11 9 MGA919 V DDD1 VSSD1 SLT Fig.1 Block diagram. 1996 Feb 01 3 VDDD2 VSSD2 Philips Semiconductors Product specification Triple RGB 6-bit video analog-to-digital interface TDA8707 PINNING SYMBOL PIN SYMBOL DESCRIPTION PIN DESCRIPTION n.c. 1 not connected CLP 23 clamping input n.c. 2 not connected CLREF 24 ADCs current reference level input G0 3 GREEN data output; bit 0 (LSB) CREFL 25 converter reference LOW level input G1 4 GREEN data output; bit 1 CREFH 26 converter reference HIGH level input G2 5 GREEN data output; bit 2 VDDA3 27 analog supply voltage 3 G3 6 GREEN data output; bit 3 INB 28 BLUE analog input G4 7 GREEN data output; bit 4 VSSA3 29 analog supply ground 3 30 analog supply voltage 2 G5 8 GREEN data output; bit 5 (MSB) VDDA2 VSSD1 9 digital supply ground 1 ING 31 GREEN analog input CLK 10 clock input VSSA2 32 analog supply ground 2 33 analog supply voltage 1 VDDD1 11 digital supply voltage 1 VDDA1 n.c. 12 not connected INR 34 RED analog input n.c. 13 not connected VSSA1 35 analog supply ground 1 B0 14 BLUE data output; bit 0 (LSB) SLT 36 select input buffer ratio B1 15 BLUE data output; bit 1 n.c. 37 not connected B2 16 BLUE data output; bit 2 R0 38 RED data output; bit 0 (LSB) n.c. 17 not connected n.c. 39 not connected B3 18 BLUE data output; bit 3 R1 40 RED data output; bit 1 B4 19 BLUE data output; bit 4 R2 41 RED data output; bit 2 B5 20 BLUE data output; bit 5 (MSB) R3 42 RED data output; bit 3 VSSD2 21 digital supply ground 2 R4 43 RED data output; bit 4 VDDD2 22 digital supply voltage 2 R5 44 RED data output; bit 5 (MSB) 1996 Feb 01 4 Philips Semiconductors Product specification 34 INR 35 V SSA1 37 n.c. 36 SLT TDA8707 38 R0 39 n.c. 40 R1 41 R2 42 R3 43 R4 index corner 44 R5 Triple RGB 6-bit video analog-to-digital interface n.c. 1 33 VDDA1 n.c. 2 32 VSSA2 G0 3 31 ING G1 4 30 V DDA2 G2 5 29 VSSA3 G3 6 G4 7 27 V DDA3 G5 8 26 CREFH V SSD1 9 25 CREFL CLK 10 24 CLREF TDA8707 28 INB VDDD1 11 VDDD2 22 B5 20 V SSD2 21 B4 19 B3 18 n.c. 17 B2 16 B1 15 B0 14 n.c. 13 n.c. 12 23 CLP MGA920 Fig.2 Pin configuration. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VDDA analog supply voltage (pins 27, 30 and 33) −0.3 +6.5 V VDDD digital supply voltage (pins 11 and 22) −0.3 +6.5 V ∆VDD supply voltage difference between VDDA and VDDD −0.5 +0.5 V VI input voltage (pins 28, 31 and 34) referenced to VSSA − VDDA V Vi(p-p) AC input voltage for switching (pins 10 and 23; peak-to-peak value) referenced to VSSD − VDDD V Tstg storage temperature −55 +150 °C Tamb operating ambient temperature −40 +85 °C Tj junction temperature − +125 °C THERMAL CHARACTERISTICS SYMBOL Rth j-a 1996 Feb 01 PARAMETER thermal resistance from junction to ambient in free air 5 VALUE UNIT 75 K/W Philips Semiconductors Product specification Triple RGB 6-bit video analog-to-digital interface TDA8707 HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. CHARACTERISTICS (see Tables 1 and 2) VDDA = VDDD = 4.5 to 5.5 V; VSSA and VSSD short-circuited together; VDDA − VDDD = −0.5 to +0.5 V; Tamb = −40 to +85 °C; SLT = 0 V; CREFH = 2 V, CREFL = 0.5 V, CL = 15 pF; typical values measured at VDDA = VDDD = 5 V; VSSA = VSSD = 0 V and Tamb = 25 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Supply VDDA analog supply voltage note 1 4.5 5.0 5.5 V VDDD digital supply voltage note 1 4.5 5.0 5.5 V IDDA analog supply current note 1 − 60 80 mA IDDD digital supply current fclk = 35 MHz − 5 8 mA Inputs DIGITAL INPUTS (CLK: PIN 10 AND CLP: PIN 23) VIL LOW level input voltage 0 − 0.8 V VIH HIGH level input voltage 2.0 − VDDD V ILI input leakage current −10 − +10 µA CI input capacitance − 7 − pF − ±0.5 − LSB CLAMP AND REFERENCES (CLREF: PIN 24, CREFL: PIN 25 AND CREFH: PIN 26) ACL clamping accuracy ICL input clamping current −200 − +400 µA CCL external series clamping capacitor 10 22 − nF RCLREF external resistor on CLREF pin for current reference of converter note 2 12 15 − kΩ VREFH converter reference voltage HIGH level applied to CREFH pin referenced to VSSA 1.5 2.0 2.5 V VREFL converter reference voltage LOW level applied to CREFL pin referenced to VSSA 0.25 0.5 0.75 V ∆REF reference voltage difference between VREFH and VREFL note 3 − 1.5 − V ZCREF internal ladder impedance between pins CREFH and CREFL − 300 − Ω SLT = logic 0; gain = 1.5; note 4 − 1.0 − V SLT = logic 1; gain = 2.0; note 4 − 0.75 − V clamp off − 5 100 nA − 7 15 pF ANALOG INPUTS (INR: PIN 34, ING: PIN 31 AND INB: PIN 28) VI(p-p) full-range input voltage (peak-to-peak value) II input current CI input capacitance 1996 Feb 01 6 Philips Semiconductors Product specification Triple RGB 6-bit video analog-to-digital interface SYMBOL PARAMETER TDA8707 CONDITIONS MIN. TYP. MAX. UNIT INPUT ISOLATION αct − crosstalk between INR, ING and INB − −40 dB Outputs (R0 to R5: pins 38 and 40 to 44; G0 to G5: pins 3 to 8; B0 to B5: pins 14 to 16 and 18 to 20) VOL LOW level output voltage 0 − 0.5 V VOH HIGH level output voltage 4.0 − VDDD V Switching characteristics CLOCK INPUT CLK (see Fig.3) fclk(max) maximum clock frequency 35 − − MHz tCPH clock pulse width HIGH 10 − − ns tCPL clock pulse width LOW 12 − − ns Analog signal processing (50% clock duty cycle) fclk = 35 MHz LINEARITY INL integral non-linearity ramp input; Tamb = 25 °C − ±0.35 ±0.6 LSB DNL differential non-linearity ramp input; Tamb = 25 °C − ±0.35 ±0.6 LSB BANDWIDTH (see Fig.5 and note 7) B −3 dB analog bandwidth − 9 − MHz tSTLH analog input settling time LOW-to-HIGH full scale square wave − 13 16 ns tSTHL analog input settling time HIGH-to-LOW full scale square wave − 11 14 ns HARMONICS; note 6 f1 fundamental harmonic − − 0 dB fall harmonics, all components − −37 − dB fi = 4.43 MHz − 5.3 − bits PAL modulated ramp − 3 − % PAL modulated ramp − 2 − deg EFFECTIVE BITS EB effective bits DIFFERENTIAL GAIN; note 5 Gdiff differential gain DIFFERENTIAL PHASE; note 5 ϕdiff differential phase Timing (see Figs 3 and 4) tdS sampling delay time − 3 − ns th output hold time 6 − − ns td output delay time − − 16 ns tr clock rise time 3 5 − ns tf clock fall time 3 5 − ns tCLP active clamping duration 3 4 − µs 1996 Feb 01 note 8 7 Philips Semiconductors Product specification Triple RGB 6-bit video analog-to-digital interface TDA8707 Notes to the characteristics 1. VDDA and VDDD should be supplied from the same power supply and decoupled separately. 2. The analog supply current is directly proportional to the series resistance between VDDA and CLREF. 3. CREFH and CREFL are connected respectively to the top and bottom reference ladders of the 3 analog-to-digital converters. 4. VI(p-p) = (VREFL − VREFH)/buffer gain factor. See Table for gain factor selection. When clamping at code 0 is used, ( V REFH – V REFL ) active video signal amplitude VACT should be: V ACT = ---------------------------------------------buffer gain factor 5. Measurement carried out using video analyser VM700A, where the video analog signal is reconstructed through a digital-to-analog converter. 6. VI(p-p) = ∆REF with fi = 4.43 MHz. 7. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale input (square-wave signal) in order to sample the signal and obtain correct output data. 8. Output data acquisition: output data is available after the maximum delay time of td. Table 1 Typical output coding (VREFH = 2 V; VREFL = 0.5 V referenced to VSSA, SLT = logic 0; buffer ratio = 1.5; Tamb = 25°C) BINARY OUTPUT BITS STEP Table 2 VI(p-p) D5 D4 D3 D2 D1 D0 − V REFL <0.333 = ---------------1.5 0 0 0 0 0 0 0 0.349 0 0 0 0 0 0 1 0.364 0 0 0 0 0 1 . . . . . . . 