PHILIPS 74LV11D

INTEGRATED CIRCUITS
74LV11
Triple 3-input AND gate
Product specification
Supersedes data of 1997 Feb 03
IC24 Data Handbook
1998 Apr 20
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LV11
FEATURES
DESCRIPTION
• Optimized for Low Voltage applications: 1.0 to 3.6 V
• Accepts TTL input levels between VCC = 2.7 V and VCC = 3.6 V
• Typical VOLP (output ground bounce) 0.8 V at VCC = 3.3 V,
The 74LV11 is a low-voltage Si-gate CMOS device and is pin and
function compatible with 74HC/HCT11.
The 74LV11 provides the 3-input AND function.
Tamb = 25°C
• Typical VOHV (output VOH undershoot) 2 V at VCC = 3.3 V,
Tamb = 25°C
• Output capability: standard
• ICC category: SSI
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25°C; tr = tf 2.5 ns
PARAMETER
SYMBOL
tPHL/tPLH
Propagation delay
nA, nB, nC to nY
CI
Input capacitance
CPD
CONDITIONS
CL = 15 pF;
VCC = 3.3 V
Power dissipation capacitance per gate
See Notes 1 and 2
TYPICAL
UNIT
10
ns
3.5
pF
18
pF
NOTES:
1. CPD is used to determine the dynamic power dissipation (PD in µW)
PD = CPD × VCC2 × fi (CL × VCC2 fo) where:
fi = input frequency in MHz; CL = output load capacitance in pF;
fo = output frequency in MHz; VCC = supply voltage in V;
(CL VCC2 fo) = sum of the outputs.
2. The condition is VI = GND to VCC.
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE
OUTSIDE NORTH AMERICA
NORTH AMERICA
PKG. DWG. #
14-Pin Plastic DIL
–40°C to +125°C
74LV11 N
74LV11 N
SOT27-1
14-Pin Plastic SO
–40°C to +125°C
74LV11 D
74LV11 D
SOT108-1
14-Pin Plastic SSOP Type II
–40°C to +125°C
74LV11 DB
74LV11 DB
SOT337-1
14-Pin Plastic TSSOP Type I
–40°C to +125°C
74LV11 PW
74LV11PW DH
SOT402-1
PIN DESCRIPTION
PIN NUMBER
FUNCTION TABLE
SYMBOL
NAME AND FUNCTION
INPUTS
1, 3, 9
1A – 3A
Data inputs
nA
nB
2, 4, 10
1B – 3B
Data inputs
L
GND
Ground (0 V)
L
12, 6, 8
1Y – 3Y
Data outputs
13, 5, 11
1C – 3C
Data inputs
7
14
VCC
OUTPUT
nC
nY
L
L
L
L
H
L
L
H
L
L
L
H
H
L
H
L
L
L
H
L
H
L
H
H
L
L
H
H
H
H
Positive supply voltage
NOTES:
H = HIGH voltage level
L = LOW voltage level
1998 Apr 20
2
853–1894 19256
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LV11
PIN CONFIGURATION
LOGIC SYMBOL
14 VCC
1
1A
2
1B
13 1C
2A
3
12 1Y
2B
4
11 3C
2C
5
10 3B
2Y
6
9
3A
GND
7
8
3Y
1
1A
2
1B
13
1C
3
2A
4
2B
5
2C
9
3A
10
3B
11
3C
1Y
12
2Y
6
3Y
8
SV00416
SV00438
LOGIC SYMBOL (IEEE/IEC)
1
2
13
&
3
4
5
&
LOGIC DIAGRAM (ONE GATE)
12
A
9
10
11
&
6
B
Y
C
SV00421
8
SV00439
RECOMMENDED OPERATING CONDITIONS
SYMBOL
VCC
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
See Note 1
1.0
3.3
3.6
V
DC supply voltage
VI
Input voltage
0
–
VCC
V
VO
Output voltage
0
–
VCC
V
+85
+125
°C
500
200
100
ns/V
Tamb
Operating ambient temperature range in free air
tr, tf
Input rise and fall times
See DC and AC
characteristics
–40
–40
VCC = 1.0V to 2.0V
VCC = 2.0V to 2.7V
VCC = 2.7V to 3.6V
–
–
–
–
–
–
NOTE:
1. The LV is guaranteed to function down to VCC = 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 3.6V.
1998 Apr 20
3
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LV11
ABSOLUTE MAXIMUM RATINGS1, 2
In accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to GND (ground = 0V).
PARAMETER
SYMBOL
VCC
DC supply voltage
IIK
DC input diode current
IOK
IO
IGND,
ICC
Tstg
PTOT
CONDITIONS
RATING
UNIT
–0.5 to +4.6
V
VI < –0.5 or VI > VCC + 0.5V
20
mA
DC output diode current
VO < –0.5 or VO > VCC + 0.5V
50
mA
DC output source or sink current
– standard outputs
–0.5V < VO < VCC + 0.5V
25
DC VCC or GND current for types with
– standard outputs
mA
mA
50
Storage temperature range
°C
–65 to +150
Power dissipation per package
– plastic DIL
– plastic mini-pack (SO)
– plastic shrink mini-pack (SSOP and TSSOP)
for temperature range: –40 to +125°C
above +70°C derate linearly with 12 mW/K
above +70°C derate linearly with 8 mW/K
above +60°C derate linearly with 5.5 mW/K
750
500
400
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
DC CHARACTERISTICS
Over recommended operating conditions. Voltages are referenced to GND (ground = 0V).
LIMITS
SYMBOL
PARAMETER
-40°C to +85°C
TEST CONDITIONS
MIN
VIH
VIL
HIGH level
l
l Input
I
t
voltage
l
l Input
I
t
LOW level
voltage
VOH
HIGH level output
voltage; all outputs
HIGH level output
voltage;
STANDARD
outputs
MIN
0.9
VCC = 2.0V
1.4
1.4
VCC = 2.7 to 3.6V
2.0
2.0
UNIT
MAX
V
VCC = 1.2V
0.3
0.3
VCC = 2.0V
0.6
0.6
VCC = 2.7 to 3.6V
0.8
0.8
V
1.2
VCC = 2.0V; VI = VIH or VIL; –IO = 100µA
1.8
2.0
1.8
VCC = 2.7V; VI = VIH or VIL; –IO = 100µA
2.5
2.7
2.5
VCC = 3.0V; VI = VIH or VIL; –IO = 100µA
2.8
3.0
2.8
VCC = 3.0V; VI = VIH or VIL; –IO = 6mA
2.40
2.82
2.20
V
V
VCC = 1.2V; VI = VIH or VIL; IO = 100µA
0
VCC = 2.0V; VI = VIH or VIL; IO = 100µA
0
0.2
0.2
VCC = 2.7V; VI = VIH or VIL; IO = 100µA
0
0.2
0.2
VCC = 3.0V; VI = VIH or VIL; IO = 100µA
0
0.2
0.2
0.25
0.40
0.50
V
1.0
1.0
µA
LOW level output
voltage; all outputs
VOL
LOW level output
voltage;
STANDARD
outputs
VCC = 3.0V; VI = VIH or VIL; IO = 6mA
Input leakage
current
VCC = 3.6V; VI = VCC or GND
1998 Apr 20
MAX
0.9
VOL
O
II
-40°C to +125°C
VCC = 1.2V
VCC = 1.2V; VI = VIH or VIL; –IO = 100µA
VOH
O
TYP1
4
V
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LV11
DC CHARACTERISTICS FOR THE LV FAMILY (Continued)
Over recommended operating conditions. Voltages are referenced to GND (ground = 0V).
SYMBOL
PARAMETER
LIMITS
TEST CONDITIONS
-40°C to +85°C
UNIT
-40°C to +125°C
ICC
Quiescent supply
current; SSI
VCC = 3.6V; VI = VCC or GND; IO = 0
20.0
40
µA
∆ICC
Additional
quiescent supply
current per input
VCC = 2.7V to 3.6V; VI = VCC – 0.6V
500
850
µA
NOTE:
1. All typical values are measured at Tamb = 25°C.
AC CHARACTERISTICS
GND = 0V; tr = tf ≤ 2.5ns; CL = 50pF; RL = 1KΩ
SYMBOL
PARAMETER
LIMITS
CONDITION
WAVEFORM
–40 to +85 °C
VCC(V)
Propagation
g
delay
y
nA, nB, nC to nY
tPHL/PLH
TYP1
MIN
–40 to +125 °C
MAX
MIN
1.2
60
2.0
20
39
46
2.7
15
29
34
3.0 to 3.6
112
23
27
Figures 1
1, 2
UNIT
MAX
ns
NOTES:
1. Unless otherwise stated, all typical values are measured at Tamb = 25°C.
2. Typical values are measured at VCC = 3.3 V.
AC WAVEFORMS
TEST CIRCUIT
VM = 1.5 V at VCC 2.7 V
VM = 0.5 × VCC at VCC < 2.7 V
VOL and VOH are the typical output voltage drop that occur with the
output load.
VCC
nA, nB, nC INPUT
VO
VI
Vl
PULSE
GENERATOR
VM
D.U.T.
50pF
RT
GND
t PHL
CL
t PLH
RL = 1k
VOH
nY OUTPUT
VOL
Test Circuit for switching times
VM
DEFINITIONS
SV00423
RL = Load resistor
Figure 1. Input (nA, nB, nC) to output (nY) propagation delays.
CL = Load capacitance includes jig and probe capacitance
RT = Termination resistance should be equal to ZOUT of pulse generators.
TEST
tPLH/tPHL
VCC
< 2.7V
2.7–3.6V
VI
VCC
2.7V
SV00901
Figure 2. Load circuitry for switching times.
1998 Apr 20
5
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LV11
DIP14: plastic dual in-line package; 14 leads (300 mil)
1998 Apr 20
6
SOT27-1
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LV11
SO14: plastic small outline package; 14 leads; body width 3.9 mm
1998 Apr 20
7
SOT108-1
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LV11
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
1998 Apr 20
8
SOT337-1
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LV11
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
1998 Apr 20
9
SOT402-1
Philips Semiconductors
Product specification
Triple 3-input AND gate
74LV11
DEFINITIONS
Data Sheet Identification
Product Status
Definition
Objective Specification
Formative or in Design
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
Preliminary Specification
Preproduction Product
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
Product Specification
Full Production
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
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Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
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 Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
print code
Document order number:
1998 Apr 20
10
Date of release: 05-96
9397-750-04408