62 1.317 1 1 1 1 1 0 63 1.333 1 1 1 1 1 1 − V REFH >1.333 = ----------------1.5 1 1 1 1 1 1 Mode selection SLT BUFFER RATIO TYPICAL VI(p-p) FULL SCALE 0 1.5 V REFH – V REFL ---------------------------------------1.5 1 2.0 V REFH – V REFL ---------------------------------------2.0 1996 Feb 01 8 Philips Semiconductors Product specification Triple RGB 6-bit video analog-to-digital interface TDA8707 TIMING DIAGRAMS t CPL handbook, full pagewidth t CPH 1.4 V CLK sample N sample N + 1 sample N + 2 IN R, G, B t dS th 2.4 V DATA D0 to D5 DATA N-2 DATA N-1 DATA N DATA N+1 1.4 V 0.4 V td MLB759 Fig.3 Input timing. handbook, full pagewidth digital output level 63 black-level clamping 0 time MGA922 CLP t CLP Fig.4 Clamp timing. 1996 Feb 01 9 Philips Semiconductors Product specification Triple RGB 6-bit video analog-to-digital interface TDA8707 t STHL t STLH handbook, full pagewidth code 64 VI 50 % 50 % code 0 2 ns 2 ns CLK MLD208 50 % 50 % 0.5 ns Fig.5 Analog input settling-time diagram. 1996 Feb 01 10 0.5 ns Philips Semiconductors Product specification Triple RGB 6-bit video analog-to-digital interface TDA8707 INTERNAL CIRCUITRY V DDA VDDD VSSD VSSA VSSA (a) (b) VDDD VSSA VSSA VSSD MGA925 (c) (d) (a) Digital inputs; pins 10, 23 and 36. (b) Analog inputs; pins 28, 31 and 34. (c) Current reference; pin 24. (d) Digital outputs; pins 3 to 8, 14 to 16, 18 to 20 and 40 to 44. Fig.6 Internal circuitry. 1996 Feb 01 11 Philips Semiconductors Product specification Triple RGB 6-bit video analog-to-digital interface TDA8707 APPLICATION INFORMATION handbook, full pagewidth R5 R4 R3 R2 R1 n.c. R0 n.c. RED SLT 22 nF VSSA1 INR 44 43 42 41 40 39 38 37 36 35 34 n.c. 1 33 n.c. 2 32 G0 3 31 G1 4 30 G2 5 29 G3 6 G4 7 27 G5 8 26 VSSD1 CLK 100 nF VDDD1 100 nF TDA8707 28 VDDA1 VSSA2 ING GREEN 100 nF VDDA2 VSSA3 INB 22 nF BLUE 100 nF VDDA3 CREFH 2V 2.2 nF 9 25 10 24 11 23 CREFL CLREF 12 13 14 15 16 17 18 19 20 21 22 VSSD2 V DDD2 n.c. n.c. B0 B1 B2 n.c. B3 B4 B5 100 nF MGA926 5V Analog and digital supplies should be separated and decoupled. Supplies are not connected internally; also applicable to grounds. The internal reference currents are set by the series resistor between pin VDDA and CLREF. The resistor value should be in the range of 12 kΩ and 15 kΩ. It is recommended, if possible, to connect pins 1, 2, 12, 13, 17, 37 and 39 to VSSD. Fig.7 Application diagram. 1996 Feb 01 22 nF 12 0.5 V 15 k Ω CLP 5V Philips Semiconductors Product specification Triple RGB 6-bit video analog-to-digital interface TDA8707 PACKAGE OUTLINE QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm SOT307-2 c y X A 33 23 34 22 ZE e Q E HE A A2 wM (A 3) A1 θ bp Lp pin 1 index L 12 44 1 detail X 11 wM bp e ZD v M A D B HD v M B 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HD HE L Lp Q v w y mm 2.10 0.25 0.05 1.85 1.65 0.25 0.40 0.20 0.25 0.14 10.1 9.9 10.1 9.9 0.8 12.9 12.3 12.9 12.3 1.3 0.95 0.55 0.85 0.75 0.15 0.15 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 θ Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-04 SOT307-2 1996 Feb 01 EUROPEAN PROJECTION 13 o 10 0o Philips Semiconductors Product specification Triple RGB 6-bit video analog-to-digital interface TDA8707 SOLDERING Wave soldering Introduction Wave soldering is not recommended for QFP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. If wave soldering cannot be avoided, the following conditions must be observed: • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). • The footprint must be at an angle of 45° to the board direction and must incorporate solder thieves downstream and at the side corners. Reflow soldering Even with these conditions, do not consider wave soldering the following packages: QFP52 (SOT379-1), QFP100 (SOT317-1), QFP100 (SOT317-2), QFP100 (SOT382-1) or QFP160 (SOT322-1). Reflow soldering techniques are suitable for all QFP packages. The choice of heating method may be influenced by larger plastic QFP packages (44 leads, or more). If infrared or vapour phase heating is used and the large packages are not absolutely dry (less than 0.1% moisture content by weight), vaporization of the small amount of moisture in them can cause cracking of the plastic body. For more information, refer to the Drypack chapter in our “Quality Reference Handbook” (order code 9397 750 00192). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. 1996 Feb 01 14 Philips Semiconductors Product specification Triple RGB 6-bit video analog-to-digital interface TDA8707 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 1996 Feb 01 15 Philips Semiconductors – a worldwide company Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40-2783749, Fax. (31)40-2788399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SÃO PAULO-SP, Brazil, P.O. Box 7383 (01064-970), Tel. (011)821-2333, Fax. (011)829-1849 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS: Tel. (800) 234-7381, Fax. (708) 296-8556 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. (852)2319 7888, Fax. (852)2319 7700 Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, 77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (45)32 88 26 36, Fax. (45)31 57 19 49 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (358)0-615 800, Fax. (358)0-61580 920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427 Germany: P.O. Box 10 51 40, 20035 HAMBURG, Tel. (040)23 53 60, Fax. (040)23 53 63 00 Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01)4894 339/4894 911, Fax. (01)4814 240 India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722 Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01)7640 000, Fax. (01)7640 200 Italy: PHILIPS SEMICONDUCTORS S.r.l., Piazza IV Novembre 3, 20124 MILANO, Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108, Tel. (03)3740 5130, Fax. (03)3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02)709-1412, Fax. (02)709-1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556 Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. (040)2783749, Fax. (040)2788399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09)849-4160, Fax. (09)849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (022)74 8000, Fax. (022)74 8341 Pakistan: Philips Electrical Industries of Pakistan Ltd., Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546 Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474 Portugal: PHILIPS PORTUGUESA, S.A., Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)4163160/4163333, Fax. (01)4163174/4163366 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430, Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494 Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM, Tel. (0)8-632 2000, Fax. (0)8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. (01)488 2211, Fax. (01)481 77 30 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (66) 2 745-4090, Fax. (66) 2 398-0793 Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. (0 212)279 27 70, Fax. (0212)282 67 07 Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165, 252148 KIEV, Tel. 380-44-4760297, Fax. 380-44-4766991 United Kingdom: Philips Semiconductors LTD., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. (0181)730-5000, Fax. (0181)754-8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601 Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-2724825 SCDS47 © Philips Electronics N.V. 1996 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 537021/1100/03/pp16 Document order number: Date of release: 1996 Feb 01 9397 750 00605